CPR3BS Rev. -
© Cree, Inc. 2003 All Rights Reserved.
G•SiC® Technology
MegaBright® Plus™ LEDs
Cxxx-MB290-S0100-Plus
Maximum Ratings at TA = 25°C Notes 1&3 Cxxx-MB290-S0100-Plus
DC Forward Current 30mA
Peak Forward Current (1/10 duty cycle @ 1kHz) 100mA
LED Junction Temperature 125°C
Reverse Voltage 5 V
Operating Temperature Range -20°C to +80°C
Storage Temperature Range -30°C to +100°C
Electrostatic Discharge Threshold (HBM) Note 2 1000 V
Electrostatic Discharge Classification (MIL-STD-883E) Note 2 Class 2
Typical Electrical/Optical Characteristics at TA = 25°C, If = 20mA Note 3
Part Number Forward Voltage
(Vf, V) Reverse Current
[I(Vr=5V), µA] Full Width
Half Max
(λD, nm)
Dominant
Wavelength
Radiant Flux Optical Rise
Time
(τ, ns)
Typ Max Max Typ Typ
C460MB290-S0100-Plus 3.5 3.8 10 26 See Bin Table See Bin Table 30
C470MB290-S0100-Plus 3.5 3.8 10 26 See Bin Table See Bin Table 30
Mechanical Specifications Note 4 Cxxx-MB290-S0100-Plus
Description Dimension Tolerance
P-N Junction Area (µm) 240 x 240 ± 25
Top Area (µm) 300 x 300 ± 25
Bottom Area (µm) 200 x 200 ± 25
Chip Thickness (µm) 250 ± 25
Au Bond Pad Diameter (µm) 114 ± 20
Au Bond Pad Thickness (µm) 1.2 ± 0.5
Back Contact Metal Width (µm) 19.8 -5, +10
Notes:
1) Maximum ratings are package dependent. The above ratings were determined using a T-1 3/4 package with Hysol OS4000 epoxy for characterization. Seller
makes no repr esentations regarding ratings for packages other than the T-1 3/4 package used by Seller. The forward currents (DC and Peak) are not limited by the
G •SiC die but by the effect of the LED junction temperature on the package. The junction tem per ature limit of 125°C is a limit of the T-1 3/4 package; junction
temperature should be characterized in a specific package to deter mine limitations. Assembly processing temperature must not exceed 325°C (< 5 seconds).
2) Product resistance to electrostatic discharge (ESD) is measured by simulating ESD using a rapid avalanche energy test (RAET). The RAET procedures are
designed to approximate the maximum ESD ratings shown. Seller gives no other assurances regarding the ability of Products to withstand ESD.
3) All Products conform to the listed minimum and maximum specifications for electrical and optical characteristics, when assembled and operated at 20 mA within
the maximum ra tings shown above. Efficiency decreases at higher currents. T ypical values given are the average values expected by Seller in large quantities and
are provided for information only. Seller gives no assurances Products shipped will exhibit such typical ratings. All measurements were made using lamps in T-1
3/4 packages with Hysol OS4000 epoxy. Optical characteristics were measured in a Photoresearch Spectrascan Integrating Sphere. Illuminance E.
4) All Products conform to the listed mechanical specifications within the tolerances shown.
5) Caution: To obtain optimum output efficiency, the maximum height of die attach epoxy on the side of the chip should not exceed 80µm.