Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v02.0106 MILITARY & SPACE MILITARY & SPACE PRODUCTS Military Level (Class B) MMIC Die and Packaged Die Screening Hittite Microwave performs Class B screening on standard & custom product die and packaged die including SMT plastic encapsulated devices for COTS applications. We also design, produce and screen highly integrated MIC modules and subsystems for major defense OEMs. Die are shipped at customer request in either conductive standard Gel-Paks or conductive standard Waffle-Paks. Tables 1 & 2 summarize tests Hittite Microwave will perform on die, packaged die, modules and subsystems for military and Hi-Rel commercial applications. Military Screened Sub-Assembly Containing MIC Modules Class B Die COTS SMT Plastic Package COTS SMT Hermetic Package Screen MIC Hybrids Hermetic Connectorized Module MIL-STD-883 Test Method and Condition 1. Electrostatic Discharge Sensitivity (ESD) 3015 2. Wafer Acceptance Table 2 herein. Class-B element evaluation 3. Internal visual 2010, Test Condition B 4. Temperature cycling 1010, Test Condition C, 10 cycles minimum 5. Constant acceleration 2001, Test Condition A, Y1 orientation only 6. Serialization In accordance with device specification 7. Interim (pre burn-in) electrical parameters In accordance with device specification 8. Burn-in test 1015, 160 hours at +125 C, biased 9. Interim (post burn-in) electrical parameters In accordance with device specification 10. Final electrical test In accordance with device specification 11. Seal a. Fine b. Gross 1014, Test Condition A & C 12. External visual 2009 and product outline specification Table 1: Class B Packaged MMIC Die and MIC Sub-Assembly Screening Procedure to MIL-PRF-38534 and MIL-PRF-38535 as applicable. i - 46 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com v02.0106 Class MIL-STD-883 Sub Group Test S B 1 x x Element electrical 2 x x Element visual Quantity (accept number) Method Condition 2010 A = Class S B = Class B 100 percent A = Class S B = Class B 10 (0) 1010 C 10 (0) 1015 240 hours minimum at +125C, biased 1005 1000 hours minimum at +125C, biased D 100 percent 2072 1/ 2073 1/ 3 x x Internal visual 2010 2072 1/ 2073 1/ 4 x Temperature cycling x Interim electrical x Burn-in x Post burn-in electrical x Steady-state life x x Final electrical 5 x x Wire bond evaluation 2011 6 x Wafer Lot Acceptance Test (LAT) 5007 * * * * MILITARY & SPACE MILITARY & SPACE PRODUCTS 10 (0) wires or 20 (1) wires 5 (0) die per wafer SEM Wafer Thickness Metal Thickness Glassivation Thickness 1/ MIL-PRF-38534 methods Table 2: Class S & B MMIC Die/Wafer Screening & Qualification Procedure For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com i - 47