
BFC2 808 .....
Ø 10 mm Film Dielectric Trimmers Vishay BCcomponents
Document Number 28528 For technical questions, contact: dc-film@vishay.com www.vishay.com
Revision 11-Oct-07 323
MOUNTING
The trimmer can be mounted on printed-circuit boards with a
grid of 2.50 mm or 2.54 mm and a minimum hole diameter of
1.25 mm.
PACKAGING
Bulk packaged in cardboard boxes lined with expanded
plastic. For smallest packaging quantities (SPQ)
see Electrical Data Table.
ELECTRICAL DATA
* ordering code for SAP system
TEST PROCEDURES AND REQUIREMENTS
GUARANTEED
MAX. Cmin/
MIN. Cmax
AT 200 kHz
(pF)
SPINDLE
SHAPE
OF
HEAD
FIG. ADJ.
MODE DIEL.
TAN δ AT
Cmax x10
-4TEMP.
COEFF.
(10-6/K)
MIN. fres
AT Cmax
(MHz)
COL.
OF
BASE
SPQ
CATALOG
NUMBER
BFC2 ... .....
1MHz 100MHz
2.5/15 vertical round
1
top + bottom PP ≤ 10 ≤ 25 - 200 ± 700 420 blue
800 .... 808 31159
2800 .... 808 32159
horizontal 3 700 .... 808 61159
3/22.5 vertical round
1
top + bottom PP ≤ 10 ≤ 25 - 200 ± 700 200 green
800 .... 808 31229
2800 .... 808 32229
horizontal 3 700 .... 808 61229
5.5/40 vertical round
1
top + bottom PP ≤ 10 ≤ 25 - 200 ± 400 200 grey
800 .... 808 31409
2800 .... 808 32409
horizontal 3 700 .... 808 61409
5.5/50 vertical round 1top + bottom PTFE ≤ 10 ≤ 25 - 200 ± 400 170 yellow 800 .... 808 01029
2800 .... 808 01006
5.5/65 vertical
round 2 top
PP ≤ 10 ≤ 25 - 200 ± 500 170 yellow
800 .... 808 01001
round 1
top + bottom
800 .... 808 31659
round 2 800 .... 808 32659
horizontal round 3 700 .... 808 61659
6/80 vertical round 1
top + bottom PC ≤ 70 - - 50 ± 400 170 red
800 .... 808 31809
round 2 800 .... 808 32809
horizontal round 3 700 .... 808 61809
7/105 vertical round 1
top + bottom PC ≤ 70 - - 50 ± 400 170 violet
800 .... 808 31101
round 2 800 .... 808 32101
horizontal round 3 700 .... 808 61101
6/120 vertical round 2 top + bottom PC ≤ 70 - - 50 ± 400 170 violet 800 .... 808 31121
IEC
60418-1
CLAUSE
IEC 60068
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
4.2 method of mounting method A
14 capacitance drift after TC measurement ΔC/C: ≤ 4.5 % for Cmax <40pF;
ΔC/C: ≤ 2.5 % for Cmax ≥40 pF
19 thrust axial thrust of 2 N ΔC/C: ≤ 0.3 %
21 robustness of terminations:
21.1 Ua tensile 1 N no damage
21.2 Ub bending 1 cycle no damage
22 Na rapid change of temperature 1 cycle; 0.5 hours at lower and 0.5
hours at upper category
temperature
ΔC/C: ≤ 1.5 %
23 T soldering:
Ta solderability solder bath immersion 3 mm;
235 °C; 2 s
good wetting
no mechanical damage
Tb resistance to heat solder bath: 260 °C; 10 s no mechanical damage
24 Eb impact bump 4000 ± 10 bumps; 40 g; 6 ms ΔC/C: ≤ 0.4 %;
no mechanical damage