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TechnischeInformation/TechnicalInformation
FZ1200R33KL2C_B5
IGBT-Module
IGBT-modules
preparedby:KHH
approvedby:TS
dateofpublication:2013-03-01
revision:2.1
VorläufigeDaten/PreliminaryDataIGBT,Wechselrichter/IGBT,Inverter
HöchstzulässigeWerte/MaximumRatedValues
Kollektor-Emitter-Sperrspannung
Collector-emittervoltage Tvj = 25°C
Tvj = -25°C VCES 3300
3300 V
Kollektor-Dauergleichstrom
ContinuousDCcollectorcurrent TC = 80°C, Tvj = 150°C
TC = 25°C, Tvj = 150°C
IC nom
IC1200
2300 A
A
PeriodischerKollektor-Spitzenstrom
Repetitivepeakcollectorcurrent tP = 1 ms ICRM 2400 A
Gesamt-Verlustleistung
Totalpowerdissipation TC = 25°C, Tvj = 150°C Ptot 14,5 kW
Gate-Emitter-Spitzenspannung
Gate-emitterpeakvoltage VGES +/-20 V
CharakteristischeWerte/CharacteristicValues min. typ. max.
Kollektor-Emitter-Sättigungsspannung
Collector-emittersaturationvoltage IC = 1200 A, VGE = 15 V
IC = 1200 A, VGE = 15 V VCE sat
3,00
3,70
3,65
4,45
V
V
Tvj = 25°C
Tvj = 125°C
Gate-Schwellenspannung
Gatethresholdvoltage IC = 120 mA, VCE = VGE, Tvj = 25°C VGEth 4,2 5,1 6,0 V
Gateladung
Gatecharge VGE = -15 V ... +15 V, VCE = 1800V QG22,0 µC
InternerGatewiderstand
Internalgateresistor Tvj = 25°C RGint 0,42 Ω
Eingangskapazität
Inputcapacitance f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V Cies 145 nF
Rückwirkungskapazität
Reversetransfercapacitance f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V Cres 8,00 nF
Kollektor-Emitter-Reststrom
Collector-emittercut-offcurrent VCE = 3300 V, VGE = 0 V, Tvj = 25°C ICES 5,0 mA
Gate-Emitter-Reststrom
Gate-emitterleakagecurrent VCE = 0 V, VGE = 20 V, Tvj = 25°C IGES 400 nA
Einschaltverzögerungszeit,induktiveLast
Turn-ondelaytime,inductiveload IC = 1200 A, VCE = 1800 V
VGE = ±15 V
RGon = 4,7 Ω, CGE = 330 nF
td on
1,00
1,00
µs
µs
Tvj = 25°C
Tvj = 125°C
Anstiegszeit,induktiveLast
Risetime,inductiveload IC = 1200 A, VCE = 1800 V
VGE = ±15 V
RGon = 4,7 Ω, CGE = 330 nF
tr
0,40
0,40
µs
µs
Tvj = 25°C
Tvj = 125°C
Abschaltverzögerungszeit,induktiveLast
Turn-offdelaytime,inductiveload IC = 1200 A, VCE = 1800 V
VGE = ±15 V
RGoff = 4,7 Ω, CGE = 330 nF
td off
3,70
3,90
µs
µs
Tvj = 25°C
Tvj = 125°C
Fallzeit,induktiveLast
Falltime,inductiveload IC = 1200 A, VCE = 1800 V
VGE = ±15 V
RGoff = 4,7 Ω, CGE = 330 nF
tf
0,25
0,35
µs
µs
Tvj = 25°C
Tvj = 125°C
EinschaltverlustenergieproPuls
Turn-onenergylossperpulse IC = 1200 A, VCE = 1800 V, LS = 60 nH
VGE = ±15 V, di/dt = 5400 A/µs (Tvj=125°C)
RGon = 2,0 Ω, CGE = 330 nF
Eon 2400
3150
mJ
mJ
Tvj = 25°C
Tvj = 125°C
AbschaltverlustenergieproPuls
Turn-offenergylossperpulse IC = 1200 A, VCE = 1800 V, LS = 60 nH
VGE = ±15 V
RGoff = 4,7 Ω, CGE = 330 nF
Eoff 1400
1900
mJ
mJ
Tvj = 25°C
Tvj = 125°C
Kurzschlußverhalten
SCdata VGE ≤ 15 V, VCC = 2500 V
VCEmax = VCES -LsCE ·di/dt ISC
5200
A
Tvj = 125°C
tP ≤ 10 µs,
Wärmewiderstand,ChipbisGehäuse
Thermalresistance,junctiontocase proIGBT/perIGBT RthJC 8,50 K/kW
Wärmewiderstand,GehäusebisKühlkörper
Thermalresistance,casetoheatsink proIGBT/perIGBT
λPaste=1W/(m·K)/λgrease=1W/(m·K) RthCH 9,00 K/kW