BIPOLAR ANALOG INTEGRATED CIRCUIT PC3241TB D 3.3 V, SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER UE DESCRIPTION The PC3241TB is a silicon monolithic integrated circuit designed as IF amplifier for DBS LNB. This device exhibits low noise figure and high power gain characteristics. This IC is manufactured using our UHS0 (Ultra High Speed Process) bipolar process. FEATURES * Low current : ICC = 19.8 mA TYP. * Power gain : GP = 23.5 dB TYP. @ f = 1.0 GHz O NT IN : GP = 24.0 dB TYP. @ f = 2.2 GHz : GP = 0.7 dB TYP. @ f = 1.0 to 2.2 GHz * Gain flatness * Noise figure : NF = 4.0 dB TYP. @ f = 1.0 GHz : NF = 4.3 dB TYP. @ f = 2.2 GHz * High linearity : PO (1dB) = +7.5 dBm TYP. @ f = 1.0 GHz : PO (1dB) = +6.0 dBm TYP. @ f = 2.2 GHz * Supply voltage : VCC = 3.0 to 3.6 V * Port impedance APPLICATIONS : input/output 50 * IF amplifiers in DBS LNB, other L-band amplifiers, etc. ORDERING INFORMATION Part Number PC3241TB-E3 Order Number Package PC3241TB-E3-A 6-pin super minimold SC (Pb-Free) Marking C3Y Supplying Form Embossed tape 8 mm wide Pin 1, 2, 3 face the perforation side of the tape Qty 3 kpcs/reel Remark To order evaluation samples, please contact your nearby sales office DI Part number for sample order: PC3241TB-A Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge Document No. PU10774EJ01V0DS (1st edition) Date Published June 2009 NS PC3241TB PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM Pin Name 1 INPUT 2 GND 3 GND 4 OUTPUT 5 GND 6 VCC UE D Pin No. PRODUCT LINE-UP OF 3 V or 3.3 V-BIAS SILICON AMPLIFIER (T A = +25C, VCC = Vout = 3.0 V or 3.3 V, ZS = ZL = 50 ) PC2762TB VCC ICC GP NF PO (1 dB) PO (sat) (V) (mA) (dB) (dB) (dBm) (dBm) 26.5 13.0 (0.9 GHz) 6.5 (0.9 GHz) 3.0 PC2763TB 27.0 PC2771TB 36.0 PC8181TB 23.0 PC8182TB 30.0 3.3 29.0 PC3241TB 19.8 8.0 (0.9 GHz) super 7.0 (1.9 GHz) 7.0 (1.9 GHz) 8.5 (1.9 GHz) 20.0 (0.9 GHz) 5.5 (0.9 GHz) 9.5 (0.9 GHz) 11.0 (0.9 GHz) 21.0 (1.9 GHz) 5.5 (1.9 GHz) 6.5 (1.9 GHz) 8.0 (1.9 GHz) 21.0 (0.9 GHz) 6.0 (0.9 GHz) 11.5 (0.9 GHz) 12.5 (0.9 GHz) 21.0 (1.5 GHz) 6.0 (1.5 GHz) 9.5 (1.5 GHz) 11.0 (1.5 GHz) 19.0 (0.9 GHz) 4.5 (0.9 GHz) 8.0 (0.9 GHz) 9.5 (0.9 GHz) 21.0 (1.9 GHz) 4.5 (1.9 GHz) 7.0 (1.9 GHz) 9.0 (1.9 GHz) 22.0 (2.4 GHz) 4.5 (2.4 GHz) 7.0 (2.4 GHz) 9.0 (2.4 GHz) 21.5 (0.9 GHz) 4.5 (0.9 GHz) 9.5 (0.9 GHz) 11.0 (0.9 GHz) 20.5 (1.9 GHz) 4.5 (1.9 GHz) 9.0 (1.9 GHz) 10.5 (1.9 GHz) 20.5 (2.4 GHz) 5.0 (2.4 GHz) 8.0 (2.4 GHz) 10.0 (2.4 GHz) 25.0 (1.0 GHz) 4.0 (1.0 GHz) 10 (1.0 GHz) 12.5 (1.0 GHz) 25.5 (2.2 GHz) 4.3 (2.2 GHz) 8 (2.2 GHz) 10 (2.2 GHz) 23.5 (1.0 GHz) 4.0 (1.0 GHz) 7.5 (1.0 GHz) 24.0 (2.2 GHz) 4.3 (2.2 GHz) 6.0 (2.2 GHz) DI Data Sheet PU10774EJ01V0DS Package 6-pin Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. 2 OUTPUT 9.0 (0.9 GHz) 15.5 (1.9 GHz) SC PC3239TB MEDIUM O NT IN Part No. MMIC POWER Marking C1Z minimold C2A C2H C3E C3F C3V C3Y PC3241TB ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Ratings Unit Supply Voltage VCC TA = +25C, pin 4 and 6 4.0 V Total Circuit Current ICC TA = +25C, pin 4 and 6 55 mA Power Dissipation PD TA = +85C 270 mW Operating Ambient Temperature TA 40 to +85 C Storage Temperature Tstg 55 to +150 C Input Power Pin 10 dBm D UE TA = +25C Note Note Mounted on double-sided copper-clad 50 50 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Parameter Conditions MIN. TYP. MAX. Unit VCC The same voltage should be applied to 3.0 3.3 3.6 V +25 +85 C O NT IN Supply Voltage Symbol pin 4 and 6. 40 TA DI SC Operating Ambient Temperature Data Sheet PU10774EJ01V0DS 3 PC3241TB ELECTRICAL CHARACTERISTICS (T A = +25C, VCC = Vout = 3.3 V, ZS = ZL = 50 , unless otherwise specified) Symbol Test Conditions MIN. TYP. MAX. Unit No input signal 15 19.8 25 mA 23 26 dB ICC Power Gain 1 GP1 f = 0.25 GHz, Pin = 30 dBm 20 Power Gain 2 GP2 f = 1.0 GHz, Pin = 30 dBm 20.5 Power Gain 3 GP3 f = 1.8 GHz, Pin = 30 dBm 21 Power Gain 4 GP4 f = 2.2 GHz, Pin = 30 dBm 21 Gain 1 dB Compression Output Power 4.0 4.8 4.3 5.1 f = 1.0 GHz, Pin = 30 dBm 27 32 ISL2 f = 2.2 GHz, Pin = 30 dBm 28 33 RLin1 f = 1.0 GHz, Pin = 30 dBm 15 20 RLin2 f = 2.2 GHz, Pin = 30 dBm 10 16 RLout1 f = 1.0 GHz, Pin = 30 dBm 11 17 RLout2 f = 2.2 GHz, Pin = 30 dBm 13 25 Noise Figure 1 NF1 f = 1.0 GHz Noise Figure 2 NF2 f = 2.2 GHz Isolation 1 ISL1 O NT IN Output Return Loss 2 27 +6.0 f = 2.2 GHz Output Return Loss 1 24 +3.0 PO (1 dB) 2 Input Return Loss 2 27 2 Input Return Loss 1 24 +7.5 f = 1.0 GHz Isolation 2 26.5 +4.5 PO (1 dB) 1 1 Gain 1 dB Compression Output Power 23.5 UE Circuit Current D Parameter dBm dB dB dB dB STANDARD CHARACTERISTICS FOR REFERENCE (T A = +25C, VCC = Vout = 3.3 V, ZS = ZL = 50 , unless otherwise specified) Parameter Power Gain 5 Power Gain 6 Gain Flatness K factor 2 Test Conditions Reference Value Unit dB GP5 f = 2.6 GHz, Pin = 30 dBm 24 GP6 f = 3.0 GHz, Pin = 30 dBm 23 GP f = 1.0 to 2.2 GHz, Pin = 30 dBm 0.7 dB K1 f = 1.0 GHz, Pin = 30 dBm 1.4 K2 f = 2.2 GHz, Pin = 30 dBm 1.5 dBm SC K factor 1 Symbol Output 3rd Order Intercept Point 1 OIP31 f1 = 1 000 MHz, f2 = 1 001 MHz 19.5 Output 3rd Order Intercept Point 2 OIP32 f1 = 2 200 MHz, f2 = 2 201 MHz 15 Input 3rd Order Intercept Point 1 IIP31 f1 = 1 000 MHz, f2 = 1 001 MHz 4 Input 3rd Order Intercept Point 2 IIP32 f1 = 2 200 MHz, f2 = 2 201 MHz 9 IM2 f1 = 1 000 MHz, f2 = 1 001 MHz, 50 dBc 65 dBc DI 2nd Order Intermodulation Distortion 2nd Harmonics 4 dBm Pout = 5 dBm/tone 2f0 f0 = 1.0 GHz, Pout = 15 dBm Data Sheet PU10774EJ01V0DS PC3241TB UE D TEST CIRCUIT O NT IN The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL CHARACTERISTICS L1 Note C1, C2 C3, C5 C4 Type Value Chip Inductor 100 nH Chip Capacitor 100 pF Chip Capacitor 1 000 pF Feed-through Capacitor 1 000 pF Note There is a case to show a dimple wave of characteristic by a chip inductor L1 part in the high frequency area. In that case, please reduce a value of L1. INDUCTOR FOR THE OUTPUT PIN The internal output transistor of this IC, to output medium power. To supply current for output transistor, connect SC an inductor between the VCC pin (pin 6) and output pin (pin 4). Select inductance, as the value listed above. The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum voltage drop to output enable high level. In terms of AC, the inductor makes output-port impedance higher to get enough gain. In this case, large inductance and Q is suitable (Refer to the following page). CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS Capacitors of 1 000 pF are recommendable as the bypass capacitor for the VCC pin and the coupling capacitors for DI the input and output pins. The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias can be supplied against VCC fluctuation. The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial impedance. Their capacitances are therefore selected as lower impedance against a 50 load. The capacitors thus perform as high pass filters, suppressing low frequencies to DC. Data Sheet PU10774EJ01V0DS 5 PC3241TB O NT IN UE D ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD Notes COMPONENT LIST Type Value Size Chip Inductor 100 nH 1005 C1, C2 Chip Capacitor 100 pF 1608 C3, C5 Chip Capacitor 1 000 pF 1005 Feed-through Capacitor 1 000 pF L1 1. 30 30 0.4 mm double sided 35 m copper clad polyimide board. 2. Back side: GND pattern 4. DI SC C4 3. Solder plated on pattern 6 Data Sheet PU10774EJ01V0DS : Through holes PC3241TB DI SC O NT IN UE D TYPICAL CHARACTERISTICS (TA = +25C, VCC = Vout = 3.3 V, ZS = ZL = 50 , unless otherwise specified) Remark The graphs indicate nominal characteristics. Data Sheet PU10774EJ01V0DS 7 DI SC O NT IN UE D PC3241TB Remark The graphs indicate nominal characteristics. 8 Data Sheet PU10774EJ01V0DS O NT IN UE D PC3241TB DI SC Remark The graphs indicate nominal characteristics. Data Sheet PU10774EJ01V0DS 9 DI SC O NT IN UE D PC3241TB Remark The graphs indicate nominal characteristics. 10 Data Sheet PU10774EJ01V0DS DI SC O NT IN UE D PC3241TB Remark The graphs indicate nominal characteristics. Data Sheet PU10774EJ01V0DS 11 DI SC O NT IN UE D PC3241TB Remark The graphs indicate nominal characteristics. 12 Data Sheet PU10774EJ01V0DS DI SC O NT IN UE D PC3241TB Remark The graphs indicate nominal characteristics. Data Sheet PU10774EJ01V0DS 13 O NT IN UE D PC3241TB DI SC Remark The graphs indicate nominal characteristics. 14 Data Sheet PU10774EJ01V0DS PC3241TB S-PARAMETERS (T A = +25C, VCC = Vout = 3.3 V, Pin = 30 dBm) DI SC S22FREQUENCY O NT IN UE D S11FREQUENCY Remarks 1. Measured on the test circuit of evaluation board. 2. The graphs indicate nominal characteristics. Data Sheet PU10774EJ01V0DS 15 PC3241TB DI SC O NT IN UE D S-PARAMETERS 16 Data Sheet PU10774EJ01V0DS PC3241TB PACKAGE DIMENSIONS DI SC O NT IN UE D 6-PIN SUPER MINIMOLD (UNIT: mm) Data Sheet PU10774EJ01V0DS 17 PC3241TB NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground terminals must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to the VCC line. D (4) The inductor (L) must be attached between VCC and output pins. The inductance value should be determined in accordance with desired frequency. RECOMMENDED SOLDERING CONDITIONS UE (5) The DC cut capacitor must be attached to input and output pin. This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Wave Soldering Partial Heating Condition Symbol Peak temperature (package surface temperature) : 260C or below Time at peak temperature : 10 seconds or less O NT IN Infrared Reflow Soldering Conditions Time at temperature of 220C or higher : 60 seconds or less Preheating time at 120 to 180C : 12030 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below DI SC Caution Do not use different soldering methods together (except for partial heating). IR260 WS260 HS350