Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC3241TB
3.3 V, SILICON MMIC MEDIUM
OUTPUT POWER AMPLIFIER
Document No. PU10774EJ01V0DS (1st edition)
Date Published June 2009 NS
DESCRIPTION
The
PC3241TB is a silicon monolithic integrated circuit designed as IF amplifier for DBS LNB.
This device exhibits low noise figure and high power gain characteristics.
This IC is manufactured using our UHS0 (Ultra High Speed Process) bipolar process.
FEATURES
•Low current : ICC = 19.8 mA TYP.
•Power gain : GP = 23.5 dB TYP. @ f = 1.0 GHz
: GP = 24.0 dB TYP. @ f = 2.2 GHz
•Gain flatness :
GP = 0.7 dB TYP. @ f = 1.0 to 2.2 GHz
•Noise figure : NF = 4.0 dB TYP. @ f = 1.0 GHz
: NF = 4.3 dB TYP. @ f = 2.2 GHz
•High linearity : PO (1dB) = +7.5 dBm TYP. @ f = 1.0 GHz
: PO (1dB) = +6.0 dBm TYP. @ f = 2.2 GHz
•Supply voltage : VCC = 3.0 to 3.6 V
•Port impedance : input/output 50
APPLICATIONS
•IF amplifiers in DBS LNB, other L-band amplifiers, etc.
ORDERING INFORMATION
Part Number
Order Number
Package
Marking
Supplying Form
PC3241TB-E3
PC3241TB-E3-A
6-pin super minimold
(Pb-Free)
C3Y
Embossed tape 8 mm wide
Pin 1, 2, 3 face the perforation side of the tape
Qty 3 kpcs/reel
Remark To order evaluation samples, please contact your nearby sales office
Part number for sample order:
PC3241TB-A
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Data Sheet PU10774EJ01V0DS
PC3241TB
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
Pin No.
Pin Name
1
INPUT
2
GND
3
GND
4
OUTPUT
5
GND
6
VCC
PRODUCT LINE-UP OF 3 V or 3.3 V-BIAS SILICON MMIC MEDIUM OUTPUT POWER
AMPLIFIER
(TA = +25°C, VCC = Vout = 3.0 V or 3.3 V, ZS = ZL = 50 )
Part No.
VCC
(V)
ICC
(mA)
GP
(dB)
NF
(dB)
PO (1 dB)
(dBm)
PO (sat)
(dBm)
Package
Marking
PC2762TB
3.0
26.5
13.0 (0.9 GHz)
15.5 (1.9 GHz)
6.5 (0.9 GHz)
7.0 (1.9 GHz)
＋8.0 (0.9 GHz)
＋7.0 (1.9 GHz)
＋9.0 (0.9 GHz)
＋8.5 (1.9 GHz)
6-pin
super
minimold
C1Z
PC2763TB
27.0
20.0 (0.9 GHz)
21.0 (1.9 GHz)
5.5 (0.9 GHz)
5.5 (1.9 GHz)
＋9.5 (0.9 GHz)
＋6.5 (1.9 GHz)
＋11.0 (0.9 GHz)
＋8.0 (1.9 GHz)
C2A
PC2771TB
36.0
21.0 (0.9 GHz)
21.0 (1.5 GHz)
6.0 (0.9 GHz)
6.0 (1.5 GHz)
＋11.5 (0.9 GHz)
＋9.5 (1.5 GHz)
＋12.5 (0.9 GHz)
＋11.0 (1.5 GHz)
C2H
PC8181TB
23.0
19.0 (0.9 GHz)
21.0 (1.9 GHz)
22.0 (2.4 GHz)
4.5 (0.9 GHz)
4.5 (1.9 GHz)
4.5 (2.4 GHz)
＋8.0 (0.9 GHz)
＋7.0 (1.9 GHz)
＋7.0 (2.4 GHz)
＋9.5 (0.9 GHz)
＋9.0 (1.9 GHz)
＋9.0 (2.4 GHz)
C3E
PC8182TB
30.0
21.5 (0.9 GHz)
20.5 (1.9 GHz)
20.5 (2.4 GHz)
4.5 (0.9 GHz)
4.5 (1.9 GHz)
5.0 (2.4 GHz)
＋9.5 (0.9 GHz)
＋9.0 (1.9 GHz)
＋8.0 (2.4 GHz)
＋11.0 (0.9 GHz)
＋10.5 (1.9 GHz)
＋10.0 (2.4 GHz)
C3F
PC3239TB
3.3
29.0
25.0 (1.0 GHz)
25.5 (2.2 GHz)
4.0 (1.0 GHz)
4.3 (2.2 GHz)
＋10 (1.0 GHz)
＋8 (2.2 GHz)
＋12.5 (1.0 GHz)
＋10 (2.2 GHz)
C3V
PC3241TB
19.8
23.5 (1.0 GHz)
24.0 (2.2 GHz)
4.0 (1.0 GHz)
4.3 (2.2 GHz)
＋7.5 (1.0 GHz)
＋6.0 (2.2 GHz)
C3Y
Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
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Data Sheet PU10774EJ01V0DS
3
PC3241TB
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Conditions
Ratings
Unit
Supply Voltage
VCC
TA = +25°C, pin 4 and 6
4.0
V
Total Circuit Current
ICC
TA = +25°C, pin 4 and 6
55
mA
Power Dissipation
PD
TA = +85C Note
270
mW
Operating Ambient Temperature
TA
40 to +85
°C
Storage Temperature
Tstg
55 to +150
°C
Input Power
Pin
TA = +25°C
10
dBm
Note Mounted on double-sided copper-clad 50 50 1.6 mm epoxy glass PWB
RECOMMENDED OPERATING RANGE
Parameter
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
Supply Voltage
VCC
The same voltage should be applied to
pin 4 and 6.
3.0
3.3
3.6
V
Operating Ambient Temperature
TA
40
+25
+85
°C
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Data Sheet PU10774EJ01V0DS
PC3241TB
ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = Vout = 3.3 V, ZS = ZL = 50 , unless otherwise
specified)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Circuit Current
ICC
No input signal
15
19.8
25
mA
Power Gain 1
GP1
f = 0.25 GHz, Pin = 30 dBm
20
23
26
dB
Power Gain 2
GP2
f = 1.0 GHz, Pin = 30 dBm
20.5
23.5
26.5
Power Gain 3
GP3
f = 1.8 GHz, Pin = 30 dBm
21
24
27
Power Gain 4
GP4
f = 2.2 GHz, Pin = 30 dBm
21
24
27
Gain 1 dB Compression Output Power
1
PO (1 dB) 1
f = 1.0 GHz
+4.5
+7.5
dBm
Gain 1 dB Compression Output Power
2
PO (1 dB) 2
f = 2.2 GHz
+3.0
+6.0
Noise Figure 1
NF1
f = 1.0 GHz
4.0
4.8
dB
Noise Figure 2
NF2
f = 2.2 GHz
4.3
5.1
Isolation 1
ISL1
f = 1.0 GHz, Pin = 30 dBm
27
32
dB
Isolation 2
ISL2
f = 2.2 GHz, Pin = 30 dBm
28
33
Input Return Loss 1
RLin1
f = 1.0 GHz, Pin = 30 dBm
15
20
dB
Input Return Loss 2
RLin2
f = 2.2 GHz, Pin = 30 dBm
10
16
Output Return Loss 1
RLout1
f = 1.0 GHz, Pin = 30 dBm
11
17
dB
Output Return Loss 2
RLout2
f = 2.2 GHz, Pin = 30 dBm
13
25
STANDARD CHARACTERISTICS FOR REFERENCE
(TA = +25°C, VCC = Vout = 3.3 V, ZS = ZL = 50 , unless otherwise specified)
Parameter
Symbol
Test Conditions
Reference Value
Unit
Power Gain 5
GP5
f = 2.6 GHz, Pin = 30 dBm
24
dB
Power Gain 6
GP6
f = 3.0 GHz, Pin = 30 dBm
23
Gain Flatness
GP
f = 1.0 to 2.2 GHz, Pin = 30 dBm
0.7
dB
K factor 1
K1
f = 1.0 GHz, Pin = 30 dBm
1.4
K factor 2
K2
f = 2.2 GHz, Pin = 30 dBm
1.5
Output 3rd Order Intercept Point 1
OIP31
f1 = 1 000 MHz, f2 = 1 001 MHz
19.5
dBm
Output 3rd Order Intercept Point 2
OIP32
f1 = 2 200 MHz, f2 = 2 201 MHz
15
Input 3rd Order Intercept Point 1
IIP31
f1 = 1 000 MHz, f2 = 1 001 MHz
4
dBm
Input 3rd Order Intercept Point 2
IIP32
f1 = 2 200 MHz, f2 = 2 201 MHz
9
2nd Order Intermodulation Distortion
IM2
f1 = 1 000 MHz, f2 = 1 001 MHz,
Pout = 5 dBm/tone
50
dBc
2nd Harmonics
2f0
f0 = 1.0 GHz, Pout = 15 dBm
65
dBc
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Data Sheet PU10774EJ01V0DS
5
PC3241TB
TEST CIRCUIT
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
COMPONENTS OF TEST CIRCUIT FOR MEASURING
ELECTRICAL CHARACTERISTICS
Type
Value
L1 Note
Chip Inductor
100 nH
C1, C2
Chip Capacitor
100 pF
C3, C5
Chip Capacitor
1 000 pF
C4
Feed-through Capacitor
1 000 pF
Note There is a case to show a dimple wave of characteristic by a chip inductor L1 part in the high frequency area.
In that case, please reduce a value of L1.
INDUCTOR FOR THE OUTPUT PIN
The internal output transistor of this IC, to output medium power. To supply current for output transistor, connect
an inductor between the VCC pin (pin 6) and output pin (pin 4). Select inductance, as the value listed above.
The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum
voltage drop to output enable high level. In terms of AC, the inductor makes output-port impedance higher to get
enough gain. In this case, large inductance and Q is suitable (Refer to the following page).
CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS
Capacitors of 1 000 pF are recommendable as the bypass capacitor for the VCC pin and the coupling capacitors for
the input and output pins.
The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias
can be supplied against VCC fluctuation.
The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial
impedance. Their capacitances are therefore selected as lower impedance against a 50 load. The capacitors thus
perform as high pass filters, suppressing low frequencies to DC.
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Data Sheet PU10774EJ01V0DS
PC3241TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
Notes
1. 30 30 0.4 mm double sided 35
m
copper clad polyimide board.
2. Back side: GND pattern
3. Solder plated on pattern
4. : Through holes
COMPONENT LIST
Type
Value
Size
L1
Chip Inductor
100 nH
1005
C1, C2
Chip Capacitor
100 pF
1608
C3, C5
Chip Capacitor
1 000 pF
1005
C4
Feed-through Capacitor
1 000 pF
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Data Sheet PU10774EJ01V0DS
7
PC3241TB
TYPICAL CHARACTERISTICS (T
A
= +25
C, V
CC
= V
out
= 3.3 V, Z
S
= Z
L
= 50
, unless otherwise specified)
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10774EJ01V0DS
PC3241TB
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10774EJ01V0DS
9
PC3241TB
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10774EJ01V0DS
10
PC3241TB
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10774EJ01V0DS
11
PC3241TB
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10774EJ01V0DS
12
PC3241TB
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10774EJ01V0DS
13
PC3241TB
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10774EJ01V0DS
14
PC3241TB
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10774EJ01V0DS
15
PC3241TB
S-PARAMETERS (TA = +25C, VCC = Vout = 3.3 V, Pin = 30 dBm)
S11FREQUENCY
S22FREQUENCY
Remarks 1. Measured on the test circuit of evaluation board.
2. The graphs indicate nominal characteristics.
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Data Sheet PU10774EJ01V0DS
16
PC3241TB
S-PARAMETERS
DISCONTINUED
Data Sheet PU10774EJ01V0DS
17
PC3241TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
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PC3241TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground terminals must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to the VCC line.
(4) The inductor (L) must be attached between VCC and output pins. The inductance value should be determined in
accordance with desired frequency.
(5) The DC cut capacitor must be attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Peak temperature (package surface temperature) : 260C or below
Time at peak temperature : 10 seconds or less
Time at temperature of 220C or higher : 60 seconds or less
Preheating time at 120 to 180C : 12030 seconds
Maximum number of reflow processes : 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
IR260
Wave Soldering
Peak temperature (molten solder temperature) : 260C or below
Time at peak temperature : 10 seconds or less
Preheating temperature (package surface temperature) : 120C or below
Maximum number of flow processes : 1 time
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (terminal temperature) : 350C or below
Soldering time (per side of device) : 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
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