ZMXM-400 Series
MATRIX TRANSCEIVER MODULES
The Matrix module is a 2.4 GHz IEEE 802.15.4 RF transceiver providing a cost-
effective solution for data links and wireless networks. The module design is
based on the IEEE 802.15.4 standard and supports peer-to-peer, star,
and mesh networking. The Matrix module is offered with two trans-
mitter output power options, either 10mW or 100mW, providing for
enhanced range performance over standard IEEE 802.15.4/ZigBee
implementations with the integrated power amplier. Additionally, each
module offers a Dynamic Power Conguration capability giving the ability to
bypass the power amplier for a 1mW power output when low power operation is
imperative.
The Matrix module consists of the Texas Instruments CC2430, 10mW or 100mW Power Amplier, and integrated PCB
trace antenna. The module has the option to be populated with a MMCX connector for use with an external cabled
antenna. The module is FCC, IC, and CE certied for fast and simple integration into end applications. The Matrix mod-
ules provide the lowest cost, best in class performance, in a compact form factor.
DESCRIPTION
Integrated Transceiver Module for ZigBee/IEEE 802.15.4
Evaluation Kits available
FEATURES
• Supports LS Research or Z-Stack™ protocols
• Miniature Footprint:
10mW ( 23.4 x 28.7 mm)
100mW (23.4 x 31.2 mm)
• Integrated certied PCB trace antenna
• Optional MMCX connector for external antenna
• 16 RF channels
(Channel 16 operates at reduced power levels)
• Long Range:
10mW - up to 2000 feet
100mW - up to 4000 feet
• Output power software controlled:
1mW - 10mW or
1mW - 100mW
The information in this document is subject to change without notice, please conrm data is current
Document No: 0004-00-07-00-000 (Issue C)
Date Published: December 4, 2009
• 17 General Purpose I/O ports
• Windows® Based Test Tools
• Serial UART interface
• Lowest Power Consumption
• Compliance Certication:
10mW - FCC (USA), IC (Canada), and CE (Europe) certification
100mW - FCC (USA) and IC (Canada) certification
• RoHS compliant
NOT RECOMMENDED
FOR NEW DESIGN
ZMXM-400 Series
MATRIX MODULES ORDERING INFORMATION
Part Number Order Number Description Mins/Mults Status
Matrix 10mW
ZMXM-400
ZMXM-400-1 Matrix 10mW transceiver module PCB Trace Antenna 180 pcs / 180 pcs Not Recommended
For New Design
ZMXM-400-1-B Matrix 10mW transceiver module PCB Trace Antenna Bulk
(1 tray) 36 pcs / 36 pcs Not Recommended
For New Design
ZMXM-400-1C Matrix 10mW transceiver MMCX connector installed 1,040 pcs / 180 pcs Not Recommended
For New Design
ZMXM-400-1C-B Matrix 10mW transceiver MMCX connector installed Bulk (1
tray) N/A Discontinued
ZMXM-400-KIT-2 10mW Matrix Module Kit 1 Not Recommended
For New Design
Matrix 100mW
ZMXM-401
ZMXM-401-1 Matrix 100mW transceiver module PCB Trace Antenna N/A Discontinued
ZMXM-401-1-B Matrix 100mW transceiver module PCB Trace Antenna Bulk
(1 tray) N/A Discontinued
ZMXM-401-1C Matrix 100mW transceiver module PCB Trace Antenna
MMCX connector installed N/A Discontinued
ZMXM-401-1C-B Matrix 100mW transceiver module PCB Trace Antenna
MMCX connector installed Bulk (1 tray) N/A Discontinued
NOT RECOMMENDED
FOR NEW DESIGN
ZMXM-400 Series
ABSOLUTE MAXIMUM RATINGS
Rating Value Unit
Power Supply Voltage 3.6 Vdc
Voltage on Any Digital Pin VDD + 0.3,
Max 3.6 Vdc
RF Input Power +10 dBm
Storage Temperature Range -45 to 125 ºC
OPERATING CONDITIONS
Note: Exceeding the maximum ratings may cause permanent damage to the module or devices.
Caution: Matrix modules are sensitive to electrostatic discharge, observe precautions when handling.
Characteristic Min Typ Max Unit
Power Supply Voltage (Vdd)
10mW 2.1 3.3 3.6 Vdc
100mW 2.4 3.3 3.6 Vdc
Input Frequency 2405 2480 MHz
Ambient Temperature Range -40 25 85 ºC
Logic Input Low Voltage 030% Vdd V
Logic Input High Voltage 70%
Vdd Vdd V
NOT RECOMMENDED
FOR NEW DESIGN
ZMXM-400 Series
ELECTRICAL SPECIFICATIONS (@ 25 ºC, Vdd = 3.3V, unless otherwise noted)
Parameter Min Typ Max Unit
General Charcteristics
RF Frequency Range 2400 2483.5 MHz
RF Data Rate 250 kbps
Host Data Rate
10 mW 115.2 kbps
100 mW 115.2 kbps
Flash Memory 128 kB
RAM 8 kB
Power Consumption
Transmit Mode
10mW 50 mA
100mW 130 mA
Receive Mode
10mW 33 mA
100mW 33 mA
Standby Mode
10mW 5 μA
100mW 5 μA
Transmitter
Nominal Output Power
10mW 10 dBm
100mW 20 dBm
Nominal Output Power (DPS) -1 dBm
Programmable Output Power range 24 dB
Error Vector Magnitude 12 35 %
Receiver
Module Sensitivity (1% PER) -89 dBm
Receiver Sensitivity (1% PER) -92 dBm
Saturation (Maximum Input Level) (1% PER) 0 10 dBm
Control AC Characteristics
RESET_N low pulse width 2.5 ns
Interrupt request pulse width 31.25 ns
Control DC Characteristics
Logic Input Low 0 0.7 0.9 V
Logic Input High VDD-0.25 VDD VDD V
Logic Output Low 0 0 0.25 V
Logic Output High VDD-0.25 VDD VDD V
I/O pin pull-up and pull-down resistor 17 20 23 kΩ
Note: Please refer to the Texas Instruments CC2430 datasheet for further information and details regarding the
conguration of the I/O ports.
NOT RECOMMENDED
FOR NEW DESIGN
ZMXM-400 Series
PIN SIGNALS I/O PORT CONFIGURATION
Matrix modules have 24 edge I/O interfaces for connection to the host board.
Figure 1 shows the layout of the 24 edge castellations.
Figure 1
I/O PIN ASSIGNMENTS
Pin # Name Type Description
1GROUND GND Ground
2P0_2 DI/DO/AI General Purpose Digital I/0 Port 0_2 or ADC input 2
3 P0_3 DI/DO/AI General Purpose Digital I/0 Port 0_3 or ADC input 3
4P0_4 DI/DO/AI General Purpose Digital I/0 Port 0_4 or ADC input 4
5P0_5 DI/DO/AI General Purpose Digital I/0 Port 0_5 or ADC input 5
6 P0_6 DI/DO/AI General Purpose Digital I/0 Port 0_6 or ADC input 6
7 P0_7 DI/DO/AI General Purpose Digital I/0 Port 0_7 or ADC input 7
8GROUND GND Ground
9MODE0 DI/DO General Purpose Digital I/O Port 2_2 or Debug CLK
10 MODE1 DI/DO General Purpose Digital I/O Port 2_1 or Debug DATA (DD)
11 MODE2 DI/DO General Purpose Digital I/O Port 2_0
12 P1_7 DI/DO General Purpose Digital I/O Port 1_7
13 P1_6 DI/DO General Purpose Digital I/O Port 1_6
14 TXD DI/DO General Purpose Digital I/O Port 1_5 or Application Transmit Data Output
15 RXD DI/DO General Purpose Digital I/O Port 1_4 or Application Receive Data Input
16 P1_3 DI/DO General Purpose Digital I/O Port 1_3
17 GROUND GND Ground
18 P1_1 DI/DO General Purpose Digital I/O Port 1_1, 20mA drive capability
19 P1_0 DI/DO General Purpose Digital I/O Port 1_0, 20mA drive capability
20 RESET DI Reset, active low
21 P0_0 DI/DO/AI General Purpose Digital I/0 Port 0_0 or ADC input 0
Optional on-board Green LED
22 P0_1 DI/DO/AI General Purpose Digital I/0 Port 0_1 or ADC input 1Optional on-board Red LED
23 VDD PI Power Supply Input
24 GROUND GND Ground
Unused I/O pins should be left unconnected and the pin state set via the Host Protocol.
DI = Digital Input PI = Power Input
DO = Digital Output GND = Ground
AI = Analog Input
AO = Analog Output
PIN 1
PIN 8
PIN 9
PIN 16
PIN 24
PIN 17
NOT RECOMMENDED
FOR NEW DESIGN
ZMXM-400 Series
ANTENNA
The Matrix module includes an integrated PCB trace antenna. An optional conguration with a MMCX connector is also
available. The module regulatory certication has been completed with the PCB trace antenna and also with a Nearson
(part# S131CL-5-RMM-2450S) dipole antenna on a 5 inch cable using the MMCX connection.
The integrated PCB antenna topology is an F-antenna. This antenna is used because it is reasonably compact, has a
fairly omni-directional radiation pattern, good efciency, and is very simple. An adequate ground plane directly beneath the
module but not under the antenna is necessary to provide good efciency.
The antenna radiation patterns are dependent upon the carrier board the Matrix module is placed upon. Measured
radiation patterns of the module alone are available by contacting LS Research.
The environment the module is placed in will dictate the range performance. The non-ideal characteristics of the
transmission channel result in the transmitted signal producing reection, diffraction, and/or scattering. All of these factors
randomly combine to create extremely complex scenarios.
It is also best to keep some clearance between the antenna and nearby objects. This includes how the module is mounted
in the product enclosure. Unless the items on the following list of recommendations are met, the radiation pattern can be
heavily distorted.
• Never place ground plane or copper trace routing underneath the antenna.
• Never place the antenna very close to metallic objects.
• In the nal product, ensure that any wiring or other components do not get too close to the antenna.
• The antenna will need a reasonable ground plane area on the mother board area to be efcient.
• Do not use a metallic enclosure or metallized plastic for the antenna.
• Try to keep any plastic enclosure greater than 1 cm from the antenna in any orientation.
POWER AMPLIFIER
Both variants of the Matrix modules contain a Power Amplier. The Matrix 10 mW (ZMXM-400) has a maximum Power Out
of 10 mW, while the Matrix 100 mW has a maximum Power Out of 100 mW.
The Power Amplier is controlled via the P1_2 General Purpose I/O (GPIO) of the Texas Instruments CC2430. As such, the
P1_2 GPIO needs to be congured as an output in the application source code to enable control the Power Amplier.
When P1_2 drives LOW (i.e. logic level ‘0’) the Power Amplier is disabled and maximum Power Out is 1 mW regardless
of module in use. When P1_2 drives HIGH (i.e. logic level ‘1’) the Power Amplier is enabled and maximum Power Out is
either 10 mW or 100 mW depending upon which variant of the Matrix module is in use. Intermediate power level settings
(i.e. between 1 mW and 10 or 100 mW) may be achieved by enabling the power amplier and then varying the Power Out
of the CC2430.
NOT RECOMMENDED
FOR NEW DESIGN
ZMXM-400 Series
DIMENSIONS: ZMXM-400-1 Matrix Module 10mW
Dimensions in inches. Tolerances = +/-0.005” unless otherwise noted.
PIN 1: GROUND
P0_2
P0_3
P0_4
P0_5
P0_6
P0_7
0.060
0.415
Optional MMCX Connector
for external antenna
Overall Height
w/MMCX Connector
J2 J2
X3
1.130
PIN 8: GROUND
PIN 9: MODE 0
MODE 1
MODE 2
P1_7
P1_6
TXD
RXD
PIN 16: P1_3
PIN 24: GROUND
+ 3.3V
P0_1
P0_0
RESET
P1_0
P1_1
PIN 17: GROUND
0.920
0.655
RF Shield
0.203
DIMENSIONS: ZMXM-400-1C Matrix Module 10mW with Optional MMCX Connector
Dimensions in inches. Tolerances = +/-0.005” unless otherwise noted.
PIN 1: GROUND
P0_2
P0_3
P0_4
P0_5
P0_6
P0_7
0.060
X3
1.130
PIN 8: GROUND
PIN 9: MODE 0
MODE 1
MODE 2
P1_7
P1_6
TXD
RXD
PIN 16: P1_3
PIN 24: GROUND
+3.3V
P0_1
P0_0
RESET
P1_0
P1_1
PIN 17: GROUND
0.920
0.655
RF Shield
0.194
PCB Trace Antenna
NOT RECOMMENDED
FOR NEW DESIGN
ZMXM-400 Series
DIMENSIONS: ZMXM-401-1 Matrix Module 100mW
Dimensions in inches. Tolerances = +/-0.005” unless otherwise noted.
PIN 1: GROUND
P0_2
P0_3
P0_4
P0_5
P0_6
P0_7
0.060
0.415
Optional MMCX Connector
for external antenna
Overall Height
w/MMCX Connector
J2 J2
X3
1.230
PIN 8: GROUND
PIN 9: MODE 0
MODE 1
MODE 2
P1_7
P1_6
TXD
RXD
PIN 16: P1_3
PIN 24: GROUND
+3.3V
P0_1
P0_0
RESET
P1_0
P1_1
PIN 17: GROUND
0.920
0.768
RF Shield
0.203
DIMENSIONS: ZMXM-401-1C Matrix Module 100mW with Optional MMCX Connector
Dimensions in inches. Tolerances = +/-0.005” unless otherwise noted.
PIN 1: GROUND
P0_2
P0_3
P0_4
P0_5
P0_6
P0_7
0.060
X3
1.230
PIN 8: GROUND
PIN 9: MODE 0
MODE 1
MODE 2
P1_7
P1_6
TXD
RXD
PIN 16: P1_3
PIN 24: GROUND
+3.3V
P0_1
P0_0
RESET
P1_0
P1_1
PIN 17: GROUND
0.920
0.768
RF Shield
0.194
PCB Trace Antenna
NOT RECOMMENDED
FOR NEW DESIGN
ZMXM-400 Series
PIN 1 PIN 24
0.455 0.455
0.700
0.105
0.005
0.105
0.100 Pitch Typ
0.085
0.085
0.080 Typ 24 Pads
0.080
0.085 Typ 24 Pads
PCB PAD LAYOUT Dimensions in inches. Tolerances = +/-0.005” unless otherwise noted.
PCB KEEP-OUT AREAS Dimensions in inches. Tolerances = +/-0.005” unless otherwise noted.
Matrix Module 10mW Matrix Module 100mW
PIN 1 PIN 24
0.270
0.175
0.990
0.2050.230
Exposed PCB Trace
Top Layer Keep-Out Area
Minimum PCB Trace, Plane and Component
Keep-Out Area, All Layers
Recommended
Host PCB Edge
0.345
0.080
PIN 1 PIN 24
0.270
0.175
0.990
0.2600.230
Exposed PCB Trace
Top Layer Keep-Out Area
Minimum PCB Trace,
Plane & Component
Keep-Out Area, All Layers
Recommended
Host PCB Edge
0.345
0.185
Note: Matrix modules should be mounted so the antenna is overhanging the board edge. This will provide the best antenna performance
for the PCB trace antenna. It is also recommended to have a ground plane on the host board underneath the rest of the module,
up to the recommended PCB edge. This will improve the antenna performance by increasing the overall ground plane.
Traces can be run underneath the Matrix module on the host PCB as long a there is an uninterrupted ground plane on one layer as
well. CEL can arrange guidance and help with the host PCB layout.
NOT RECOMMENDED
FOR NEW DESIGN
ZMXM-400 Series
AGENCY SAFETY CERTIFICATIONS
FCC Part 15.247 Module Certied (Portable)
The Matrix modules comply with Part 15 of the Federal Communications Commission rules and regulations. To meet the
FCC Certication requirements, the user must meet these regulations.
• The text on the FCC ID label provided with the module is placed on the outside of the nal product.
• The modules may only use the antennas that have been tested and approved with this module.
— The on-board PCB trace antenna
— Nearson S131CL-5-RMM-2450S antenna.
Per section 2.1091, the Matrix module has been certied by the FCC for use with other products without additional
certication. Any modications to this product may violate the rules of the Federal Communications Commission and make
operation of the product unlawful.
Per sections 15.107 and 15.109, the user’s end product must be tested to comply with unintentional radiators for
compliance.
Per Section 47 C.F.R. Sec.15.105(b), the Matrix module is certied as a portable device for the FCC radiation exposure
limits set forth for an uncontrolled environment. The antenna used with this module must be installed to provide a
separation distance of at least 8 inches (20cm) from all persons. If the module is to be used in a handheld application, the
user is responsible for passing the additional FCC part 2.1091 rules (SAR) and FCC Guidelines for Human Exposure to
Radio Frequency Electromagnetic Fields, OET Bulletin and Supplement C.
IC Certication — Canada
Matrix modules are IC certied. The labeling requirements for Industry Canada are similar to those of the FCC. A visible
label on the outside of the nal product must display the IC labeling. The user is responsible for the end product to comply
with IC ICES-003 (Unintentional radiators).
CE Certication — Europe
Matrix modules are EN 300-328-1 certied in Europe. The user must ensure compliance of the nal product with the
European harmonized EMC and safety standards. Annex II of the R&TTE Directive provides the requirements for the
issuance of a Declaration of Conformity. The CE marking must be afxed legibly and indelibly to a visible location on the
user’s product.
FCC Approved Antennas
• Integrated PCB trace antenna
• Nearson S131CL-5-RMM-2450S – A 2.4GHz Dipole antenna with a 5 inch cable and a right angle MMCX connector.
NOT RECOMMENDED
FOR NEW DESIGN
ZMXM-400 Series
SHIPMENT, HANDLING, AND STORAGE
Shipment
Matrix Modules are delivered in single piece, or 50 piece cartons in individual anti-static bags.
Handling
Matrix Modules are designed and packaged to be processed in an automated assembly line.
!Warning Matrix Modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may
destroy or damage the module permanently.
!Warning According to JEDEC ISP, Matrix Modules are moisture sensitive devices. Appropriate handling instructions
and precautions are summarized in Section 2.1. Read carefully to prevent permanent damages due to moisture intake.
Moisture Sensitivity Level (MSL)
MSL 3, per J-STD-033
Storage
Storage/Shelf life in sealed bags is 12 months at <40ºC and <90% relative humidity.
PROCESSING
Reow Soldering
A convection soldering oven is recommended over the infrared radiation type oven. Convection ovens allow more precise
temperature control, and more even heating of parts regardless of material composition, thickness, or color.
Preheat Phase
Initial heating of component leads and solder paste balls, for removal of residual humidity.
Note: The preheat phase is not intended to replace prior baking procedures.
• Temperature rise rate: 0.8-1.7ºC/sec
Note: Excessive slumping can result if the temperature rise is too rapid.
• Time: 60-120 seconds
Note: If the preheat is insufcient, large solder balls tend to be generated. Conversely, if preheat is excessive,
small and large balls will be generated in clusters.
• End Temperature: 150-200ºC
Heating/Relow Phase
The temperature rises above the liquidus temperature of the solder paste selected.
Avoid a sudden rise in temperature as any slump of the solder paste could become worse.
• Limit time above liquidus temperature to 35-90 seconds.
• Peak reow temperature: 230-250ºC
NOT RECOMMENDED
FOR NEW DESIGN
ZMXM-400 Series
Cooling Phase
A controlled cooling phase avoids unwanted metallurgical effects of the solder, and possible mechanical tensions in the
products. Controlled cooling helps achieve the brightest possible solder llets with a good shape and low contact angle.
• Temperature fall rate: max 3ºC/sec
Pb-Free Soldering Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
The pastes listed in the examples below meet these criteria.
Soldering Paste: Indium 5.1 (Indium Corporation of America)
Alloy Specication: SAC305 - Sn Zinc 96.5%/Ag Silver 3.0%/Cu Copper 0.5%
Alloy Specication: SAC387 - Sn Zinc 95.5%/Ag Silver 3.8%/Cu Copper 0.7%
Melting Temperature: 217ºC
Soldering Paste: LFSOLDER TLF-206-93F (Tamura Kaken [UK] Ltd.)
Alloy Specication: Sn Zinc 95.5%/Ag Silver 3.9%/Cu Copper 0.6%
Melting Temperature: 216-221ºC
The nal choice of the soldering paste depends on individual factory approved manufacturing procedures.
Stencil Thickness: 150 μm for host boards
Note: The quality of the solder joints on the castellations (‘half vias’) where they contact the host board should meet
the appropriate IPC specication. See IPC-A-610-12.2.4.
PROCESSING (Continued)
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed
with any cleaning process.
• Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and
the module. The combination of soldering ux residuals and encapsulated water could lead to short circuits between
neighboring pads. Water could also damage any stickers or labels.
• Cleaning with alcohol or a similar organic solvent will likely ood soldering ux residuals into the two housings, which is
not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
• Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “no clean” soldering paste and eliminate the post soldering cleaning step.
NOT RECOMMENDED
FOR NEW DESIGN
ZMXM-400 Series
Optical Inspection
Repeating Reow Soldering
Wave Soldering
Hand Soldering
Rework
Additional Grounding
Conformal Coating
PROCESSING (Continued)
After soldering the Module to the host board, consider optical inspection to check the following:
• Proper alignment and centering of the module over the pads.
• Proper solder joints on all pads.
• Excessive solder or contacts to neighboring pads, or vias.
Only a single reow soldering process is encouraged for host boards.
If a wave soldering process is required on the host boards due to the presents of leaded components, only a single wave
soldering process is encouraged.
Hand soldering is possible. Use a soldering iron temperature setting equivalent to 350ºC, follow IPC recommendations/
reference document IPC-7711.
Matrix Modules can be unsoldered from the host board. Use of a hot air re-work tool and hot plate for pre-heating from
underneath is recommended. Avoid overheating.
!Warning - Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will terminate
warranty coverage.
Attempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover
is done at the customers own risk. The numerous ground pins at the module perimeter should be sufcient for optimum
immunity to external RF interference.
Conformal coating may be necessary in certain applications. Please note that the RF shield and the sticker prevent
optimum inow of liquids or aerosols.
NOT RECOMMENDED
FOR NEW DESIGN
ZMXM-400 Series
REVISION HISTORY & DISCLAIMER
Revision History
Previous Versions Changes to Current Version Page
0004-00-07-00-000 (Issue B)
(Preliminary) May 07, 2008 Initial advance datasheet. N/A
0004-00-07-00-000 (Issue C)
December 4, 2009
Updated Miniature Footprint dimensions for 100mW on front page and dimension
drawings for 100mW, corrected the certication status under features, corrected J1
to J2 in the ordering information section, updated reow soldering process specs
(temperature rise time and limit time above liquius temerature), add Power Ampier
section on page 5, updated published date and Issue to C, removed preliminary
datasheet from front page and added revision history and disclaimer to last page of
datasheet.
1,5,7,
10,13
Disclaimer
• The information in this document is current as of the published date. The information is subject to change without
notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most
up-to-date specications of CEL products. Not all products and/or types are available in every country. Please
check with an CEL sales representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of CEL. CEL assumes no responsibility for any errors that may appear in this document.
• CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of CEL products listed in this document or any other liability arising from the
use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of CEL or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software and information in the design of a customer’s •equipment shall be done under the full responsibility of the
customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use
of these circuits, software and information.
• While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and
acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to
property or injury (including death) to persons arising from defects in CEL products, customers must incorporate
sufcient safety measures in their design, such as redundancy, re-containment and anti-failure features.
NOT RECOMMENDED
FOR NEW DESIGN