935294036534 - NXP SEMICONDUCTORS - Datasheet.Live

Data Sheet: JN5148-001-Myy

JenNet, ZigBee PRO and IEEE802.15.4 Module

JN-DS-JN5148-001-Myy 1v4 © NXP Laboratories UK 2010

Overview Overview Features: Module

• 2.4GHz IEEE802.15.4, JenNet and

ZigBee PRO compatible

• Sleep current (with active sleep

timer) 2.6µA

• JN5148-001-M00/03

up to 1km range (Ext antenna)

M00: integral antenna 18x32mm

M03: uFl connector 18x30m m

o TX power +2.5dBm

o Receiver sensitivity –95dBm

o TX current 15mA

o RX current 17.5mA

o 2.3-3.6V operation

• JN5148-001-M04

up to 4km range (Ext Antenna)

o 20dBm TX power

o Receiver sensi t ivity -98dBm

o uFl connector

o TX current 110mA

o RX current 23mA

o 18x41mm

o 2.7-3.6V operation

Features: Microcontroller

• 32-bit RISC CPU, up to 32MIPs with

low power

• 128kB ROM stores system code

• 128kB RAM stores system data and

bootloaded program cod e

• 4Mbit serial flash for program code

and data

• On chip OTP efuse

• JTAG debug interface

• 4-input 12-bit ADC, 2 12-bit DACs, 2

comparators

• 3 application timer/counters,

3 system timers

• 2 UARTs

• SPI port with 5 selects

• 2-wire serial interface

• 4-wire digital audio interface

• Watchdog timer

• Up to 21 DIO

Industrial temp (-40°C to +85°C)

Lead-free and RoHS com pliant

The JN5148-001-Myy family is a range of ultra low power, high performance surface

mount modules targeted at JenNet and ZigBee PRO networking applications,

enabling users to realise products with minimum time to market and at the lowest

cost. They remove the need for expensive and lengthy development of custom RF

board designs and test suites. The modules use Jennic’s JN5148 wireless

microcontroller to provide a comprehensive solution with large memory, high CPU

and radio performance and all RF components included. All that is required to

develop and manufacture wireless control or sensing products is to connect a power

supply and peripherals such as switches, actuators and sensors, considerably

simplifying product development.

The JN5148-001-Myy family is a range of ultra low power, high performance surface

mount modules targeted at JenNet and ZigBee PRO networking applications,

enabling users to realise products with minimum time to market and at the lowest

cost. They remove the need for expensive and lengthy development of custom RF

board designs and test suites. The modules use Jennic’s JN5148 wireless

microcontroller to provide a comprehensive solution with large memory, high CPU

and radio performance and all RF components included. All that is required to

develop and manufacture wireless control or sensing products is to connect a power

supply and peripherals such as switches, actuators and sensors, considerably

simplifying product development.

Three module variants are available: JN5148-001-M00 with an integrated antenna,

JN5148-001-M03 with an antenna connector and the JN5148-001-M04 with an

antenna connector, power amplifier and LNA for extended range. The modules can

implement networking stacks such as JenNet and ZigBee PRO, as well as customer

applications

Three module variants are available: JN5148-001-M00 with an integrated antenna,

JN5148-001-M03 with an antenna connector and the JN5148-001-M04 with an

antenna connector, power amplifier and LNA for extended range. The modules can

implement networking stacks such as JenNet and ZigBee PRO, as well as customer

applications

Module Block Diagram Module Block Diagram

Timers

UARTs

12-bit ADC,

comparators

12-bit DA Cs,

temp sen so r

2-wire serial

SPI

RAM

128kB

128-bit A E S

Encryption

Accelerator

2.4GHz

Radio

ROM

128kB

RISC CPU

Power

Management

XTAL

O-QPSK

Modem

IEEE802.15.4

MAC

Accelerator

512kB Serial

Flash Memory

JN5148 c hip

Power

Matching

uFl

Connector

Matching

Integrated Antenna

Matching

uFl

Connector PA / L N A

External

Antenna

M00 Option

M03 Option

M04 Option

4-Wire Audio

Sleep Counters

32-byte

OTP eFuse

Watchdog timer

Time o f F lig h t

Engine

Benefits

•

Microminiature module solutions

•

Ready to use in products

•

Minimises product development

time

•

No RF test required for systems

•

Compliant with FCC part 15

rules, IC Canada RSS 210e,

ETSI EN 300-328 and Japan

ARIB STD-T66

Applications

•

Robust and secure low power

wireless applications

•

ZigBee PRO and JenNet

networks

•

Home and commercial building

automation

•

Utilities metering (e.g. AMR)

•

Location Aware services (e.g.

Asset Tra cking)

•

Toys and gaming periphe rals

•

Industrial systems

•

Telemetry

•

Remote Control

Contents

1. Introduction 3

1.1. Variants 3

1.2. Regulatory Approvals 3

2. Specifications 4

3. Product Development 5

3.1. JN5148 Single Chip Wireless Microcontroller 5

4. Pin Configurations 6

4.1. Pin Assignment 7

4.2. Pin Descriptions 8

4.2.1 Power Supplies 8

4.2.2 SPI Memory Connections 8

5. Electrical Characteristics 9

5.1. Maximum Ratings 9

5.2. Operating Conditions 9

Appendix A Additional Information 10

A.1 Outline Drawing 10

A.2 Module PCB Footprint 13

A.3 Manufacturing 14

A.3.1 Reflow Profile 14

A.3.2 Soldering Paste and Cleaning 14

A.4 Ordering Information 15

A.5 Tape and Reel Information: 16

A.5.1 Tape Orientation and dimensions 16

A.5.2 Cover tape details 16

A.5.3 Leader and Trailer 17

A.5.4 Reel Dimensions: 17

A.6 Related Documents 17

A.7 Federal Communication Commission Interference Statement 18

A.7.1 Antennas approved by FCC for use with JN5148 modules 19

A.7.2 High Power Module usage limitation 20

A.7.3 High Power Module channel restriction 20

A.7.4 FCC End Product Labelling 20

A.8 Industry Canada Statement 20

A.8.1 Industry Canada End Product Labelling 20

A.9 European R & TTE Directive 1999/5/EC Statement 21

A.10 RoHS Compliance 22

A.11 Status Information 22

A.12 Disclaimers 22

Version Control 23

ii JN-DS-JN5148-001-Myy 1v4 © NXP Laboratories UK 2010

1. Introduction

The JN5148-001-Myy module family provides designers with a ready made component that provides a fully

integrated solution for applications, using the IEEE802.15.4 standard in the 2.4-2.5GHz ISM frequency band [1],

including JenNet and ZigBee PRO, and can be quickly and easily included in product designs. The modules

integrate all of the RF comp onents required, removing the nee d to perform expensive RF design and test. Products

can be designe d by simpl y co nnecting s ens o rs and s witches to the m od ule IO pi ns. T he modu les use J enn ic’s sing le

chip IEEE802.15.4 Wireless Microcontroller, allowing designers to make use of the extensive chip development

support material. Hence, this range of modules allows designers to bring wireless applications to market in the

minimum time with significantly reduced development effort and cost.

Three variants are available: JN5148-001-M00 (standard module with integral antenna), JN5148-001- M03 (standard

module with uFl con nector for use with external a ntennae) a nd JN51 48-001-M04 ( high RF power with uF L connector,

improved sensitivity module for evaluation of extended range applications). All modules have FCC modular

approvals and are compliant with EU regulations. The variants available are described below.

1.1. Variants

Variant Description FCCID Industry Canada ID

JN5148-001-M00 Standard Power, integrated antenna TYOJN5148M0 IC: 7438A-CYO5148M0

JN5148-001-M03 Standard Power, uFl connector TYOJN5148M3 IC: 7438A-CYO5148M3

JN5148-001-M04 High Power, uFl connector TYOJN5148M4 IC: 7438A-CYO5148M4

1.2. Regulatory Approvals

All module types have been tested against the requirements of European standard ETS 300 328 v1.7.1 and a

Notified Body statement of opinion for this standar d is available o n request. The High Power module with M04 suffix

is approved for use in Europe with red uced output power: +10dBm EIRP is the maximum permitted in Europe.

Additionally, all module types have received FCC “Modular Approvals”, in compliance with CFR 47 FCC part 15

regulations and in accordance to FCC Public notice DA00-1407, appendix A.7 contains details on the conditions

applying to this modular approval. The modules are approved for use with a range of different antennas; further

details of which can be found in section App endix A.6.1. The modular approvals n otice and test reports are available

on request.

The high power module variant is classified as ‘mobile’ device pursuant with FCC § 2.1091 and must not be used at a

distance of less than 20 cm (8”) from any person.

In addition, all modules have Industry Canada modular approval and RSS210e Issue 7 (June 2007) certi fication.

© NXP Laboratories UK 2010 JN-DS-JN5148-001-Myy 1v4 3

2. Specifications

Most specification parameters for the modul es are specified in the chip datasheet - JN-DS-JN5148 Wireless

Microcontroller Datasheet, [2]. Where there are differences, the parameters are defined here.

VDD=3.0V @ +25°C

Typical DC Characteristi cs Notes

JN5148-001-

M00/03 JN5148-001-

M04

Deep sleep current 1.3uA 1.3uA

Sleep current 2.6uA 2.6uA With active sleep timer

Radio transmit current 15mA 110mA CPU in doze, radio transmitting

Radio receive current 17.5mA 23mA CPU in doze, radio receiving

Centre frequency accuracy +/-25ppm +/-25ppm Additional +/-15ppm allowance for

temperature and ageing

Typical RF Characteristics Notes

Receive sensitivity -95dBm -98dBm Nominal for 1% PER, as per

802.15.4 section 6.5.3.3 (Note 1)

Maximum Transmit power +2.5dBm 18dBm Nominal (Note 1)

Transmit power at 3.6V 20dBm With Vdd=3.6V

Maximum input signal +5dBm -5dBm For 1% PER, measured as

sensitivity

RSSI range -95 to -10

dBm -105 to -20

dBm

RF Port impedance – uFl connector 50 ohm 50 ohm 2.4 - 2.5GHz

VSWR (max) 2:1 2:1 2.4 - 2.5GHz

Peripherals Notes

Master SPI port 5 selects 3 selects 250kHz - 16MHz

Slave SPI port 9 9 250kHz - 8MHz

Two UARTs 9 9 16550 compatible

Two-wire serial I/F (compatible with SMbus & I2C) 9 9 Up to 400kHz

Two programmabl e Timer/Counters with

capture/compare facility, Tick timer 9 9 16MHz clock

Two programmable Sleep Timers 9 9 32kHz clock

Digital IO lines (multiplexed with UARTs, timers

and SPI selects) 21 19

Four channel Analogue-to-Digital converter 9 9 12-bit, up to 100ks/s

Two channel Digital-to-Analogue converter 9 9 12-bit, up to 100ks/s

Two programmable analogue comparators 9 9 Ultra low power mode for sleep

Internal temperature sensor and battery monitor 9 9

The performance of all perip herals is defined in the JN-DS-JN5148 Wireless Microcontroller Datasheet [2]

Note 1: Sensitivity is defined for conducted measurements on connectorised modules. Modules with an integrated

antenna have appro ximately 4 dB less e.i.r.p and reciprocal receive sensitivity.

4 JN-DS-JN5148-001-Myy 1v4 © NXP Laboratories UK 2010

3. Product Development

Jennic supplies all the dev elopment tools a nd net working st acks needed to enab le end-product dev elop ment to occur

quickly and efficiently. T hese are al l freely av aila ble from www.nxp.com/jennic. A range of evaluation/developer kits

is also available, allowing products to be quickly bread boarded. Efficient development of software applications is

enabled by the provision of a compl ete, unlimited, soft ware developer kit. Together with the available l ibraries for the

IEEE802.15.4 MAC and the JenNet and ZigBee PRO network stacks, this package provides everything required to

develop application co de and to trial it with hardware representative of the final module.

The modules can be user programmed both in development and in production using software supplied by Jennic.

Access to the on-chip peripherals, MAC and network stack software is provided through specific APIs. This

information is available on the Jennic support website, together with many example applications, user guides,

reference manuals and appl ication notes.

3.1. JN5148 Single Chip Wireless Microcontroller

The JN5148-001-Myy series is constructed around the JN5148-001 single chip wireless microcontroller, which

includes the radio system, a 32-bit RISC CPU, ROM and RAM memory and a range of analogue and digital

peripherals.

The chip is described fully in JN-DS-JN5148 Wireless Microcontroller Datasheet [2].

The module also includes a 4Mbit serial flash memory, which holds the application code that is loaded into the

JN5148 during the boot sequence an d provides static data storage, required by the application.

© NXP Laboratories UK 2010 JN-DS-JN5148-001-Myy 1v4 5

4. Pin Configurations

1

2

3

4

16

ADC4

DAC1

DAC2

COMP2+

COMP2-

SPICLK

SPIMISO

SPIMOSI

SPISSZ

DIO0

DIO1

DIO2

SPISSM

SPISWP

DIO3

DIO4

DIO5

DIO6

DIO7

DIO8

DIO9

DIO10

DIO11

VDD

GND

VSSA

ADC3

ADC2

ADC1

DIO20

DIO19

DIO18

DIO17

DIO16

DIO15

RESETN

DIO14

DIO13

DIO12

5

6

7

8

9

10

11

12

13

14

15

17 18 19 20 21 22 23 24 25 26

41

40

39

38

37

36

35

34

33

32

31

30

29

28

27

COMP1+

COMP1-

Figure 1: Pin Configuration (top view)

Note that the same basic pin configuration applies for all module designs. However, DIO3 and DIO2 are not available

on the high power modules.

6 JN-DS-JN5148-001-Myy 1v4 © NXP Laboratories UK 2010

4.1. Pin Assignment

Pin Functions Pin

No Primary Alternate Functions Signal

Type Description

1 ADC4 3.3V Analogue to Digital Input

2 DAC1 3.3V DAC Output

3 DAC2 3.3V DAC Output

4 COMP2+ 3.3V Comparator 2 Input +ve

5 COMP2- 3.3V Comparat or 2 Input -ve

6 SPICLK CMOS SPI Clock Output

7 SPIMISO CMOS SPI Master In Slave Out Input

8 SPIMOSI CMOS SPI Master Out Slave In Output

9 SPISSZ CMSO SPI Select From Module – SS0

Output

10 DIO0 SPISEL1 CMOS DIO0 or SPI Slave Select Output 1

11 DIO1 SPISEL2 PC0 CMOS DIO1, SPI Slave Select Output 2

or Pulse Counter0 Input

12 DIO2* SPISEL3 RFRX CMOS DIO2, SPI Slave Select Output 3

or Radio Receive Control Output

13 SPISSM CMOS SPI Select to FLASH (Input)

14 SPISWP CMOS FLASH Write Protect (Input)

15 DIO3* SPISEL4 RFTX CMOS DIO3, SPI Slave Select Output 4

or Radio Transmit Control Output

16 DIO4 CTS0 JTAG_TCK CMOS DIO4, UART 0 Clear To Send

Input or JTAG CLK

17 DIO5 RTS0 JTAG_TMS CMOS DIO5, UART 0 Request To Send

Output or JTAG Mode Select

18 DIO6 TXD0 JTAG_T DO CMOS DIO6, UART 0 Transmit Data

Output or JTAG Data Output

19 DIO7 RXD0 JTAG_TDI CMOS DIO7, UART 0 Receive Data Input

or JTAG Data Input

20 DIO8 TIM0CK_GT PC1 CMOS DIO8, Timer0 Clock/Gate Input or

Pulse Counter1 Input

21 DIO9 TIM0CAP 32KXTALIN 32KIN CMOS DIO9, Timer0 Capture Input, 32K

External Crystal Input or 32K

Clock Input

22 DIO10 TIM0OUT 32KXTALOUT CMOS DIO10, Timer0 PWM Output or

32K External Crystal Output

23 DIO11 TIM1CK_GT TIM2OUT CMOS DIO11, Timer1 Clock/Gate Input or

Timer2 PWM Output

24 VDD 3.3V Supply Voltage

25 GND 0V Digital Ground

26 VSSA 0V Analogue Ground

27 DIO12 TIM1CAP ADO DAI_WS CMOS DIO12, Timer1 Capture Input,

Antenna Diversity or Digital Audio

Word Select

28 DIO13 TIM1OUT ADE DAI_SDIN CMOS DIO13, Timer1 PWM Output,

Antenna Diversity or Digital Audio

Data Input

29 RESETN CMOS Reset input

30 DIO14 SIF_CLK IP_CLK CMOS DIO14, Serial Interface Clock or

Intelligent Peripheral Clock Input

31 DIO15 SIF_D IP_DO CMOS DIO15, Serial Interface Data or

Intelligent Peripheral Data Out

32 DIO16 IP_DI

CMOS DIO16, Intelligent Peripheral Data

In

© NXP Laboratories UK 2010 JN-DS-JN5148-001-Myy 1v4 7

33 DIO17 CTS1 IP_SEL DAI_SCK JTAG_TCK CMOS DIO17, UART 1 Clear To Send

Input, Intelligent Peripheral Device

Select Input or Digital Audio Clock

or JTAG CLK

34 DIO18 RTS1 IP_INT DAI_SDOUT JTAG_TMS CMOS DIO18, UART 1 Request To Send

Output, Intelligent Peripheral

Interrupt Output or Digital Audio

Data Output or JTAG Mode Select

35 DIO19 TXD1 JTAG_TDO CMOS DIO19 or UART 1 Transmit Data

Output or JTAG Data Out

36 DIO 20 RXD1 JTAG_TDI CMOS DIO 20, UART 1 Receive Data

Input or JTAG data In

37 COMP1- 3.3V Comparator 1 Input -ve

38 COMP1+ 3.3V Comparat or 1 Input +ve

39 ADC1 3.3V Analogue to Digital Input

40 ADC2 3.3V Analogue to Digital Input

41 ADC3 3.3V Analogue to Digital Input

*: These two pins are not connected for Hi gh power modules

4.2. Pin Descriptions

All pins behave as described in the JN-DS-JN5148 Wireless Microcontroller Datasheet [2], with the exception of the

following:

4.2.1 Power Supplies

A single power supply pin, VD D is provided. Separate analogue (VSSA) and digital (GND) grounds are provided.

These should be connecte d together at the module pins.

4.2.2 SPI Memory Connections

SPISWP is a write protect pin for the serial flash memory. This should be held low to inhibit writes to the flash device.

SPISSZ is connected to SPI Slave Select 0 on the JN5148.

SPISSM is connected to the Slave Select pin on the memory.

This configuration allows the flash memory device to be programmed using an external SPI programmer if required.

For programming in this mode, the JN5148 should be held in reset by taking RESETN low. Two potential flash 4Mbit

memory devices may be used in the modul e, the Numonyx M25P40 and the SST SST25VF 040B.

The memory can also be programmed over the UART by using the flash programmer software provided by Jennic.

This is available as part of the Software Developer kit and libraries availabl e from www.nxp.com/jennic. To enter

this programming mode, SPIMISO (pin 7) should be hel d low whilst the chip is reset. Once programming has finished,

the chip should be reset, when it will execute the new code downloaded.

For normal operation of the module and programming over the UART, SPISSZ should be connected to

SPISSM.

8 JN-DS-JN5148-001-Myy 1v4 © NXP Laboratories UK 2010

5. Electrical Characteristics

In most cases, the Electrical Characteristics are the same for both module and chip. They are described in detail in

the chip datasheet. Where there are differences, they are d etail ed below.

5.1. Maximum Ratings

Exceeding these conditions will result in damage to the device.

Parameter Min Max

Device supply voltage VDD -0.3V 3.6V

Voltage on analogue pins VR EF, ADC1-4, DAC1-2,

COMP1M, COMP1P, COMP2M, COMP2P, IBIAS -0.3V VDD + 0.3V

Voltage on 5v tolerant digital pins DIO0-DIO8 &

DIO11-20, RESETN -0.3V Lower of (VDD + 2V) and

5.5V

Voltage on 3v tolerant digital pins DIO9, DIO10,

SPISSM, SPISWP, SPICLK, SPIMOSI, SPIMISO,

SPISSZ

-0.3V VDD + 0.3V

Storage temperature -40ºC 150ºC

5.2. Operating Conditions

Supply Min Max

VDD (Module M00/M03) 2.3V 3.6V

VDD (Module M04) 2.7V 3.6V

Ambient temperature range -40ºC 85ºC

© NXP Laboratories UK 2010 JN-DS-JN5148-001-Myy 1v4 9

Appendix A Additional Information

A.1 Outline Drawing

32.2mm

18mm

2.76

mm

2.54

mm

2.54

mm

1.27

mm

Thickness: 3.5mm

Figure 2 JN5148-001-M00 Outline Drawing

10 JN-DS-JN5148-001-Myy 1v4 © NXP Laboratories UK 2010

30mm

18mm

2.76

mm

2.54

mm

2.54

mm

6.58

mm

9.76mm

1.27

mm

Thickness: 3.5mm

Figure 3 JN5148-001-M03 Outline Drawing

© NXP Laboratories UK 2010 JN-DS-JN5148-001-Myy 1v4 11

40.5mm

18mm

.2.76

mm

2.54

mm

1.27

mm

2.54

mm

4.05mm

7.2mm

Thickness: 3.5mm

Figure 4 JN5148-001-M04 Outline Drawing

12 JN-DS-JN5148-001-Myy 1v4 © NXP Laboratories UK 2010

A.2 Module PCB Footprint

All dimensions are in mm.

Note: All modules have the same footprint.

Figure 5 Module PCB footprint

RF note for –M00 modules with integral antenna: No components, ground plane or tracks on any layer of the

mother board should be placed within 20mm of the 3 free sides of the antenna. Tracks etc may be placed

adjacent to the can, but should not extend past the can tow ards the an tenna end of the module for 20mm

from the antenna.

© NXP Laboratories UK 2010 JN-DS-JN5148-001-Myy 1v4 13

A.3 Manufacturing

A.3.1 Reflow Profile

For reflow soldering, it is recommended to follow the reflow profile in figure 6 as a guide, as well as the paste

manufacturers guidelines on p eak flow temperature, soak times, time above liquidus and ramp rates.

Temperature 25~160 ºC 160~190 ºC > 220º C 230~Pk. Pk. Temp

(235ºC)

Target Time (s) 90~130 30~60 20~50 10~15 150~270

Figure 6: Recommended solder reflow profile

A.3.2 Soldering Paste and Cleaning

Jennic would not recommend use of a solder paste that requires the module and pcb assembly to be cleaned (rinsed

in water) for the following reasons:

Solder flux residues and water can be trapped by the pcb, can or components and result in short circuits.

The module label could be damaged or removed.

Jennic recommends use of a 'no clean' solder paste for all its module prod ucts.

14 JN-DS-JN5148-001-Myy 1v4 © NXP Laboratories UK 2010

A.4 Ordering Information

Ordering Code Format:

JN5148 - 001 – M / Y1Y2 Y3

Shipping

T Tape Mounted 500-piece reel

Module Type

00 Standard Power, Integral antenna

03 Standard Power, uFl connector

04 High power, uFl connector

Where this Data Sheet is denoted as “Advanced” or “Preliminary”, devices will be either Engineer ing Samples or

Prototypes. Devices of this status have an Rx suffix after the module type to identify qualification status during these

product phases - for example , JN5148-001-M00R1T.

Part Number Ordering Code Description

JN5148-001-M00T JN5148-001-M/00T

JN5148-001-M03T JN5148-001-M/03T

JN5148-001-M04T JN5148-001-M/04T

JN5148 module, variant as detailed above

Label line 1: IC ID Number

Label line 2: FCC ID Numb er

Label line 3: Part Number

Label line 4: Barcode Label

Label line 5: YYWWTNNNNN (see below)

Identifier Description Format

YY Year 06 (example)

WW Week 45 (example)

T Module type

NNNNN Serial Number

IC: 7438A CYO5148M0

FCC ID: TYOJN5148M0

JN51XX-XXX-XXX JENNIC

YYWWTNNNNN

© NXP Laboratories UK 2010 JN-DS-JN5148-001-Myy 1v4 15

Figure 8: Example module labelling for FCC approved modules

A.5 Tape and Reel Information:

A.5.1 Tape Orientation and dime nsions

All dimensions are in mm

Module type: A B W F E P0 P1 P2 T Cover Tape

width (W)

JN5148-001-M00 18.4 32.6 44 20.2 1.75 4.0 2.0 24.0 3.4 37.5

JN5148-001-M03 18.4 30.4 44 20.2 1.75 4.0 2.0 24.0 3.4 37.5

JN5148-001-M04 18.5 40.9 56 26.2 1.75 4.0 2.0 24.0 3.4 49.5

Tolerance ±0.1 ±0.1 ±0.3 ±0.1 +0.1 ±0.1 ±0.1 ±0.1 ±0.1 ±0.1

A.5.2 Cover tape details

Thickness (T) 0.061mm

Surface resistivity (component side) 104 to 107 Ohms/sq

Surface resistivity (component side) Non-conductive

Backing type: Polyester

Adhesive type: PSA

Sealing: Room ambient

16 JN-DS-JN5148-001-Myy 1v4 © NXP Laboratories UK 2010

A.5.3 Leader and Trailer

300 MM300 MM

A.5.4 Reel Dimensions:

All dimensions are in mm.

Module type: A B C N W (min)

JN5148-xxx-M00/03 330 ±1.0 2.2±0.5 13 ±0.2 100 +0.1 44.5 ±0.3

JN5148-xxx-M04 330 ±1.0 2.2±0.5 13 ±0.2 100 +0.1 56.5 ±0.3

A.6 Related Documents

[1] IEEE Std 802.15.4-2003 IEEE Standard for Information Technology – Part 15.4 Wireless Medium Access Control

(MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)

[2] JN-DS-JN5148 Wireless Microcontroller D atashe et

© NXP Laboratories UK 2010 JN-DS-JN5148-001-Myy 1v4 17

A.7 Federal Communication Commission Interference Statement

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15

of the FCC Rules. These limits are des igned to provide reasonable protection against harmful interference in a

residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed

and used in accordance with the instructions, may cause harmful interference to radio communications. However,

there is no guarantee that interference will no t occur in a particular installation. If this equipment does cause harmful

interference to radio or television reception, which can be determined by turnin g the equipment off and on, the user is

encouraged to try to correct the interference by one of the f ollowing measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and recei ver.

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This

device may not cause harmful interference, and (2) this device must accept any interference received, including

interference that may cause undesired operation.

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could

void the user's authority to operate this equipment.

WARNING!

FCC Radiation Exposure Statement:

This portable equipment with its antenna complies with FCC’s RF radiation exposure lim its set forth for an

uncontrolled environment. To maintain compliance follow the instructions below;

1. This transmitter must not be co-located or operating in conj unction with any other antenna or transmitter.

2. Avoid direct contact to the antenna, or keep it to a minimum while using this equipme nt.

This transmitter module is authorized to be used in other devices only by OEM integrators under the

following condition:

The transmitter module must not be co-located with any other antenna or transmitter.

As long as the above condition is met, further transmitter testing will not be required. However, the OEM integrator is

still responsible for testing their end product for any additional complianc e requirements required with this module

installed (for example, digital d evice emissions, PC peripheral requirements, etc.).

18 JN-DS-JN5148-001-Myy 1v4 © NXP Laboratories UK 2010

A.7.1 Antennas approved by FCC for use with JN5148 modules

Brand Model Number Description Gain (dBi) Connector type

1 Aveslink Technology, Inc E-0360-AT Patch Antenna - outdoor 18 RP-N

2 Aveslink Technology, Inc E-0260-AT Patch Antenna - outdoor 15 RP-N

3 Aveslink Technology, Inc E-1050-AT Vertical - outdoor colinear 15 RP-N

4 Aveslink Technology, Inc E-1040-AT Vertical - outdoor colinear 12 RP-N

5 Aveslink Technology, Inc E-0100-AC Patch Antenna - flying lead 10 RP-SMA

6 Aveslink Technology, Inc E-1030-AT Vertical - outdoor colinear 9 RP-N

7 Aveslink Technology, Inc E-1020-AT Vertical - outdoor colinear 7 RP-N

8 Aveslink Technology, Inc E-171 0-GC Vertical - swivel 7 RP-SMA

9 Aveslink Technology, Inc E-1710-GM Vertical - swivel 7 RP-TNC

10 Aveslink Technology, Inc E-1511-GC Vertical - swivel 5 RP-SMA

11 Aveslink Technology, Inc E-0030-AA Patch Antenna - flying lead 4 uFL

12 Aveslink Technology, Inc E-0030-AC Patch Antenna - flying lead 4 RP-SMA

13 Aveslink Technology, Inc E-1204-AC Ceiling antenn a - fl ying lead 4 RP-SMA

14 Aveslink Technology, Inc E-1520-CA Vertical - bulkhead- flying lead 4 uFL

15 Aveslink Technology, Inc E-1520-GC Vertical - swivel 4 RP-SMA

16 Aveslink Technology, Inc E-1450-GC Vertical-swivel mount 4 RP-SMA

17 Nearson S152CL-L-P X-2450S Vertical - knuckle-flying lead 4 uFL

18 Antenna Factor ANT-2.4-CW-RCL Vertical - knuckle antenna 2.9 RP-SMA

19 Aveslink Technology, Inc E-0901-AA Embedded - flying lead 2.5 uFL

20 Antenna Factor ANT-2.4-CW-RCT-RP Vertical - knuckle antenna 2.2 RP-SMA

21 Antennova 2010B6090-01 Vertical - knuckle antenna 2.2 RP-SMA

22 Hyperlink Technology HG2402RD-RSF Vertical - knuckle antenn a 2.2 RP-SMA

23 Aveslink Technology, Inc E-0005-AC Vertical- flying lead 2 RP-SMA

24 Aveslink Technology, Inc E-2411-GC Vertical - swivel 2 RP-SMA

25 Aveslink Technology, Inc E-2410-CA Vertical - bulkhead- flying lead 2 uFL

26 Aveslink Technology, Inc E-2410-GC Vertical - swivel 2 RP-SMA

27 Aveslink Technology, Inc E-2820-CA Vertical - bulkhead- flying lead 2 uFL

28 Aveslink Technology, Inc E-2820-GC Vertical - swivel 2 RP-SMA

29 Aveslink Technology, Inc E-0903-AX Embedded - nickel silver strip 2 None

30 Aveslink Technology, Inc E-0904-AX Embedded - nickel silver strip 2 None

31 Embedded Antenna Design FBKR35068-RS-KR Vertical - knuckle antenna 2 RP-SMA

32 Nearson S131CL-L-P X-2450S Vertical - knuckle-flying lead 2 uFL

33 Laird Technologies WRR240 0-IP04 Vertical - knuckle-flying lead 1.5 uFL

34 Laird Technologies WRR2400-RPSMA Vertical - knuckle-flying lead 1.3 RP-SMA

35 Aveslink Technology, Inc E-6170-DA Vertical - right angle 1 uFL

36 Laird Technologies WCR2400-SM RP Vertical - knuckle antenna 1 RP-SMA

37 Siretta ANTC0010G0200GQ12 PCB antenna – flying lead uFL 2.6 uFL

These antennae or versions with alternative connectors may be used to meet European regulations.

© NXP Laboratories UK 2010 JN-DS-JN5148-001-Myy 1v4 19

This device has been designed to operate with the antennas listed above, and having a maximum gain of 4.4 dBi.

Antennas not included in this list or having a gain greater than 4.4 dBi are strictly prohibited for use with this device.

The required antenna impedance is 50 ohms.

A.7.2 High Power Module usage limitation

The high power module variants are classified as ‘mobile’ device pursuant with FCC § 2.1091 and must not be used

at a distance of < 20 cm (8”) from any people.

IMPORTANT NOTE: In the event that these conditions can not be met (for certain configurations or co-location with

another transmitter), then the FCC authorization is no longer considered v alid and the FCC ID can not be used on the

final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product

(including the transmitter) an d obtaining a separate FCC authorization.

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this

RF module in the user manual of the end product.

The user manual for the end product must include the following information in a prominent location;

“To comply with FCC’s RF radiation exposure requirements, the antenna(s) used for this transmitter must not be co-

located or operating in con jun ction with any other antenna or transmitter.”

A.7.3 High Power Module channel restriction

The FCC grant for the TYOJN5148M4 does not permit the use of channel 26. Access to channel 26 is fo rbidden by

the 802.15.4 MAC layer when the JN5148 chip is in high po wer mode. Users will not be able to access channel 26

when using the JN5148-001- M04 module under any circumstances.

A.7.4 FCC End Product Labelling

The final ‘end product’ should be labelled in a visible area with the following:

“Contains TX FCC ID: TYOJN5148M0, TYOJN5148M3 or TYOJN5148M4 ” to reflect the version of the module being

used inside the product.

A.8 Industry Canada Statement

To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the

equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication.

These modules have been designed to operate with anten nas having a maximum gain of 18 dBi. Antennas having a

gain greater than 18 dBi are strictly prohibited for use with this device. The requir ed antenna impedance is 50 ohms.

As long as the above condition is met, further transmitter testing will not be required. However, the OEM integrator is

still responsible for testing their end-product for any additional compliance requirements required with this module

installed (for example, digital d evice emissions, PC peripheral requirements, etc).

A.8.1 Industry Canada End Product La belling

For Industry Canada purposes the following should be used.

“Contains Industry Canada ID IC: 7438A-CYO5148M0, IC: 7438A-CYO5148M3 or IC: 7438A-CYO514 8 M 4” to reflect

the version of the module being use d inside the product.

20 JN-DS-JN5148-001-Myy 1v4 © NXP Laboratories UK 2010

A.9 European R & TTE Directive 1999/5/EC Statem ent

All modules listed in this datasheet are compl iant with ETSI EN 300 328V1.7.1 (2006/05) and are subject to a Notified

Body Opinion.

The modules are approved for use with the antennas listed in the following table. T he high power module M04 is

limited to an antenna with a gain of 2.2 dBi or less and is approved for use with a reduced output po wer: +10dBm

EIRP is the maximum permitted.

Brand Model Number Description Gain (dBi) Connector type

1 Aveslink Technology, Inc E-0100-AC Patch Antenna - flying lead 10 RP-SMA

2 Aveslink Technology, Inc E-1030-AT Vertical - outdoor colinear 9 RP-N

3 Aveslink Technology, Inc E-1020-AT Vertical - outdoor colinear 7 RP-N

4 Aveslink Technology, Inc E-171 0-GC Vertical - swivel 7 RP-SMA

5 Aveslink Technology, Inc E-1710-GM Vertical - swivel 7 RP-TNC

6 Aveslink Technology, Inc E-151 1-GC Vertical - swivel 5 RP-SMA

7 Aveslink Technology, Inc E-0030-AA Patch Antenna - flying lead 4 uFL

8 Aveslink Technology, Inc E-0030-AC Patch Antenna - flying lead 4 RP-SMA

9 Aveslink Technology, Inc E-1204-AC Ceil ing antenna - flying lead 4 RP-SMA

10 Aveslink Technology, Inc E-1520-CA Vertical - bulkhead- flying lead 4 uFL

11 Aveslink Technology, Inc E-1520-GC Vertical - swivel 4 RP-SMA

12 Aveslink Technology, Inc E-1450-GC Vertical-swivel mount 4 RP-SMA

13 Nearson S152CL-L-P X-2450S Vertical - knuckle-flying lead 4 uFL

14 Antenna Factor ANT-2.4-CW-RCL Vertical - knuckle antenna 2.9 RP-SMA

15 Aveslink Technology, Inc E-0901-AA Embedded - flying lead 2.5 uFL

16 Antenna Factor ANT-2.4-CW-RCT-RP Vertical - knuckle antenna 2.2 RP-SMA

17 Antennova 2010B6090-01 Vertical - knuckle antenna 2.2 RP-SMA

18 Hyperlink Technology HG2402RD-RSF Vertical - knuckle antenn a 2.2 RP-SMA

19 Aveslink Technology, Inc E-0005-AC Vertical- flying lead 2 RP-SMA

20 Aveslink Technology, Inc E-2411-GC Vertical - swivel 2 RP-SMA

21 Aveslink Technology, Inc E-2410-CA Vertical - bulkhead- flying lead 2 uFL

22 Aveslink Technology, Inc E-2410-GC Vertical - swivel 2 RP-SMA

23 Aveslink Technology, Inc E-2820-CA Vertical - bulkhead- flying lead 2 uFL

24 Aveslink Technology, Inc E-2820-GC Vertical - swivel 2 RP-SMA

25 Aveslink Technology, Inc E-0903-AX Embedded - nickel silver strip 2 None

26 Aveslink Technology, Inc E-0904-AX Embedded - nickel silver strip 2 None

27 Embedded Antenna Design FBKR35068-RS-KR Vertical - knuckle antenna 2 RP-SMA

28 Nearson S131CL-L-P X-2450S Vertical - knuckle-flying lead 2 uFL

29 Laird Technologies WRR240 0-IP04 Vertical - knuckle-flying lead 1.5 uFL

30 Laird Technologies WRR2400-RPSMA Vertical - knuckle-flying lead 1.3 RP-SMA

31 Aveslink Technology, Inc E-6170-DA Vertical - right angle 1 uFL

32 Laird Technologies WCR2400-SM RP Vertical - knuckle antenna 1 RP-SMA

33 Siretta ANTC0010G0200GQ12 PCB antenna – flying lead uFL 2.6 uFL

© NXP Laboratories UK 2010 JN-DS-JN5148-001-Myy 1v4 21

A.10 RoHS Compliance

JN5148-001-Myy devices meet the requirements of Directive 2002/95/EC of the European Parliament and of the

Council on the Restriction of Hazardous Substance (RoHS).

The JN5148-001-M00, M03 and M04 modules meet the requirements of Chinese RoHS requirements SJ/T11363-

2006.

Full data can be found at www.nxp.com/jennic.

A.11 Status Information

The status of this Data Sheet is Production.

Jennic products progress acc ordi ng to the following format:

Advanced

The Data Sheet shows the specification of a product in planning or in development.

The functionality and el ectrical performance specifications are target values and may be used as a guide to the final

specification.

Jennic reserves the right to make changes to the product specification at anytime without notice.

Preliminary

The Data Sheet shows the specification of a product that is commercially available, but is not yet fully qualified.

The functionality of the produc t is final. The electrical performance specifications are target values and may be used

as a guide to the final specification. Modul es are identified with an Rx suffix, for example JN5148-001-M 00R2.

Jennic reserves the right to make changes to the product specification at anytime without notice.

Production

This is the production Data Sheet for the product.

All functional and electrical p erformance specifications, where include d, including min and max values are derived

from detailed product characterization.

This Data Sheet supersedes all pr evious document versions.

Jennic reserves the right to make changes to the product specification at anytime.

A.12 Disclaimers

The contents of this document are subject to chan ge without notice. Jennic reserves the right to make ch anges,

without notice, in the products, including circuits and/or software, described or contained therein. Information

contained in this document regarding device applications and the like is intended through suggestion only and may

be superseded by updates. It is your responsibility to ensure that your application meets with your specifications.

Jennic warrants performance of its hardware products to the specifications applicable at the time of sale in

accordance with Jennic’s standard warranty. Testing and other qu ality control techniques are used to the extent

Jennic deems necessary to support this warranty. Except where mandatory by government requirements, testing of

all parameters of each product is not necessarily performed.

Jennic assumes no responsibility or liability for the use of any of these products, conveys no license or title under any

patent, copyright, or mask work right to these products, and makes no representations or warranties that these

products are free from patent, copyright, or mask work infringement, unless otherwise specified.

Jennic products are not intended for use in life support systems, appliances or systems where malfunction of these

products can reasonably be expected to result in person al i njur y, death or severe property or environmental damage.

Jennic customers using or selling th ese products for use in such applications do so at their o wn risk and agre e to fully

indemnify Jennic for an y dam ages resulting from such use.

All products are sold subject to Jenn ic' s terms and conditions of sale supplied at the time of order acknowledgment.

All trademarks are the property of their respec tive owners.

22 JN-DS-JN5148-001-Myy 1v4 © NXP Laboratories UK 2010

Version Control

Version Notes

1.0 1st Issue of Advanced Datasheet

1.1 1st Issue of Preliminary Datasheet, minor parametric chan ges and addition of Appendix A6.3

1.2 1st Issue of Production Datasheet, addition of PCB clean ing information in Appendix A3

1.3 Logo updated and support of JenN et added

1.4 Ordering information changed

NXP Laboratories UK Ltd

(Formerly Jennic Ltd)

Furnival Street

Sheffield

S1 4QT

United Kingdom

Tel: +44 (0)114 281 2655

Fax: +44 (0) 114 281 2951

E-mail: info@jennic.com

For the contact details of your local Jennic office or distributor, refer to the Jennic web site:

www.nxp.com/jennic

© NXP Laboratories UK 2010 JN-DS-JN5148-001-Myy 1v4 23