Datasheet CMOS LDO Regulator Series for Portable Equipments Versatile Package FULL CMOS LDO Regulator BUxxUA3WNVX series General Description BUxxUA3WNVX series is high-performance FULL CMOS regulator with 300-mA output, which is mounted on versatile package SSON004X1010 (1.00mm 1.00 mm 0.60mm). It has excellent noise characteristics and load responsiveness characteristics despite its low circuit current consumption of 50A. It is most appropriate for various applications such as power supplies for logic IC, RF, and camera modules. Key Specifications Output voltage: Accuracy output voltage: Low current consumption: Operating temperature range: 1.0V to 3.7V 1.0% (25mV) 50A -40C to +85C Applications Battery-powered portable equipment, etc. Package SSON004X1010 : Features High accuracy detection low current consumption Compatible with small ceramic capacitor (Cin=Co=1.0uF) With built-in output discharge circuit High ripple rejection ON/OFF control of output voltage With built-in over current protection circuit and thermal shutdown circuit Low dropout voltage 1.00mm x 1.00mm x 0.60mm Typical Application Circuit STBY VIN VOUT STBY VOUT VIN GND GND GND Figure 1. Application Circuit Product structureSilicon monolithic integrated circuit www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211114001 This product is not designed for protection against radioactive rays 1/27 TSZ02201-0GBG0A300010-1-2 30.Oct.2015 Rev.008 Datasheet BUxxUA3WNVX series Connection Diagram SSON004X1010 TOP VIEW 4 VIN 3 STBY BOTTOM VIEW 1 VOUT 2 GND LOT Number reverse FIN 1 2 Part Number Marking 1 VOUT 2 GND 4 VIN 3 STBY 1PIN MARK Pin Descriptions SSON004X1010 Symbol Function VOUT Output Voltage GND Grouding ON/OFF control of output voltage STBY (High: ON, Low: OFF) VIN Power Supply Voltage FIN Substrate (Connect to GND) PIN No. 1 2 3 4 reverse Ordering Information B U x Part Number x U Output Voltage 10 : 1.0V A 3 Low Dropout Voltage Maximum Output Current 300mA W N V with Package output discharge NVX : SSON004X1010 X - T L Packageing and forming specification Embossed tape and reel TL : The pin number 1 is the lower left 37 : 3.7V SSON004X1010 <Tape and Reel information> 1.00.1 0.6MAX 1.00.1 1PIN MARK 0.320.1 8 1 2 (0.12) +0.03 0.02 -0.02 05 0.650.05 0. 4 0. Embossed carrier tape Quantity 5000pcs Direction of feed S 0.05 Tape TL The direction is the 1pin of product is at the lower left when you hold ( reel on the left hand and you pull out the tape on the left hand ) 3-C0.18 R0.05 45 5 .0 0 0.070.1 48 0.250.05 3 0.250.1 0. 4 1pin (Unit : mm) www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Reel 2/27 Direction of feed Order quantity needs to be multiple of the minimum quantity. TSZ02201-0GBG0A300010-1-2 30.Oct.2015 Rev.008 Datasheet BUxxUA3WNVX series Lineup Marking Output Voltage Part Number e ml nl Ul Yl al ql Bi f g bl 1.0V 1.05V 1.1V 1.15V 1.2V 1.25V 1.3V 1.35V 1.5V 1.8V 1.85V BU10 BU1A BU11 BU1B BU12 BU1C BU13 BU1D BU15 BU18 BU1J dl 1.9V BU19 el 2.0V BU20 fl 2.05V BU2A gl 2.1V BU21 rl h 2.5V BU25 m 2.6V BU26 ul yl 2.2V BU22 hl 2.3V BU23 2.7V BU27 2.75V BU2H n 2.8V BU28 z 2.85V BU2J u 2.9V BU29 0i k 3.0V BU30 1i 2i 2.95V BU2K 3.1V BU31 3.2V BU32 y 3.3V BU33 3.4V BU34 3i 9 3.7V BU37 Absolute Maximum Ratings (Ta=25C) PARAMETER Symbol Power Supply Voltage Power Dissipation Maximum junction temperature Operating Temperature Range Storage Temperature Range Limit VMAX -0.3 Unit +6.0 V Pd 560(*1) mW TjMAX +125 Topr -40 +85 Tstg -55 +125 (*1) Pd deleted at 5.6mW/ at temperatures above Ta=25, mounted on 70x70x1.6 mm glass-epoxy PCB. RECOMMENDED OPERATING RANGE (not to exceed Pd) PARAMETER Symbol Limit Unit Power Supply Voltage VIN 1.75.5 V Maximum Output Current IMAX 300 mA OPERATING CONDITIONS PARAMETER Symbol MIN. TYP. MAX. Unit Input Capacitor Cin 0.47(*2) Output Capacitor Co 0.47(*2) 1.0 - F 1.0 - F CONDITION Ceramic capacitor recommended (*2) Make sure that the output capacitor value is not kept lower than this specified level across a variety of temperature, DC bias, characteristic. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 3/27 TSZ02201-0GBG0A300010-1-2 30.Oct.2015 Rev.008 Datasheet BUxxUA3WNVX series Electrical Characteristics (Ta=25, VIN=VOUT+1.0V (*3), STBY=VIN, Cin=1.0F, Co=1.0F, unless otherwise noted.) PARAMETER Limit Symbol MIN. TYP. Unit MAX. Conditions Overall Device Output Voltage VOUTx0.99 VOUT Operating Current Operating Current (STBY) Ripple Rejection Ratio Dropout Voltage VOUT-25mV VOUTx1.01 V VOUT+25mV IOUT=10AVOUT2.5V IOUT=10AVOUT2.5V IIN - 50 90 A IOUT=0mA ISTBY - - 1.0 A RR 45 70 - dB STBY=0V VRR=-20dBv,fRR=1kHz,IOUT=150mA, VIN=3.6V - 470 700 mV 1.0VVOUT1.2V(IOUT=300mA) - 350 500 mV 1.2VVOUT1.5V(IOUT=300mA) - 280 380 mV 1.5VVOUT1.7V(IOUT=300mA) - 250 320 mV 1.7VVOUT2.1V(IOUT=300mA) - 220 260 mV 2.1VVOUT2.5V(IOUT=300mA) - 200 220 mV 2.5VVOUT(IOUT=300mA) VSAT Line Regulation VOUT VDL Load Regulation VDLO Over-current Protection (OCP) - 2 20 mV VIN=VOUT+1.0V to 5.5V(*4), IOUT=10A - 25 45 mV IOUT=0.01mA to 300mA Limit Current ILMAX 370 550 - mA Vo=VOUT*0.95 Short Current ISHORT 50 150 300 mA Vo=0V RDSC 20 50 80 VIN=5.5V, STBY=0V, VOUT=2.6V ISTB 0.1 0.9 8.0 A ON VSTBH 1.2 - 5.5 V OFF VSTBL -0.3 - 0.3 V Standby Block Discharge Resistor STBY Pin Pull-down Current STBY Control Voltage STBY=1.5V This product is not designed for protection against radioactive rays. (*3) VIN=2.5V for VOUT1.5V (*4) VIN=2.5V to 5.5V for VOUT1.5V Block Diagrams VIN VIN 4 VREF VOUT Cin VOUT 1 GND 2 OCP Co TSD STBY STBY 3 STBY Discharge Cin1.0F (Ceramic) Co 1.0F (Ceramic) Figure 2. Block Diagrams www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4/27 TSZ02201-0GBG0A300010-1-2 30.Oct.2015 Rev.008 Datasheet BUxxUA3WNVX series Reference data BU10UA3WNVX (Ta=25C unless otherwise specified.) LINEREGULATION LINEREGULATION 1.10 1.08 Vout=1.0V Iout=300mA 1.08 1.06 1.06 1.04 1.04 1.02 1.02 VOUT[V] VOUT[V] 1.10 Vout=1.0V Iout=10mA 1.00 0.98 1.00 0.98 0.96 0.96 0.94 0.94 85 25 -40 0.92 0.90 0.90 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 VIN[V] VIN[V] Figure 3. Figure 4. LOAD REGULATION 1.10 85 25 -40 0.92 OUTPUT VOLTAGE vs TEMPERATURE 1.10 Vout=1.0V Vout=1.0V 1.08 1.06 1.05 1.02 VOUT[V] VOUT[V] 1.04 1.00 0.98 1.00 0.96 0.95 0.94 10mA 150mA 300mA 85 25 -40 0.92 0.90 0 50 100 150 200 250 0.90 300 -40 IOUT[mA] -20 0 20 GROUND PIN CURRENT vs INPUT VOLTAGE Vout=1.0V 65 60 80 Figure 6. Figure 5. 70 40 Temperature[] GROUND PIN CURRENT vs LOAD 450 Vout=1.0V 400 60 55 350 50 300 IGND[uA] IGND[uA] 45 40 35 30 25 250 200 150 20 100 15 85 25 -40 10 5 0 0 2.3 2.5 2.7 2.9 3.1 3.3 85 25 -40 50 0 3.5 50 100 150 VIN[V] IOUT[mA] Figure 7. Figure 8. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 5/27 200 250 300 TSZ02201-0GBG0A300010-1-2 30.Oct.2015 Rev.008 Datasheet BUxxUA3WNVX series Reference data BU10UA3WNVX (Ta=25C unless otherwise specified.) GROUND PIN CURRENT vs TEMPERATURE Vout=1.0V 70 90 60 80 85 25 -40 70 ISHDN[nA] 50 IGND[uA] SHUTDOWN CURRENT vs INPUT VOLTAGE Vout=1.0V 100 40 30 60 50 40 30 20 20 10 10 0 0 -40 -20 0 20 40 60 Temperature[] 2.3 80 2.5 2.7 3.1 3.3 3.5 VIN[V] Figure 10. Figure 9. CURRENT LIMIT vs INPUT VOLTAGE 700 2.9 POWER-SUPPLY RIPPLE REJECTION vs FREQUENCY 100 Vout=1.0V 90 600 10mA 150mA 80 70 PSRR[dB] ILIM[mA] 500 400 300 60 50 40 30 200 20 85 25 -40 100 10 0 0 2.3 2.5 2.7 2.9 3.1 3.3 10 3.5 100 Figure 11. 20mA/div 100mV/div 100mA/div 100mV/div 1000000 Trise=Tfall=1us 0mA VOUT 10mA IOUT 0mA VOUT Vout=1.0V Vout=1.0V 10s/div 10s/div Figure 13. Figure 14. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 100000 LOAD TRANSIENT RESPONSE 200mA IOUT 10000 Figure 12. LOAD TRANSIENT RESPONSE Trise=Tfall=1us 1000 Frequency[Hz] VIN[V] 6/27 TSZ02201-0GBG0A300010-1-2 30.Oct.2015 Rev.008 Datasheet BUxxUA3WNVX Reference data BU10UA3WNVX (Ta=25C unless otherwise specified.) LOAD TRANSIENT RESPONSE LOAD TRANSIENT RESPONSE 200mA/div Trise=Tfall=1us 50mA IOUT 0mA 100mV/div 100mV/div 50mA/div Trise=Tfall=1us VOUT 300mA IOUT 0mA VOUT Vout=1.0V Vout=1.0V 10s/div 10s/div Figure 15. Figure 16. LINE TRANSIENT RESPONSE LINE TRANSIENT RESPONSE Slew Rate = 0.5V/s 1V/div 1V/div Slew Rate = 0.5V/s 2.9V VIN 2.9V VIN 2.3V 100mV/div 100mV/div 2.3V VOUT Vout=1.0V VOUT Vout=1.0V Iout=1mA Iout=300mA 1ms/div 1ms/div Figure 17. Figure 18. VIN RAMP UP, RAMP DOWN RESPONSE LINE TRANSIENT RESPONSE Slew Rate = 0.5V/s Vout=1.0V Iout=1mA 1V/div 3.6V VIN VIN 100mV/div 1V/div 2.1V VOUT VOUT Vout=1.0V Iout=300mA 1ms/div 200ms/div Figure 20. Figure 19. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 7/27 TSZ02201-0GBG0A300010-1-2 30.Oct.2015 Rev.008 Datasheet BUxxUA3WNVX Reference data BU10UA3WNVX (Ta=25C unless otherwise specified.) START UP TIME DISCHARGE TIME 1.5V 1V/div 1V/div 1.5V STBY 0V VOUT 1V/div 1V/div STBY Vout=1.0V Iout=0mA Cout=1.0uF 0V VOUT Vout=1.0V Iout=0mA Cout=1.0uF 20s/div 40s/div Figure 21. Figure 22. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 8/27 TSZ02201-0GBG0A300010-1-2 30.Oct.2015 Rev.008 Datasheet BUxxUA3WNVX Reference data BU11UA3WNVX (Ta=25C unless otherwise specified.) LINEREGULATION LINEREGULATION 1.20 1.18 Vout=1.1V Iout=300mA 1.18 1.16 1.16 1.14 1.14 1.12 1.12 VOUT[V] VOUT[V] 1.20 Vout=1.1V Iout=10mA 1.10 1.08 1.06 1.10 1.08 1.06 1.04 1.04 85 25 -40 1.02 1.00 85 25 -40 1.02 1.00 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 VIN[V] VIN[V] Figure 23. LOAD REGULATION 1.20 OUTPUT VOLTAGE vs TEMPERATURE 1.20 Vout=1.1V 1.18 1.18 1.16 1.16 1.14 1.14 1.12 1.12 VOUT[V] VOUT[V] Figure 24. 1.10 1.08 1.06 Vout=1.1V 1.10 1.08 1.06 1.04 1.04 85 25 -40 1.02 1.00 0 50 100 150 200 250 10mA 150mA 300mA 1.02 1.00 300 -40 IOUT[mA] -20 0 20 GROUND PIN CURRENT vs INPUT VOLTAGE Vout=1.1V 65 60 80 Figure 26. Figure 25. 70 40 Temperature[] GROUND PIN CURRENT vs LOAD 450 Vout=1.1V 400 60 55 350 50 300 IGND[uA] IGND[uA] 45 40 35 30 25 250 200 150 20 100 15 85 25 -40 10 5 0 0 2.3 2.5 2.7 2.9 3.1 3.3 0 3.5 50 100 150 200 250 300 IOUT[mA] VIN[V] Figure 28. Figure 27. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 85 25 -40 50 9/27 TSZ02201-0GBG0A300010-1-2 30.Oct.2015 Rev.008 Datasheet BUxxUA3WNVX Reference data BU11UA3WNVX (Ta=25C unless otherwise specified.) GROUND PIN CURRENT vs TEMPERATURE Vout=1.1V 70 SHUTDOWN CURRENT vs INPUT VOLTAGE Vout=1.1V 100 90 60 80 85 25 -40 70 ISHDN[nA] IGND[uA] 50 40 30 60 50 40 30 20 20 10 10 0 0 -40 -20 0 20 40 60 Temperature[] 2.3 80 2.5 2.7 3.1 3.3 3.5 VIN[V] Figure 30. Figure 29. CURRENT LIMIT vs INPUT VOLTAGE 700 2.9 POWER-SUPPLY RIPPLE REJECTION vs FREQUENCY 100 Vout=1.1V 90 600 10mA 150mA 80 70 PSRR[dB] ILIM[mA] 500 400 300 60 50 40 30 200 20 85 25 -40 100 10 0 0 2.3 2.5 2.7 2.9 3.1 3.3 10 3.5 100 Figure 31. 20mA/div 100mV/div 100mA/div 100mV/div 1000000 Trise=Tfall=1us 0mA VOUT 10mA IOUT 0mA VOUT Vout=1.1V Vout=1.1V 10s/div 10s/div Figure 33. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 100000 LOAD TRANSIENT RESPONSE 200mA IOUT 10000 Figure 32. LOAD TRANSIENT RESPONSE Trise=Tfall=1us 1000 Frequency[Hz] VIN[V] Figure 34. 10/27 TSZ02201-0GBG0A300010-1-2 30.Oct.2015 Rev.008 Datasheet BUxxUA3WNVX Reference data BU11UA3WNVX (Ta=25C unless otherwise specified.) LOAD TRANSIENT RESPONSE LOAD TRANSIENT RESPONSE 200mA/div Trise=Tfall=1us 50mA IOUT 0mA 100mV/div 100mV/div 50mA/div Trise=Tfall=1us VOUT 300mA IOUT 0mA VOUT Vout=1.1V Vout=1.1V 10s/div 10s/div Figure 35. Figure 36. LINE TRANSIENT RESPONSE LINE TRANSIENT RESPONSE Slew Rate = 0.5V/s 1V/div 1V/div Slew Rate = 0.5V/s 2.9V VIN 2.9V VIN 2.3V 100mV/div 100mV/div 2.3V VOUT Vout=1.1V VOUT Vout=1.1V Iout=1mA Iout=300mA 1ms/div 1ms/div Figure 37. Figure 38. VIN RAMP UP, RAMP DOWN RESPONSE LINE TRANSIENT RESPONSE Slew Rate = 0.5V/s Vout=1.1V Iout=1mA 1V/div 3.6V VIN VIN 100mV/div 1V/div 2.1V VOUT VOUT Vout=1.1V Iout=300mA 1ms/div 200ms/div Figure 40. Figure 39. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 11/27 TSZ02201-0GBG0A300010-1-2 30.Oct.2015 Rev.008 Datasheet BUxxUA3WNVX Reference data BU11UA3WNVX (Ta=25C unless otherwise specified.) DISCHARGE TIME START UP TIME 1.5V 1V/div 1V/div 1.5V STBY 0V VOUT 1V/div 1V/div STBY Vout=1.1V Iout=0mA Cout=1.0uF 0V VOUT Vout=1.1V Iout=0mA Cout=1.0uF 20s/div 40s/div Figure 41. Figure 42. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 12/27 TSZ02201-0GBG0A300010-1-2 30.Oct.2015 Rev.008 Datasheet BUxxUA3WNVX Reference data BU12UA3WNVX (Ta=25C unless otherwise specified.) LINEREGULATION LINEREGULATION 1.30 1.28 Vout=1.2V Iout=300mA 1.28 1.26 1.26 1.24 1.24 1.22 1.22 VOUT[V] VOUT[V] 1.30 Vout=1.2V Iout=10mA 1.20 1.18 1.16 1.20 1.18 1.16 1.14 1.14 85 25 -40 1.12 1.10 85 25 -40 1.12 1.10 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 VIN[V] VIN[V] Figure 43. LOAD REGULATION 1.30 OUTPUT VOLTAGE vs TEMPERATURE 1.30 Vout=1.2V 1.28 1.28 1.26 1.26 1.24 1.24 1.22 1.22 VOUT[V] VOUT[V] Figure 44. 1.20 1.18 1.16 Vout=1.2V 1.20 1.18 1.16 1.14 1.14 85 25 -40 1.12 1.10 0 50 100 150 200 250 10mA 150mA 300mA 1.12 1.10 300 -40 IOUT[mA] -20 0 20 GROUND PIN CURRENT vs INPUT VOLTAGE Vout=1.2V 65 60 80 Figure 46. Figure 45. 70 40 Temperature[] GROUND PIN CURRENT vs LOAD 450 Vout=1.2V 400 60 55 350 50 300 IGND[uA] IGND[uA] 45 40 35 30 25 250 200 150 20 100 15 85 25 -40 10 5 0 0 2.3 2.5 2.7 2.9 3.1 3.3 0 3.5 50 100 150 200 250 300 IOUT[mA] VIN[V] Figure 48. Figure 47. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 85 25 -40 50 13/27 TSZ02201-0GBG0A300010-1-2 30.Oct.2015 Rev.008 Datasheet BUxxUA3WNVX Reference data BU12UA3WNVX (Ta=25C unless otherwise specified.) GROUND PIN CURRENT vs TEMPERATURE Vout=1.2V 70 SHUTDOWN CURRENT vs INPUT VOLTAGE Vout=1.2V 100 90 60 80 85 25 -40 70 ISHDN[nA] IGND[uA] 50 40 30 60 50 40 30 20 20 10 10 0 0 -40 -20 0 20 40 60 Temperature[] 2.3 80 2.5 2.7 3.1 3.3 3.5 VIN[V] Figure 50. Figure 49. CURRENT LIMIT vs INPUT VOLTAGE 700 2.9 POWER-SUPPLY RIPPLE REJECTION vs FREQUENCY 100 Vout=1.2V 90 600 10mA 150mA 80 70 PSRR[dB] ILIM[mA] 500 400 300 60 50 40 30 200 20 85 25 -40 100 10 0 0 2.3 2.5 2.7 2.9 3.1 3.3 10 3.5 100 Figure 51. 20mA/div 100mV/div 100mA/div 100mV/div 1000000 Trise=Tfall=1us 0mA VOUT 10mA IOUT 0mA VOUT Vout=1.2V Vout=1.2V 10s/div 10s/div Figure 53. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 100000 LOAD TRANSIENT RESPONSE 200mA IOUT 10000 Figure 52. LOAD TRANSIENT RESPONSE Trise=Tfall=1us 1000 Frequency[Hz] VIN[V] Figure 54. 14/27 TSZ02201-0GBG0A300010-1-2 30.Oct.2015 Rev.008 Datasheet BUxxUA3WNVX Reference data BU12UA3WNVX (Ta=25C unless otherwise specified.) LOAD TRANSIENT RESPONSE LOAD TRANSIENT RESPONSE 200mA/div Trise=Tfall=1us 50mA IOUT 0mA 100mV/div 100mV/div 50mA/div Trise=Tfall=1us VOUT 300mA IOUT 0mA VOUT Vout=1.2V Vout=1.2V 10s/div 10s/div Figure 55. Figure 56. LINE TRANSIENT RESPONSE LINE TRANSIENT RESPONSE Slew Rate = 0.5V/s 1V/div 1V/div Slew Rate = 0.5V/s 2.9V VIN 2.9V VIN 100mV/div 2.3V 100mV/div 2.3V VOUT Vout=1.2V VOUT Vout=1.2V Iout=1mA Iout=300mA 1ms/div 1ms/div Figure 57. Figure 58. VIN RAMP UP, RAMP DOWN RESPONSE LINE TRANSIENT RESPONSE Slew Rate = 0.5V/s Vout=1.2V Iout=1mA 1V/div 3.6V VIN VIN 100mV/div 1V/div 2.1V VOUT VOUT Vout=1.2V Iout=300mA 1ms/div 200ms/div Figure 60. Figure 59. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 15/27 TSZ02201-0GBG0A300010-1-2 30.Oct.2015 Rev.008 Datasheet BUxxUA3WNVX Reference data BU12UA3WNVX (Ta=25C unless otherwise specified.) DISCHARGE TIME START UP TIME 1.5V 1V/div 1V/div 1.5V STBY 0V VOUT 1V/div 1V/div STBY Vout=1.2V Iout=0mA Cout=1.0uF 0V VOUT Vout=1.2V Iout=0mA Cout=1.0uF 20s/div 40s/div Figure 61. Figure 62. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 16/27 TSZ02201-0GBG0A300010-1-2 30.Oct.2015 Rev.008 Datasheet BUxxUA3WNVX Reference data BU18UA3WNVX (Ta=25C unless otherwise specified.) LINEREGULATION LINEREGULATION 1.90 1.88 Vout=1.8V Iout=300mA 1.88 1.86 1.86 1.84 1.84 1.82 1.82 VOUT[V] VOUT[V] 1.90 Vout=1.8V Iout=10mA 1.80 1.78 1.76 1.80 1.78 1.76 1.74 1.74 85 25 -40 1.72 1.70 85 25 -40 1.72 1.70 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 VIN[V] VIN[V] Figure 64. Figure 63. LOAD REGULATION OUTPUT VOLTAGE vs TEMPERATURE 1.90 Vout=1.8V 1.88 1.88 1.86 1.86 1.84 1.84 1.82 1.82 VOUT[V] VOUT[V] 1.90 1.80 1.78 1.76 Vout=1.8V 1.80 1.78 1.76 1.74 1.74 85 25 -40 1.72 1.70 0 50 100 150 200 250 10mA 150mA 300mA 1.72 1.70 300 -40 -20 0 20 Figure 65. 65 60 80 Figure 66. GROUND PIN CURRENT vs INPUT VOLTAGE Vout=1.8V 70 40 Temperature[] IOUT[mA] GROUND PIN CURRENT vs LOAD 450 Vout=1.8V 400 60 55 350 50 300 IGND[uA] IGND[uA] 45 40 35 30 25 250 200 150 20 100 15 85 25 -40 10 5 0 0 2.3 2.5 2.7 2.9 3.1 3.3 0 3.5 50 100 150 200 250 300 IOUT[mA] VIN[V] Figure 67. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 85 25 -40 50 Figure 68. 17/27 TSZ02201-0GBG0A300010-1-2 30.Oct.2015 Rev.008 Datasheet BUxxUA3WNVX Reference data BU18UA3WNVX (Ta=25C unless otherwise specified.) GROUND PIN CURRENT vs TEMPERATURE Vout=1.8V 70 SHUTDOWN CURRENT vs INPUT VOLTAGE Vout=1.8V 100 90 60 80 85 25 -40 70 ISHDN[nA] IGND[uA] 50 40 30 60 50 40 30 20 20 10 10 0 0 -40 -20 0 20 40 60 Temperature[] 2.3 80 2.5 2.7 2.9 Figure 69. 3.3 3.5 Figure 70. CURRENT LIMIT vs INPUT VOLTAGE 700 3.1 VIN[V] POWER-SUPPLY RIPPLE REJECTION vs FREQUENCY 100 Vout=1.8V 90 600 10mA 150mA 80 70 PSRR[dB] ILIM[mA] 500 400 300 60 50 40 30 200 20 85 25 -40 100 10 0 0 2.3 2.5 2.7 2.9 3.1 3.3 10 3.5 100 Figure 71. 20mA/div 100mV/div 100mA/div 100mV/div 1000000 Trise=Tfall=1us 0mA VOUT 10mA IOUT 0mA VOUT Vout=1.8V Vout=1.8V 10s/div 10s/div Figure 74. Figure 73. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 100000 LOAD TRANSIENT RESPONSE 200mA IOUT 10000 Figure 72. LOAD TRANSIENT RESPONSE Trise=Tfall=1us 1000 Frequency[Hz] VIN[V] 18/27 TSZ02201-0GBG0A300010-1-2 30.Oct.2015 Rev.008 Datasheet BUxxUA3WNVX Reference data BU18UA3WNVX (Ta=25C unless otherwise specified.) LOAD TRANSIENT RESPONSE LOAD TRANSIENT RESPONSE 200mA/div Trise=Tfall=1us 50mA IOUT 0mA 100mV/div 100mV/div 50mA/div Trise=Tfall=1us VOUT 300mA IOUT 0mA VOUT Vout=1.8V Vout=1.8V 10s/div 10s/div Figure 75. Figure 76. LINE TRANSIENT RESPONSE LINE TRANSIENT RESPONSE Slew Rate = 0.5V/s 1V/div 1V/div Slew Rate = 0.5V/s 2.9V VIN 2.9V VIN 2.3V 100mV/div 100mV/div 2.3V VOUT Vout=1.8V VOUT Vout=1.8V Iout=1mA Iout=300mA 1ms/div 1ms/div Figure 77. Figure 78. VIN RAMP UP, RAMP DOWN RESPONSE LINE TRANSIENT RESPONSE Slew Rate = 0.5V/s Vout=1.8V Iout=1mA 1V/div 3.6V VIN VIN 100mV/div 1V/div 2.1V VOUT VOUT Vout=1.8V Iout=300mA 1ms/div 200ms/div Figure 80. Figure 79. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 19/27 TSZ02201-0GBG0A300010-1-2 30.Oct.2015 Rev.008 Datasheet BUxxUA3WNVX Reference data BU18UA3WNVX (Ta=25C unless otherwise specified.) DISCHARGE TIME START UP TIME 1.5V 1V/div 1V/div 1.5V STBY 0V VOUT 1V/div 1V/div STBY Vout=1.8V Iout=0mA Cout=1.0uF VOUT Vout=1.8V Iout=0mA Cout=1.0uF 40s/div 20s/div Figure 81. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 0V Figure 82. 20/27 TSZ02201-0GBG0A300010-1-2 30.Oct.2015 Rev.008 Datasheet BUxxUA3WNVX Reference data BU31UA3WNVX (Ta=25C unless otherwise specified.) LINEREGULATION LINEREGULATION 3.20 3.18 Vout=3.1V Iout=300mA 3.18 3.16 3.16 3.14 3.14 3.12 3.12 VOUT[V] VOUT[V] 3.20 Vout=3.1V Iout=10mA 3.10 3.08 3.06 85 25 -40 3.10 3.08 3.06 3.04 3.04 85 25 -40 3.02 3.00 3.02 3.00 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5.0 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5.0 VIN[V] VIN[V] Figure 84. Figure 83. LOAD REGULATION 3.20 3.18 85 25 -40 Vout=3.1V 3.18 10mA 150mA 300mA 3.16 3.14 3.14 3.12 3.12 VOUT[V] VOUT[V] 3.16 OUTPUT VOLTAGE vs TEMPERATURE 3.20 Vout=3.1V 3.10 3.08 3.10 3.08 3.06 3.06 3.04 3.04 3.02 3.02 3.00 3.00 0 50 100 150 200 250 300 -40 IOUT[mA] -20 0 20 Figure 85. 65 60 80 Figure 86. GROUND PIN CURRENT vs INPUT VOLTAGE Vout=3.1V 70 40 Temperature[] GROUND PIN CURRENT vs LOAD 450 Vout=3.1V 400 60 55 350 50 300 IGND[uA] IGND[uA] 45 40 35 30 25 250 200 150 20 15 100 85 25 -40 10 5 85 25 -40 50 0 0 3.3 3.8 4.3 0 4.8 Figure 87. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 50 100 150 200 250 300 IOUT[mA] VIN[V] Figure 88. 21/27 TSZ02201-0GBG0A300010-1-2 30.Oct.2015 Rev.008 Datasheet BUxxUA3WNVX BU31UA3WNVX Reference data (Ta=25C unless otherwise specified.) GROUND PIN CURRENT vs TEMPERATURE Vout=3.1V 70 SHUTDOWN CURRENT vs INPUT VOLTAGE Vout=3.1V 100 90 85 25 -40 60 80 70 ISHDN[nA] IGND[uA] 50 40 30 60 50 40 30 20 20 10 10 0 0 -40 -20 0 20 40 60 Temperature[] 3.3 80 3.5 3.7 CURRENT LIMIT vs INPUT VOLTAGE 4.7 4.9 90 10mA 150mA 80 70 PSRR[dB] 600 ILIM[mA] 4.5 POWER-SUPPLY RIPPLE REJECTION vs FREQUENCY 100 Vout=3.1V 700 500 400 300 60 50 40 30 200 20 85 25 -40 100 10 0 0 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 10 5.6 100 Figure 91. Trise=Tfall=1us 20mA/div 100mV/div 0mA VOUT 10mA IOUT 0mA VOUT Vout=3.1V Vout=3.1V 10s/div 10s/div Figure 94. Figure 93. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 100000 LOAD TRANSIENT RESPONSE 200mA IOUT 10000 Figure 92. LOAD TRANSIENT RESPONSE Trise=Tfall=1us 1000 Frequency[Hz] VIN[V] 100mA/div 4.3 Figure 90. 800 100mV/div 4.1 VIN[V] Figure 89. 900 3.9 22/27 TSZ02201-0GBG0A300010-1-2 30.Oct.2015 Rev.008 Datasheet BUxxUA3WNVX Reference data BU31UA3WNVX (Ta=25C unless otherwise specified.) LOAD TRANSIENT RESPONSE LOAD TRANSIENT RESPONSE 200mA/div Trise=Tfall=1us 50mA IOUT 0mA 100mV/div 100mV/div 50mA/div Trise=Tfall=1us VOUT 300mA IOUT 0mA VOUT Vout=3.1V Vout=3.1V 10s/div 10s/div Figure 95. Figure 96. LINE TRANSIENT RESPONSE LINE TRANSIENT RESPONSE Slew Rate = 0.5V/s 1V/div 1V/div Slew Rate = 0.5V/s 4.3V VIN 4.3V VIN 3.7V 100mV/div 100mV/div 3.7V VOUT Vout=3.1V VOUT Vout=3.1V Iout=1mA Iout=300mA 1ms/div 1ms/div Figure 97. Figure 98. VIN RAMP UP, RAMP DOWN RESPONSE LINE TRANSIENT RESPONSE Slew Rate = 0.5V/s Vout=3.1V Iout=1mA 1V/div 5.0V VIN VIN 100mV/div 1V/div 3.5V VOUT VOUT Vout=3.1V Iout=300mA 1ms/div 200ms/div Figure 100. Figure 99. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 23/27 TSZ02201-0GBG0A300010-1-2 30.Oct.2015 Rev.008 Datasheet BUxxUA3WNVX Reference data BU31UA3WNVX (Ta=25C unless otherwise specified.) DISCHARGE TIME START UP TIME 1.5V 1V/div 1V/div 1.5V STBY 0V VOUT 1V/div 1V/div STBY Vout=3.1V Iout=0mA Cout=1.0uF Vout=3.1V Iout=0mA Cout=1.0uF VOUT 40s/div 20s/div Figure 101. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 0V Figure 102. 24/27 TSZ02201-0GBG0A300010-1-2 30.Oct.2015 Rev.008 Datasheet BUxxUA3WNVX About power dissipation (Pd) As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability. Therefore, be sure to prepare sufficient margin within power dissipation for usage. Calculation of the maximum internal power consumption of IC (PMAX) PMAX=(VIN-VOUT)xIOUT(MAX.) (VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current) Measurement conditions Standard ROHM Board Evaluation Board 1 Top Layer (Top View) Top Layer (Top View) Bottom Layer (Top View) Bottom Layer (Top View) Measurement State With board implemented (Wind speed 0 m/s) With board implemented (Wind speed 0 m/s) Board Material Glass epoxy resin (Double-side board) Glass epoxy resin (Double-side board) Board Size 70 mm x 70 mm x 1.6 mm 40 mm x 40 mm x 1.6 mm Metal (GND) wiring rate: Approx. 0% Metal (GND) wiring rate: Approx. 50% Metal (GND) wiring rate: Approx. 50% Metal (GND) wiring rate: Approx. 50% Diameter 0.5mm x 6 holes Diameter 0.5mm x 25 holes Power Dissipation 0.56W 0.39W Thermal Resistance ja=178.6C/W ja=256.4C/W Layout of Board for Measurement IC Implementation Position Top layer Bottom layer Through Hole Wiring Rate 0.6 0.56W 0.5 Pd [W] 0.4 0.39W 0.3 * Please design the margin so that PMAX becomes is than Pd (PMAXPd) within the usage temperature range 0.2 0.1 0 0 25 50 75 85 100 125 Ta [] Figure 103. SSON004X1010 www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Power dissipation heat reduction characteristics (Reference) 25/27 TSZ02201-0GBG0A300010-1-2 30.Oct.2015 Rev.008 Datasheet BUxxUA3WNVX Operation Notes 1.) Absolute maximum ratings Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode) when such damage is suffered. If operational values are expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC. 2.) GND potential The potential of the GND pin must be the minimum potential in the system in all operating conditions. Never connect a potential lower than GND to any pin, even if only transiently. 3.) Thermal design Use a thermal design that allows for a sufficient margin for that package power dissipation rating (Pd) under actual operating conditions. 4.) Inter-pin shorts and mounting errors Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting or shorts between pins may result in damage to the IC. 5.) Common impedance Wiring traces should be as short and wide as possible to minimize common impedance. Bypass capacitors should be use to keep ripple to a minimum. 6.) Voltage of STBY pin To enable standby mode for all channels, set the STBY pin to 0.3 V or less, and for normal operation, to 1.2 V or more. Setting STBY to a voltage between 0.3 and 1.2 V may cause malfunction and should be avoided. Keep transition time between high and low (or vice versa) to a minimum. Additionally, if STBY is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit, causing a temporary voltage to remain on the output pin. If the IC is switched on again while this voltage is present, overshoot may occur on the output. Therefore, in applications where these pins are shorted, the output should always be completely discharged before turning the IC on. 7.) Over-current protection circuit (OCP) This IC features an integrated over-current and short-protection circuitry on the output to prevent destruction of the IC when the output is shorted. The OCP circuitry is designed only to protect the IC from irregular conditions (such as motor output shorts) and is not designed to be used as an active security device for the application. Therefore, applications should not be designed under the assumption that this circuitry will engage. 8.) Thermal shutdown circuit (TSD) This IC also features a thermal shutdown circuit that is designed to turn the output off when the junction temperature of the IC exceeds about 150. This feature is intended to protect the IC only in the event of thermal overload and is not designed to guarantee operation or act as an active security device for the application. Therefore, applications should not be designed under the assumption that this circuitry will engage. 9.) Input/output capacitor Capacitors must be connected between the input/output pins and GND for stable operation, and should be physically mounted as close to the IC pins as possible. The input capacitor helps to counteract increases in power supply impedance, and increases stability in applications with long or winding power supply traces. The output capacitance Unstable region value is directly related to the overall stability and transient response of the regulator, and should be set to the largest possible value for the application to increase these characteristics. During design, keep in mind that in general, ceramic capacitors have a wide range of tolerances, temperature coefficients and DC bias characteristics, and that their capacitance values tend to decrease over time. Confirm these details before choosing appropriate capacitors for your application.(Please refer the technical note, regarding ceramic capacitor of recommendation) 10.) About the equivalent series resistance (ESR) of a ceramic capacitor Capacitors generally have ESR (equivalent series resistance) 100 and it operates stably in the ESR-IOUT area shown on the right. Since ceramic capacitors, tantalum capacitors, electrolytic capacitors, etc. generally have different ESR, please check 10 the ESR of the capacitor to be used and use it within the stability area range shown in the right graph for evaluation 1 of the actual application. Cout=1.0uF Cin=1.0uF Temp=25 ESR[] Unstable 0.1 Stable 0.01 0 100 200 IOUT[mA] 300 400 Figure 104. Stable region (example) www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 26/27 TSZ02201-0GBG0A300010-1-2 30.Oct.2015 Rev.008 Datasheet BUxxUA3WNVX Revision History Date Revision Changes 31.Jan.2013 001 New Release. 20.Feb.2013 002 Package size is changed. 21.Feb.2013 003 Adding a revision history Adding a lineup. The condition of drop voltage is changed. 19.Apr.2013 28.Jun.2013 004 005 06.Sep.2013 006 05.Feb.2014 10.Oct.2015 007 008 Adding lineup. Adding reference data. Adding Pin Descriptions. Adding BOTTOM VIEW. Adding reference data Lineup is changed. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 27/27 TSZ02201-0GBG0A300010-1-2 30.Oct.2015 Rev.008 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BU27UA3WNVX - Web Page Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BU27UA3WNVX SSON004X1010 5000 5000 Taping inquiry Yes