Datashee
t
○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays
1/27
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TSZ22111・14・001
TSZ02201-0GBG0A300010-1-2
CMOS LDO Regulator Series for Portable Equipments
Versatile Package
FULL CMOS LDO Regulator
BUxxUA3WNVX series
●General Description
BUxxUA3WNVX series is high-performance FULL
CMOS regulator with 300-mA output, which is mounted
on versatile package SSON004X1010 (1.00mm 1.00
mm 0.60mm). It has excellent noise characteristics and
load responsiveness characteristics despite its low circuit
current consumption of 50A. It is most appropriate for
various applications such as power supplies for logic IC,
RF, and camera modules.
●Features
High accuracy detection
low current consumption
Compatible with small ceramic capacitor (Cin=Co=1.0uF)
With built-in output discharge circuit
High ripple rejection
ON/OFF control of output voltage
With built-in over current protection circuit
and thermal shutdown circuit
Low dropout voltage
●Typical A pplication Circuit
●Key Specifications
Output voltage: 1.0V to 3.7V
Accuracy output voltage: ±1.0% (±25mV)
Low current consumption: 50μA
Operating temperature range: -40°C to +85°C
●Applications
Battery-powered portable equipment, etc.
●Package
SSON004X1010 : 1.00mm x 1.00mm x 0.60mm
Figure 1. Application Circuit
STBY
VIN
GND
STBY
GND
GND
VOUTVOUT
VIN
2/27
30.Oct.2015 Rev. 008
BUxxUA3WNVX series
Datasheet
TSZ02201-0GBG0A300010-1-2
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
BUx xUA3 W NVX- T L
Part Output Voltage Low Dropout Voltage with Package Packageing and forming specification
Number 10 : 1.0V Maximum Output Current output discharge NVX : SSON004X1010 Embossed tape and reel
300mA TL : The pin number 1 is the lower left
37 : 3.7V
●Connection Diagram
●Pin Descriptions
● Ordering Information
1 VOUT 2 GND
3 STBY
4 VIN
SSON004X1010 TOP VIEW
Part Number Marking
LOT Number
1PIN MARK
1 2
SSON004X1010
PIN No. Symbol Function
1 VOUT Output Voltage
2 GND Grouding
3 STBY
ON/OFF control of output voltage
(High: ON, Low: OFF)
4 VIN Power Supply Voltage
reverse FIN Substrate (Connect to GND)
SSON004X1010
(Unit : mm
)
1.0±0.1
1.0±0.1
1PIN MARK
0.6MAX
0.02+0.03
−0.02
S
0.05
(0.12)
0.65±0.05
0.48±0.05
0.07±0.1
0.25±0.05
0.25±0.1
1
45º
4
2
3
3-C0.18
R0.05
0.48±0.05
0.32±0.1
∗ Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the lower left when you hold
reel on the left hand and you pull out the tape on the left hand
5000pcs
TL
()
Direction of feed
Reel 1pin
1 VOUT 2 GND
3 STBY
4 VIN
BOTTOM VIEW
reverse FIN
3/27
30.Oct.2015 Rev. 008
BUxxUA3WNVX series
Datasheet
TSZ02201-0GBG0A300010-1-2
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
●Lineup
●Absolute Maximum Ratings (Ta=25°C)
PARAMETER Symbol Limit Unit
Power Supply Voltage VMAX -0.3 ～ +6.0 V
Power Dissipation Pd 560(*1) mW
Maximum junction temperature TjMAX +125 ℃
Operating Temperature Range Topr -40 ～ +85 ℃
Storage Temperature Range Tstg -55 ～ +125 ℃
(*1) Pd deleted at 5.6mW/℃ at temperatures above Ta=25℃, mounted on 70×70×1.6 mm glass-epoxy PCB.
● RECOMMENDED OPERATING RANGE (not to exceed Pd)
PARAMETER Symbol Limit Unit
Power Supply Voltage VIN 1.7～5.5 V
Maximum Output Current IMAX 300 mA
●OPERATING CONDITIONS
(*2) Make sure that the output capacitor value is not kept lower than this specified level across a variety of temperature, DC bias,
characteristic.
PARAMETER Symbol MIN. TYP. MAX. Unit CONDITION
Input Capacitor Cin 0.47(*2) 1.0 - μF Ceramic capacitor recommended
Output Capacitor Co 0.47(*2) 1.0 - μF
Marking e ml nl Ul Yl al ql Bi f g bl
Output
Voltage 1.0V 1.05V 1.1V 1.15V 1.2V 1.25V 1.3V 1.35V 1.5V 1.8V 1.85V
Part
Number BU10 BU1A BU11 BU1B BU12 BU1C BU13 BU1D BU15 BU18 BU1J
dl el fl gl
rl hl h m
ul yl n
1.9V 2.0V 2.05V 2.1V 2.2V 2.3V 2.5V 2.6V 2.7V 2.75V 2.8V
BU19 BU20 BU2A BU21 BU22 BU23 BU25 BU26 BU27 BU2H BU28
z u 0i k 1i 2i y 3i 9
2.85V 2.9V 2.95V 3.0V 3.1V 3.2V 3.3V 3.4V 3.7V
BU2J BU29 BU2K BU30 BU31 BU32 BU33 BU34 BU37
4/27
30.Oct.2015 Rev. 008
BUxxUA3WNVX series
Datasheet
TSZ02201-0GBG0A300010-1-2
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
●Electrical Characteristics
(Ta=25℃, VIN=VOUT+1.0V (*3), STBY=VIN, Cin=1.0μF, Co=1.0μF, unless otherwise noted.)
○This product is not designed for protection against radioactive rays.
(*3) VIN=2.5V for VOUT≦1.5V
(*4) VIN=2.5V to 5.5V for VOUT≦1.5V
●Block Diagrams
PARAMETER Symbol Limit Unit Conditions
MIN. TYP. MAX.
Overall Device
Output Voltage VOUT VOUT×0.99 VOUT VOUT×1.01 V IOUT=10μA，VOUT≧2.5V
VOUT-25mV VOUT+25mV IOUT=10μA，VOUT＜2.5V
Operating Current IIN - 50 90 μA IOUT=0mA
Operating Current (STBY) ISTBY - - 1.0 μASTBY=0V
Ripple Rejection Ratio RR 45 70 - dB VRR=-20dBv,fRR=1kHz,IOUT=150mA,
VIN=3.6V
Dropout Voltage VSAT
- 470 700 mV 1.0V≦VOUT＜1.2V(IOUT=300mA)
- 350 500 mV 1.2V≦VOUT＜1.5V(IOUT=300mA)
- 280 380 mV 1.5V≦VOUT＜1.7V(IOUT=300mA)
- 250 320 mV 1.7V≦VOUT＜2.1V(IOUT=300mA)
- 220 260 mV 2.1V≦VOUT＜2.5V(IOUT=300mA)
- 200 220 mV 2.5V≦VOUT(IOUT=300mA)
Line Regulation VDL - 2 20 mV VIN=VOUT+1.0V to 5.5V(*4), IOUT=10μA
Load Regulation VDLO - 25 45 mV IOUT=0.01mA to 300mA
Over-current Protection (OCP)
Limit Current ILMAX 370 550 - mA Vo=VOUT*0.95
Short Current ISHORT 50 150 300 mA Vo=0V
Standby Block
Discharge Resistor RDSC 20 50 80 Ω VIN=5.5V, STBY=0V, VOUT=2.6V
STBY Pin Pull-down
Current ISTB 0.1 0.9 8.0 μA STBY=1.5V
STBY Control
Voltage
ON VSTBH 1.2 - 5.5 V
OFF VSTBL -0.3 - 0.3 V
Figure 2. Block Diagrams
Cin･･･1.0μF (Ceramic)
Co ･･･1.0μF (Ceramic)
4
3
1
2
Cin
VIN
GND
STBY
STBY
VOUT VOUT
Co
VREF
OCP
STBY Discharge
TSD
VIN
5/27
30.Oct.2015 Rev. 008
BUxxUA3WNVX series
Datasheet
TSZ02201-0GBG0A300010-1-2
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
● Reference data BU10UA3WNVX (Ta=25ºC unless otherwise specified.)
Figure 3. Figure 4.
Figure 5. Figure 6.
Figure 8.
Figure 7.
GROUND PIN CURRENT vs LOAD
0
50
100
150
200
250
300
350
400
450
0 50 100 150 200 250 300
IOUT[mA]
IGND[uA]
85℃
25℃
-40℃
Vout=1.0V
GROUND PIN CURRENT vs INPUT VOLTAGE
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
2.3 2.5 2.7 2.9 3.1 3.3 3.5
VIN[V]
IGND[uA]
85℃
25℃
-40℃
Vout=1.0V
OUTPUT VOLTAGE vs TEMPERATURE
0.90
0.95
1.00
1.05
1.10
-40-200 20406080
Temperature[℃]
VOUT[V]
10mA
150mA
300mA
Vout=1.0V
LOAD REGULATION
0.90
0.92
0.94
0.96
0.98
1.00
1.02
1.04
1.06
1.08
1.10
0 50 100 150 200 250 300
IOUT[mA]
VOUT[V]
85℃
25℃
-40℃
Vout=1.0V
LINE REGULATION
0.90
0.92
0.94
0.96
0.98
1.00
1.02
1.04
1.06
1.08
1.10
1.61.71.81.92.02.12.22.32.42.52.62.72.82.93.03.13.2
VIN[V]
VOUT[V]
85℃
25℃
-40℃
Vout=1.0V
Iout=300mA
LINE REGULATION
0.90
0.92
0.94
0.96
0.98
1.00
1.02
1.04
1.06
1.08
1.10
1.61.71.81.92.02.12.22.32.42.52.62.72.82.93.03.13.2
VIN[V]
VOUT[V]
85℃
25℃
-40℃
Vout=1.0V
Iout=10mA
6/27
30.Oct.2015 Rev. 008
BUxxUA3WNVX series
Datasheet
TSZ02201-0GBG0A300010-1-2
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
● Reference data BU10UA3WNVX (Ta=25ºC unless otherwise specified.)
Figure 12. Figure 11.
Figure 10.
Figure 9.
POWER-SUPPLY RIPPLE REJECTION vs FREQUENCY
0
10
20
30
40
50
60
70
80
90
100
10 100 1000 10000 100000 1000000
Frequency[Hz]
PSRR[dB]
10mA
150m
A
Figure 13. Figure 14.
Vout=1.0V
0mA
10mA
IOUT
VOUT
Trise=Tfall=1us
10µs/div
20mA/di
v
100mV/di
v
LOAD TRANSIENT RESPONSE
Vout=1.0V
0mA
200mA
IOUT
VOUT
Trise=Tfall=1us
10µs/div
100mA/di
v
100mV/di
v
LOAD TRANSIENT RESPONSE
CURRENT LIMIT vs INPUT VOLTAGE
0
100
200
300
400
500
600
700
2.3 2.5 2.7 2.9 3.1 3.3 3.5
VIN[V]
ILIM[mA]
85℃
25℃
-40℃
Vout=1.0V
SHUTDOWN CURRENT vs INPUT VOLTAGE
0
10
20
30
40
50
60
70
80
90
100
2.3 2.5 2.7 2.9 3.1 3.3 3.5
VIN[V]
ISHDN[nA]
85℃
25℃
-40℃
Vout=1.0V
GROUND PIN CURRENT vs TEMPERATURE
0
10
20
30
40
50
60
70
-40 -20 0 20 40 60 80
Temperature[℃]
IGND[uA]
Vout=1.0V
7/27
30.Oct.2015 Rev. 008
TSZ02201-0GBG0A300010-1-2
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TSZ22111・15・001
BUxxUA3WNVX シリーズ Datasheet
● Reference data BU10UA3WNVX (Ta=25ºC unless otherwise specified.)
Figure 16.
Figure 15.
Figure 17.
Figure 20.
Figure 19.
Figure 18.
2.1V
3.6V
VIN
VOUT
Slew Rate = 0.5V/µs
Vout=1.0V
Iout=300mA
1ms/div
1V/di
v
100mV/di
v
LINE TRANSIENT RESPONSE
VIN
VOUT
Vout=1.0V
Iout=1mA
200ms/div
1V/di
v
VIN RAMP UP, RAMP DOWN RESPONSE
2.3V
2.9V
VIN
VOUT
Slew Rate = 0.5V/µs
Vout=1.0V
Iout=1mA
1ms/div
1V/di
v
100mV/di
v
LINE TRANSIENT RESPONSE
2.3V
2.9V
VIN
VOUT
Slew Rate = 0.5V/µs
Vout=1.0V
Iout=300mA
1ms/div
1V/di
v
100mV/di
v
LINE TRANSIENT RESPONSE
Vout=1.0V
0mA
300mA
IOUT
VOUT
Trise=Tfall=1us
10µs/div
200mA/di
v
100mV/di
v
LOAD TRANSIENT RESPONSE
Vout=1.0V
0mA
50mA
IOUT
VOUT
Trise=Tfall=1us
10µs/div
50mA/di
v
100mV/di
v
LOAD TRANSIENT RESPONSE
8/27
30.Oct.2015 Rev. 008
TSZ02201-0GBG0A300010-1-2
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TSZ22111・15・001
BUxxUA3WNVX シリーズ Datasheet
● Reference data BU10UA3WNVX (Ta=25ºC unless otherwise specified.)
Figure 21. Figure 22.
Vout=1.0V
Iout=0mA
Cout=1.0uF
0V
STBY
VOUT
20µs/div
1V/di
v
START UP TIME
1V/di
v
1.5V
1V/di
v
1V/di
v
40µs/div
0V
STBY
VOUT
1.5V
Vout=1.0V
Iout=0mA
Cout=1.0uF
DISCHARGE TIME
9/27
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TSZ02201-0GBG0A300010-1-2
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TSZ22111・15・001
BUxxUA3WNVX シリーズ Datasheet
● Reference data BU11UA3WNVX (Ta=25ºC unless otherwise specified.)
Figure 23. Figure 24.
Figure 25. Figure 26.
Figure 28.
Figure 27.
LINE REGULATION
1.00
1.02
1.04
1.06
1.08
1.10
1.12
1.14
1.16
1.18
1.20
1.61.71.81.9 2.02.12.22.32.42.52.62.72.82.93.03.13.2
VIN[V]
VOUT[V]
85℃
25℃
-40℃
Vout=1.1V
Iout=10mA
LINE REGULATION
1.00
1.02
1.04
1.06
1.08
1.10
1.12
1.14
1.16
1.18
1.20
1.61.71.81.9 2.02.12.22.32.42.52.62.72.82.93.03.13.2
VIN[V]
VOUT[V]
85℃
25℃
-40℃
Vout=1.1V
Iout=300mA
LOAD REGULATION
1.00
1.02
1.04
1.06
1.08
1.10
1.12
1.14
1.16
1.18
1.20
0 50 100 150 200 250 300
IOUT[mA]
VOUT[V]
85℃
25℃
-40℃
Vout=1.1V OUTPUT VOLTAGE vs TEMPERATURE
1.00
1.02
1.04
1.06
1.08
1.10
1.12
1.14
1.16
1.18
1.20
-40-200 20406080
Temperature[℃]
VOUT[V]
10mA
150mA
300mA
Vout=1.1V
GROUND PIN CURRENT vs INPUT VOLTAGE
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
2.3 2.5 2.7 2.9 3.1 3.3 3.5
VIN[V]
IGND[uA]
85℃
25℃
-40℃
Vout=1.1V
GROUND PIN CURRENT vs LOAD
0
50
100
150
200
250
300
350
400
450
0 50 100 150 200 250 300
IOUT[mA]
IGND[uA]
85℃
25℃
-40℃
Vout=1.1V
10/27
30.Oct.2015 Rev. 008
TSZ02201-0GBG0A300010-1-2
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TSZ22111・15・001
BUxxUA3WNVX シリーズ Datasheet
● Reference data BU11UA3WNVX (Ta=25ºC unless otherwise specified.)
Figure 32.
Figure 31.
Figure 30.
Figure 29.
POWER-SUPPLY RIPPLE REJECTION vs FREQUENCY
0
10
20
30
40
50
60
70
80
90
100
10 100 1000 10000 100000 1000000
Frequency[Hz]
PSRR[dB]
10mA
150m
A
GROUND PIN CURRENT vs TEMPERATURE
0
10
20
30
40
50
60
70
-40 -20 0 20 40 60 80
Temperature[℃]
IGND[uA]
Vout=1.1V
SHUTDOWN CURRENT vs INPUT VOLTAGE
0
10
20
30
40
50
60
70
80
90
100
2.3 2.5 2.7 2.9 3.1 3.3 3.5
VIN[V]
ISHDN[nA]
85℃
25℃
-40℃
Vout=1.1V
CURRENT LIMIT vs INPUT VOLTAGE
0
100
200
300
400
500
600
700
2.3 2.5 2.7 2.9 3.1 3.3 3.5
VIN[V]
ILIM[mA]
85℃
25℃
-40℃
Vout=1.1V
Vout=1.1V
0mA
200mA
IOUT
VOUT
Trise=Tfall=1us
10µs/div
100mA/di
v
100mV/di
v
LOAD TRANSIENT RESPONSE
Figure 33. Figure 34.
Vout=1.1V
0mA
10mA
IOUT
VOUT
Trise=Tfall=1us
10µs/div
20mA/di
v
100mV/di
v
LOAD TRANSIENT RESPONSE
11/27
30.Oct.2015 Rev. 008
TSZ02201-0GBG0A300010-1-2
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
BUxxUA3WNVX シリーズ Datasheet
● Reference data BU11UA3WNVX (Ta=25ºC unless otherwise specified.)
Figure 36.
Figure 35.
Figure 37.
Figure 40.
Figure 39.
Figure 38.
Vout=1.1V
0mA
50mA
IOUT
VOUT
Trise=Tfall=1us
10µs/div
50mA/di
v
100mV/di
v
LOAD TRANSIENT RESPONSE
Vout=1.1V
0mA
300mA
IOUT
VOUT
Trise=Tfall=1us
10µs/div
200mA/di
v
100mV/di
v
LOAD TRANSIENT RESPONSE
2.3V
2.9V
VIN
VOUT
Slew Rate = 0.5V/µs
Vout=1.1V
Iout=300mA
1ms/div
1V/di
v
100mV/di
v
LINE TRANSIENT RESPONSE
2.3V
2.9V
VIN
VOUT
Slew Rate = 0.5V/µs
Vout=1.1V
Iout=1mA
1ms/div
1V/di
v
100mV/di
v
LINE TRANSIENT RESPONSE
2.1V
3.6V
VIN
VOUT
Slew Rate = 0.5V/µs
Vout=1.1V
Iout=300mA
1ms/div
1V/di
v
100mV/di
v
LINE TRANSIENT RESPONSE
VIN
VOUT
Vout=1.1V
Iout=1mA
200ms/div
1V/di
v
VIN RAMP UP, RAMP DOWN RESPONSE
12/27
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TSZ22111・15・001
BUxxUA3WNVX シリーズ Datasheet
● Reference data BU11UA3WNVX (Ta=25ºC unless otherwise specified.)
Figure 41. Figure 42.
Vout=1.1V
Iout=0mA
Cout=1.0uF
0V
STBY
VOUT
20µs/div
1V/di
v
START UP TIME
1V/di
v
1.5V
1V/di
v
1V/di
v
40µs/div
0V
STBY
VOUT
1.5V
Vout=1.1V
Iout=0mA
Cout=1.0uF
DISCHARGE TIME
13/27
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TSZ22111・15・001
BUxxUA3WNVX シリーズ Datasheet
● Reference data BU12UA3WNVX (Ta=25ºC unless otherwise specified.)
Figure 43. Figure 44.
Figure 45. Figure 46.
Figure 48.
Figure 47.
LINE REGULATION
1.10
1.12
1.14
1.16
1.18
1.20
1.22
1.24
1.26
1.28
1.30
1.61.71.81.92.02.12.22.32.42.52.62.72.82.93.03.13.2
VIN[V]
VOUT[V]
85℃
25℃
-40℃
Vout=1.2V
Iout=10mA
LINE REGULATION
1.10
1.12
1.14
1.16
1.18
1.20
1.22
1.24
1.26
1.28
1.30
1.61.71.81.92.02.12.22.32.42.52.62.72.82.93.03.13.2
VIN[V]
VOUT[V]
85℃
25℃
-40℃
Vout=1.2V
Iout=300mA
LOAD REGULATION
1.10
1.12
1.14
1.16
1.18
1.20
1.22
1.24
1.26
1.28
1.30
0 50 100 150 200 250 300
IOUT[mA]
VOUT[V]
85℃
25℃
-40℃
Vout=1.2V OUTPUT VOLTAGE vs TEMPERATURE
1.10
1.12
1.14
1.16
1.18
1.20
1.22
1.24
1.26
1.28
1.30
-40-200 20406080
Temperature[℃]
VOUT[V]
10mA
150mA
300mA
Vout=1.2V
GROUND PIN CURRENT vs INPUT VOLTAGE
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
2.3 2.5 2.7 2.9 3.1 3.3 3.5
VIN[V]
IGND[uA]
85℃
25℃
-40℃
Vout=1.2V
GROUND PIN CURRENT vs LOAD
0
50
100
150
200
250
300
350
400
450
0 50 100 150 200 250 300
IOUT[mA]
IGND[uA]
85℃
25℃
-40℃
Vout=1.2V
14/27
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BUxxUA3WNVX シリーズ Datasheet
● Reference data BU12UA3WNVX (Ta=25ºC unless otherwise specified.)
Figure 52.
Figure 51.
Figure 50.
Figure 49.
POWER-SUPPLY RIPPLE REJECTION vs FREQUENCY
0
10
20
30
40
50
60
70
80
90
100
10 100 1000 10000 100000 1000000
Frequency[Hz]
PSRR[dB]
10mA
150m
A
GROUND PIN CURRENT vs TEMPERATURE
0
10
20
30
40
50
60
70
-40 -20 0 20 40 60 80
Temperature[℃]
IGND[uA]
Vout=1.2V
SHUTDOWN CURRENT vs INPUT VOLTAGE
0
10
20
30
40
50
60
70
80
90
100
2.3 2.5 2.7 2.9 3.1 3.3 3.5
VIN[V]
ISHDN[nA]
85℃
25℃
-40℃
Vout=1.2V
CURRENT LIMIT vs INPUT VOLTAGE
0
100
200
300
400
500
600
700
2.3 2.5 2.7 2.9 3.1 3.3 3.5
VIN[V]
ILIM[mA]
85℃
25℃
-40℃
Vout=1.2V
Vout=1.2V
0mA
200mA
IOUT
VOUT
Trise=Tfall=1us
10µs/div
100mA/di
v
100mV/di
v
LOAD TRANSIENT RESPONSE
Vout=1.2V
0mA
10mA
IOUT
VOUT
Trise=Tfall=1us
10µs/div
20mA/di
v
100mV/di
v
LOAD TRANSIENT RESPONSE
Figure 54. Figure 53.
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BUxxUA3WNVX シリーズ Datasheet
● Reference data BU12UA3WNVX (Ta=25ºC unless otherwise specified.)
Figure 56.
Figure 55.
Figure 57.
Figure 60.
Figure 59.
Figure 58.
Vout=1.2V
0mA
50mA
IOUT
VOUT
Trise=Tfall=1us
10µs/div
50mA/di
v
100mV/di
v
LOAD TRANSIENT RESPONSE
Vout=1.2V
0mA
300mA
IOUT
VOUT
Trise=Tfall=1us
10µs/div
200mA/di
v
100mV/di
v
LOAD TRANSIENT RESPONSE
2.3V
2.9V
VIN
VOUT
Slew Rate = 0.5V/µs
Vout=1.2V
Iout=300mA
1ms/div
1V/di
v
100mV/di
v
LINE TRANSIENT RESPONSE
2.3V
2.9V
VIN
VOUT
Slew Rate = 0.5V/µs
Vout=1.2V
Iout=1mA
1ms/div
1V/di
v
100mV/di
v
LINE TRANSIENT RESPONSE
2.1V
3.6V
VIN
VOUT
Slew Rate = 0.5V/µs
Vout=1.2V
Iout=300mA
1ms/div
1V/di
v
100mV/di
v
LINE TRANSIENT RESPONSE
VIN
VOUT
Vout=1.2V
Iout=1mA
200ms/div
1V/di
v
VIN RAMP UP, RAMP DOWN RESPONSE
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BUxxUA3WNVX シリーズ Datasheet
● Reference data BU12UA3WNVX (Ta=25ºC unless otherwise specified.)
Figure 61. Figure 62.
Vout=1.2V
Iout=0mA
Cout=1.0uF
0V
STBY
VOUT
20µs/div
1V/di
v
START UP TIME
1V/di
v
1.5V
1V/di
v
1V/di
v
40µs/div
0V
STBY
VOUT
1.5V
Vout=1.2V
Iout=0mA
Cout=1.0uF
DISCHARGE TIME
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● Reference data BU18UA3WNVX (Ta=25ºC unless otherwise specified.)
Figure 63. Figure 64.
Figure 65. Figure 66.
Figure 68.
Figure 67.
LINE REGULATION
1.70
1.72
1.74
1.76
1.78
1.80
1.82
1.84
1.86
1.88
1.90
2.02.12.22.32.42.52.62.72.82.93.03.13.23.33.43.53.6
VIN[V]
VOUT[V]
85℃
25℃
-40℃
Vout=1.8V
Iout=10mA
LINE REGULATION
1.70
1.72
1.74
1.76
1.78
1.80
1.82
1.84
1.86
1.88
1.90
2.02.12.22.32.42.52.62.72.82.93.03.13.23.33.43.53.6
VIN[V]
VOUT[V]
85℃
25℃
-40℃
Vout=1.8V
Iout=300mA
LOAD REGULATION
1.70
1.72
1.74
1.76
1.78
1.80
1.82
1.84
1.86
1.88
1.90
0 50 100 150 200 250 300
IOUT[mA]
VOUT[V]
85℃
25℃
-40℃
Vout=1.8V
OUTPUT VOLTAGE vs TEMPERATURE
1.70
1.72
1.74
1.76
1.78
1.80
1.82
1.84
1.86
1.88
1.90
-40-200 20406080
Temperature[℃]
VOUT[V]
10mA
150mA
300m
A
Vout=1.8V
GROUND PIN CURRENT vs INPUT VOLTAGE
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
2.3 2.5 2.7 2.9 3.1 3.3 3.5
VIN[V]
IGND[uA]
85℃
25℃
-40℃
Vout=1.8V
GROUND PIN CURRENT vs LOAD
0
50
100
150
200
250
300
350
400
450
0 50 100 150 200 250 300
IOUT[mA]
IGND[uA]
85℃
25℃
-40℃
Vout=1.8V
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BUxxUA3WNVX シリーズ Datasheet
● Reference data BU18UA3WNVX (Ta=25ºC unless otherwise specified.)
GROUND PIN CURRENT vs TEMPERATURE
0
10
20
30
40
50
60
70
-40 -20 0 20 40 60 80
Temperature[℃]
IGND[uA]
Vout=1.8V
Figure 72.
Figure 71.
Figure 70.
Figure 69.
Vout=1.8V
0mA
200mA
IOUT
VOUT
Trise=Tfall=1us
10µs/div
100mA/di
v
100mV/di
v
LOAD TRANSIENT RESPONSE
Vout=1.8V
0mA
10mA
IOUT
VOUT
Trise=Tfall=1us
10µs/div
20mA/di
v
100mV/di
v
LOAD TRANSIENT RESPONSE
Figure 74.
Figure 73.
CURRENT LIMIT vs INPUT VOLTAGE
0
100
200
300
400
500
600
700
2.3 2.5 2.7 2.9 3.1 3.3 3.5
VIN[V]
ILIM[mA]
85℃
25℃
-40℃
Vout=1.8V
POWER-SUPPLY RIPPLE REJECTION vs FREQUENCY
0
10
20
30
40
50
60
70
80
90
100
10 100 1000 10000 100000 1000000
Frequency[Hz]
PSRR[dB]
10mA
150m
A
SHUTDOWN CURRENT vs INPUT VOLTAGE
0
10
20
30
40
50
60
70
80
90
100
2.3 2.5 2.7 2.9 3.1 3.3 3.5
VIN[V]
ISHDN[nA]
85℃
25℃
-40℃
Vout=1.8V
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● Reference data BU18UA3WNVX (Ta=25ºC unless otherwise specified.)
Vout=1.8V
0mA
50mA
IOUT
VOUT
Trise=Tfall=1us
10µs/div
50mA/di
v
100mV/di
v
LOAD TRANSIENT RESPONSE
Vout=1.8V
0mA
300mA
IOUT
VOUT
Trise=Tfall=1us
10µs/div
200mA/di
v
100mV/di
v
LOAD TRANSIENT RESPONSE
Figure 76.
Figure 75.
Figure 77.
2.3V
2.9V
VIN
VOUT
Slew Rate = 0.5V/µs
Vout=1.8V
Iout=300mA
1ms/div
1V/di
v
100mV/di
v
LINE TRANSIENT RESPONSE
2.3V
2.9V
VIN
VOUT
Slew Rate = 0.5V/µs
Vout=1.8V
Iout=1mA
1ms/div
1V/di
v
100mV/di
v
LINE TRANSIENT RESPONSE
2.1V
3.6V
VIN
VOUT
Slew Rate = 0.5V/µs
Vout=1.8V
Iout=300mA
1ms/div
1V/di
v
100mV/di
v
LINE TRANSIENT RESPONSE
VIN
VOUT
Vout=1.8V
Iout=1mA
200ms/div
1V/di
v
VIN RAMP UP, RAMP DOWN RESPONSE
Figure 80.
Figure 79.
Figure 78.
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BUxxUA3WNVX シリーズ Datasheet
● Reference data BU18UA3WNVX (Ta=25ºC unless otherwise specified.)
Figure 81.
Vout=1.8V
Iout=0mA
Cout=1.0uF
0V
STBY
VOUT
20µs/div
1V/di
v
START UP TIME
1V/di
v
1.5V
1V/di
v
1V/di
v
40µs/div
0V
STBY
VOUT
1.5V
Vout=1.8V
Iout=0mA
Cout=1.0uF
DISCHARGE TIME
Figure 82.
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BUxxUA3WNVX シリーズ Datasheet
● Reference data BU31UA3WNVX (Ta=25ºC unless otherwise specified.)
Figure 83. Figure 84.
Figure 85. Figure 86.
Figure 88.
Figure 87.
LINE REGULATION
3.00
3.02
3.04
3.06
3.08
3.10
3.12
3.14
3.16
3.18
3.20
3.43.53.63.73.83.94.04.14.24.34.44.54.64.74.84.95.0
VIN[V]
VOUT[V]
85℃
25℃
-40℃
Vout=3.1V
Iout=10mA
LINE REGULATION
3.00
3.02
3.04
3.06
3.08
3.10
3.12
3.14
3.16
3.18
3.20
3.43.53.63.73.83.94.04.14.24.34.44.54.64.74.84.95.0
VIN[V]
VOUT[V]
85℃
25℃
-40℃
Vout=3.1V
Iout=300mA
LOAD REGULATION
3.00
3.02
3.04
3.06
3.08
3.10
3.12
3.14
3.16
3.18
3.20
0 50 100 150 200 250 300
IOUT[mA]
VOUT[V]
85℃
25℃
-40℃
Vout=3.1V OUTPUT VOLTAGE vs TEMPERATURE
3.00
3.02
3.04
3.06
3.08
3.10
3.12
3.14
3.16
3.18
3.20
-40 -20 0 20 40 60 80
Temperature[℃]
VOUT[V]
10mA
150mA
300mA
Vout=3.1V
GROUND PIN CURRENT vs INPUT VOLTAGE
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
3.3 3.8 4.3 4.8
VIN[V]
IGND[uA]
85℃
25℃
-40℃
Vout=3.1V
GROUND PIN CURRENT vs LOAD
0
50
100
150
200
250
300
350
400
450
0 50 100 150 200 250 300
IOUT[mA]
IGND[uA]
85℃
25℃
-40℃
Vout=3.1V
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BUxxUA3WNVX シリーズ Datasheet
● Reference data BU31UA3WNVX (Ta=25ºC unless otherwise specified.)
Figure 92.
Figure 91.
Figure 90.
Figure 89.
Figure 94.
Figure 93.
GROUND PIN CURRENT vs TEMPERATURE
0
10
20
30
40
50
60
70
-40-200 20406080
Temperature[℃]
IGND[uA]
Vout=3.1V
SHUTDOWN CURRENT vs INPUT VOLTAGE
0
10
20
30
40
50
60
70
80
90
100
3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9
VIN[V]
ISHDN[nA]
85℃
25℃
-40℃
Vout=3.1V
Vout=3.1V
0mA
200mA
IOUT
VOUT
Trise=Tfall=1us
10µs/div
100mA/di
v
100mV/di
v
LOAD TRANSIENT RESPONSE
Vout=3.1V
0mA
10mA
IOUT
VOUT
Trise=Tfall=1us
10µs/div
20mA/di
v
100mV/di
v
LOAD TRANSIENT RESPONSE
CURRENT LIMIT vs INPUT VOLTAGE
0
100
200
300
400
500
600
700
800
900
4.04.24.44.64.85.05.25.45.6
VIN[V]
ILIM[mA]
85℃
25℃
-40℃
Vout=3.1V
POWER-SUPPLY RIPPLE REJECTION vs FREQUENCY
0
10
20
30
40
50
60
70
80
90
100
10 100 1000 10000 100000
Frequency[Hz]
PSRR[dB]
10mA
150mA
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BUxxUA3WNVX シリーズ Datasheet
● Reference data BU31UA3WNVX (Ta=25ºC unless otherwise specified.)
Figure 96.
Figure 95.
Figure 97.
Figure 100.
Figure 99.
Figure 98.
Vout=3.1V
0mA
50mA
IOUT
VOUT
Trise=Tfall=1us
10µs/div
50mA/di
v
100mV/di
v
LOAD TRANSIENT RESPONSE
Vout=3.1V
0mA
300mA
IOUT
VOUT
Trise=Tfall=1us
10µs/div
200mA/di
v
100mV/di
v
LOAD TRANSIENT RESPONSE
3.7V
4.3V
VIN
VOUT
Slew Rate = 0.5V/µs
Vout=3.1V
Iout=300mA
1ms/div
1V/di
v
100mV/di
v
LINE TRANSIENT RESPONSE
3.7V
4.3V
VIN
VOUT
Slew Rate = 0.5V/µs
Vout=3.1V
Iout=1mA
1ms/div
1V/di
v
100mV/di
v
LINE TRANSIENT RESPONSE
3.5V
5.0V
VIN
VOUT
Slew Rate = 0.5V/µs
Vout=3.1V
Iout=300mA
1ms/div
1V/di
v
100mV/di
v
LINE TRANSIENT RESPONSE
VIN
VOUT
Vout=3.1V
Iout=1mA
200ms/div
1V/di
v
VIN RAMP UP, RAMP DOWN RESPONSE
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BUxxUA3WNVX シリーズ Datasheet
● Reference data BU31UA3WNVX (Ta=25ºC unless otherwise specified.)
Figure 101. Figure 102.
Vout=3.1V
Iout=0mA
Cout=1.0uF
0V
STBY
VOUT
20µs/div
1V/di
v
START UP TIME
1V/di
v
1.5V
1V/di
v
1V/di
v
40µs/div
0V
STBY
VOUT
1.5V
Vout=3.1V
Iout=0mA
Cout=1.0uF
DISCHARGE TIME
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● About power dissipation (Pd)
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of
IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the
original IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability.
Therefore, be sure to prepare sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (PMAX)
PMAX=(VIN-VOUT)×IOUT(MAX.) (VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current)
Measurement conditions
Standard ROHM Board Evaluation Board 1
Layout of Board for
Measurement
IC
Implementation
Position
Top Layer (Top View) Top Layer (Top View)
Bottom Layer (Top View) Bottom Layer (Top View)
Measurement State With board implemented (Wind speed 0 m/s) With board implemented (Wind speed 0 m/s)
Board Material Glass epoxy resin (Double-side board) Glass epoxy resin (Double-side board)
Board Size 70 mm x 70 mm x 1.6 mm 40 mm x 40 mm x 1.6 mm
Wiring
Rate
Top layer Metal (GND) wiring rate: Approx. 0% Metal (GND) wiring rate: Approx. 50%
Bottom
layer Metal (GND) wiring rate: Approx. 50% Metal (GND) wiring rate: Approx. 50%
Through Hole Diameter 0.5mm x 6 holes Diameter 0.5mm x 25 holes
Power Dissipation 0.56W 0.39W
Thermal Resistance θja=178.6°C/W θja=256.4°C/W
* Please design the margin so that
PMAX becomes is than Pd (PMAXPd)
within the usage temperature range
Figure 103. SSON004X1010 Power dissipation heat reduction characteristics (Reference)
0
0.1
0.2
0.3
0.4
0.5
0.6
0 25 50 75 100 125
Ta [℃]
Pd [W]
0.56W
85
0.39W
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●Operation Notes
1.) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result
in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode) when
such damage is suffered. If operational values are expected to exceed the maximum ratings for the device, consider
adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC.
2.) GND potential
The potential of the GND pin must be the minimum potential in the system in all operating conditions.
Never connect a potential lower than GND to any pin, even if only transiently.
3.) Thermal design
Use a thermal design that allows for a sufficient margin for that package power dissipation rating (Pd) under actual
operating conditions.
4.) Inter-pin shorts and mounting errors
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting
or shorts between pins may result in damage to the IC.
5.) Common impedance
Wiring traces should be as short and wide as possible to minimize common impedance. Bypass capacitors
should be use to keep ripple to a minimum.
6.) Voltage of STBY pin
To enable standby mode for all channels, set the STBY pin to 0.3 V or less, and for normal operation, to 1.2 V or more.
Setting STBY to a voltage between 0.3 and 1.2 V may cause malfunction and should be avoided. Keep transition time
between high and low (or vice versa) to a minimum.
Additionally, if STBY is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit, causing
a temporary voltage to remain on the output pin. If the IC is switched on again while this voltage is present, overshoot
may occur on the output. Therefore, in applications where these pins are shorted, the output should always be completely
discharged before turning the IC on.
7.) Over-current protection circuit (OCP)
This IC features an integrated over-current and short-protection circuitry on the output to prevent destruction of the IC
when the output is shorted. The OCP circuitry is designed only to protect the IC from irregular conditions (such as motor
output shorts) and is not designed to be used as an active security device for the application. Therefore, applications
should not be designed under the assumption that this circuitry will engage.
8.) Thermal shutdown circuit (TSD)
This IC also features a thermal shutdown circuit that is designed to turn the output off when the junction temperature of the
IC exceeds about 150℃. This feature is intended to protect the IC only in the event of thermal overload and is not
designed to guarantee operation or act as an active security device for the application. Therefore, applications should not
be designed under the assumption that this circuitry will engage.
9.) Input/output capacitor
Capacitors must be connected between the input/output pins and GND for stable operation, and should be physically
mounted as close to the IC pins as possible. The input capacitor helps to counteract increases in power supply
impedance, and increases stability in applications with long or winding power supply traces. The output capacitance
value is directly related to the overall stability and transient response of the regulator, and should be set to the largest
possible value for the application to increase these characteristics. During design, keep in mind that in general, ceramic
capacitors have a wide range of tolerances, temperature coefficients and DC bias characteristics, and that their
capacitance values tend to decrease over time. Confirm these details before choosing appropriate capacitors for your
application.(Please refer the technical note, regarding ceramic capacitor of recommendation)
10.) About the equivalent series resistance (ESR) of a ceramic capacitor
Capacitors generally have ESR (equivalent series resistance)
and it operates stably in the ESR-IOUT area shown on the right.
Since ceramic capacitors, tantalum capacitors, electrolytic
capacitors, etc. generally have different ESR, please check
the ESR of the capacitor to be used and use it within the
stability area range shown in the right graph for evaluation
of the actual application.
Figure 104. Stable region (example)
Unstable region
Cout=1.0uF Cin=1.0uF Temp=25℃
0.01
0.1
1
10
100
0 100 200 300 400
IOUT[mA]
ESR[Ω]
Stable
Unstable
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BUxxUA3WNVX シリーズ Datasheet
●Revision History
Date Revision Changes
31.Jan.2013 001 New Release.
20.Feb.2013 002 Package size is changed.
21.Feb.2013 003
Adding a revision history
Adding a lineup.
The condition of drop voltage is changed.
19.Apr.2013 004 Adding lineup.
28.Jun.2013 005 Adding reference data.
06.Sep.2013 006
Adding Pin Descriptions.
Adding BOTTOM VIEW.
05.Feb.2014 007 Adding reference data
10.Oct.2015 008 Lineup is changed.
Datasheet
Datasheet
Notice-PGA-E Rev.00
2
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary elec tronic equip ments (such as AV equipment ,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred b y you or third parties arisin g from the use of an y ROHM’s Prod ucts for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe d esign against the physical injur y, damage to any property, which
a failure or malfunction of our Products may cause. T he following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliabili ty, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlig ht or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing comp onents, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products i n using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Po wer Dissip ation depending on ambient temperat ure. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in a ny way responsible or liable for failure induced un der deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halog enous (chlor ine, bromine, etc.) flux is used, the residue of flux ma y negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM represe ntative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice-PGA-E Rev.00
2
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise you r own indepen dent verificatio n and judgmen t in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please t ake special care under dry condit ion (e.g. Grounding of human body / equipment / sol der iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportati on
1. Product performance a nd soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderabil ity of products out of recommended storage time perio d
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommen de d storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive s t ress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products pl ease dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained i n this document. Provide d, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including b ut not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
