PHP
www.vishay.com Vishay Dale Thin Film
Revision: 27-Jun-16 1Document Number: 60076
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High Power Thin Film Wraparound Chip Resistor
PHP series chip resistors are designed with enlarged
backside terminations to reduce the thermal resistance
between the topside resistor layer and the solder joint on the
end users circuit board.
Actual power handling capability is limited by the end user
mounting process. As with any high power chip resistor the
ability to remove the generated heat is critical to the overall
performance of the device.
FEATURES
• High purity ceramic substrate
• Power rating to 2.5 W
• Resistance range 10 to 30.1 k
• Resistor tolerance to ± 0.1 %
• TCR to ± 25 ppm/°C
• Flame resistant UL 94 V-0
APPLICATIONS
• Power supplies
• Power switching
• Braking system
• Test and measurement equipment
• Motor deflection circuits
TYPICAL PERFORMANCE
Note
(1) Dependent on component mounting by user.
ABSOLUTE
TCR 25
TOL. 0.1
STANDARD ELECTRICAL SPECIFICATIONS
TEST SPECIFICATIONS CONDITIONS
Material Nichrome -
Resistance Range 10 to 30.1 k-
TCR: Absolute 25 ppm/°C, 50 ppm/°C (standard)
and, 100 ppm/°C -55 °C to +125 °C
Tolerance: Absolute 0.1 %, 0.5 %, 1.0 % and, 5.0 % +25 °C
Power Rating: Resistor 0.375 W - 2.5 W (1) Maximum at +70 °C
Stability: Absolute R 0.1 % 2000 h at +70 °C
Stability: Ratio Not applicable -
Voltage Coefficient < 0.1 ppm/V -
Working Voltage 75 V to 200 V -
Operating Temperature Range -55 °C to +155 °C -
Storage Temperature Range -55 °C to +155 °C -
Noise < -30 dB -
Shelf Life Stability: Absolute ± 0.01 % 1 year at +25 °C
COMPONENT RATINGS
CASE SIZE POWER RATING (mW) WORKING VOLTAGE (V) RESISTANCE RANGE ()
0603 375 (1) 75 10 to 30.1K
0805 625 (1) 100 10 to 30.1K
1206 1000 (1) 200 10 to 30.1K
2512 2500 (1) 200 10 to 30.1K
ENVIRONMENTAL TESTS (Vishay Performance vs. MIL-PRF-55342 Requirements)
ENVIRONMENTAL TEST LIMITS MIL-PRF-55342
CHARACTERISTIC “E” TYPICAL VISHAY PERFORMANCE
Resistance Temperature Characteristic ± 25 ppm/°C ± 15 ppm/°C
Maximum Ambient Temperature at Rated Wattage +70 °C +70 °C
Maximum Ambient Temperature at Power Derating +150 °C +150 °C
Thermal Shock ± 0.1 % ± 0.04 %
Low Temperature Operation ± 0.1 % ± 0.001 %
Short Time Overload ± 0.1 % ± 0.003 %
High Temperature Exposure ± 0.1 % ± 0.030 %
Resistance to Soldering Heat ± 0.2 % ± 0.007 %
Moisture Resistance ± 0.2 % ± 0.002 %
Life at +70 °C for 2000 h ± 0.5 % ± 0.100 %