Preliminary Specification Num ber : SP-ZZ1MD-I
Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
WiFi Module Data Sheet
Cypress BCM43438 WLAN + ST Micro STM32F412 MCU
for 802.11b/g/n
Electric Imp P/N : Imp004m
Tentative P/N : LBEE5ZZ1MD-TEMP
This Datasheet is preliminary version, and subject
to change without notice.
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Revision history
Issued
Date
Revision
Code
Revision
Page
Changed Items Chang e Reason
Jul. 6. 2016
First Issue
Sep. 9. 2016 A
P3
P4
P6
P15
P17
2. Part Number
4.1. Dimensions
4.2. Terminal Configurations
11. Land pattern (Top View)
13. Tape and Reel Packing
Oct. 11. 2016 B
P3
P4
P6
P10
P12
2. Part Number
4.1. Dimensions (LMK)
42 Terminal Configurations
8. Power up sequence
9. RF Characteri stics
Oct. 13. 2016 C
P6
P8
P9
P10
P11
P16
P17
4.2. Pin configurat i ons
4.3. Pin mux table
5. LED drive
6. Phototransistor
7. SPI flash requirements
9. Operating condi tion
10. External 32kHz crystal
14. Reference circuit
15. Recommended components
Oct. 20. 2016
D
P10
6. Phototransistor
Correct imp003 ref erence
Oct. 21. 2016
E
P3
1. Scope
Update cloud inf orm ation
Mar. 14. 2017 F P5 4.1. Dimensions
Correct
Pin 1 Marking
Apr. 13. 2017 G
P5
P12
4. Dimensions, Marking and
Terminal Configurations
9. Operating Condit i on
Correct Top view design
Correct
the range of
VDD_WLAN, VDDA_MCU
and VDD_IO_MCU
Apr. 20. 2017
H
P5
4.1. Dimensions
Correct the marking.
Jun. 27. 2017
I
P3
1. Scope
Wording.
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TABLE OF CONTENTS
1. Scope ................................................................................................................................................... 3
2. Part Number ......................................................................................................................................... 3
3. Block Diagram ...................................................................................................................................... 4
4. Dimensions, Marking and Terminal Configur ations............................................................................... 5
4.1. Dimensions .................................................................................................................................... 5
4.2. Terminal Configurations ................................................................................................................. 7
4.3. Pin Mux table ................................................................................................................................. 9
5. LED drive ............................................................................................................................................ 10
6. Phototransistor ................................................................................................................................... 11
7. SPI flash requirements ....................................................................................................................... 11
8. Absolute Maximum Rating .................................................................................................................. 12
9. Operating Condition ........................................................................................................................... 12
10. External 32.768 kHz Crystal ............................................................................................................. 12
11. Power Up Sequence ......................................................................................................................... 13
11.1. Without nRESET control ............................................................................................................ 13
11.2. With nRESET control ................................................................................................................. 13
11.3. nRESET Circuit .......................................................................................................................... 14
12. Electrical Characteristics .................................................................................................................. 15
13. Land pattern (Top View) ................................................................................................................... 16
14. Reference Circuit .............................................................................................................................. 17
15. Recommended Com ponents ............................................................................................................ 18
15.1. Bi-color LED ............................................................................................................................... 18
15.2. Phototransistor ........................................................................................................................... 18
15.3. SPI Flash ................................................................................................................................... 18
16. Tape and Reel Pack ing ..................................................................................................................... 19
17. NOTICE ............................................................................................................................................ 22
17.1. Storage Conditions: .................................................................................................................... 22
17.2. Handling Con ditions: .................................................................................................................. 22
17.3. Standard PCB Des i gn (Land Pattern and Dimensions): ............................................................. 22
17.4. Notice for Chip P l acer: ............................................................................................................... 22
17.5. Soldering Conditions: ................................................................................................................. 23
17.6. Cleaning: .................................................................................................................................... 23
17.7. Operational Environment Condi tions: ........................................................................................ 23
17.8. Input Power Capacity: ................................................................................................................ 23
18. PRECONDITIO N TO USE OUR PRODUCTS .................................................................................. 24
Please be aware that an important notice concerning availability, standard warranty and use in critical
applications of Murata products and disclaimers thereto appears at the end of this specificati on sheet.
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1. Scope
This specification is for the LBEE5ZZ1MD (imp004m) module that provides connectivity to the internet
via WiFi. The fully maintained, secure OS that is part of the Electric Imp cloud service comes
pre-loaded.
• 802.11 b/g/n 1x1 WiFi
802.11b 17dBm (typ.)
802.11g 13dBm (typ.)
802.11n 12dBm (typ.) [20MHz channels]
RX Sensitivity -98dBm (typ.) [@1Mbps]
On-board antenna
Supports WEP, WPA, WPA2, WPS
• 32-bit Cortex M4 proc essor
- Robust embedded op erating system with fail-safe firmware updates
- Virtual machine for customer firmware
- 256kB of application bytecode flash
- Around 190kB of dedicated application RAM
• Electric Imp OS & service
- Robust embedded op erating system with fail-safe, secure OS & applicati on updates
- Pre-provisioned MA C address & per-device secrets
- TLS1.2-RSA-ECDHE (forward secrecy) connection to cloud
- Elliptic curve chall enge-response to prevent devi ce impersonati on
- Fully featured cloud VM for every devic e for easy integration wit h RESTful APIs
- Open source integrations with AWS, Azure, etc services
• LED drive for red/green status LEDs
• Phototransistor input for Electric imp’s p atented BlinkUpTM technology for easy configuration
from any smartpho ne, tablet, or web browser
• 23 user selectable I/Os
- GPIO, PWM, Analog input & output, SPI, UART, I2C
- Dedicated SPI bus for local storage
• Low power 4uA sleep mode (with ext ernal load switc h)
- Option for coin cell RTC battery backup
• Compliant with the RoHS directive
2. Part Number
Sample Part Number
LBEE5ZZ1MD-TEMP
Production Part Number
LBEE5ZZ1MD-011
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3. Block Diagram
37.4MHz
Matching
Circuit
LPF
BCM43438
(802.11b/g/n) STM32F412
(Cortex M4)
26MHz
VIO VBAT
UART x3
SPI x2
I2C x2
PWM
GPIOs
ADC
32.768KHz
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4. Dimensions, Marking and Ter m inal Conf igurations
4.1. Dimensions
< Side View >
< Top View >
< Top View >
(F)
imp004m
(E)
(B)
(G)
electricimp
(C)
(A)
Model:Type1MD
R 001-P01018
FCC:VPYLB1MDIMP004
IC :772C-LB1MDIMP004
(H)
(J)
(I)
(D)
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Mark
Dimensions
Mark
Dimensions
Mark
Dimensions
L
21.0 +/- 0.2
W
17.5 +/- 0.2
T
2.3 max.
a1
0.4 +/- 0.1
a2
0.4 +/- 0.1
b1
0.2 +/- 0.2
b2
0.2 +/- 0.2
c1
0.8 +/- 0.1
c2
0.8 +/- 0.1
e1
0.3 +/- 0.1
e2
0.3 +/- 0.1
e3
2.2 +/- 0.1
e4
1.6 +/- 0.1
e5
2.1 +/- 0.1
e6
3.1 +/- 0.1
e7
2.5 +/- 0.1
m1
0.8 +/- 0.1
m2
0.8 +/- 0.1
m3
0.7 +/- 0.1
m4
0.8 +/- 0.1
(unit : mm)
Marking
Marking
Meaning
(A)
Pin 1 Marking
(B)
Murata Logo
(C)
Electric Imp Logo
(D)
Murata Module Type
(E)
Imp Module Type
(F)
Inspection Number
(G)
2D code
(H)
Japanese Ty pe certification No.
(I)
FCC certification ID
(J)
IC certificat ion No.
Structure
Mounting
The module is designed to be mounted on the edge of the board, with the antenna section hanging off in
free space. The antenna is tuned for free space operation. Ple ase see the design guid e on Electric Imp
dev center websit e at http://www.electricimp.com/docs for more information.
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4.2. Terminal Configurations
Top view (thr ough package)
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No.
Name
Type
Description
1 GND GND
2 CLK_REQ O
Asserts CLK_ REQ when WL AN di r ect s the hos t t o tur n on t he ref ere nce c loc k .
The CLK_REQ polarity is active-high.
3 NC -
4
NC
-
5 pinM I/O GPIO, i2cNM SDA, PWM
6 pinN I/O GPIO, i2cNM SCL, PWM
7 pinP I/O GPIO, i2cQP SDA, PWM, IRQ
8 pinW I/O
GPIO, uartBCAW CTS, ADC, IRQ & wake from deep sleep (active
high)
9 GND GND
10
pinA
I/O
GPIO, uartBCAW RTS, spiAHSR MOSI, ADC, PWM
11
pinB
I/O
GPIO, uartBCAW TX, ADC, PWM, IRQ
12 pinC I/O GPIO, uartBCAW RX, ADC, IRQ
13 LPO_IN I Sleep Clock
14
pinD
I/O
GPIO, ADC, PWM, IRQ
15
pinE
I/O
GPIO, IRQ
16 pinK I/O GPIO, spiGJKL SCLK, ADC, PWM
17 pinL I/O GPIO, spiGJKL NSS, ADC , IRQ
18
GND
GND
19
VDD_IO_MCU
PWR
MCU/WLAN VIO
20 GND GND
21 pinQ I/O GPIO, uartQ TX, i2cQP SCL, IRQ
22
pinR
I/O
GPIO, spiAHSR NSS, IRQ
23
pinS
I/O
GPIO, spiAHSR SCLK, IRQ
24 PSU_ENABLE O Active high when WiFi needs 2.7v+
25 pinF I/O GPIO, uartFGJH TX
26
pinG
I/O
GPIO, uartFGJH RX , spiGJKL MOSI
27
pinH
I/O
GPIO, uartFGJH CTS, uartHJ TX, spiAHSR MISO, IRQ
28 pinJ I/O GPIO, uartFGJ H RTS, uartHJ RX, spiGJKL MISO, pulse count er
29 GND GND
30
LED_RED
O
Red LED drive
31
LED_GREEN
O
Green LED drive
32 OPTO_IN I Phototrans i stor input
33 OPTO_BIAS O Phototransis tor s upply
34
FLASH_MOSI
O
SPI flash connection
35
FLASH_SCLK
O
SPI flash connection
36 FLASH_CS_L O SPI flash connection
37 FLASH_MISO I SPI flash connection
38
NC
-
39
nRESET
I
MCU reset, internally pulled up
40 VSSA/VREF- GND Must be connected to GND
41 OSC32_OUT O 32kHz xtal connection
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42 OSC32_IN I 32kHz xtal connection (ground if no xt al fitted)
43 GND GND
44
VBAT_MCU
PWR
MCU VBAT input
45
VDDA_MCU
PWR
MCU VDDA input
46 VDD_WLAN PWR WLAN VBAT input
47
-70 GND GND
71
-74
NC -
75
-76
GND GND
77
-83
NC -
84
-103
GND GND
104 NC NC Note this pad should not be t ouching any PCB
4.3. Pin Mux table
Pin
uart
BCAW
uart
FGJH
uart
HJ
uart
Q
i2c
NM
i2c
QP
spi
AHSR
spi
GJKL
ADC
PWM
Pulse
count
State
change
pinA
RTS
MOSI
Yes
Yes
pinB
TX
Yes
Yes
Yes
pinC
RX
Yes
Yes
pinD
Yes
Yes
Yes
pinE
Yes
pinF
TX
pinG
RX
MOSI
pinH
CTS
TX
MISO
Yes
pinJ
RTS
RX
MISO
Yes
pinK
SCLK
Yes
Yes
pinL
NSS
Yes
Yes
pinM
SDA
Yes
pinN
SCL
Yes
pinP
SDA
Yes
Yes
pinQ
TX
SCL
Yes
pinR
NSS
Yes
pinS
SCLK
Yes
pinW
CTS
Yes
Yes
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5. LED drive
The indicator LED should be bicolor, because red, green and amber (red+green) are used to indicate
status.
The LED drive pins will auto-det ect common anod e or common cat hode parts. The detection is done by
looking to see which way up the LED_RED pin is idling at boot; to ensure this works correctly, please
place a 10k resis tor in parallel with the red LED.
The current drive on these pins is 20mA maxim um .
Please refer to section 15 for the recom m ended LEDs.
<Common anode diagram> <Comm on cathode diagram>
Two specific LED codes indicate errors when talki ng to the SPI flash:
SPI flash not found
SPI flash error
If you encounter either of these codes, then this indicates an electrical connection issue or an
incompatible flash part.
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6. Phototransistor
The phototransi stor is used to receive Bl inkUp configuration data. The bias resistor connect ed between
OPTO_IN and GND may need to be adjusted to ensure adequate sensitivity and response time - in
general you need at least 500mV swing on the OPTO_IN pin between black and white states, with the
worst (dimmest) BlinkUp sender you can find. More information and sample code to tune blinkup is
available on the Electric Imp dev cent er website.
End-user BlinkUp send data at between 30 and 60 bits per second, depending on the user’s device. For
factory configuration, data is typically sent at 142 bits per second using red LED(s) in a test fixture. If
your application does not require optical configuration, config can be sent electrically at 142 bits per
second from another micro using t he OPTO_IN pin. Please contact us for more details.
It is also recommended to place 0402, 13pF capacitor footprints (Murata GRM1555C1H130JA01) close
to the imp004m between OPTO_BIAS and GND, and OPTO_IN and GND. I f issues are seen with RF
coupling onto t he bl inkup circuit, then t hese components wil l address the issue by presenting a low
impedance in the 2.4GHz band.
Please refer to paragraph 15 for the recommended phototransistors .
7. SPI flash requirements
An external SPI Flash part is required for operation, which must be pre-loaded with the correct WiFi
firmware image before assembly. The requi red image is avai l able from the Electric Imp dev c enter
website at http://www.electricimp.com/docs
The minimum siz e of the SPI Flash is 8Mbit (1M B), and the maximum s i ze is 128Mbit (16MB). The area
below address 0xC2000 (776kB) is the pre-programmed area. The remainder of the flash device is made
available to user code programmatically, and may optionall y be pre-programmed for user applications
before assembly.
The imp004m’s SPI flash chip must support both 4KB and 64KB erases (command 0x20 and 0xD8) and
Page Program (command 0x02). You must also ensure that the SPI flash you use is able to run down to
the minimum operational voltage of your product to ensure that the SPI flash is operational at all times
that the imp is operational. This is critical during upgrades in low battery states. If you are running from a
single LiMnO2 c el l (eg. CR123), you should use a wide voltage range SPI flash that is operational from
1.7-3.6V such as the Macronix MX25R8035FM2I H0.
Minimum Size
8 Mbit (1024 kByte)
Reserved for OS (do not pre-program)
0x000000 to 0xC2000 (776 kByte)
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8. Absolute Maximum Rating
min.
max.
unit
Storage Temperature
-40
125
deg.C
Supply Voltage
VBAT_MCU
-0.3
4
V
VDDA_MCU
-0.3
4
VDD_WLAN
-0.5
6
VDD_IO_MCU
-0.3
3.63
Stres ses in exces s of the absolut e ratings may caus e permanent damage. Functi onal ope ration is not implie d unde r
these conditions. Exposure to absolute ratings for extended periods of time may adversely affect reliability. No
damage assuming only one parameter is set at limit at a time with all other parameters is set within operating
condition.
9. Operating Condition
min.
typ.
max.
unit
Operating Temperature Range
-30
25
70
deg.C
Specification Temperature Range
-20
25
55
deg.C
Supply Voltage
VBAT_MCU
1.65
3.3
3.6
V
VDDA_MCU
1.8
3.3
3.6
VDD_WLAN
3.0
3.3
3.6
VDD_IO_MCU
1.8
3.3
3.6
Notes :
All RF characteristics in this datasheet are defined by Specification Temperature Range.
Specifications require derati ng at extreme temperat ures.
VDDA_MCU and VDD_IO_MCU must be t he same potential.
10. External 32.768 kHz Crystal
If the application requires the imp004m to enter deep sleep mode, a 32kHz crystal should be attached to
the OSC32_IN and OSC32_OUT pins. Please refer to the STM32F412 datasheet and application note
AN2867 for detailed crystal requirements.
If deep sleep mode is not required, OSC32_IN should be connected to GND and OSC32_OUT left
floating. The imp004m will det ect this state and disable the sl eep APIs.
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11. Power Up Sequence
11.1. Without nRESET control
Following tim i ng di agram explain module power up sequence.
*Power down sequence is opposite seque nce of power up.
11.2. With nRESET control
*Power down sequence is opposite seque nce of power up.
*nRESET pin must be controlled by Open Drain.
VBAT_MCU
Ramp time 90% > 40µs
VDD_WLAN
VDDA_MCU
Timing same as VBAT_MCU
VDD_IO_MCU
VBAT_MCU
Ramp time 90% > 40µs
VDD_WLAN
VDDA_MCU
Timing same as VBAT_MCU
VDD_IO_MCU
nRESET
Timing of deassertion Reset signal same as VDD_IO
Timing same as VBAT_MCU
Timing same as VBAT_MCU
Timing same as VBAT_MCU
Timing same as VBAT_MCU
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11.3. nRESET Circuit
(1) The reset network protects the device against parasitic resets.
(2) The use must ensure that the level on the nRESET pin can go below the VIL(NRST) max level
specified in below table. Otherwise the reset is not taken into account by the device.
(3) nRESET pin must be controlled by Open Drain. High signal must not input to this pin.
Symbol
Parameter
Min
Typ
Max
Unit
VIL nRESET I/O input
low level voltage - - 0.1xVDD_IO_MCU+0.1 V
Filter
Internal
Reset
V
DD_IO_MCU (3)
40kΩ
nRESET
(2
)
External
Reset circuit
(1)
Murata
Module
0.1uF
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12. Electrical Characteristics
- DC Characteristics -
min.
typ.
max.
unit
1. DC current
1) Tx mode1) 300 370 mA
2) Rx mode 45 100 mA
1) Conditions: 25deg.C, VDD_WLAN=3.3V, VDD_IO_MCU=3.3V
(1Mbps mode unless otherwis e specified.)
Note: The above mentioned values have been obtained according to our own measuring methods and
may very depend on the circuit, in whic h the component is act ually i ncorporated. Therefore, you are
kindly requested to test the performance of the component act ual ly in your set.
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13. Land pattern (Top View)
Unit : mm
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14. Reference Circuit
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15. Recommended Components
15.1. Bi-color LED
Manufacturer
Manufacturer’s part num ber
Surface mount
top-view
SunLED
XZMDKVG59W-1
Liteon
LTST-C195KGJRKT
side-view
SunLED
XZMDKVG88W
Bivar
SM1204BC
Through-hole
3mm
SunLED
XLMDKVG34M
Liteon
LTL1BEKVJNN
15.2. Phototransistor
Manufacturer
Manufacturer’s part num ber
Surface mount
top-view
Everlight
PT17-21C/L41/TR8
Fairchild
KDT00030TR
side-view
SunLED
XZRNI56W-1
Everlight
PT12-21C/TR8
Through-hole
3mm
SunLED
XRNI30W-1
LiteOn
LTR-4206
15.3. SPI Flash
Size
Manufacturer
Manufacturer’s part num ber
8 Mbit
Adesto
AD25SF081
16 Mbit
Spansion
S25FL116K
32 Mbit
Spansion
S25FL132K
64 Mbit
Spansion
S25FL164K
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16. Tape and Reel Packing
(1) Dimensions of Tape (Plastic tape)
*1 Cumulative tolerance of max. ± 0.3 every 10 pitches
*2 Reference value
(Unit : mm)
(2) Dimensions of Reel
(Unit: mm)
2.0±
0.15
0.3±
0.05
24.0±
0.1
1.5+0.1/-0.0
2.0+0.1/-0.0
4
.0±
0.1*1
22.00±0.10*2
18.00±
0.10
2.55±0.1
44.0
±
0.3
40.4
±
0.1
20.2
±
0.1
1.75
±
0.1
(φ 100)
φ 21±0.8
2.0±0.5
45.5
(φ 330)
50.5max
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(3) Taping Diagrams
[1] Feeding Hole : As specified in (1)
[2] Hole for chip : As specified in (1)
[3] Cover tape : 62μm in thickness
[4] Base tape : As specifi ed i n (1)
(4) Leader and Tail tape
Tail tape
(No components)
500 to 1500mm
Components
No components
200mm min.
Leader tape
(Cover tape alone)
250mm min.
Feeding direction
Chip
Feeding Direc tion
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(5) The tape for chips are wound clockwise, the feeding holes t o the right side as the tape is pulled
toward the us er.
(6) The cover tape and the base tape are not adhered at no com ponents area f or 250mm min.
(7) Tear off strength against pulling of cover tape : 5N min.
(8) Packaging unit: 500pcs./ reel
(9) Material: Bas e tape : Plastic
Real : Plastic
Cover tape, cavity tape and reel are made the anti -s tatic processing.
(10) Peeling of force: 1.1N max. in the direc tion of peeling as shown below.
(11) Packaging (Humidity proof Packing)
Tape and ree l must be sealed with the anti-humidity plastic bag. The bag contains the desiccant
and the humidity i ndi cator.
165 t o 180 °
1.1 N m ax.
Base tape
Cover tape
　湿度
インジケ－タ
乾燥剤
表示ラべル
防湿梱包袋
表示ラベル
Label
Label
Desiccant
Humidity
Indicator
Anti-humidity
Plastic Bag
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17. NOTICE
17.1. Storage Conditions:
Please use this product within 6month after receipt.
- The product shall be stored without opening the packing under the ambient temperature from 5 to
35deg.C and humidi ty from 20 to 70%RH.
(Packing materials, in particular, may be deformed at the temperature over 40deg.C.)
- The product left more than 6months after reception, it needs to be confirmed the solderbility before
used.
- The product shall be stored in non corrosive gas (Cl 2, NH3, SO2, Nox, etc.).
- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp
object and dropping the product, shall not be applied in order n ot to damage the packing materi al s.
This product is applicable to MS L3 (Based on JEDEC Standard J-STD-020)
- After the packing opened, t he product shall be stored at <30deg.C / <60%RH and t he product s hall be
used within 168hours .
- When the color of the indicator in the packing changed, t he product shall be baked before soldering.
Baking condition: 125+5/-0deg.C, 24hours, 1time
The products shall be baked on t he he at -resi stant tray beca us e the m ateri al ( Bas e Tape, Reel Tape a nd
Cover Tape) are not heat-resistant.
17.2. Handling Conditions:
Be careful in handling or transporting products because excessive stress or mechanical shock may
break products.
Handle with care if products may have cracks or damages on their terminals, the characteristics of
products may change. Do not touch products with bear hands that may result in poor solder abil ity and
destroy by static elec trical charge.
17.3. Standard PCB Design (Land Pattern and Dimensions):
All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern
should be provided between IN and OUT terminals. Please refer to the specifications for the standard
land dimensions.
The recommended land pattern and dimensions is as Murata's standard. The characteristics of products
may vary depending on t he pattern drawing met hod, grounding method, land dimens ions, land forming
method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the
characterist ic s in the actual set. When using non-standard lands, c ontact Murata beforehand.
17.4. Notice for Chip Placer:
When placing products on the PCB, products may be stressed and broken by uneven forces from a
worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to
follow the specifications for the maintenance of the chip placer being used. For the positioning of
products on the PCB, be aware that mechanical chucking may damage products.
Preliminary Specification Num ber : SP-ZZ1MD-I
23 / 24
Preliminary
< Specif ic ation may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
17.5. Soldering Conditions:
The recommendation c onditions of soldering are as in the fol lowing figure.
When products are immersed in solvent after mounting, pay special attention to maintain the
temperature difference within 100 °C. Soldering must be carried out by the above mentioned
conditions to prevent products from damage. Set up the highest temperature of reflow within 260 °C.
Contact Murata before use if concerning ot her soldering condit ions.
Reflow solderin g standard conditions(Example)
Please use the reflow wi thin 2 times.
Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.
17.6. Cleaning:
Since this Product i s Moisture Sensiti ve, any cleaning is not perm itted.
17.7. Operational Environment Conditions:
Products are designed to work for electronic products under normal environmental conditions (ambient
temperature, humidity and pressure). Therefore, products have no problems to be used under the similar
conditions to t he above-mentioned. Howeve r, if products are used under the following circumstances, it
may damage products and leakage of electric ity and abnormal temperature may occur.
- In an atmosphere containing c orrosive gas ( Cl 2, NH3, SOx, NOx etc.).
- In an atmosphere containing c om bustible and volat i l e gases.
- Dusty place.
- Direct sunlight place.
- Wat er splashing place.
- Humid place where wat er condenses.
- Freezing place.
If there are poss ibilities for products to be used under the preceding clause, consult with Murata before
actual use.
As it might be a cause of degradation or destruction to apply static electricity to products, do not apply
static electricity or excessive voltage while assembling and measuring.
17.8. Input Power Capacity:
Products shall be used in the i nput power capacity as specified in this specifications.
Inform Murata beforehand, in case that the components are used beyond such input power capacity
range.
Within 120s
Pre-heating
time(s)
220 deg.C
Within 60s
Cooling down
S
lowly
180 deg.C
150 deg.C
240to 250 deg.C
Within 3s
Preliminary Specification Num ber : SP-ZZ1MD-I
24 / 24
Preliminary
< Specif ic ation may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
18. PRECONDI TION TO USE OUR PRODUCTS
PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS .
Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications
of our product wh en our product is mounted to your product.
All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our
product is used for the purpose, under the condition and in the environment specified in this specification. You are
requested not to use our prod uc t deviating from the conditio n and the environment specifi ed in this specification.
Please note that the only warranty that we provide regarding the products is its conformance to the specifications provided
herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such products,
which are caus ed under the cond itions other than those specif i ed in this specification.
WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED,
INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PAR TICULAR PURPOSE, THAT THEY ARE
DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS.
The product shall not be used in any application listed below which requires especially high reliabi lity for the prevention of
such defect as ma y directly cause dam age to the third party's life, body or property. You acknowledge and agree that, if
you use our products in such applications, we will not be responsible for any failure to meet such requirements.
Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS,
DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY
FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH APPLICATIONS.
- Aircraft equip ment. - Aerospace equipment - Undersea equipment.
- Power plant control equipme nt - Medical equipment.
- Transportation equipment (vehicles, tr ains, ships, elevator, etc.).
- Traffic signal equipment. - Disaster preve ntion / crime prevention equipment.
-Burning / explosion control equipment
- Application of similar c omplexity and/ or reliability requirements to the applicatio ns listed in t he above.
We expressly prohibit you from analyzing, breaking, reverse-engineering, remodeling altering, and reproducing our
product. Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by the
regulations and laws in the world.
We do not warrant or represent that any license, either express or implied, is granted under any our patent right, copyright,
mask work right, or our other intellectual property right relating to any combination, machine, or process in which our
products or services ar e us ed. I nfor mat ion pr ovid ed b y us re gard ing t hir d-party products or services does not constitut e a
license from us to use such products or services or a warranty or endorsement thereof. Use of such information may
require a licen se from a third party under the patents or other intell ectual property of the third party, or a lic ense from us
under our patents or other intellectual propert y.
Please do not use our pro ducts, our t echnical infor mation a nd other data prov ided by us for the pur pose of developing of
mass-destruction weapons and t he pur pose of military use.
Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations",
etc.
Please note th at we may dis contin ue the ma nufact ure of our products, due t o reasons suc h as end of s upply of m ateri als
and/or compo nents from our suppliers.
By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your
company and that you understand and accept the validity of the contents herein. When you are not able to return the
signed version of specification sheet or approval sheet within 30 days from receiving date of specification sheet or
approval she et, it shall be de emed to be your consent on the co ntent of specifi cation sheet or approval sheet . Customer
acknowledges that engineering samples may deviate from specifications and may contain defects due to their
development s tatus. We reject any liab ility or product warranty for engineeri ng samples. In particular we disclaim liabili ty
for damages caused by
- the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the
product to be sold by you,
-deviation or lapse in function of engineering sam ple,
-improper use of engineering s amples.
We discla i m any liability for consequential and incidental damages.
If you can’t agree the above contents, you should inquire our sales.