PC1S3052NTZF Series
1
Sheet No.: D2-A08801EN
Date Dec. 1. 2005
© SHARP Corporation
Notice The content of data sheet is subject to change without prior notice.
In the absence of con rmation by device speci cation sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device speci cation sheets before using any SHARP device.
PC1S3052NTZF
Series
VDRM : 600V
Non-zero cross type
DIP 6pin
Phototriac Coupler for triggering
Description
PC1S3052NTZF Series Phototriac Coupler include
an infrared emitting diode (IRED) optically coupled to
an output Phototriac.
These devices feature full wave control and are ideal
isolated drivers for medium to high current Triacs.
DIP package provides 5kV isolation from input to
output with superior commutative noise immunity.
Features
1. High repetitive peak off-state voltage (VDRM : 600V)
2. Non-zero crossing functionality
3. 6pin DIP package
4. Superior noise immunity (dV/dt : MIN. 1 000V/μs)
5. Double transfer mold construction (Ideal for Flow
Soldering)
6. High isolation voltage between input and output
(Viso(rms) : 5kV)
7. Lead-free and RoHS directive compliant
Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation),
le No. E64380 (as model No. 1S3052)
2. Approved by CSA, le No. CA95323 (as model No.
1S3052)
3. Optionary available VDE Approved (DIN EN
60747-5-2), le No. 4008189 (as model No. 1S3052)
4. Package resin : UL ammability grade (94V-0)
Applications
1. Triggering for Triacs used to switch on and off
devices which require AC Loads
For example heaters, fans, motors, solenoids, and
valves
2. Triggering for Triacs used for implementing phase
control in applications such as lighting control and
temperature control (HVAC).
3. AC line control in power supply applications.
2
Sheet No.: D2-A08801EN
PC1S3052NTZF Series
Internal Connection Diagram
Outline Dimensions (Unit : mm)
1
6
4
1
3
5
2
2
3
4
5
6
Anode
Cathode
NC
Anode/Cathode
No external connection
Cathode/Anode
1. Through-Hole [
ex. PC1S3052NTZF
]
7.12±0.5
θ
θ
θ : 0 to 13˚
7.62±0.3
Epoxy resin
6.5±0.5
0.6±0.2
1.2±0.3
1 2 3
6 5 4
0.5TYP.
2.9±0.5
0.5±0.1
2.54±0.25
3.25±0.5
3.5±0.5
1S3052
SHARP
mark
"S"
Date code (2 digit)
Model No.
Factory identification mark
Anode
mark
Product mass : approx. 0.35g
2. SMT Gullwing Lead-Form [ex. PC1S3052NXPF]
7.12±0.5
7.62±0.3
Epoxy resin
6.5±0.5
0.6±0.2 1.2±0.3
2.54±0.25
3.5±0.5
0.35±0.25
1+0.4
0
1+0.4
0
10+0
0.5
0.26±0.1
1 2 3
6 5 4
SHARP
mark
"S"
Date code (2 digit)
Factory identification mark
Anode
mark
1S3052
Model No.
Product mass : approx. 0.33g
Plating material : SnCu (Cu : TYP. 2%)
Pin 5 is not allowed external connection
3
Sheet No.: D2-A08801EN
PC1S3052NTZF Series
repeats in a 20 year cycle
Rank mark
There is no rank mark indicator.
1st digit 2nd digit
Year of production Month of production
A.D. Mark A.D. Mark Month Mark
1990 A 2002 P January 1
1991 B 2003 R February 2
1992 C 2004 S March 3
1993 D 2005 T April 4
1994 E 2006 U May 5
1995 F 2007 V June 6
1996 H 2008 W July 7
1997 J 2009 X August 8
1998 K 2010 A September 9
1999 L 2011 B October O
2000 M 2012 C November N
2001 N : : December D
Date code (2 digit)
Factory identi cation Mark Country of origin
no mark
Japan
Indonesia
Philippines
or China
* This factory marking is for identi cation purpose only.
Please contact the local SHARP sales representative to see the actural status of the
production.
Factory identi cation mark
4
Sheet No.: D2-A08801EN
PC1S3052NTZF Series
Absolute Maximum Ratings
Electro-optical Characteristics
(Ta=25˚C )
Parameter Symbol Rating Unit
Input Forward current IF50 mA
Reverse voltage VR6V
Output
RMS ON-state current
IT(rms) 0.1 A
Peak one cycle surge current
Isurge 1.23A
Repetitive peak OFF-state voltage VDRM 600 V
*1 Isolation voltage Viso(rms) 5 kV
Operating temperature Topr 30 to +100 ˚C
Storage temperature Tstg 55 to +125 ˚C
*2 Soldering temperature Tsol 270 ˚C
*1 40 to 60%RH, AC for 1minute, f=60Hz
*2 For 10s
*3 f=50Hz sine wave
(Ta=25˚C)
Parameter Symbol Condition MIN. TYP. MAX. Unit
Input Forward voltage VFIF=20mA 1.2 1.4 V
Reverse current IRVR=3V −−
10 μA
Output
Repentitive peak OFF-state current IDRM VD=VDRM −−1μA
ON-state voltage VTIT=0.1A −−
2.5 V
Holding current IHVD=6V 0.1 3.5 mA
Critical rate of rise of OFF-state voltage
dV/dt VD=1/
2 ·VDRM 1 000 −−
V/μs
Transfer
charac-
teristics
Minimum trigger current IFT VD=6V, RL=100Ω−
10 mA
Isolation resistance RISO DC500V, 40 to 60%RH 5×1010 1011 −Ω
Turn-on time tON VD=6V, RL=100Ω, IF=20mA −−
50 μs
1mm
Soldering area
5
Sheet No.: D2-A08801EN
PC1S3052NTZF Series
Model Line-up
Please contact a local SHARP sales representative to inquire about production status or any product related
questions.
Lead Form Through-Hole SMT Gullwing Form
Package Sleeve Taping
50 pcs/sleeve 1 000 pcs/reel
Model No. PC1S3052NTZF PC1S3052NXZF PC1S3052NXPF
6
Sheet No.: D2-A08801EN
PC1S3052NTZF Series
Fig.5 Relative Repetitive Peak OFF-state
Voltage vs. Ambient Temperature
Fig.6 ON-state Voltage vs.
Ambient Temperature
Forward current IF (mA)
Ambient temperature Ta (C)
0
10
20
30
40
50
60
70
30 100050
RMS ON-state current IT (rms) (mA)
0
25
50
75
100
125
150
175
30 0 10050
Ambient temperature Ta (C)
0 0.5 1 1.5 2 2.5 3
Forward current IF (mA)
Forward voltage VF (V)
1
10
100
Ta=100C
75C
50C
25C
0C
30C
0
1
2
3
4
5
6
7
8
9
10
Minimum trigger current IFT (mA)
40 20 0 20 40 60 80 100
Ambient temperature Ta (C)
VD=6V
RL=100Ω
Relative repetitive peak OFF-state voltage
VDRM (Tj=Ta) / VDRM (Tj=25C)
0.7
1.3
1.2
1.1
1
0.9
0.8
40 20 0 20 40 60 80 100
Ambient temperature Ta (C)
ON-state voltage VT (V)
1
2
1.8
1.6
1.4
1.2
40 20 100806040200
Ambient temperature Ta (C)
IT=100mA
1.9
1.7
1.5
1.3
1.1
Fig.3 Forward Current vs. Forward Voltage Fig.4 Minimum Trigger Current vs.
Ambient Temperature
Fig.1 Forward Current vs.
Ambient Temperature
Fig.2 RMS ON-state Current vs.
Ambient Temperature
7
Sheet No.: D2-A08801EN
PC1S3052NTZF Series
Fig.7 Holding Current vs.
Ambient Temperature
Fig.8
Repetitive Peak OFF-state Current vs.
Ambient Temperature
Fig.9
Turn-on Time vs. Forward Current
Holding current IH (mA)
0.1
1
10
40 20 100806040200
Ambient temperature Ta (C)
VD=6V
Repetitive peak OFF-state current IDRM (A)
1010
108
106
109
107
40 20 100806040200
Ambient temperature Ta (C)
VD=600V
Turn-on time ton (μs)
10
100
1 000
1 10010
Forward current IF (mA)
VD=6V
RL=100
Ta=25C
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
8
Sheet No.: D2-A08801EN
PC1S3052NTZF Series
Design Considerations
Design guide
In order for the Phototriac to turn off, the triggering current (IF) must be 0.1mA or less
Please refrain from using these devices in a direct drive con guration.
These Phototriac Coupler are intended to be used as triggering device for main Triacs.
Please ensure that the output rating of these devices will be suf cient for triggering the main output Triac of
your choice. Failure to do may result in malfunctions.
In phase control applications or where the Phototriac Coupler is being by a pulse signal, please ensure that
the pulse width is a minimum of 1ms
For designs that will experience excessive noise or sudden changes in load voltage, please include an
appropriate snubber circuit as shown in the below circuit.
Please keep in mind that Sharp Phototriac Couplers incorporate superor dV/dt ratings which can often
eliminate the need for a snubber circuit.
Degradation
In general, the emission of the IRED used in Phototriac Couplers will degrade over time.
In the case where long term operation and / or constant extreme temperature uctuations will be applied to
the devices, please allow for a worst case scenario of 50% degradation over 5 years.
Therefore in order to maintain proper operation, a design implementing these Phototriac Couplers should
provide at least twice the minimum required triggering current from initial operation.
Recommended foot print (reference)
SMT Gullwing Lead-form
2.542.54
1.7
2.2
8.2
(Unit : mm)
9
Sheet No.: D2-A08801EN
PC1S3052NTZF Series
Standard Circuit (Medium/High Power Triac Drive Circuit)
AC Line
Triac
Load
PC1S3052NTZF
Note) Please add the snubber circuit according to a condition.
Any snubber or varistor used for the above mentioned scenarios should be located
as close to the main output triac as possible.
6
4
1
2
5
3
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
10
Sheet No.: D2-A08801EN
PC1S3052NTZF Series
Manufacturing Guidelines
Soldering Method
Re ow Soldering:
Re ow soldering should follow the temperature pro le shown below.
Soldering should not exceed the curve of temperature pro le and time.
Please don't solder more than twice.
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the
below listed guidelines.
Flow soldering should be completed below 270C and within 10s.
Preheating is within the bounds of 100 to 150C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400C.
Please don't solder more than twice.
Other notice
Please test the soldering method in actual condition and make sure the soldering works fine, since
the impact on the junction between the device and PCB varies depending on the tooling and soldering
conditions.
1234
300
200
100
00
(˚C)
Terminal : 260˚C peak
( package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
(min)
11
Sheet No.: D2-A08801EN
PC1S3052NTZF Series
Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Speci c brominated ame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
12
Sheet No.: D2-A08801EN
PC1S3052NTZF Series
Package speci cation
Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50 pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
(Unit : mm)
12
6.7
5.8
10.8
520
±2
13
Sheet No.: D2-A08801EN
PC1S3052NTZF Series
Sleeve package
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
K
EI
DJ
B
H
H
A
C
G
5˚MAX.
Dimensions List (Unit:mm)
A
16±0.3
B
7.5±0.1
C
1.75±0.1
D
12±0.1
E
2±0.1
H
10.4±0.1
I
0.4±0.05
J
4.2±0.1
K
7.8±0.1
F
4±0.1
G
φ1.5+0.1
0
Reel structure and Dimensions
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
a
330
b
17.5±1.5
c
100±1
d
13±0.5
e
23±1
f
2±0.5
g
2±0.5
Direction of product insertion
Pull-out direction
[Packing : 1 000 pcs/reel]
14
Sheet No.: D2-A08801EN
PC1S3052NTZF Series
Important Notices
· The circuit application examples in this publication
are provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related
to any intellectual property right of a third party resulting
from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
speci cations, characteristics, data, materials, structure,
and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
without notice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used speci ed in the relevant speci cation
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Of ce automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traf c signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative
if there are any questions about the contents of this
publication.
[G053]