TEST AND MEASUREMENT PRODUCTS
1www.semtech.com
Edge737
Per-Pin Precision
Measurement Unit
Description Features
Functional Block Diagram
Applications
Revision 5 / February 20, 2003
The Edge737 is a precision measurement unit designed
for automatic test equipment and instrumentation.
Manufactured in a wide voltage CMOS process, it is a
monolithic solution for a per pin PMU.
The Edge737 supports two modes of operation: force
current/measure voltage and force voltage/measure
current. The Edge737 can force or measure voltage in
the range of +7V to –5V. In addition, the Edge737 can
force or measure a current of up to 40 mA over four distinct
ranges: ±40 mA, ±1 mA, ±100 µA and ±10 µA.
The Edge737 has an on board window comparator that
provides three bits of information: DUT too high, DUT too
low, and DUT fail. There is also a monitor function which
provides a real time analog voltage signal proportional to
either the DUT voltage or current.
On board clamps prevent large transient spikes when
changing operating mode or current range. Also, the PMU
will survive a direct short over the legal voltage range.
The Edge737 is designed to be a low power, low cost,
small footprint solution to allow high pin count testers to
support a PMU per pin.
• FV / MI Capability
• FI / MV Capability
• 4 Current Ranges (±40 mA, ±1 mA, ±100 µA,
±10 µA)
• +7V / –5V I / O Range
• Short Circuit Protection
• Clamps for limiting mode and range select transients
• Automatic Test Equipment
- Memory Testers
- VLSI Testers
- Mixed Signal Tester
VINP
IVIN
MODE SEL
I/V MAX
I/V MIN
DISABLE
FORCE
SENSE
Comparators
Detector Logic
Voltage Monitor
HIZ
DUT LTH
PASS/FAIL*
DUT GTL
I/V MONITOR
2Revision 5 / February 20, 2003 www.semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge737
Pin Description
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3
Revision 5 / February 20, 2003 www.semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge737
Pin Description (continued)
32 Pin TQFP
(7 mm x 7 mm x 1.4 mm)
(Top View)
DUT LTH
I/V MAX
VEE
N/C
N/C
VCC
DUT GTL
PASS/FAIL*
I/V MIN
CB
RD
IVIN
VINP
RC
DISABLE
N/C
CA
SENSE
FORCE
GND
RA
N/C
CAPI
HIZ
RS1
MODE SEL
RS2
I/V MONITOR
VEE
COMP2
COMP1
RB
1
917
25
4Revision 5 / February 20, 2003 www.semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge737
Circuit Description
Circuit Overview
The Edge737 is a parametric test and measurement unit
that can :
• Force Voltage / Measure Current
• Force Current / Measure Voltage.
The Edge737 can force or measure voltage over a +7V to
-5V range, and force or measure current over four distinct
ranges:• ± 40 mA
• ± 1 mA
• ± 100 µA
• ± 10 µA.
An on board window comparator provides three-bit
measurement range classification. Also, a monitor passes
a real time analog signal which tracks either the DUT’s
current or voltage performance.
Control Inputs
MODE SEL is a digital input which determines whether
the PMU forces voltage or current, when it is not placed in
a high impedance state by the HIZ input (see Table 1).
Table 1.
RS1 and RS2 are digital inputs to an analog MUX which
establishes the full scale current range of the PMU. One
of four current ranges can be selected by using RS1 and
RS2 as shown in Table 2.
Table 2.
Comparator Outputs
The comparator outputs DUT GTL, DUT LTH, and
PASS/F AIL* are open drain outputs. When active (logical
0), they will pull to ground. When disabled (logical 1 or
DISABLE = 1), they require an external pull up resistor to
a positive voltage to achieve a high state.
Force / Sense
FORCE is an analog output which either forces a current
or forces a voltage, depending on which operating mode
is selected.
The SENSE pin is a high impedance analog input which
measures the DUT voltage input in the FI / MV operating
mode.
FORCE and SENSE are brought out to separate pins to
allow for remote sensing.
I/V MONITOR
I/V MONITOR is a real time analog output which tracks the
sensed parameter . I/V MONITOR functionality is described
in Table 3.
Table 3.
In the FI / MV mode, the output voltage is a 1:1 mapping
of the DUT voltage. In the FV / MI mode, I/V MONITOR
follows the equation:
I(measured) = I/V MONITOR / (4.0 * REXT).
Using nominal values for the external resistors, I/V
MONITOR of +8.0V corresponds to Imax and –8.0V
corresponds to Imin of the selected current range.
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5
Revision 5 / February 20, 2003 www.semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge737
Circuit Description (continued)
HIZ
HIZ is a digital input which places the FORCE output into a
high impedance state, regardless of the operating mode
(forcing current or voltage.) This function allows the PMU
to be connected directly to the pin electronics without an
isolation relay while NOT adding any leakage current.
DISABLE
DISABLE is a digital input which places DUT L TH, DUT GTL,
I/V MONITOR, and P ASS/FAIL* into high impedance states.
Force Voltage / Measure Current Mode
In the FV / MI mode, VINP is a high input impedance,
analog voltage input that maps directly to the voltage forced
at the DUT (see Figure 1), where FORCE = VINP.
A current monitor is connected in series with the Op Amp
driving the FORCE voltage. This monitor generates a
voltage that is proportional to the current passing through
it, and its output is brought out to I/V MONITOR. The
monitor’s voltage may also be evaluated using the Window
Comparator whose operation is in accordance with the
FV/MI functional truth table (Table 6).
I/V MAX and I/V MIN are high impedance analog inputs
that establish the upper and lower thresholds for the
window comparator (see Table 4). In the FV / MI mode, a
maximum voltage input corresponds to at least a maximum
current output. Positive current is defined as current
flowing out of the PMU.
Table 4.
The voltage at I/V MONITOR follows the equation:
I(measured) = I/V MONITOR / (4.0 * REXT).
Nominally, the external resistors (RA, RB, RC, and RD)
should be chosen such that Imax * REXT = 2.0V.
Force Current / Measure Voltage Mode
In the FI / MV mode, IVIN is a high input impedance,
analog voltage input that is converted into a current (see
Table 5) using the following relationship:
FORCE = IVIN / (4.0 * REXT)
with positive current is defined as current flowing out of
the PMU.
Table 5.
The resulting DUT voltage is then tested via the SENSE
input by a window comparator , whose functional truth table
is shown in Table 7.
I/V MAX and I/V MIN are high impedance analog inputs
that establish the upper and lower thresholds for the win-
dow comparator. In the FI / MV mode, the reference in-
puts translate 1:1 to SENSE level thresholds.
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6Revision 5 / February 20, 2003 www.semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge737
Circuit Description (continued)
Figure 1. Edge737 Functional Schematic
DRIVER
+
–
INST.
+
–
4X
+
–
CAPI
COMP2
COMP1
CB CA
VINP
IVIN HiZ
SENSE
Cext
Cext
Cext
FV*
FV*
FV
FV*
FV*
FV*
FV
FV
FV
FV
40KΩ
40KΩ
D*
D*
D
D
C*
C
B*
B
A*
A
C* C
B* B
A* A
RD
RC
RB
RA
FV*
FV*
FV
FV
Edge737 Functional Schematic
FV ⇒ FV/FI* = 1
FV* ⇒ FV/FI* = 0
Cext
COMP1, COMP2: Force amplifier compensation
Cext
CB, CA: Current sense resistor compensation
Cext
CAPI: Input noise filter capacitor (low pass)
5 KΩ15 KΩ
70 Ω typ.
5KΩ
15KΩ
+
–
+
–
IV_MAX
DISABLE
IV_MIN +
–
10
10
10
10
DUT_LTH
PASS/FAIL*
I/V MONITOR
FORCE
DUT_GTL
7
Revision 5 / February 20, 2003 www.semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge737
Circuit Description (continued)
NOITIDNOCTSETELBASIDHTLTUDLTGTUDROTINOMV/I*LIAF/SSAP
X1ZiHZiHZiH
XAMV/I>ROTINOMV/I XAMV/I<ROTINOMV/I 0
00
1A/N A/N TXER*0.4*tuoI=ROTINOMV/I TXER*0.4*tuoI=ROTINOMV/I 0A/N
NIMV/I>ROTINOMV/I NIMV/I<ROTINOMV/I 0
0A/N A/N 1
0TXER*0.4*tuoI=ROTINOMV/I TXER*0.4*tuoI=ROTINOMV/I A/N0
XAMV/I<ROTINOMV/I dna NIMV/I>ROTINOMV/I 011 TXER*0.4*tuoI=ROTINOMV/I1
NOITIDNOCTSETELBASIDHTLTUDLTGTUDROTINOMV/I*LIAF/SSAP
X1ZiHZiHZiH
XAMV/I>ESNES XAMV/I<ESNES 0
00
1A/N A/N ESNES=ROTINOMV/I ESNES=ROTINOMV/I 0A/N
NIMV/I>ESNES NIMV/I<ESNES 0
0A/N A/N 1
0ESNES=ROTINOMV/I ESNES=ROTINOMV/I A/N0
XAMV/I<TUD dna NIMV/I>TUD 011 ESNES=ROTINOMV/I1
Table 6. FV / MI Truth Table
Table 7. FI / MV Truth Table
8Revision 5 / February 20, 2003 www.semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge737
Circuit Description (continued)
REXT Selection
The Edge737 is designed for the voltage drop across RA,
RB, RC, and RD to be ≤ 2V with the maximum current
passing through them. However, these resistor values
can be changed to support different applications.
Increasing the maximum current beyond the nominal range
is not recommended. However, decreasing the maximum
current is allowed.
Short Circuit Protection
The Edge737 is designed to survive a direct short circuit
to any voltage within the supply rails at the FORCE and
SENSE pins.
Transient Clamps
The Edge737 has on-board clamps to limit the voltage
and current spikes that might result from either changing
the current range or changing the operating mode.
Common Mode Error/Calibration
In order to attain a high degree of accuracy in a typical
ATE application, offset and gain errors are accounted for
through software calibration. When forcing or measuring
a current with the Edge737, an additional source of error,
common mode error, should be accounted for. Common
mode error is a measure of how the common mode
voltage, VCM, at the input of the current sense amplifier
affects the forced or measured current values (see Figure
2). Since this error is created by internal resistors in the
current sense amplifier, it is very linear in nature.
Using the common mode error and common mode linearity
specifications, one can see that with a small number of
calibration steps (see Applications note PMU-A1), the
effect of this error can be significantly reduced.
Compensation Capacitors
COMP1 and COMP2 are internal op amp compensation
pins that require a 120 pF capacitor connected between
the two pins.
CAPI is an external noise compensation pin that can be
used as a low pass filter to eliminate noise from the IVIN
and VINP input pins through the connection of an external
capacitor from CAPI to GND. The relationship between
the roll-off frequency of noise filtered (in Hz) to the external
capacitance (in farads) can be seen below:
Filter Frequency =
CA and CB are internal compensation pins that require a
120 pF capacitor connected between them.
Power Supply Sequencing
In order to help protect the Edge737 from a latch-up
condition, it is important that VCC ≥ All Input Voltages ≥
VEE, and VCC ≥ GND ≥ VEE at all times.
1
80,000 π X CCAPI
Figure 2. Graphical Representation of
Common Mode Error
–5V 7V
VOS@IVMON
VCM@FORCE
CM Error = Slope
CM Linearity
9
Revision 5 / February 20, 2003 www.semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge737
Application Information
FORCE Pin Output Voltage (Positive Headroom
Requirement)
The maximum positive voltage that can be forced at the
FORCE pin by the Edge 737 in the force voltage/measure
current (FV/MI) mode and the maximum compliance volt-
age that can appear at the FORCE pin in the force cur-
rent/measure voltage mode (FI/MV) is a function of the
positive power supply (VCC), device case temperature (T c),
and selected current range. The plot in Figure 3 depicts
the typical positive voltage that can appear at the FORCE
pin for various power supply combinations across the speci-
fied case temperature range of the device. All plots rep-
resent the Edge 737 being used with a ± 2V full-scale
swing across the external current sense resistors for each
range.
Figure 3. Typical Edge737 FORCE Pin Voltage vs. Case Temperature
Edge 737 FORCE Voltage Positive Headroom
6.6
6.8
7.0
7.2
7.4
7.6
7.8
8.0
8.2
8.4
8.6
25 30 35 40 45 50 55 60 65 70 75
TEMPERATURE (C)
V
CC = 11.5V, VEE = -9.5V, Ranges A, B, C
V
CC = 11.5V, VEE = -9.5V, Range D
V
CC = 12V, VEE = 10V, Ranges A, B, C
V
CC = 12V, VEE = 10V, Range D
V
CC = 13V, VEE = -9.5V, Ranges A, B, C
V
CC = 13V, VEE = -9.5V, Range D
10Revision 5 / February 20, 2003 www.semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge737
Required External Components
RA
120 pF
120 pF *
120 pF
200 KΩ
20 KΩ
2 KΩ
50 Ω
RB
RC
RD
FORCE
DUT LTH
COMP1 COMP2 CAPI
VCC
VCC
.1 µF
VEE
DUT GTL
PASS/FAIL*
CA
CB
VEE
.1 µF
* Optional (see Compensation Capacitors Section)
Actual decoupling capacitor values depend
on the actual system environment.
V+
RPU
RPU RPU
Choose Rext such that:
Typical Values
Iout (low) = V+ / RPU < 1 mA, V+ ≤ VCC
Application Information (continued)
11
Revision 5 / February 20, 2003 www.semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge737
Package Information
b
D
3
4
4
e
N / 4 TIPS
4 X
E / 2
D / 2
SEE DETAIL "A"
E
0.20 C A – B D
TOP VIEW
D1
E1
57
5 7
4 X
D1 / 2
E1 / 2
0.20 H A – B D
BOTTOM VIEW
C
O
O
32 Pin TQFP Package
7 mm x 7 mm x 1.4 mm
12Revision 5 / February 20, 2003 www.semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge737
Package Information (continued)
3
DETAIL "A"
e / 2
b
0 MIN.
0.08 / 0.20 R.
GAUGE PLANE
0.25
0 – 7
L
C.08
R. MIN.
0.20 MIN.
1.00 REF.
DATUM
PLANE
– H –
A2
0.05
A1
–S
DETAIL "B"
9
;;;
;;;
SSDC
ddd M A – B
WITH LEAD FINISH
Lead)
Cross Section
0.09 / 0.20 0.09 / 0.16
b
b1
BASE METAL
2
8 PLACES)
11 / 13
A
0.10/ / C
M
SEE DETAIL "B"
0.05
ccc
– H –)
– C –)
SECTION C–C
Notes:
1. All dimensions and tolerances conform to ANSI Y14.5-1982.
2. Datum plane -H- located at mold parting line and coincident with
lead, where lead exits plastic body at bottom of parting line.
3. Datums A-B and -D- to be determined at centerline between leads
where leads exit plastic body at datum plane -H-.
4. To be determined at seating plane -C-.
5. Dimensions D1 and E1 do not include mold protrusion.
6. “N” is the total # of terminals.
7. These dimensions to be determined at the datum plane -H-.
8. Package top dimensions are smaller than bottom dimensions and
top of package will not overhang bottom of package.
9. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08 mm total in excess of the b
dimension at maximum material condition. Dambar cannot be
located on the lower radius or the foot.
10. Controlling dimension: millimeter.
11. Maximum allowable die thickness to be assembled in this
package family is 0.30 millimeters.
12. This outline conforms to JEDEC publication 95, registration
MO-136, variations AC, AE, and AF.
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DCSB00.94
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ECSB00.94
1ECSB00.78,7htdiWydoBegakcaP
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b03.073.054.09 ssenkcihTdaeL
1b03.053.004.0
ccc01.0
ddd02.0
JDEC Variation
Dimensions in Millimeters
13
Revision 5 / February 20, 2003 www.semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge737
Recommended Operating Conditions
Absolute Maximum Ratings
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ylppuSrewoPevitisoPCCV0 0.41V
ylppuSrewoPevitageNEEV0.31–0V
ylppuSrewoPlatoTEEV–CCV0 0.32V
stupnIlatigiD 5.–0.7V
erutarepmeTegarotSST55–051+C˚
erutarepmeTnoitcnuJJT56–051+C˚
erutarepmeTgniredloS 062+C˚
Stresses above listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these or any other conditions above those listed in the
operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for
extended period may affect device reliability.
retemaraPlobmySniMpyTxaMstinU
)DNGotevitaleR(ylppuSrewoPgolanAevitisoPCCV5.112131V
)DNGotevitaleR(ylppuSrewoPgolanAevitageNEEV11–01–5.9–V
ylppuSrewoPgolanAlatoTEEV–CCV12225.22V
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CJ
1.41W/C˚
Production tested @ +12V, –10V for linearity and min/max parametric testing.
14Revision 5 / February 20, 2003 www.semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge737
DC Characteristics
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311–3
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5
5–113–11
324–0
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BdBdBdBd
ROTINOMV/IotEEV/CCV zHk1.0 zHk0.1 zHk01 )edomIM(zHk001 )edomVM(zHk001
5606055.151
BdBdBdBdBd
edoMtnerruCerusaeM/egatloVecroF
PNIV@egnaRegatloVtupnI PNIV@tnerruCsaiBtupnI ytilibatSrofECROF@egnaRgnidaoLeviticapaC egnaRegatloVgnicroFtuptuO
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CECROF
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4+EEV 4.0–05.4+EEV
4–CCV 4.021 0.5–CCV
V
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001 520.0 510.1
Vm RVSF% V/V
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01–001–1–04–
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4
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Vm RCSF% V/V V/Vm Vm
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ROTINOMV/I@egnaRgnidaoLeviticapaCC
ROTINOMV/I 21Fn
15
Revision 5 / February 20, 2003 www.semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge737
noitpircseDlobmySniMpyTxaMstinU
edoMegatloVerusaeM/tnerruCecroF
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01 0011
04
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SOI niaGIF LNIIF rorrEMCI
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4–42.0 53.0–570.0–1.0–
52.0 462.0 53.0 570.0 1.0
RCSF% V/V RCSF% V/RCSF% RCSF%
nitnerruCegakaeLdenibmoCESNES/ECROF edoMZiH I
KAEL
02–02An
egnaRegatloVecnailpmoCV
ECNAILPMOC
5.4+EEV0.5–CCVV
)ROTINOMV/I@(ycaruccAtnemerusaeMegatloV tesffO niaG )3etoN(ytiraeniL
SOV niaGVM LNIVM
001–589.0 520.0–1001 510.1 520.0
VmV/V RVSF%
elbasiDnitnerruCegakaeLtuptuOROTINOMV/I edoM I
KAEL
051–051An
ROTINOMV/I@egnaRgnidaoLeviticapaCC
ROTINOMV/I
21Fn
rotarapmoC
)XAMV/I,NIMV/I(egnaRegatloVtupnINIV1+EEV3–CCVV
egatloVtesffOtupnISOV001–001Vm
)XAMV/I,NIMV/I(tnerruCsaiBtupnINII4.0–4.0Aµ
TUD,HTLTUD(Am1=LOI@leveLwoLtuptuO )*LIAF/SSAP,LTG LOV004Vm
edoMDELBASIDniegakaeLtuptuOHOI1–1Aµ
egakaeLtuptuOI
KAEL
2.0–2.0Aµ
tnerruCsaiBtupnIELBASIDNII2.0–2.0Aµ
DC Characteristics (continued)
16Revision 5 / February 20, 2003 www.semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge737
DC Characteristics (continued)
DC Test Conditions: CAPI = 120 pF connected to GND, CA – CB = 120 pF, COMP1 – COMP2 = 120 pF,
TA = 25˚C unless otherwise noted.
Note 1: Test Conditions are as follows: VCC = 12 to 13V, VEE = –10V, 40 mA is externally forced into
FORCE pin.
Note 2: Guaranteed by design and characterization. Not production tested.
Note 3: Characterized with a ±10 µA current load at I/V MONITOR.
Note 4: V/V units derived as follows:
MI Gain =
Note 5: V/V units derived as follows:
FI Gain =
Unit Definitions:
FSCR = F ull Scale Current Range
Range A, FSCR = 20 µA
Range B, FSCR = 200 µA
Range C, FSCR = 2 mA
Range D, FSCR = 80 mA
FSVR = Full Scale Voltage Range = 12V nominal (–5V to 7V)
noitpircseDlobmySniMpyTxaMstinU
)2SR,1SR(XUMgolanA
leveLhgiHtupnIHIV4.2V
leveLwoLtupnILIV8.0V
tnerruCsaiBtupnINII2.0–2.0Aµ
stupnIlatigiDrehtO
)ZIH,LESEDOM(leveLhgiHtupnIHIV4.2V
)ZIH,LESEDOM(leveLwoLtupnILIV8.0V
tnerruCsaiBtupnILESEDOMNII2.0–2.0Aµ
tnerruCsaiBtupnIZIHNII1–05Aµ
VIVMON
(IMEASURED x REXT)
IFORCE x REXT
VIVIN
17
Revision 5 / February 20, 2003 www.semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge737
noitpircseDlobmySniMpyTxaMstinU
edoMtnerruCerusaeM/egatloVecroF
emiTgniltteSegatloVECROF )ECROF@daolFp001( petSV01fo%1.0oT AegnaR D,C,BsegnaR petSV01fo%520.0oT segnaRllA
t
elttes
051 021
003
sµsµ
sµ
emiTyrevoceRnoitarutaSpmAECROFt
tas
53sµ
emiTgniltteStnerruCerusaeM )ROTINOMV/I@daolFp001( RCSFfo%1.0oT AegnaR D,C,BsegnaR RCSFfo%520.0oT AegnaR D,C,BsegnaR
t
elttes
004 521
5.1 003
sµsµ
smsµ
hgiHotwoLZiH,emiTelbasiD woLothgiHZiH,emiTelbanE t
z
t
eo
1054 sµsn
edoMegatloVerusaeM/tnerruCecroF
emiTgniltteStnerruCtuptuOECROF )ECROF@daolFp001( RCSFfo%1.0oT AegnaR D,C,BsegnaR RCSFfo%520.0oT AegnaR D,C,BsegnaR
t
elttes
007 052
2003
sµsµ
smsµ
emiTyrevoceRnoitarutaSpmAECROFt
tas
53sµ
emiTgniltteSegatloVerusaeM )ROTINOMV/I@daolFp001( petSV01fo%1.0oT AegnaR C,C,BsegnaR petSV01fo%520.0oT AegnaR D,C,BsegnaR
t
elttes
007 052
2053
sµsµ
smsµ
hgiHotwoLZiH,emiTelbasiD woLothgiHZiH,emiTelbanE t
z
t
eo
154.0 sµsµ
18Revision 5 / February 20, 2003 www.semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge737
AC Characteristics
noitpircseDlobmySniMpyTxaMstinU
rotarapmoC
yaleDnoitagaporPt
dp
03sµ
hgiHotwoLELBASID,emiTelbasiDt
z
003sn
woLothgiHELBASID,emiTelbanEt
eo
5.5sµ
ROTINOMV/I
hgiHotwoLELBASID,emiTelbasiDt
z
053sn
woLothgiHELBASID,emiTelbanEt
eo
04sµ
noitceleSegnaR/edoM
yaleDnoitagaporPLESEDOMt
dp
01sµ
yaleDnoitagaporP1SR/0SRt
dp
1sµ
AC Test Conditions: CAPI = 120 pF connected to GND, CA – CB = 120 pF, COMP1 – COMP2 = 120 pF,
TA = 25˚C unless otherwise noted.
Settling times guaranteed by design and characterization (not production tested).
19
Revision 5 / February 20, 2003 www.semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge737
Ordering Information
Contact Information
Semtech Corporation
Test and Measurement Division
10021 Willow Creek Rd., San Diego, CA 92131
Phone: (858)695-1808 FAX (858)695-2633
rebmuNledoMegakcaP
FTA737E PFQTniP-23 mm7xmm7
FTA737MVEeludoMnoitaulavEH737egdE
This device is ESD sensitive. Care should be taken when handling and
installing this device to avoid damaging it.
