HT1MOA2S30 - Philips Semiconductors / NXP Semiconductors

HITAG

1 Chip Module

August 1997Preliminary Specification

Revision 1.1

HT1 MOA3 S30

Specifications of the HT1 MOA3 S30 Rev. 1.1 1997-08-19

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Table of Contents

1 Definitions.............................................................................................................................. 3

1.1 Objective of the Specifications..................................................................................................................... 3

1.2 Definition of the Chip Module..................................................................................................................... 3

1.3 Use of the Modules......................................................................................................................................3

2 Specifications.........................................................................................................................4

2.1 Mechanical Properties ................................................................................................................................. 4

2.2 Materials .....................................................................................................................................................4

2.3 Temperature Range .....................................................................................................................................4

2.4 Storage Conditions ......................................................................................................................................5

2.5 Delivery Conditions.....................................................................................................................................5

2.6 Electrical Specifications...............................................................................................................................6

3 Drawing of the Chip Module HT1 MOA3 S30.....................................................................7

3.1 Drawing of the Reel.....................................................................................................................................7

3.2 Module outline suggestion...........................................................................................................................8

3.3 Splicing Specification..................................................................................................................................9

4 Coil Specifications................................................................................................................ 10

5 Functional Description of HITAG 1 ................................................................................... 12

5.1 Memory Organization................................................................................................................................ 12

5.2 Anticollision.............................................................................................................................................. 13

5.3 Operation Modes and Configuration.......................................................................................................... 14

5.3.1 Modes of Operation............................................................................................................................ 14

5.3.2 Configuration..................................................................................................................................... 14

5.4 Configuration of Delivered HITAG 1 Transponders................................................................................... 17

5.5 Definition of Keys and Logdata ................................................................................................................. 17

6 Quality Inspection ............................................................................................................... 19

7 Characterisation and Test of the Final Transponder......................................................... 20

7.1 Characterisation of the Transponder.......................................................................................................... 20

7.2 Final Test of the Transponder.................................................................................................................... 20

8 Ordering Information.......................................................................................................... 21

HITAGTM is a trademark of Philips Electronics N.V.

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1 Definitions

1.1 Objective of the Specifications

This specification lists the parameters to be fulfilled by the HITAG 1 chip module

HT1 MOA3 S30 for contactless smart cards or similar transponders (as e.g. discs).

1.2 Definition of the Chip Module

A chip module is an electronically packaged chip covered with a globe top cap. The

HT1 MOA3 S30 is above all used as card module, i.e. for further lamination into contactless

smart cards according to ISO 10536.1.

So the HITAG 1 chip module HT1 MOA3 S30 is best suited for customers that do not want to

spend time with micro assembly and therefore start - e.g. ISO card production - with the

HITAG 1 chip module.

1.3 Use of the Modules

The HITAG 1 modules are designed t o be co nnected t o a coil and t hen to be furt her pro cessed by

packaging into a transponder (e.g. lamination into an ISO smart card). Specific processing

information for the coil-module connection and packaging is given in the specification.

For production of contactless chip cards it is recommended to prepunch card foils to create a

recess for the chip module in the card body.

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2 Specifications

2.1 Mechanical Properties

Width

(Proposed Punching Outline) 7.55 mm

Length

(Proposed Punching Outline) 11.75 mm see also drawing in chapter 3

Overall Thickness 0.45 mm ± 0.03 mm

Film Thickness 0.16 mm ± 0.005 mm

Bondpad Size for

Transponder Coil / Module

Interconnection

1.9 x 3.5 mm Suitable for Welding/Soldering/

Conductive Gluing

2.2 Materials

Tape 110 µm Glass epoxy

Copper Plating 35 µm ED copper

Bond Plating Ni / Au Suitable for Al and Au wire

bonding

Backside Plating Ni / Au

Glob Top Filled Epoxy Thermal curing

2.3 Temperature Range

Operating -25°C to +85°C For packed transponder,

depending on type of package

Processing 150°C for 30 minutes at a standard lamination

pressure for contactless smart

card plastic materials (e.g. PVC,

PET, ...)

Welding Parameters max. 25 ms @ 500 °C on bond pads

Soldering Parameters max. 3 s @ 390 °C on bond pads

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2.4 Storage Conditions

Temperature 15 - 30 °C

Relative Humidity 40 - 70 %

Duration 1 year

2.5 Delivery Conditions

Delivery Identification Date of ready for shipment, reel numbers, total quantity of good

modules with the detail of good modules per reel, order number,

product type, no supplier identification on reels, bags and boxes.

Types of Delivery Chip modules on reel

single chip modules (bulk goods)

approx. 15.000 to 20.000

pcs. per reel,

tape width super 35 mm,

pitch 9,5 mm, 2 rows

500 pcs . per bag

Packing and Transport According to documentation

"Packing Method Modules (reel)"

"Packing Method Modules (singulated)"

Order-No. 3322 845 04881

Bad Module Marking All bad modules (mechanical and

electrical faults) must be punched by

reject hole for customer

Bad positions (reel): <20%

see drawings chapter 3

Splicing Specifications Tape material: adhes. tape 15,5 +/- 0,7

mm, thermal resistance at

<190°C by < 100 cN tractive power and

< 30 sec. duration.

see drawings chapter 3

Labeling Identification label on the reel and on

carton bag:

- Product type

- Number of the reel

- Total number of positions

- Number of good positions

- Date of sealing (to be checked)

- Two batches per reel only

- Batchnumber indication (only coded,

to be checked)

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2.6 Electrical Specifications

Symbol min typ max Comment / Conditions

Absolute Maximum Ratings

Junction Temperature TJ-55°C 140°C

Input Peak Current IINpeak 30 mA

Latch up Current 100 mA MIL-STD 883D, Method 3023

ESD 2 kV MIL-STD 883D, Method 3015.7,

Human Body

Operating Range

Temperature TA-40°C 85°C RThJunctionAmbient ≤ 30 K/W @

IINpeak = 30 mA

Input Threshold Voltage 1) 3) VIN,TH 3,1 Vp4,2 Vpstart modulation after SETCC

Input Read Voltage 1) 3) VIN,RD 3,5 Vp4,5 Vpread E²PROM

Input Write Voltage 1) 3) VIN,WR 3,7 Vp4,7 Vpwrite E²PROM

Demodulator

Range 3) VDEM_R 2,0 Vp4,0 VpVINHigh - VINLow @ VINHigh = 5,0 Vp

T0=8 µs, TMOD=6*T0 2)

Modulator

R_MOD linear 3) RMODL 4,5 kΩVINLow ≤ 2,0 Vp

R_MOD nonlinear 3) RMODNL 3,6 kΩVINLow ≥ 2,0 Vp

Resonance Capacitor 3)

CResInit 189 pF 210 pF 231 pF VIN = 4,0 Vp

EEPROM

Write Current 4) IW25 µA VDD = 2,8 V

Read Current 4) IR9 µA VDD = 2,8 V

Data Retention Years 10 @ 55°C

Write Endurance Cycles 100.000

1) VIN = VIN1 − VIN2 ... voltage between connection pads

2) VINHigh input voltage before modulation

VINLow input voltage during modulation

TMOD duration of the modulation

3) @ Ri = 10 kΩresistance of measurement equipment

4) tested on silicon level

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3 Drawing of the Chip Module HT1 MOA3 S30

3.1 Drawing of the Reel

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3.2 Module outline suggestion

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3.3 Splicing Specification

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4 Coil Specifications

The HITAG 1 chip module has to be connected to a coil whose parameters are briefly described

in the following.

Equivalent circuit of the transponder

Xpc Rpc Cp Uc Cchip Rchip

Uc... voltage at the connection pads

fres ... resonant frequency of the transponder

Xpc ... parallel reactance of the coil (f = 125 kHz)

Rpc ... parallel resistance of the coil (f = 125 kHz)

Cp... parasitic capacitance of the package

Cchip ... capacitance of the chip (Uc > 4 Vpp)

Rchip ... resistance of the chip

fresc ... self resonant frequency of the coil

Lpc =Xpc/2πf (f = 125 kHz)

Lpc =7.72 mH ± x % (Cp = 0, x depends on the coil production process)

Cchip = 210 pF ± 10 %

Rpc > 45 k



fresc > 750 kHz

Note: The parasitic capacitance of the package (C p) must be considered.

()

2(C C).L 125 kHz L = 1

2f C + C

res chip p pc pc

res chip p

=+=⇒

ππ

Typical values for Cp

hot laminated cards: Cp = 1.5 pF

moulded tags: Cp = 6.0 pF

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For a rough estimation ( ± 10 %) of the number of coil windings following formula can be used.

It is assumed that the winding is done in circular form.

2Uln(u

1,85

N ... Number of windings

L ... Inductance [nH]

U ... average coil circumference [cm]

d ... copper diameter [mm]

u ... average coil circumference [mm]

For fine tuning a measurement of the inductance and an according adjustment of the number of

windings is necessary. This process always needs some iterations.

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5 Functional Description of HITAG 1

5.1 Memory Organization

The 2 kBit EEPROM memory on the transponder is divided into 16 blocks.

Every block consists of 4 pages. A page is the smallest access unit.

Every page consists of 4 bytes (at 8 bits).

Block access is only available for Blocks 2-15, page access is available for Pages 0-63.

read onl

read/write

write onl

one time pro

rammable

neither read nor write

r/w

OTP

Serial Number

data 1B

data 0A

data 1A

data 0B

Configuration

Block 1

Block 4

Block 7

Block 8

Block 15

user data

Block 0

Configuration of the memory is

done in the configuration page

secret

public

r/w

OTP r/w

wo or 0

r/w

secret

Areas (or settings) with light dark background may be configured by the OEM client using the

Configuration Page (Page 1).

Memory locations marked with "secret" can only be accessed after a mutual authentication. An

enciphered data communication is used in that area.

Memory locations marked with "public" can be accessed without mutual authentication, no

encryption is used.

Block 0 includes the unique serial number (programmed during the production process), the

Configuration Page (configuration of the memory area) and the keys, Block 1 includes the

logdata.

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Blo cks 4 to 7 can be used eit her as secret or public areas (co nfigurable), and Blocks 2 to 7 either

as read / write or read only areas (configurable). You can also modify keys and logdata and

prevent them from being accessed.

Finally the Configuration Page itself can be set to read only.

It is extremely important to be particularly careful when using the Configuration Page (it

only can be set to read only once!), keys and logdata as you can lose access to the secret

area on the transponder in case of a mistake.

ATTENTION:

Changing of the Configuration Page (Page 1), Keys and Logdata must be done in secure

environment. The transponder must not be moved out of the communication field of the

antenna during programming! We recommend to put the transponder close to the antenna

(zero-distance) and not to remove it during programming.

5.2 Anticollision

Anticollision Mode in long range applications including HITAG 1 transponders permits you to

process several transponders simultaneously. Theoretically up to 232 transponders can be

p roc e s s e d s imulta nou s ly. In p r ac tic e th is number is limite d, b ecause o f t he mut ual influence o f t he

transponders - they detune each other, if there are too many too close to each other.

The currently used read/wr it e device must also suppo rt full ant ico llis ion fe a ture (e . g. H TR M 800).

For read/write devices without that feature only one transponder is handled even if there are

several transponders within the communication field of the antenna. In this case either no

communication takes place or the "stronger" or closer transponder takes over.

By muting a selected transponder (HALT Mode) another transponder that is to be found in the

communication field of the antenna can be recognized.

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5.3 Operation Modes and Configuration

5.3.1 Modes of Operation

The HITAG 1 can be operated in two modes (Standard Protocol Mode, Advanced Protocol

Mode) that cannot be configured using the Configuration Page, but via special host commands.

A dv a nced Protocol M ode i s not av ailable for HITA G 1 transponders b as ed on ASIC HT1 ICS30 01x

(only available f or HITAG 1 transponders bas ed on ASIC HT1 ICS30 02x) and uses, above all, an

additional Cyclic Redundancy Check (CRC) for read operations.

5.3.2 Configuration

The Configuration Page consists of 4 Configuration Bytes, the first two bytes are used for

configuration, the other two bytes can be used freely.

The bit maps in Configurat ion Byt es 0 and 1 determine the configurat io n of t he memo ry, i.e. t hey

define which area is secret or public, read/write, read only, write only or neither read nor write.

You can allocat e and write t he Configurat io n Page until it is locked (Bit 4 of Co nfigurat ion Byte

1 is set to ‘0’).

Aft er that these bytes are r ead only bytes and the co nfiguration of t he transpo nder memory cannot

be changed any more.

ATTENTION: Once set to read only the Configuration Page cannot be changed back to

read/write again (transponder is hardware protected)!

Configuration Bytes 2 and 3: These two bytes, too, are set to read only by the OEM Lock Bit

(Configuration Byte 1 / Bit 4 = ”0”). Considering that fact you can use these two bytes freely.

They will not affect memory configuration.

Explanations of abbreviations used:

r/w read and write

ro read only

wo write only

0 neither read nor write

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Configuration Byte 0:

Configuration Byte 0 / Bit 7:

Bit 7 = ‘1’: Logdata can be read and written to.

Bit 7 = ‘0’: Logdata cannot be accessed.

This bit can be set or reset until Bit 4 of Configuraion Byte 1 is set to ‘0’.

For further information on Logdata and Keys see chapter “Definition of Keys and Logdata“.

Configuration Byte 0 / Bit 6:

Bit 6 = ‘1’: Keys can only be written to.

Bit 6 = ‘0’: Keys cannot be accessed.

This bit can be set or reset until Bit 4 of Configuration Byte 1 is set to ‘0’.

For further information on Logdata and Keys see chapter “Definition of Keys and Logdata“.

Configuration Byte 0 / Bits 0 ... 5:

If one of these Configuration Bits is ‘1’, the corresponding block of the transponder can be read

and written.

If the bit is set to ‘0’, the corresponding block can only be read.

Within one blo ck the configurat io n is always id ent ical, t hat means either all 4 pages are read/wr it e

or all of them are read only.

These bits can be set or reset until Bit 4 of Configuration Byte 1 is set to ‘0’.

1 03 25 47 6

Block 7: "1" ... r/w

"0" ... ro

Block 6: "1" ... r/w

"0" ... ro

Block 5: "1" ... r/w

"0" ... ro

Block 4: "1" ... r/w

"0" ... ro

Block 3: "1" ... r/w

"0" ... ro

Block 2: "1" ... r/w

"0" ... ro

Key A and Key B: "1" ... wo

"0" ... 0

Logdata A and B: "1" ... r/w

"0" ... 0

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Configuration Byte 1:

Configuration Byte 1 / Bits 5 ... 7:

These three bits are reserved.

ATTENTION: When writing a new value to Configuration Byte 1, bit p ositions marked as

“reserved“ must not be altered. To meet that condition read the current Configuration

Byte 1 value and mask in your new values for bit positions you are allowed to change.

Configuration Byte 1 / Bit 4:

Bit 4 = ‘1’: Configuration Page can be read and written to.

Bit 4 = ‘0’: Configuration Page can only be read. This process is irreversible !

ATTENTION: Do not set Bit 4 of Configuration Byte 1 to ‘0’ before having written the

final data into the Configuration Page of the transponder.

Configuration Byte 1 / Bits 1 ... 3:

These three bits are reserved.

ATTENTION: When writing a new value to Configuration Byte 1, bit p ositions marked as

“reserved“ must not be altered. To meet that condition read the current Configuration

Byte 1 value and mask in your new values for bit positions you are allowed to change.

Configuration Byte 1 / Bit 0:

Bit 0 = ‘0’: Access type for Blocks 4 to 7 is SECRET.

Bit 0 = ‘1’: Access type for Blocks 4 to 7 is PUBLIC.

This bit can be set or reset until Bit 4 of Configuration Byte 1 is set to ‘0’.

1 03 25 47 6

Access type for Blocks 4 to 7: "0" ... SECRET

"1" ... PUBLIC

reserved

OEM Lock Bit: "0" ... Configuration Page is ro

"1" ... Configuration Page is r/w

reserved

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5.4 Configuration of Delivered HITAG 1 Transponders

HITAG 1 transponders are delivered with the following configuration by Philips Semiconductors:

Unique Serial Number:

Serial Number: Read Only - fixed

Configuration Byte 0:

Logdata: ‘1’ = r/w - can be changed

Key A, Key B: ‘1’ = wo - can be changed

Blocks 2 - 7: ‘1’ = r/w - can be changed

Configuration Byte 1:

OEM Lock Bit: ‘1’ = Configuration Page is r/w - can be changed

Blocks 4 - 7: ‘1’ = public - can be changed

Value for Transport Keys, Transport Logdata:

0x00000000

RECOMMENDATION:

Before delivering transponders to end users, the Configuration Page should be set to read only

(Configuration Byte 1/Bit 4 = ‘0’).

5.5 Definition of Keys and Logdata

In order to be able to read data from the secret area of a transponder, you have to carry out a

procedure called authentication. To do this you need special data (keys).

After transmitting the according command the authentication is automatically carried out by the

read/write device.

Keys are cryptographic codes, which determine data encryption during data transfer between

read/write device and transponder.

Two keys (Key A and Key B) which yo u can use independent ly o f each ot her, have been inst alled

for s e c u rity an d fle xib ility r e a s on s . T h e iden tity of e ither K e y A or K e y B on th e re a d /w r ite d e v ic e

and on the transponder is sufficient.

Logdata represent "passwords" needed to gain access to secret areas on the transponder. A pair

of logdat a is included wit h every crypt ographic key ( Key A and Key B). This logdata pair has t o

be identical both on the transponder and the read/write device.

ad Key A: Logdata 0 A "Password" which the transponder sends t o

the read/write device and which is verified

by the latter.

Logdata 1 A "Password" which the read/write device

sends to the transponder and which is

checked for identity by the latter.

ad Key B: Logdata 0 B and

Logdata 1 B analogous to Key A

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It is imp or t ant that t he fo llowing values ar e in acco rdance wit h each o t her, i.e. t he respect ive dat a

on the read/write device and on the transponder have to be identical pairs:

on the

read/write

device

on the

transponder

KEY A ⇔KEY A 

LOGDATA 0A ⇔LOGDATA 0A  Set A

LOGDATA 1A ⇔LOGDATA 1A 

KEY B ⇔KEY B 

LOGDATA 0B ⇔LOGDATA 0B  Set B

LOGDATA 1B ⇔LOGDATA 1B 

The keys and logdata are predefined by Philips Semiconductors by means of defined Transport

Keys (both keys show the same bit map) and Transport Logdata (all logdata show the same bit

map), see also chapter “Configuration of Delivered HITAG 1 Transponders“.

They can be written to, which means that they can be changed.

ATTENTION: Keys and Logdata only can be changed if their current values are known!

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6 Quality Inspection

Quality inspection is performed with statistical quality control according to ISO 2859 part 1, with

AQL1.0.

Optical Properties scratches,

encapsulation failures,

gold discolouration,

delamination

according to the reference sample

catalogue

Geometrical Properies width measured with gauge

length measured with gauge

overall thickness measured with micrometer at the center of

the glob top

Electrical Properties operation basic read/write operations

Shipment Quantity

Packing and Labeling

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7 Characterisation and Test of the Final Transponder

7.1 Characterisation of the Transponder

The parameters recommended to be characterised for the transponder are:

Parameter Comment

Resonant frequency f res Transponder does not modulate

Resonant frequency @ Tamb = 22°C, @ BTH

Threshold value BTH Start of modulation

Threshold value for READ BRD Command READ_PAGE OK

Threshold value for WRITE BWR Command WRITE_PAGE OK

For the measurement of these parameters we recommend to use the test equipment available from

SCEMTEC, Marienheide-Rodt, Germany (Transponder Measurement System STM-1).

This device also supports functional testing (besides parameter testing). Therefore it can also be

used as production test equipment for the final transponder test. For further information please

contact Scemtec GmbH.

7.2 Final Test of the Transponder

In addition to the equipment described in the previous chapter Philips Semiconductors offers a

device for a final functional test of transponders, the HITAGTM Test System HT OT490.

Parameter tests are not supportet by this device.

Basic flow for production and test:

1. Assembly of transponders

2. Functional test and final test of the EEPROM

Since the Keys and Logdata are changed during final test the Configuration and

personalization must take place after the final test. The final test is disabled (not reversible)

by setting the Tag-test mode bit to 0.

For the final test of transponders we recommend to use the

HITAGTM Test System HT OT490 of Philips Semiconductors or the

Transponder Measurement System STM-1 of Scemtec.

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8 Ordering Information

Type Name Description Ordering Number

HT1 MOA3 S30/E/3 HITAG 1 S30 Chip Module, reels 9352 600 61118

HT1 MOA3 S30/E/1 HITAG 1 S30 Chip Module, bulk 9352 602 18122

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Definitions

Data sheet status

Objective specificationThis data sheet conta ins target or goal specifications for product deve lopment.

Preliminary specificationThis data sheet conta ins preliminary data; supp lementary data may be

published later.

Product spec ification This data sheet conta ins final product spec ifications.

Limiting values

Limiting values given are in acco rdance with the Abso lute Maximum Rating Syste m (IEC 134).

Stress above one o r more of the limiting values may cause pe rmanent da mage to the dev ice.

These are stress ratings on ly and ope ration of the device at thes e o r at any othe r conditions

above those g iven in the Characteristics s ect ion of the spec ification is not implied. Exposu re to

limiting values for extended pe riods may affect dev ice reliability.

Application information

Where application information is given, it is advisory and does not form part of the s pec ification.

Life support applications

These products are not designed for use in life support appliances, devices, or systems where

malfunction of these products can reasonably be expected to result in personal injury. Philips

Semiconductors´ customers using or selling these products for use in such applications do so on

their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from

such improper use or sale.

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France: 4 Rue du Port-aux-Vins, BP 317, 92156 SURESNES Cedex, 04547-130 Sao Paulo, SAO PAULO - SP, Brazil,

Tel. +331 40 99 6161, Fax. +331 40 99 6427 Tel. +5511 821 2333, Fax. +5511 829 1849

Germany: Hammerbrookstraße 69, D-20097 HAMBURG, Spain: Balmes 22, 08007 BARCELONA,

Tel. +4940 23 53 60, Fax. +4940 23 536 300 Tel. +343 301 6312, Fax. +343 301 4107

Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,

Tel. +301 4894 339/239, Fax. +301 4814 240 Tel. +468 632 2000, Fax. +468 632 2745

Hungary: see Austria Switzerland: Allmendstraße 140, CH-8027 ZÜRICH,

India: Philips INDIA Ltd., Shivsagar Estate, A Block, Dr. Annie Besant Rd. Tel. +411 488 2686, Fax. +411 481 7730

Worli, MUMBAI 400018, Tel. +9122 4938 541, Fax. +9122 4938 722 Taiwan: Philips Taiwan Ltd., 2330F, 66,

Indonesia: see Singapore Chung Hsiao West Road, Sec. 1, P.O.Box 22978,

Ireland: Newstead, Clonskeagh, DUBLIN 14, TAIPEI 100, Tel. +8862 382 4443, Fax. +8862 382 4444

Tel. +3531 7640 000, Fax. +3531 7640 200 Thailand: Philips Electronics (Thailand) Ltd.,

Israel: RAPAC Electronics, 7 Kehilat Saloniki St., TEL AVIV 61180, 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,

Tel. +9723 645 0444, Fax. +9723 649 1007 Tel. +662 745 4090, Fax. +662 398 0793

Italy: Philips Semiconductors, Piazza IV Novembre 3, Turkey: Talapasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,

20124 MILANO, Tel. +392 6752 2531, Fax. +392 6752 2557 Tel. +90212 279 2770, Fax. +90212 282 6707

Japan: Philips Bldg. 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Ukraine: Philips Ukraine, 4 Patrice Lumumba Str., Building B, Floor 7,

Tel. +813 3740 5130,Fax. +813 3740 5077 252042 KIEV, Tel. +38044 264 2776, Fax. +38044 268 0461

Korea: Philips House, 260-199, Itaewon-dong, Yonsan-ku, SEOUL, United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,

Tel. +822 709 1412, Fax. +822 709 1415 MIDDLESEX UM3 5BX, Tel. +44181 730 5000, Fax. +44181 754 8421

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, Selangor, United States: 811 Argues Avenue, SUNNYVALE, CA94088-3409,

Tel. +60 3750 5214, Fax. +603 757 4880 Tel. +1800 234 7381

Mexico: 5900 Gateway East, Suite 200, EL PASO, Texas 79905, Uruguay: see South America

Tel. +9 5800 234 7381 Vietnam: see Singapore

Middle East: see Italy Yugoslavia: Philips, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. +38111 625 344, Fax. +38111 635 777

Philips Semiconductors, Mikron-Weg 1, A-8101 Gratkorn, Austria Fax: +43 / 3124 / 299 - 270

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Internet: http://www.semiconductors.philips.com

Building BE-p, P.O.Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax: +3140 27 24825

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