MIL SPECS icf go00125 Ooo2es3a4 1 & NOTICE INCH~POUND OF VALIDATION MIL-S-19500/195D NOTICE 1 26 August 1988 MILITARY SPECIFICATION SHEET SEMICONDUCTOR DEVICE, DIODE, SILICON, MICRO-MINIATURE, SWITCHING TYPE 1N3206 Military specification MIL-S-19500/195D, dated 6 August 1979, has been reviewed and determined to be valid for use in acquisition. Custodians: Preparing Activity: Army - ER Army - ER Navy ~ Ec Air Force - 11 Agent: Review activities: DLA ~ ES Army - AR Navy - SH Air Force - 11, 17, 85 DLA - ES User activities: Army - SM, MI Navy ~ MC, CG, OS, AS Air Force - 13, 15, 19, 70, 80 AMSC N/A FSC 5961 DISTRIBUTION STATEMENT A: Approved for public release; distribution is unlimited. 1 of 1MIL SPECS Ic O0001e5 0002535 0 i MIL-S-19500/195D 6 Aupwat 1969 SUPERSE DING MIL-S-19500/195C 29 November 1966 MILITARY SPECIFICATION SEMICONDUCTOR DEVICE, DIODE, SILICON, MICRO-MINIATURE, SWITCHING TYPE 1N3206 This specification is mandatory for use by all Depart- ments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the detail requirements for a silicon, micro-miniature, plastic-encapsulated switching diode and shall be in accordance with MIL-S-19500 except as other - wise specified herein. This device shall not be used for new design. 1.2 Maximum ratings. | 1/ ig (surge) (1/120-sec) v(pk) Vdc mAdc ma 100 80 50 500 1/For ambient temperature above 25C, derate 0.4 mAdc/C, TEMPERATURE RANGE (OPERATING): Ta = -65C to +150C TEMPERATURE RANGE (NONOPERATING): TA = -65C to +200C BAROMETRIC PRESSURE REDUCED (ALTITUDE OPERATION): 8 mm Hg., min 2. APPLICABLE DOCUMENTS 2.1 The following documents, of the issue in effect on date of invitation for bids or request for proposal, form a part of the specification to the extent specified herein: SPECIFICATIONS MILITARY MIL-S-19491 - Semiconductor Devices, Packaging of. MIL-S-19500 - Semiconductor Devices, General Specification For. STANDARD MILITARY MIL-STD-750 - Test Methods for Semiconductor Devices. (Copies of specifications, standards, drawings, and publications required by suppliers in connection with specific procurement functions should be obtained from the procuring activity or as directed by the contracting officer. ) FSC 5961MIL-$-19500/198D MIL SPECS Tc} oooo1es Oooasap 2 Bf 3. REQUIREMENTS 3.1 Requirements. Requirements shall be in accordance with MIL-S-19500 and as specified herein. 3.2 Abbreviations and symbols. The abbreviations and symbols used herein are defined in MIL-S-19500. 3.3 Design, construction, and physical dimensions. The semiconductor diode shall be of the design, construction, and physical dimensions specified as shown on figure 1. 3.3.1 Encapsulating case material. The encapsulating case material shall be of a plastic material which polymerizes to a rigid condition by virtue of a chemical cross-linking mechanism. Information concerning the material(s) used shall be included with the qualification design data to the qualifying activity. 3.4 Performance characteristics. Performance characteristics shall be as specified in tables 1, Tf, and WI. 3.5 Marking. The marking specified in MIL-S-19500 shall be placed on either the unit package or holding strip of the device. 3.5.1 Polarity. The polarity marking shall be indicated with a green dot or color band on the cathode end of the device. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection shall be in accordance with MIL-S-19500, and as specified herein. . 4.2 Qualification inspection. Qualification inspection shall consist of the examinations and tests specified in tables I, I, and IT. 4.3 Quality conformance inspection. Quality conformance inspection shall consist of groups A, B, and C,. 4.4 Group Ainspection. Group A inspection shall consist of the examinations and tests specified in table I. 4.5 Group Binspection. Group B inspection shall consist of the examinations and tests specified in table IT. 4.6 Group C inspection. Group C inspection shall consist of the examinations and tests specified in table III and shall be conducted on the initial lot and thereafter every six months during production. 4.7 Methods of examination and test. Methods of examination and test shall be as specified in tables I, II, and DI and as follows: 4.7.1 Pulse measurement. Pulse measurement shall be in accordance with section 4 of MIL-STD- 750. 4.7.2 Thermal shock (temperature cycling). The semiconductor diode shall be maintained at each extreme temperature until thermal equilibrium is reached, but not less than 15 minutes. No longer than 15 minutes shall transpire during changeover from one extreme temperature to other extreme temperature. This test may be started at any point in the cycle.MIL SPECS Ic oooo1es oooas37 4 i MIL-S-19500/195D BODY DIMENSIONS N INCHES MILLIMETERS | T LTR MIN MAX | MIN MA X A 100 2.54 B | .430 10.92 C (45 1.14 D | 018 022 46 56 E ; .003 005 -08 13 NOTE: 1, Metric equivalents (to the nearest .01 mm) are given for general information only and are based upon 1 inch = 25.4 mm. FIGURE 1. Semiconductor device, diode, type 1N3206.MIL-S-19500/195D MIL SPECS icf Ooo0125 0002534 & [ 4.7.3 Terminal strength (lead fatigue). A 3/32-inch thick flat spacer shall be placed between the diode body and the bend during this test. 4.7.4 Steady-state operation life. This test shall be conducted with a half-sine wave of the speci- fied peak voltage impressed across the diode in the reverse direction followed by a half-sine wave of the specified average rectified current. The forward conduction angle of the rectified current shall not be greater than 180 nor less than 150; and the power shall be equal to or greater than that of a half-sine wave. : 4.7.4.1 There shall bea spacing of 0. 4-inch minimum between the clips holding the diodes on the life-test rack, with the diode body centrally located between the clips. 4.7.4.2 The end-point tests shall be made at 340, 670, and 1, 000 hours. 4.7.5 Mechanical damage resulting from tests. Except for inherently deforming, multilating, or dismembering mechanical-stress tests to which samples are subjected, there shall be no evidence of mechanical damage to any sample as a result of any of the group A, B, or C tests. 4.8 Inspection of preparation for delivery (see 5). Sample items and packs shall be selected and inspected in accordance with MIL-S-19491. (Particular attention should be given to the preservation and packaging, level A, nonhermetically sealed requirements. ) TABLE I. Group A inspection MIL-~STD-~750 Limits Examination or test LTPD Method Details Symbol Min Max Unit Subgroup 1 5 Visual and mechanical 2071 --- --- cee [ --- examination : Subgroup 2 5 Forward voltage (see 4. 7. 1) 4011 ig = 10 ma(pk) (pulsed) VE --- 1.0 | v(pk) Forward voltage (see 4.7. 1) 4011 ig = 50 ma(pk) (pulsed) VE =<. 2.0 | v(pk) Reverse current 4016 DC method; Vp = 20 Vdc IR --- {0.025 | pAde Reverse current 4016 DC method; Vp = 80 Vde IR =e: 0.5 | pAdc Reverse recovery time 4031 Test condition B; try --- 4.0 | nsec - Ip = Ip = 10 mAdc; VR = 6 Vdc; ip, = 1.0 mA; Ry, = 100 ohms +5%; C = Spf Capacitance 4001 | Vp = 0; Vgig = 50 mv(p-p), Cc --- | 2.0] pe . max; f= 1 Z Reverse current at peak 4016 AC method; vy = 100 v(pk) iy aa- 100 | ya(pk) reverse voltage Reverse current * 4016 =| DC method; T, = 150C; IR ~-- 30 | pAdc VR = 20 Vdc. y L Sf 4MIL SPECS Ic 0000125 0002539 4 i MIL-S-19500/195D TABLE II. Group B inspection _ MIL-STD-750 Limits Examination or test LTPD Method Details Symbot Min Max Unit Subgroup 1 10 Physical dimensions 2066 (See figure 1) --- --- --- --- Subgroup 2 10 Solderability 2026 --- --- --- --- Thermal shock (temperature 1051 Test condition C2; _ --- --- wee cycling) (see 4.7, 2) 50 cycles Thermal shock (glass strain) | 1056 | Test condition B; w-- [| --- | --- | --- T(high) = +200C T(low) = -65C Terminal strength (tension) 2036 Test condition A; --- --- --~ a weight = 16 oz; t= 15 +3 sec Moisture resistance 1021 No initial conditioning --- wee oo- --- End points: Forward voltage (see 4.7.1)! 4011 ig = 10 ma(pk) (pulsed) VE --- 1.0 v(pk) Reverse current 4016 DC method; VR = 80 Vdc IR --- 0.5 pAdc Capacitance 4001 VR = 0; Vgie = 5 mv(p-p), Cc --- 2.0 | pf max;f=1 Zz Subgroup 3 10 Shock 2016 | Nonoperating; 1, 500 G; ene fo wee | nee fF oee tp = 0.5 msec; 3 blows each in orientations: Xj, Yj, (total - 6 blows) . Vibration, variable frequency! 2056 Nonoperating; --- --- --- --- orientations Xj, Y; Constant acceleration 2006 | Nonoperating; 20, 000 G; wee | --- J --- | one orientations Xj, Yy End points: (Same as subgroup 2) Subgroup 4 10 Terminal strength (lead 2036 Test condition E; w~n- --- --- --- fatigue) (see 4.7. 3) weight = 4 oz End points: (Same as subgroup 2) Subgroup 5 10 Salt spray (corrosion) 1046 Test condition B --- --- --- --- End points: (Same as subgroup 2)1ff ooo0125 oooasyo y i MIL SPECS MIL-S-19500/195D TABLE 1]. Group B inspection - Continued MIL-STD-750 Limits Examinotion or test Te ~ Totes 7 vom oa 7 LTPD pam ep Method Details Symbol Min Max Unit Subgroup 6 10 Surge current 4086 Ten 1/120-sec surges at aoe woe o-- 1 mirute intervals; ig(surge) = 500 ma; I, = 50 mAde End points: (Same as subgroup 2) Subgroup 7 Az5 High-temperature life 1031 Ta = +200C wee --- --- woe (nonoperating) End points: (Same as subgroup 2) Subgroup 8 A=5 Steady-state operation life 1026 vy = 60 vipk); --- --+ --- --- (see 4. 7.4) Ip = 50 mAde; f = 60 Hz End points: (Same as subgroup 2) TABLE I. Group C inspection MIL-STD-750 Limits Examination or test LTPD Method Details Symbol! Min Mox Unit 10 Subgroup 1 1001 Pressure = 8 mm Hg, min Barometric pressure reduced (altitude operation) pAdc 0.5 DC method; VR = 80 Vae; Measurement during test: 4016 t = 60 sec Reverse current 10 1021 Omit initial conditioning 50 cycles Subgroup 2 Moisture resistance End points: (Same as subgroup 2 group B inspection)Wh ke "Ww" eee Ne MIL SPECS Ic ctio IC TABLET. Group pinepection__ qggoues 0002541 b MIL-STD-750 Limits Exominotion or test - LTPD thethod Details Symbo! Min Mox Unit Subgroup 1 10 Physical dimensions 2066 (See figure 1) --- --- coe --- Subgroup 2 10 Solderability 2026 =o- --- wer --- Thermal shock (temperature 1051 Test condition C2; o-- oo wee --- cycling) (see 4.7. 2) 50 cycles Thermal shock (glass strain) 1056 Test condition B; --- --- --- --- T(high) = +200C T(low) = -65C Terminal strength (tension) 2036 Test condition A; -e- --- --- -e- weight = 16 0z; t= 15 +3 sec Moisture resistance 1021 No initial conditioning wee --- --- eee End points: -~ Forward voltage (see 4.7.1)} 4011 i = 10 ma(pk) (pulsed) vf wee 1.0 v(pk) Reverse current 4016 DC method; VR = 80 Vdc IR --- 0.5 pAdc Capacitance 4001 VR = 0; Veig = 5 mv(p-p), Cc --- 2.0 pf max; {= 1 A Subgroup 3 10 Shock 2016 Nonoperating; 1, 500 G; wee --- --- wee tp = 0.5 msec; 3 blows each in orientations: Xj, Yj, (total - 6 blows) . Vibration, variable frequency| 2056 Nonoperating; wee --- we orientations Xj, XY, Constant acceleration 2006 Nonoperating; 20, 000 G; --- wee --- --- orientations Xj, Yy End points: (Same as subgroup 2) Subgroup 4 10 Terminal strength (lead 2036 Test condition E; ; oe --- --- --- fatigue) (see 4.7. 3) weight = 4 oz End points: (Same as subgroup 2) Subgroup 5 10 Salt spray (corrosion) 1046 Test condition B wen --- --- --- End points: (Same as subgroup 2). . ion - Continued MIL SPECS TC TAREE te sroup 2 anapection = Continued | aqgga5 Gooashe 8 i. MIL-STD-~750 Limits Examination ot test . - 7 Tt = 7 4 LTPD fo py Method Details Symbol Min Mox Unit Subgroup 6 10 Surge current 4066 Ten 1/120-sec surges at --- wee ++ o-- 1 mirate intervals; ig(surge) = 500 ma; I, = 50 mAdc End points: (Same as subgroup 2) Subgroup 7 A=5 High-temperature life 1031 | Ta = +200C wee [nee [ene | --- (nonoperating) - End points: (Same as subgroup 2) Subgroup 8 A=5 Steady-state operation life 1026 Vy = 60 vipk); --- --- --- (see 4.7.4) I, = 50 mAdc; f = 60 Hz End points: (Same as subgroup 2) TABLE II. Group C inspection MIL-~STD-750 Limits Exomination or test LTPD Method Details Symbol Min Max Unit Subgroup 1 10 Barometric pressure 1001 Pressure = 8 mm Hg, min --- wee --- --- reduced (altitude operation) Measurement during test: 4016 DC method; VR = 80 Vde; Ip --- 0.5 pAdc t = 60 sec 10 Reverse current Subgroup 2 1021 Omit initial conditioning 50 cycles Moisture resistance End points: (Same as subgroup 2 group B inspection)MIL-S-19500/195D MIL SPECS Tc Gooo12s oooesya + I 5. PREPARATION FOR DELIVERY 5.1 Preparation for delivery. Preparation for delivery shall be in accordance with MIL-S-19500. 6. NOTES 6.1 Notes. The notes specified in MIL-S-19500 are applicable to this specification. 6.2 Deletedtype. Type 1N4373 has been deleted from this specification. (EIA lists type 1N4373.) 6.3 Changes from previous issue. Asterisks are not used in this revision to identify changes with respect to the previous issue, due to the extensiveness of the changes, Custodians: Preparing activity: Army - EL Army - EL Navy - EC Air Force - 11 Agent: DSA - ES Review activities: Army - MU (Project 5961-0138) Navy - SH Air Force - 11, 17, 85 DSA - ES User activities: Army - MI, SM Navy - AS, OS, MC, CG Air Force - 13, 15, 19, 70, 80