¡ Semiconductor MSM6660-01,02,03
1/18
GENERAL DESCRIPTION
The MSM6660 is a dynamic display LCD driver, equipped with a function that can switch
between 1/2 and 1/3 duty. The MSM6660 can directly drive LCDs with up to 124 or 186
segments, depending on whether 1/2 or 1/3 duty is selected.
The MSM6660’s on-board display synchronization circuit allows display in a multi-chip
configuration.
FEATURES
• Power supply voltage : 4 to 6 V (for both logic and LCD driver)
• Operating temperature : –40˚C to +85˚C
• Applicable LCD duty : 1/2 (1/2 bias), 1/3 (1/3 bias)
• Common output : 2 (1/2 duty), 3 (1/3 duty)
• Segment output : 62
• Serial transfer clock rate : 2 MHz Maximum
On-board display synchronization circuit which enables display in a multi-chip configuration.
• CE, DATA, and CK are provided for microcomputer interface.
• Handling of display data segments in three blocks enables efficient data transfer.
• Equipped with display-blanking input and display segment test input functions.
• A built-in voltage dividing resistor for bias voltage generation.
- 01: No internal resistance
- 02: 1 k internal resistance
- 03: 30 k internal resistance
• A built-in RC oscillation circuit which uses an external RC.
• Package options:
80-pin plastic QFP (QFP80-P-1420-0.80-K) (Product name: MSM6660-01GS-K)
(Product name: MSM6660-02GS-K)
(Product name: MSM6660-03GS-K)
80-pin plastic QFP (QFP80-P-1420-0.80-BK) (Product name: MSM6660-01GS-BK)
(Product name: MSM6660-02GS-BK)
(Product name: MSM6660-03GS-BK)
¡ Semiconductor
MSM6660-01,02,03
1/2, 1/3 DUTY LCD DRIVER WITH 3-DOT COMMON DRIVER AND 62-DOT SEGMENT
DRIVER
E2B0011-27-Y3
This version: Nov. 1997
Previous version: Mar. 1996
¡ Semiconductor MSM6660-01,02,03
2/18
BLOCK DIAGRAM
62-BIT OUTPUT DRIVER
62-SEGMENT DATA SELECTOR
186-BIT DATA LATCH
72-BIT SHIFT REGISTER
BL
V
DD
GND
CE
DATA
CK
OSC
SEL
LT
SEG0 SEG61
COM1
COM2
COM3
COMOUT
Oscillation
circuit
1/4 1/2 or 1/3
Synchronization circuit
Timing
generation
circuit
2/3 V
LC1
SYNC V
LC2
V
LC3
¡ Semiconductor MSM6660-01,02,03
3/18
PIN CONFIGURATION (TOP VIEW)
SEG40
41
SEG41
42
SEG42
43
SEG43
44
SEG44
45
SEG45
46
SEG46
47
SEG47
48
SEG48
49
SEG49
50
SEG50
51
SEG51
52
SEG52
53
SEG53
54
SEG54
55
SEG55
56
SEG56
57
SEG57
58
SEG58
59
SEG59
60
SEG60
61
SEG61
62
COMOUT
63
SYNC
64
SEG39 40
SEG38 39
SEG37 38
SEG36 37
SEG35 36
SEG34 35
SEG33 34
SEG32 33
SEG31 32
SEG30 31
SEG29 30
SEG28 29
SEG27 28
SEG26 27
SEG25 26
SEG24 25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
SEG23
SEG22
SEG21
SEG20
SEG19
SEG18
SEG17
SEG16
SEG15
SEG14
SEG13
SEG12
SEG11
SEG10
SEG9
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
SEG1
SEG0
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
CE
DATA
CK
OSC
SEL
2/3
LT
BL
VDD
VLC1
VLC2
VLC3
GND
COM1
COM2
COM3
80-Pin Plastic QFP
¡ Semiconductor MSM6660-01,02,03
4/18
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
Oscillation Circuit
Parameter
Oscillation Resistance
Symbol Condition Max.
20
Typ.Min.
kW
100 120
Unit
R
O
Oscillation Capacitance 0.0047 mF
0.01 0.047C
O
Oscillation Frequency kHz
1.4 f
OSC
COMOUT Frequency Hz
350 f
COM
Parameter Symbol Condition Rating Unit
Supply Voltage
Input Voltage
Power Dissipation
V
DD
V
IN
P
D
T
STG
Ta=25°C
Ta=25°C
–0.3 to +7
300
–0.3 to V
DD
+0.3
V
V
mW
Ta=85°C
°CStorage Temperature –55 to +150
Parameter Symbol Condition Range Unit
Supply Voltage
"H" Input Voltage
"L" Input Voltage
VDD
VIH
VIL
fCK
Top
4 to 6
0 to VDD ¥ 0.3
VDD ¥ 0.7 to VDD
V
V
V
MHz
Shift Frequency 0.1 to 2
°C
Operating Temperature
–40 to +85
¡ Semiconductor MSM6660-01,02,03
5/18
ELECTRICAL CHARACTERISTICS
DC Characteristics
"H" Input Voltage1
Hysteresis Width
V
DD
¥ 0.7
0.8
V
V
IH
= V
DD
V
Common Output
ON Resistance
Supply Current
V
IL1
V
HS *2
V
DD
= 5V, I
O
= –0.5mA
Segment Output
ON Resistance
Parameter Condition Max.Typ.Min. Unit
(V
DD
= 5V±20%, Ta = –40 to +85°C)
Symbol
"L" Input Voltage1
*1
V
DD
¥ 0.3—V
*1
V
IH1
"H" Input Voltage2 V
DD
¥ 0.85 V
V
IL2
"L" Input Voltage2
*12
0.4—V
*12
V
IH2
–1 1mA
–1 1mA
–15 –50 –100 mA
–1 1mA
3.5 V
——
0.4 V
——1
kW
——3
kW
——3
kW
——3
kW
——1
kW
——3
kW
——3
kW
——3
kW
0.3 1.0 mA
"H" Input Current I
IH
"L" Input Current 1 I
IL1
"L" Input Current 2 I
IL2
Leakage Current I
Z
"H" Output Voltage V
OH
"L" Output Voltage V
OL
R
ONDP
R
ONV1
R
ONV2
R
ONV3
R
ONDP
R
ONV1
R
ONV2
R
ONV3
I
DD
V
IL
= GND
V
LC1
= 3.33V, I
O
= ±0.5mA
V
DD
= 5V, V
IL
= GND
V
LC2
= 1.67V, I
O
= ±0.5mA
V
I
= V
DD
or GND
V
LC3
= 0.0V, I
O
= 0.5mA
V
DD
= 4V, I
OH
= –0.4mA
V
DD
= 5V, I
O
= –0.5mA
V
DD
= 4V, I
OH
= 0.4mA
V
LC1
= 3.33V, I
O
= ±0.5m
V
LC2
= 1.67V, I
O
= ±0.5mA
V
LC3
= 0.0V, I
O
= 0.5mA
f
OSC
= 1.4kHz, no load, CK=DC
*3
*4
*5
*6
*7
*7
*8,*11
*8,*11
*8,*11
*8,*11
*9,*11
*9,*11
*9,*11
*9,*11
*10
*1 Applicable to all input pins except OSC pin on the master side.
*2 Applicable to CE, CK, and DATA input.
*3 Applicable to CE, CK, DATA, SEL, 2/3, BL, and LT.
*4 Applicable to CE, CK, DATA, SEL, and 2/3.
*5 Applicable to BL and LT input.
*6 Applicable to SYNC.
*7 Applicable to SYNC and COMOUT.
*8 Applicable to SEG0 - SEG61.
*9 Applicable to COM1 - COM3.
*10 If a voltage-dividing resistor for bias voltage generation is included (- 02 and - 03), the value
does not include the current that flows through the resistor.
*11 If a voltage-dividing resistor for bias voltage generation is included (- 02 and - 03), the output
ON resistance value depends on the built-in dividing resistor.
*12 Applicable to the OSC pin on the master side.
¡ Semiconductor MSM6660-01,02,03
6/18
Voltage-dividing resistor for bias voltage generation
tDS
tS
tDS
tS
tCKW
tH
1/fCK
tH
tHtCEW
CE
DATA
CK
COMOUT
SYNC
AC Characteristics
V
LC1
R
LCD
V
LC2
R
LCD
V
LC3
R
LCD
V
DD
Code Name
-02
-03
Condition Max.
0.6
10
Typ.Min.
1
30
1.4
100
Unit
Ta = –40 to +85°C
Ta = –40 to +85°C
kW
kW
Symbol
R
LCD
R
LCD
Parameter
Maximum Clock Frequency
Symbol Condition Max.
2
Typ.Min.
Unit
f
CK
(V
DD
= 5V ± 20%, Ta = –40 to +85°C)
MHz
Clock Pulse Width 200
t
CKW
—ns
Data Set-up Time 200
t
S
—ns
Data Hold Time 200
t
H
—ns
CE Pulse Width 200
t
CEW
—ns
COMOUT-SYNC Delay Time 40
t
DS
C
L
=50pF ns
Oscillation Frequency 1.4 50
f
OSC
OSC Pin Operating Frequency
kHz
¡ Semiconductor MSM6660-01,02,03
7/18
FUNCTIONAL DESCRIPTION
Pin Functional Description
OSC (pin 68)
When the master mode is selected, connect an external resistor and capacitor for the RC
oscillation circuit to this pin. When the slave mode is selected, this pin becomes the input pin
for an external clock signal.
The relationship of oscillation frequency to external CO and RO, when the master mode is
selected, is shown below.
fOSC =
1
0.69¥R
O
¥C
O
(Ta = 25˚C)
Example: When CO = 0.01µF and RO = 100 k , the oscillation frequency, fOSC, is approximately
1.4 kHz.
CE (pin 65)
This is a chip select input pin. Input data is valid only when this pin is set to "H". Data that
is input into the 72-stage shift register synchronously with the rising edge of CK will be
latched with the falling edge of this pin, and the display will be updated. A Schmitt trigger
is built into the input area.
DATA (pin 66)
This is a data input pin. Data input is valid only when the CE pin is set to "H". The 72-stage
shift register contents are latched with the falling edge of this pin, and the display will be
updated. A Schmitt trigger is built into the input area.
CK (pin 67)
This is a serial data shift lock input pin. Data is input synchronously with the rising edge of
the shift clock. A Schmitt trigger is built into the input area. Data can be latched even if the
shift clock is stopped, since a static shift register is used.
SEL (pin 69)
This is an input pin used to switch between the master and the slave modes when a multi-chip
configuration is used. Set this pin to "H" to select the master mode, and to "L" to select the slave
mode.
SYNC (pin 64)
When the master mode is selected, this pin becomes an output pin for synchronous signals.
When the slave mode is selected, this pin becomes an input pin for synchronous signals.
CO
SEL
OSC
RO
VDD
¡ Semiconductor MSM6660-01,02,03
8/18
2/3 (pin 70)
This pin is used to switch between 1/2 and 1/3 duty.
Set this pin to "H" to select 1/2 duty, and to "L" to select 1/3 duty.
COMOUT (pin 63)
This is an output pin for clock synchronization. A frequency equal to fOSC/4 is output from
this pin.
•V
LC1 (pin 74), VLC2 (pin 75) and VLC3 (pin 76)
When the code is -01, these pins are used as input pins for LCD bias voltage. The VLC3 pin
should be connected with GND. The settings for these pins should be as follows:
VDD VLC1 VLC2 VLC3 = GND
When the code is -02 or -03, VLC1 and VLC2 pins should be left open, and VLC3 pin connected
with GND since a voltage-dividing resistor for bias voltage generation has been built in.
(However, when the code setting is -02 or -03, and if 1/2 duty is selected, VLC1 and VLC2
should be externally shorted.)
COM1-COM3 (pins 78 to 80)
These are common signal output pins for driving the LCD. In the 1/2 duty mode, leave the
COM3 pin open.
SEG0-SEG61 (pins 1 to 62)
These are segment signal output pins for driving the LCD. 1/2 or 1/3 duty can be selected
using the 2/3 pin, and 1/2 or 1/3 bias can be selected using pins VLC1 through VLC3.
LT (pin 71)
This is an input pin for controlling the display on the LCD. If this pin is set to "L", all segments
will be turned on. A pull-up resistor is included.
BL (pin 72)
This is an input pin for controlling the display on the LCD. If this pin is set to "L", all segments
will be turned off. A pull-up resistor is included.
¡ Semiconductor MSM6660-01,02,03
9/18
Data Input
Display data should be input according to the timing diagram below.
* Display Data
* Address Data
The most significant 3 bits (the last 3 bits) contain the address data.
Address data: "100" — SEG0 - SEG20
"010" — SEG21 - SEG41
"001" — SEG42 - SEG61
Since the last 3 bits correspond to each group of segments, if the address is "110", SEG0 - SEG20
and SEG21 - SEG41 are all updated at a time in accordance with the data.
CE
CK
DATA
Display
LSB MSB
D
n
D
n-1
D
3
D
n-2
D
2
D
1
D
0
Old New
Duty Mode 2/3 Pin Data Length COM Data
1/2 Duty
1/3 Duty
H48-Bit (D0 - D47) ¥ 3
COM1: D0, D2.....D0+2n
COM2: D1, D3.....D1+2n
n = 0 - 61
COM1: D0, D3.....D0+3n
COM2: D1, D4.....D1+3n
COM2: D2, D5.....D2+3n
n = 0 - 61
72-Bit (D0 - D71) ¥ 3L
¡ Semiconductor MSM6660-01,02,03
10/18
1) Data format when 1/2 duty (124 segments) is selected.
S0
C1
D0
S0
C2
D1
S1
C1
D2
S1
C2
D3 D4
S2
C2
D5
S19
C2
D39
S20
C1
D40
S20
C2
D41
1
D45
0
D46
0
D47D42- D44
S21
C1
D0
S21
C2
D1
S22
C1
D2
S22
C2
D3
S23
C1
D4
S23
C2
D5
S40
C2
D39
S41
C1
D40
S41
C2
D41
0
D45
1
D46
0
D47D42- D44
S42
C1
D0
S42
C2
D1
S43
C1
D2
S43
C2
D3 D4
S60
C2
D37
S61
C1
D38
S61
C2
D39
0
D45
0
D46
1
D47D40- D44
S2
C1
D42 - D44 are Dummy Data
D42 - D44 are Dummy Data
D40 - D44 are Dummy Data
2) Data format when 1/3 duty (186 segments) is selected.
D60 D61 D62 D69 D70 D71D63- D68
S0
C1
D0
S0
C2
D1
S0
C3
D2
S1
C1
D3
S1
C2
D4
S1
C3
D5
S20
C1
S20
C2
S20
C3 1 0 0
D60 D61 D62 D69 D70 D71D63- D68
S21
C1
D0
S21
C2
D1
S21
C3
D2
S22
C1
D3
S22
C2
D4
S22
C3
D5
S41
C1
S41
C2
S41
C3 0 1 0
S42
C1
D0
S42
C2
D1
S42
C3
D2
S43
C1
D3 D4
S61
C1
D57
S61
C2
D58
S61
C3
D59
0
D69
0
D70
1
D71D60- D68
D63 - D68 are Dummy Data
D63 - D68 are Dummy Data
D60 - D68 are Dummy Data
¡ Semiconductor MSM6660-01,02,03
11/18
LCD Display Timing
1) 1/2 duty mode (2/3 = "H")
Off
V
DD
V
LC1,2
V
LC3
COM1
V
DD
GND
COMOUT
SYNC V
DD
GND
V
DD
V
LC1,2
V
LC3
COM2
V
DD
V
LC1,2
V
LC3
SEGn
On OffOn OffOn OffOn OffOn OffOn On
Note: When 1/2 duty is selected and 1/2 bias is used, perform the following:
- When the code is -01, short VLC1 and VLC2, and supply the bias voltage.
- When the code is -02 or -03, externally short VLC1 and VLC2.
¡ Semiconductor MSM6660-01,02,03
12/18
2) 1/3 duty mode (2/3 = "L")
Off
V
DD
V
LC1
V
LC2
V
LC3
SEGn
V
DD
V
LC1
V
LC2
V
LC3
COM3
V
DD
V
LC1
V
LC2
V
LC3
COM2
V
DD
V
LC1
V
LC2
V
LC3
COM
V
DD
GND
COMOUT
SYNC
On Off Off On On OnOff Off Off Off Off
V
DD
GND
¡ Semiconductor MSM6660-01,02,03
13/18
Pin Functions in a Multi-chip Configuration
When MSM6660 ICs are used in a multi-chip configuration, one of them is used in the master
mode to generate the common frequency and the synchronization signal. These signals are then
received by the slave mode ICs to enable synchronous operation.
LCD Bias Voltage Application Method
1) For 1/2 bias (when 1/2 duty is selected)
R
LCD
R
LCD
V
DD
V
LC1
V
LC2
V
LC3
Note: The above case is for code -01. When the code is -02 or -03, an external voltage-dividing
resistor is not needed, because it is already built into the type signified by these
settings. However, pins VLC1 and VLC2 must be shorted externally.
2) For 1/3 bias (when 1/3 duty is selected)
R
LCD
R
LCD
V
DD
V
LC1
V
LC2
V
LC3
R
LCD
Note: The above case is for the code -01. When the code is -02 or -03, an external voltage-
dividing resistor is not needed, because it is already built into the type signified by
these settings. Leave VLC1 through VLC3 open.
Symbol Pin Master Mode LSI Slave Mode LSI
COMOUT
SYNC
OSC
63 Connect to Slave IC OSC
Connect to Slave IC SYNC
Open (Unused)
Connect to Master IC COMOUT
Connect to Master IC SYNC
Connect an external resistor and capacitor
SEL
64
68
69 "L" (GND) level"H" (V
DD
) level
¡ Semiconductor MSM6660-01,02,03
14/18
Method of Reducing the Transfer Time When Unused Segments Exist
When unused segments exist, it is not required to transfer the data of unused segments. This
allows the data transfer time to be reduced. However, the last 3 bits are address data.
D0
S2
C2
D1
S19
C2
D35
S20
C1
D36
S20
C2
D37
1
D41
0
D42
0
D43D38- D40
S2
C1
Unused segment data reduced D38 - D40 are dummy data
When SEG0 and 1 are not used, the data can be reduced from the original 48 bits to 44 bits.
¡ Semiconductor MSM6660-01,02,03
15/18
APPLICATION CIRCUIT
For 1/3 duty, 1/3 bias (when the code setting is -01)
R
LCD
R
LCD
R
LCD
Ro Co
V
LC1
V
LC2
V
LC3
OSC
SEL
COM1
COM2
COM3
COMOUT
SYNC
BL
CK
DATA
CE
SEG0 - SEG61
V
LC1
V
LC2
V
LC3
OSC
SEL
COM1
COM2
COM3
COMOUT
SYNC
BL
CK
DATA
CE
SEG0 - SEG61
BL
CK
DATA
CE1
CE2
LCD PANEL
MSM6660
(Master Mode)
MSM6660
(Slave Mode)
¡ Semiconductor MSM6660-01,02,03
16/18
REFERENCE DATA
fCOM vs. RO, CO
fOSC vs. VDD
040 60 80 100 120 140
1
fCOM (kHz)
3
4
160
0.0022
0.0047
0.01
0.022
V
DD
= 5V, Ta = Room Temp.
Capacitance C
O
(mF)
2
Resistance RO (kW)
1.2 234567
1.3
f
OSC
(kHz)
1.5
1.6
8
Ta = Room Temp.
R
O
= 100kW, C
O
= 0.01mF
1.4
V
DD
(V)
¡ Semiconductor MSM6660-01,02,03
17/18
(Unit : mm)
PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.27 TYP.
QFP80-P-1420-0.80-K
Mirror finish
¡ Semiconductor MSM6660-01,02,03
18/18
(Unit : mm)
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
QFP80-P-1420-0.80-BK
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.27 TYP.
Mirror finish