1. Product profile
1.1 General description
Planar Schottky barrier single diode with an integrated guard ring for stress protection,
encapsulated in a SOD123F small and flat lead SMD plastic package.
1.2 Features
■Low forward voltage
■Small and flat lead SMD plastic package
■Low capacitance
■Flat leads: excellent coplanarity and improved thermal behavior
1.3 Applications
■Ultra high-speed switching
■Voltage clamping
■Line termination
■Inverse-polarity protection
1.4 Quick reference data
[1] Pulse test: tp≤300 µs; δ≤0.02.
2. Pinning information
[1] The marking bar indicates the cathode.
BAT54H
Schottky barrier single diode in small SOD123F package
Rev. 01 — 7 April 2005 Product data sheet
Table 1: Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
IFforward current - - 200 mA
VRreverse voltage - - 30 V
VFforward voltage IF=10mA [1] - - 400 mV
Table 2: Pinning
Pin Description Simplified outline Symbol
1 cathode [1]
2 anode 21
sym001
12
9397 750 14919 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 7 April 2005 2 of 8
Philips Semiconductors BAT54H
Schottky barrier single diode in SOD123F package
3. Ordering information
4. Marking
5. Limiting values
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Soldering point of cathode tab.
Table 3: Ordering information
Type number Package
Name Description Version
BAT54H - plastic surface mounted package; 2 leads SOD123F
Table 4: Marking codes
Type number Marking code
BAT54H AG
Table 5: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VRreverse voltage - 30 V
IFforward current - 200 mA
IFRM repetitive peak forward
current tp≤1s;δ≤0.5 - 300 mA
IFSM non-repetitive peak forward
current tp≤10 ms - 600 mA
Ptot total power dissipation Tamb ≤25 °C[1] - 375 mW
Tjjunction temperature - 125 °C
Tamb ambient temperature −65 +125 °C
Tstg storage temperature −65 +150 °C
Table 6: Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistancefromjunctionto
ambient in free air [1] [2] - - 330 K/W
Rth(j-sp) thermal resistancefrom junctionto
solder point [3] - - 70 K/W
9397 750 14919 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 7 April 2005 3 of 8
Philips Semiconductors BAT54H
Schottky barrier single diode in SOD123F package
7. Characteristics
[1] Pulse test: tp≤300 µs; δ≤0.02.
Table 7: Characteristics
T
amb
= 25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VFforward voltage IF= 0.1 mA [1] - - 240 mV
IF=1mA [1] - - 320 mV
IF=10mA [1] - - 400 mV
IF=30mA [1] - - 500 mV
IF= 100 mA [1] - - 800 mV
IRreverse current VR=25V - - 2 µA
Cddiode capacitance VR=1V; f=1MHz - - 10 pF
9397 750 14919 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 7 April 2005 4 of 8
Philips Semiconductors BAT54H
Schottky barrier single diode in SOD123F package
(1) Tamb = 125 °C
(2) Tamb =85°C
(3) Tamb =25°C
(1) Tamb = 125 °C
(2) Tamb =85°C
(3) Tamb =25°C
Fig 1. Forward current as a function of forward
voltage; typical values Fig 2. Reverse current as a function of reverse
voltage; typical values
Tamb =25°C; f = 1 MHz
Fig 3. Diode capacitance as a function of reverse voltage; typical values
103
102
10−1
IF
(mA)
VF (V)
10
1
1.20.80.40
msa892
(3)(2)(1)
(3)(2)(1)
0102030
VR (V)
103
102
10−1
IR
(µA)
10
1
(1)
(2)
(3)
msa893
0102030
0
5
10
15
VR (V)
Cd
(pF)
msa891
9397 750 14919 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 7 April 2005 5 of 8
Philips Semiconductors BAT54H
Schottky barrier single diode in SOD123F package
8. Package outline
9. Packing information
[1] For further information and the availability of packing methods, see Section 15.
10. Soldering
Fig 4. Package outline SOD123F
04-11-29Dimensions in mm
1.2
1.0
0.25
0.10
3.6
3.4 2.7
2.5
0.55
0.35
0.70
0.55
1.7
1.5
1
2
Table 8: Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
3000 10000
BAT54H SOD123F 4 mm pitch, 8 mm tape and reel -115 -135
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 5. Reflow soldering footprint SOD123F
1.6
1.6
2.9
4
4.4
1.1 1.22.1
1.1
(2×)
solder lands
solder resist
occupied area
solder paste
9397 750 14919 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 7 April 2005 6 of 8
Philips Semiconductors BAT54H
Schottky barrier single diode in SOD123F package
11. Revision history
Table 9: Revision history
Document ID Release date Data sheet status Change notice Doc. number Supersedes
BAT54H_1 20050407 Product data sheet - 9397 750 14919 -
Philips Semiconductors BAT54H
Schottky barrier single diode in SOD123F package
9397 750 14919 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 7 April 2005 7 of 8
12. Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
13. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
14. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
15. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Level Data sheet status[1] Product status[2] [3] Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights. Date of release: 7 April 2005
Document number: 9397 750 14919
Published in The Netherlands
Philips Semiconductors BAT54H
Schottky barrier single diode in SOD123F package
16. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 2
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
9 Packing information. . . . . . . . . . . . . . . . . . . . . . 5
10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 6
12 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . . 7
13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
14 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
15 Contact information . . . . . . . . . . . . . . . . . . . . . 7
