CPC1019N 60V Normally-Open Single-Pole 4-Pin SOP OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current Load Current, Peak AC Rating 60 750 1 Units VP mA On-Resistance (max) LED Current to operate 0.6 2 Description CPC1019N is a miniature, low-voltage, low on-resistance, single-pole, normally-open (1-Form-A) solid state relay in a small 4-pin SOP package. A Embodying IXYS Integrated Circuits' patented OptoMOS technology, the CPC1019N comprises a highly efficient infrared LED that is optically coupled to efficient MOSFET output switches to provide 1500Vrms of input-to-output isolation. mA Features * * * * * * * * * * * Low On-Resistance: 0.6 Low Drive Current: 2mA High Load Current: 750mA 1500Vrms Input/Output Isolation 100% Solid State Compact 4-Pin SOP Package Arc-Free With No Snubbing Circuits No EMI/RFI Generation Immune to Radiated EM Fields Tape & Reel Version Available Flammability Rating UL 94 V-0 IXYS Integrated Circuits' state of the art double-molded vertical construction packaging produces a very compact solid state relay that is ideal for replacing larger, less-reliable reed and electromechanical relays. Approvals * UL Recognized Component: File E76270 * CSA Certified Component: Certificate 1172007 * EN/IEC 60950-1 Certified Component: Certificate available on our website Applications * Security * Passive Infrared Detectors (PIR) * Data Signalling * Sensor Circuitry * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Utility Meters (gas, oil, electric and water) * Medical Equipment--Patient/Equipment Isolation * Aerospace * Industrial Controls * ATE Ordering Information Part # CPC1019N CPC1019NTR Description 4-Pin SOP (100/tube) 4-Pin SOP (2000/reel) Pin Configuration + Control - Control 1 4 3 2 Load Load Switching Characteristics of Normally-Open Devices Form-A IF 90% 10% ILOAD ton DS-CPC1019N-R05 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC1019N Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Derate linearly 1.33 mW / C 2 Derate linearly 3.33 mW / C Ratings 60 5 50 1 70 400 1500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms C C Typical values are characteristic of the device at +25C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25C Parameter Output Characteristics Load Current Continuous Continuous, AC Peak Peak On-Resistance 1 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 2 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 1 2 2 Conditions Symbol Min Typ Max Units IF=2mA IL ILPK RON ILEAK - 0.35 - 750 1 3 0.6 1 mADC A AP t < 10ms IL=750mA VL=60VP IF=0mA, VL=50V, f=1MHz ton toff COUT - 0.4 0.4 60 3 3 - ms ms pF IL=750mA IF=5mA VR=5V IF IF VF IR 0.1 0.9 - 0.15 0.14 1.2 - 2 1.5 10 mA mA V A VIO=0V, f=1MHz CIO - 1 - pF IF=5mA, VL=10V A Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 4mA is recommended. www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION CPC1019N PERFORMANCE DATA* 25 Device Count (N) 20 15 10 5 20 20 15 10 5 0 0 1.250 1.255 1.260 1.265 LED Forward Voltage (V) 20 15 10 5 0 0.180 0.31 15 10 5 1.2 IF=5mA IF=2mA 1.1 -20 0 20 40 60 Temperature (C) 80 Typical Turn-On Time vs. LED Forward Current (IL=100mA) 0.25 0.20 0.15 0.10 -40 -20 0 20 40 60 Temperature (C) 80 100 75.0 75.5 76.0 76.5 Blocking Voltage (VP) 77.0 Typical Turn-Off Time vs. LED Forward Current (IL=100mA) 0.41 1.5 1.0 0.5 2.0 10 0.40 0.39 0.38 0.37 0.36 0.35 0.34 0 Typical LED Current to Operate vs. Temperature (IL=500mA) 15 74.5 2.0 100 20 0.43 10 20 30 40 LED Forward Current (mA) 0 50 Typical Turn-On Time vs. Temperature (IL=100mA) IF=2mA 1.5 1.0 IF=5mA 0.5 0 -40 -20 0 20 40 60 Temperature (C) 80 100 0.8 Turn-Off Time (ms) 0.30 0.40 0.41 0.42 Turn-Off Time (ms) 0.0 Turn-On Time (ms) 1.0 -40 0.39 Turn-Off Time(ms) 1.3 25 0 0.38 Turn-On Time (ms) 1.4 0.36 5 2.5 IF=50mA IF=20mA IF=10mA 0.33 0.34 0.35 On-Resistance (:) 30 0.585 1.6 0.32 Typical Blocking Voltage Distribution (N=50) 0 1.5 5 35 Typical LED Forward Voltage Drop vs. Temperature LED Forward Voltage (V) 0.120 0.135 0.150 0.165 LED Current (mA) Device Count (N) 20 Device Count (N) Device Count (N) 25 0.385 0.435 0.485 0.535 Turn-On Time (ms) 10 Typical Turn-Off Time Distribution (N=50, IF=5mA, IL=100mA) 25 0.335 15 0 0.105 1.270 Typical Turn-On Time Distribution (N=50, IF=5mA, IL=100mA) LED Current (mA) Typical On-Resistance Distribution (N=50, IF=2mA, IL=0.75A) Device Count (N) 25 Device Count (N) Typical IF for Switch Operation (N=50, IL=100mA) LED Forward Voltage Distribution (N=50, IF=5mA) 10 20 30 40 LED Forward Current (mA) 50 Typical Turn-Off Time vs. Temperature (IL=100mA) 0.7 IF=5mA 0.6 0.5 IF=2mA 0.4 0.3 0.2 -40 -20 0 20 40 60 Temperature (C) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. R05 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1019N PERFORMANCE DATA* Typical Load Current vs. Load Voltage (IF=2mA) 1000 0.70 250 0 -250 -500 -750 0.55 0.50 0.45 0.40 0.35 0.4 79 80 Leakage Current (nA) 78 77 76 75 74 -20 0 20 40 60 Temperature (C) 80 100 0 20 40 60 Temperature (C) 80 600 550 -40 100 Typical Leakage Current vs. Temperature (VL=60V) 3.5 70 -20 0 20 40 60 Temperature (C) 80 100 10s 100s Energy Rating Curve (IF=2mA) 3.0 60 50 40 30 20 2.5 2.0 1.5 1.0 0.5 10 0 -40 650 450 -20 Load Current (A) 0.3 0.25 -40 700 500 0.30 Typical Blocking Voltage vs. Temperature Blocking Voltage (VP) 750 0.60 Load Current (mA) On-Resistance (:) Load Current (mA) 500 73 -40 800 0.65 750 -1000 -0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 Load Voltage (V) Maximum Load Current vs. Temperature (IF=2mA) Typical On-Resistance vs. Temperature (IF=2mA, IL=500mA) -20 0 20 40 60 Temperature (C) 80 100 0 10Ps 100Ps 1ms 10ms 100ms Time 1s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION CPC1019N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1019N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)C or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles CPC1019N 260C 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R05 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1019N MECHANICAL DIMENSIONS CPC1019N 4.089 0.025 (0.161 0.001) Recommended PCB Land Pattern 0.203 0.025 (0.008 0.001) 6.096 0.102 (0.240 0.004) 3.810 0.025 (0.150 0.001) 0.559 0.127 (0.022 0.005) 0.910 0.025 (0.036 0.001) Pin 1 2.54 Typ (0.100 Typ) 2.54 (0.10) Dimensions mm (inches) Package standoff: 0.064 0.040 (0.0025 0.0015) 0.381 0.025 (0.015 0.001) 3.85 (0.152) 1.54 (0.061) 2.030 0.025 (0.080 0.001) 0.481 (0.019) 0-0.1 (0-0.004) 0.60 (0.024) Note: 1. Lead dimensions do not include plating: 1000 microinches max. CPC1019NTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=12.00 (0.472) B0=4.70 (0.185) K0=2.70 (0.106) K1=2.30 (0.091) P1=8.00 (0.315) A0=6.50 (0.256) User Direction of Feed Dimensions mm (inches) Embossed Carrier Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC1019N-R05 (c)Copyright 2018, IXYS Integrated Circuits OptoMOS(R) is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 6/1/2018 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: IXYS: CPC1019NTR