W28F321BB/TB 32MBIT (2MBIT x 16) PAGE MODE DUAL WORK FLASH MEMORY 1. GENERAL DESCRIPTION The W28F321, a 4-Plane Page Mode Dual Work (Simultaneous Read while Erase/Program) Flash memory, is a low power, high density, cost efficiency, nonvolatile read/write storage solution for a wide range of applications. The product can be operated at VDD = 2.7V to 3.6V and VPP = 1.65V to 3.6V or 11.7V to 12.3V. Its low voltage operation capability greatly extends battery life for portable applications. The W28F321 provides high performance asynchronous page mode. It allows code execution directly from Flash, thus eliminating time-consuming wait states. Furthermore, its configurative partitioning architecture allows flexible dual work operation. The memory array block architecture utilizes Enhanced Data Protection features, and provides separate Parameter and Main Blocks that provide maximum flexibility for safe nonvolatile code and data storage. Fast program capability is provided through the use of high speed Page Buffer Program. Special OTP (One Time Program) block provides an area to store permanent code such as a unique number. 2. FEATURES * 32M Density with 16 Bit I/O Interface - 4-Word User-Programmable Area * High-Performance Reads * High Performance Program with Page Buffer - 70/25 nS 8-Word Page Mode * Configurative 4-Plane Dual Work - Flexible Partitioning - Read operations during Block Erase or (Page Buffer) Program - Status Register for Each Partition * Low Power Operation - 16-Word Page Buffer - 5 S/ Word (Typ.) at 12V VPP * Operating Temperature - -40C to +85C * CMOS Process (P-type silicon substrate) * Flexible Blocking Architecture - Eight 4k-word Parameter Blocks - 2.7V Read and Write Operations - Sixty-three 32k-word Main Blocks - VDDQ for Input/Output Power Supply Isolation - Automatic Power Savings Mode Reduces ICCR in Static Mode - Top or Bottom Parameter Location * Enhanced Data Protection Features - Individual Block Lock and Block Lock-Down with Zero-Latency * Enhanced Code + Data Storage - 5 S Typical Erase/Program Suspends - All blocks are locked at power-up or device reset * OTP (One Time Program) Block - Absolute Protection with VPP VPPLK - 4-Word Factory-Programmed Area -1- Publication Release Date: February 17, 2003 Revision A2 W28F321BB/TB - Block Erase, Full Chip Erase, (Page Buffer) Word Program Lockout during Power Transitions * Automated Erase/Program Algorithms - Basic Command Set * Extended Cycling Capability - Minimum 100,000 Block Erase Cycles * Chip-Size Packaging - 3.0V Low-Power 11 S/ Word (Typ.) Programming - 0.75 mm pitch 48-Ball TFBGA(7mm x 7mm) * ETOXTM Flash Technology - 12V No Glue Logic 9 S/ Word (Typ.) Production Programming and 0.5s Erase (Typ.) * No designed or rated as radiation hardened * Cross-Compatible Command Support * ETOX is a trademark of Intel Corporation. - Common Flash Interface (CFI) 3. PIN CONFIGURATION 1 2 A A13 A11 B A14 C D 3 4 5 6 7 8 A8 VPP #WP A19 A7 A4 A10 #WE #RESET A18 A17 A5 A2 A15 A12 A9 NC A20 A6 A3 A1 A16 DQ14 DQ5 DQ11 DQ8 #CE A0 DQ9 DQ0 Vss DQ10 DQ1 #OE DQ2 E VDDQ DQ15 DQ6 DQ12 DQ3 F Vss DQ7 DQ13 DQ4 V DD Figure 1. 0.75 mm pitch TFBGA 48-Ball Pinout -2- 0.75mm pitch 48-Ball TFBGA Pinout 7 x 7 mm TOP VIEW W28F321BB/TB Table 1. Pin Descriptions SYMBOL TYPE A0 - A20 INPUT NAME AND FUNCTION ADDRESS INPUTS: Inputs for addresses. 32M: A0 - A20. DATA INPUT/OUTPUTS: Inputs data and commands during CUI (Command User Interface) write cycles, outputs data during memory array, status register, query code, identifier code and partition configuration register code reads. Data pins float to high impedance (High Z) when the chip or outputs are deselected. Data is internally latched during an erase or program cycle. DQ0 - DQ15 INPUT/ OUTPUT #CE INPUT CHIP ENABLE: Activates the device's control logic, input buffers, decoders and sense amplifiers. #CE-high (VIH) deselects the device and reduces power consumption to standby levels. #RESET INPUT RESET: When low (VIL), #RESET resets internal automation and inhibits write operations, which provides data protection. #RESET-high (VIH) enables normal operation. After power-up or reset mode, the device is automatically set to read array mode. #RESET must be low during power-up/down. #OE INPUT OUTPUT ENABLE: Gates the device's outputs during a read cycle. #WE INPUT WRITE ENABLE: Controls writes to the CUI and array blocks. Addresses and data are latched on the rising edge of #CE or #WE (whichever goes high first). #WP INPUT WRITE PROTECT: When #WP is VIL, locked-down blocks cannot be unlocked. Erase or program operation can be executed to the blocks which are not locked and lockeddown. When #WP is VIH, lock-down is disabled. MONITORING POWER SUPPLY VOLTAGE: VPP is not used for power supply pin. With VPP VPPLK, block erase, full chip erase, (page buffer) program or OTP program cannot be executed and should not be attempted. Applying 12V0.3V to VPP provides fast erasing or fast programming mode. In this mode, VPP is power supply pin. Applying 12V0.3V to VPP during erase/program can only be done for a maximum of 1,000 cycles on each block. VPP may be connected to 12V0.3V for a total of 80 hours maximum. Use of this pin at 12V beyond these limits may reduce block cycling capability or cause permanent damage. VPP INPUT VDD SUPPLY DEVICE POWER SUPPLY (2.7V to 3.6V): With VDD VLKO, all write attempts to the flash memory are inhibited. Device operations at invalid VDD voltage (see DC Characteristics) produce spurious results and should not be attempted. VDDQ SUPPLY INPUT/OUTPUT POWER SUPPLY (2.7V to 3.6V): Power supply for all input/output pins. VSS SUPPLY GROUND: Do not float any ground pins. NC NO CONNECT: Lead is not internally connected; it may be driven or floated. -3- Publication Release Date: February 17, 2003 Revision A2 W28F321BB/TB Table 2. Simultaneous Operation Modes Allowed with Four Planes(1,2) THEN THE MODES ALLOWED IN THE OTHER PARTITION IS: IF ONE PARTITION IS Read Array Read Read Read ID/OTP Status Query Word Program Page Buffer Program OTP Program Full Block Program Chip Erase Suspend Erase Block Erase Suspend Read Array X X X X X X X X X Read ID/OTP X X X X X X X X X Read Status X X X X X X X X Read Query X X X X X X X X Word Program X X X X X Page Buffer Program X X X X X OTP Program Block Erase X X X X X X X Full Chip Erase X X X Program Suspend X X X X Block Erase Suspend X X X X X X X X Notes: 1. "X" denotes the operation available. 2. Configurative Partition Dual Work Restrictions: Status register reflects partition state, not WSM (Write State Machine) state - this allows a status register for each partition. Only one partition can be erased or programmed at a time - no command queuing. Commands must be written to an address within the block targeted by that command. -4- W28F321BB/TB 1FF000h - 1FFFFFh 1FE000h - 1FEFFFh 1FD000h - 1FDFFFh 1FC000h - 1FCFFFh 1FB000h - 1FBFFFh 1FA000h - 1FAFFFh 1F9000h - 1F9FFFh 1F8000h - 1F8FFFh 1F0000h - 1F7FFFh 1E8000h - 1EFFFFh 1E0000h - 1E7FFFh 1D8000h - 1DFFFFh 1D0000h - 1D7FFFh 1C8000h - 1CFFFFh 1C0000h - 1C7FFFh 1B8000h - 1BFFFFh 1B0000h - 1B7FFFh 1A8000h - 1AFFFFh 1A0000h - 1A7FFFh 198000h - 19FFFFh 190000h - 197FFFh 188000h - 18FFFFh 180000h - 187FFFh 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 178000h - 17FFFFh 170000h - 177FFFh 168000h - 16FFFFh 160000h - 167FFFh 158000h - 15FFFFh 150000h - 157FFFh 148000h - 14FFFFh 140000h - 147FFFh 138000h - 13FFFFh 130000h - 137FFFh 128000h - 12FFFFh 120000h - 127FFFh 118000h - 11FFFFh 110000h - 117FFFh 108000h - 10FFFFh 100000h - 107FFFh BLOCK NUMBER ADDRESS RANGE PLANE1 (UNIFORM PLANE) 4K-WORD 4K-WORD 4K-WORD 4K-WORD 4K-WORD 4K-WORD 4K-WORD 4K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 0F8000h - 0FFFFFh 0F0000h - 0F7FFFh 0E8000h - 0EFFFFh 0E0000h - 0E7FFFh 0D8000h - 0DFFFFh 0D0000h - 0D7FFFh 0C8000h - 0CFFFFh 0C0000h - 0C7FFFh 0B8000h - 0BFFFFh 0B0000h - 0B7FFFh 0A8000h - 0AFFFFh 0A0000h - 0A7FFFh 098000h - 09FFFFh 090000h - 097FFFh 088000h - 08FFFFh 080000h - 087FFFh PLANE0 (UNIFORM PLANE) PLANE3 (PARAMETER PLANE) ADDRESS RANGE 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 PLANE2 (UNIFORM PLANE) BLOCK NUMBER 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 078000h - 07FFFFh 070000h - 077FFFh 068000h - 06FFFFh 060000h - 067FFFh 058000h - 05FFFFh 050000h - 057FFFh 048000h - 04FFFFh 040000h - 047FFFh 038000h - 03FFFFh 030000h - 037FFFh 028000h - 02FFFFh 020000h - 027FFFh 018000h - 01FFFFh 010000h - 017FFFh 008000h - 00FFFFh 000000h - 007FFFh Figure 2.1 Top Parameter Memory Map -5- Publication Release Date: February 17, 2003 Revision A2 W28F321BB/TB 1F8000H - 1FFFFFH 1F0000H - 1F7FFFH 1E8000H - 1EFFFFH 1E0000H - 1E7FFFH 1D8000H - 1DFFFFH 1D0000H - 1D7FFFH 1C8000H - 1CFFFFH 1C0000H - 1C7FFFH 1B8000H - 1BFFFFH 1B0000H - 1B7FFFH 1A8000H - 1AFFFFH 1A0000H - 1A7FFFH 198000H - 19FFFFH 190000H - 197FFFH 188000H - 18FFFFH 180000H - 187FFFH 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 178000H - 17FFFFH 170000H - 177FFFH 168000H - 16FFFFH 160000H - 167FFFH 158000H - 15FFFFH 150000H - 157FFFH 148000H - 14FFFFH 140000H - 147FFFH 138000H - 13FFFFH 130000H - 137FFFH 128000H - 12FFFFH 120000H - 127FFFH 118000H - 11FFFFH 110000H - 117FFFH 108000H - 10FFFFH 100000H - 107FFFH BLOCK NUMBER 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 0F8000H - 0FFFFFH 0F0000H - 0F7FFFH 0E8000H - 0EFFFFH 0E0000H - 0E7FFFH 0D8000H - 0DFFFFH 0D0000H - 0D7FFFH 0C8000H - 0CFFFFH 0C0000H - 0C7FFFH 0B8000H - 0BFFFFH 0B0000H - 0B7FFFH 0A8000H - 0AFFFFH 0A0000H - 0A7FFFH 098000H - 09FFFFH 090000H - 097FFFH 088000H - 08FFFFH 080000H - 087FFFH 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 4K-WORD 4K-WORD 4K-WORD 4K-WORD 4K-WORD 4K-WORD 4K-WORD 4K-WORD 078000H - 07FFFFH 070000H - 077FFFH 068000H - 06FFFFH 060000H - 067FFFH 058000H - 05FFFFH 050000H - 057FFFH 048000H - 04FFFFH 040000H - 047FFFH 038000H - 03FFFFH 030000H - 037FFFH 028000H - 02FFFFH 020000H - 027FFFH 018000H - 01FFFFH 010000H - 017FFFH 008000H - 00FFFFH 007000H - 007FFFH 006000H - 006FFFH 005000H - 005FFFH 004000H - 004FFFH 003000H - 003FFFH 002000H - 002FFFH 001000H - 001FFFH 000000H - 000FFFH Figure 2.2 Bottom Parameter Memory Map -6- ADDRESS RANGE PLANE1 (UNIFORM PLANE) 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD 32K-WORD PLANE0 (PARAMETER PLANE) PLANE3 (UNIFORM PLANE) ADDRESS RANGE 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 PLANE2 (UNIFORM PLANE) BLOCK NUMBER W28F321BB/TB Table 3. Identifier Codes and OTP Address for Read Operation ADDRESS [A15 - A0] (1) CODE Manufacture Code Manufacture Code 0000H Top Parameter Device Code 0001H Bottom Parameter Block is Unlocked Block Lock Configuration Code Block is Locked Block is not Locked-Down Block Address +2 Block is Locked-Down Device Configuration Code DATA [DQ15 - DQ0] NOTES 00B0H 00B4H 2 00B5H 2 DQ0 = 0 3 DQ0 = 1 3 DQ1 = 0 3 DQ1 = 1 3 Partition Configuration register 0006H PCRC 4 OTP Lock 0080H OTP-LK 5 OTP 0081-0088H OTP 6 OTP Notes: 1. The address A20 - A16 are shown in below table for reading the manufacturer, device, lock configuration, device configuration code and OTP data. 2. Bottom parameter device has its parameter blocks in the plane0 (The lowest address). Top parameter device has its parameter blocks in the plane3 (The highest address). 3. DQ15 - DQ2 are reserved for future implementation. 4. PCRC = Partition Configuration Register Code. 5. OTP - LK = OTP Block Lock configuration. 6. OTP = OTP Block data. Table 4. Identifier Codes and OTP Address for Read Operation on Partition Configuration(1) PARTITION CONFIGURATION REGISTER(2) ADDRESS (32M-BIT DEVICE) [A20 - A16] PCR.10 PCR.9 PCR.8 0 0 0 00H 0 0 1 00H or 08H 0 1 0 00H or 10H 1 0 0 00H or 18H 0 1 1 00H or 08H or 10H 1 1 0 00H or 10H or 18H 1 0 1 00H or 08H or 18H 1 1 1 00H or 08H or 10H or 18H Notes: 1. The address to read the identifier codes or OTP data is dependent on the partition which is selected when writing the Read Identifier Codes/OTP command (90H). 2. Refer to Table 12 for the partition configuration register. -7- Publication Release Date: February 17, 2003 Revision A2 W28F321BB/TB [A20-A0] 000088H Customer Programmable Area 000085H 000084H Factory Programmed Area 000081H 000080H Reserved for Future Implementation (DQ15 - DQ2) Customer programmable Area Lock Bit (DQ1) Factory programmed Area Lock Bit (DQ0) Figure 3. OTP Block Address Map for OTP Program (The area outside 80H - 88H cannot be used.) Table 5. Bus Operations (1, 2) NOTE #RESET #CE #OE #WE ADDRESS VPP DQ0 - 15 6 VIH VIL VIL VIH X X DOUT Output Disable VIH VIL VIH VIH X X High Z Standby VIH VIH X X X X High Z MODE Read Array Reset 3 VIL X X X X X High Z Read Identifier Codes/OTP 6 VIH VIL VIL VIH See Table 3, 4 X See Table 3, 4 6, 7 VIH VIL VIL VIH See Appendix X See Appendix 4, 5, 6 VIH VIL VIH VIL X X DIN Read Query Write Notes: 1. Refer to DC Characteristics. When VPP VPPLK, memory contents can be read, but cannot be altered. 2. X can be VIL or VIH for control pins and addresses, and VPPLK or VPPH1/2 for VPP. See DC Characteristics for VPPLK and VPPH1/2 voltages. 3. #RESET at VSS 0.2V ensures the lowest power consumption. 4. Command writes involving block erase, (page buffer) program or OTP program are reliably executed when VPP = VPPH1/2 and VDD = 2.7V to 3.6V. Command writes involving full chip erase are reliably executed when VPP = VPPH1 and VDD = 2.7V to 3.6V. 5. Refer to Table 6 for valid DIN during a write operation. 6. Never hold #OE low and #WE low at the same timing. 7. Refer to Appendix for more information about query code. -8- W28F321BB/TB Table 6. Command Definitions(11) COMMAND Read Array Read Identifier Codes/OTP Read Query Read Status Register Clear Status Register Block Erase Full Chip Erase BUS CYCLES REQ'D. 1 2 2 2 1 2 2 Program Page Buffer Program Block Erase and (Page Buffer) Program Suspend Block Erase and (Page Buffer) Program Resume Set Block Lock Bit Clear Block Lock Bit Set Block Lock-down Bit OTP Program Set Partition configuration Register NOTE FIRST BUS CYCLE Oper(1) Addr(2) Data(3) 2 2, 3, 4 2, 3, 4 2, 3 2 2, 3, 5 2, 5, 9 Write Write Write Write Write Write Write PA PA PA PA PA BA X 2 2, 3, 5, 6 Write WA 4 2, 3, 5, 7 Write WA FFH 90H 98H 70H 50H 20H 30H 40H or 10H E8H 1 2, 8, 9 Write PA B0H 1 2, 8, 9 Write PA D0H 2 2 2 2 2 2, 10 2 2, 3, 9 Write Write Write Write BA BA BA OA 2 2, 3 Write PCRC SECOND BUS CYCLE Oper(1) Addr(2) Read Read Read Data(3) IA or OA ID or OD QA QD PA SRD Write Write BA X D0H D0H Write WA WD Write WA N-1 60H 60H 60H C0H Write Write Write Write BA BA BA OA 01H D0H 2FH OD 60H Write PCRC 04H Notes: 1. Bus operations are defined in Table 5. 2. The address which is written at the first bus cycle should be the same as the address which is written at the second bus cycle. X = Any valid address within the device. PA = Address within the selected partition. IA = Identifier codes address (See Table 3 and Table 4). QA = Query codes address. Refer to Appendix for details. BA = Address within the block being erased, set/cleared block lock bit or set block lock-down bit. WA = Address of memory location for the Program command or the first address for the Page Buffer Program command. OA = Address of OTP block to be read or programmed (See Figure 3). PCRC = Partition configuration register code presented on the address A0 - A15. 3. ID = Data read from identifier codes. (See Table 3 and Table 4). QD = Data read from query database. Refer to Appendix for details. SRD = Data read from status register. See Table 10 and Table 11 for a description of the status register bits. WD = Data to be programmed at location WA. Data is latched on the rising edge of #WE or #CE (whichever goes high first). OD = Data to be programmed at location OA. Data is latched on the rising edge of #WE or #CE (whichever goes high first). N-1 = N is the number of the words to be loaded into a page buffer. 4. Following the Read Identifier Codes/OTP command, read operations access manufacturer code, device code, block lock configuration code, partition configuration register code and the data within OTP block (See Table 3 and Table 4). The Read Query command is available for reading CFI (Common Flash Interface) information. 5. Block erase, full chip erase or (page buffer) program cannot be executed when the selected block is locked. Unlocked block can be erased or programmed when #RESET is VIH. 6. Either 40H or 10H are recognized by the CUI (Command User Interface) as the program setup. 7. Following the third bus cycle, inputs the program sequential address and write data of "N" times. Finally, input the any valid address within the target partition to be programmed and the confirm command (D0H). Refer to Appendix for details. -9- Publication Release Date: February 17, 2003 Revision A2 W28F321BB/TB 8. If the program operation in one partition is suspended and the erase operation in other partition is also suspended, the suspended program operation should be resumed first, and then the suspended erase operation should be resumed next. 9. Full chip erase and OTP program operations can not be suspended. The OTP Program command can not be accepted while the block erase operation is being suspended. 10. Following the Clear Block Lock Bit command, block which is not locked-down is unlocked when #WP is VIL. When #WP is VIH, lock-down bit is disabled and the selected block is unlocked regardless of lock-down configuration. 11. Commands other than those shown above are reserved by Winbond for future device implementations and should not be used. Table 7. Functions of Block Lock(5) and Block Lock-Down CURRENT STATE State [000] [001](3) [011] [100] [101](3) [110](4) [111] #WP 0 0 0 1 1 1 1 DQ1(1) 0 0 1 0 0 1 1 DQ0(1) 0 1 1 0 1 0 1 State Name Unlocked Locked Locked-down Unlocked Locked Lock-down Disable Lock-down Disable Erase/Program Allowed(2) Yes No No Yes No Yes No Notes: 1. DQ0 = 1: a block is locked; DQ0 = 0: a block is unlocked. DQ1 = 1: a block is locked-down; DQ1 = 0: a block is not locked-down. 2. Erase and program are general terms, respectively, to express: block erase, full chip erase and (page buffer) program operations. 3. At power-up or device reset, all blocks default to locked state and are not locked-down, that is, [001] (#WP = 0) or [101] (#WP = 1), regardless of the states before power-off or reset operation. 4. When #WP is driven to VIL in [110] state, the state changes to [011] and the blocks are automatically locked. 5. OTP (One Time Program) block has the lock function, which is different from those described above. Table 8. Block Locking State Transitions upon Command Write(4) CURRENT STATE State [000] [001] [011] [100] [101] [110] [111] #WP 0 0 0 1 1 1 1 DQ1 0 0 1 0 0 1 1 RESULT AFTER LOCK COMMAND WRITTEN (Next State) DQ0 0 1 1 0 1 0 1 Set Lock(1) [001] No Change(3) No Change [101] No Change [111] No Change Clear Lock(1) No Change [000] No Change No Change [100] No Change [110] Set Lock-down(1) [011](2) [011] No Change [111](2) [111] [111](2) No Change Notes: 1. "Set Lock" means Set Block Lock Bit command, "Clear Lock" means Clear Block Lock Bit command and "Set Lock-down" means Set Block Lock-Down Bit command. 2. When the Set Block Lock-Down Bit command is written to the unlocked block (DQ0 = 0), the corresponding block is lockeddown and automatically locked at the same time. 3. "No Change" means that the state remains unchanged after the command written. 4. In this state transitions table, assumes that #WP is not changed and fixed VIL or VIH. - 10 - W28F321BB/TB Table 9. Block Locking State Transitions upon #WP Transition(4) Previous State Current State Result after #WP Transition (Next State) State #WP DQ1 DQ0 #WP = 01(1) #WP = 10(1) [000] 0 0 0 [100] - [001] 0 0 1 [101] - [011] 0 1 1 [110] - [111] - - [100] 1 0 0 - [000] - [101] 1 0 1 - [001] - [110] 1 1 0 - [011](3) - [111] 1 1 1 - [011] (2) [110] (2) Other than [110] Notes: 1. "#WP = 01" means that #WP is driven to VIH and "#WP = 10" means that #WP is driven to VIL. 2. State transition from the current state [011] to the next state depends on the previous state. 3. When #WP is driven to VIL in [110] state, the state changes to [011] and the blocks are automatically locked. 4. In this state transitions table, assumes that lock configuration commands are not written in previous, current and next state. - 11 - Publication Release Date: February 17, 2003 Revision A2 W28F321BB/TB Table 10. Status Register Definition R R R R R R R R 15 14 13 12 11 10 9 8 WSMS BESS BEFCES PBPOPS VPPS PBPSS DPS R 7 6 5 4 3 2 1 0 SR.15 - SR.8 = RESERVED FOR FUTURE ENHANCEMENTS (R) NOTES: SR.7 = WRITE STATE MACHINE STATUS (WSMS) 1 = Ready 0 = Busy Status Register indicates the status of the partition, not WSM (Write State Machine). Even if the SR.7 is "1", the WSM may be occupied by the other partition when the device is set to 2, 3 or 4 partitions configuration. SR.6 = BLOCK ERASE SUSPEND STATUS (BESS) 1 = Block Erase Suspended 0 = Block Erase in Progress/Completed Check SR.7 to determine block erase, full chip erase, (page buffer) program or OTP program completion. SR.6 - SR.1 are invalid while SR.7 = "0". SR.5 = BLOCK ERASE AND FULL CHIP ERASE STATUS (BEFCES) 1 = Error in Block Erase or Full Chip Erase 0 = Successful Block Erase or Full Chip Erase If both SR.5 and SR.4 are "1"s after a block erase, full chip erase, (page buffer) program, set/clear block lock bit, set block lock-down bit, set partition configuration register attempt, an improper command sequence was entered. SR.4 = (PAGE BUFFER) PROGRAM AND OTP PROGRAM STATUS (PBPOPS) 1 = Error in (Page Buffer) Program or OTP Program 0 = Successful (Page Buffer) Program or OTP Program SR.3 = VPP STATUS (VPPS) 1 = VPP LOW Detect, Operation Abort 0 = VPP OK SR.2 = (PAGE BUFFER) PROGRAM SUSPEND STATUS (PBPSS) 1 = (Page Buffer) Program Suspended 0 = (Page Buffer) Program in Progress/Completed SR.1 = DEVICE PROTECT STATUS (DPS) 1 = Erase or Program Attempted on a Locked Block, Operation Abort 0 = Unlocked SR.3 does not provide a continuous indication of VPP level. The WSM interrogates and indicates the VPP level only after Block Erase, Full Chip Erase, (Page Buffer) Program or OTP Program command sequences. SR.3 is not guaranteed to report accurate feedback when VPP VPPH1, VPPH2 or VPPLK. SR.1 does not provide a continuous indication of block lock bit. The WSM interrogates the block lock bit only after Block Erase, Full Chip Erase, (Page Buffer) Program or OTP Program command sequences. It informs the system, depending on the attempted operation, if the block lock bit is set. Reading the block lock configuration codes after writing the Read Identifier Codes/OTP command indicates block lock bit status. SR.15 - SR.8 and SR.0 are reserved for future use and should be masked out when polling the status register. SR.0 = RESERVED FOR FUTURE ENHANCEMENTS (R) - 12 - W28F321BB/TB Table 11. Extended Status Register Definition R R R R R R R R 15 14 13 12 11 10 9 8 SMS R R R R R R R 7 6 5 4 3 2 1 0 NOTES: XSR.15-8 = RESERVED FOR FUTURE ENHANCEMENTS (R) After issue a Page Buffer Program command (E8H), XSR.7="1" indicates that the entered command is accepted. XSR.7 is "0", the command is not accepted and a next Page Buffer Program command (E8H) should be issued again to check if page buffer is available or not. XSR.7 = STATE MACHINE STATUS (SMS) 1 = Page Buffer Program available 0 = Page Buffer Program not available XSR.6-0 = RESERVED FOR FUTURE ENHANCEMENTS (R) XSR.15-8 and XSR.6-0 are reserved for future use and should be masked out when polling the extended status register. - 13 - Publication Release Date: February 17, 2003 Revision A2 W28F321BB/TB Table 12. Partition Configuration Register Definition R R R R R PC2 PC1 PC0 15 14 13 12 11 10 9 8 R R R R R R R R 7 6 5 4 3 2 1 0 PCR.150-11 = RESERVED FOR FUTURE ENHANCEMENTS (R) PCR.10-8 = PARTITION CONFIGURATION (PC2 - 0) 000 = No partitioning. Dual Work is not allowed. 001 = Plane1 - 3 are merged into one partition. (default in a bottom parameter device) 010 = Plane 0-1 and Plane2 - 3 are merged into one partition respectively. 100 = Plane 0 - 2 are merged into one partition. (default in a top parameter device) 011 = Plane 2 - 3 are merged into one partition. There are three partitions in this configuration. Dual work operation is available between any two partitions. 110 = Plane 0 - 1 are merged into one partition. There are three partitions in this configuration. Dual work operation is available between any two partitions. 101 = Plane 1 - 2 are merged into one partition. There are three partitions in this configuration. Dual work operation is available between any two partitions. PCR.7 - 0 = RESERVED FOR FUTURE ENHANCEMENTS (R) NOTES: After power-up or device reset, PCR10-8 (PC2 - 0) is set to "001" in a bottom parameter device and "100" in a top parameter device. See Figure 4 for the detail on partition configuration. PCR.15 - 11 and PCR.7 - 0 are reserved for future use and should be masked out when polling the partition configuration register. 1 0 1 PLANE0 PLANE0 PLANE1 PLANE2 PARTITION1 PLANE2 PARTITION2 PARTITION0 PLANE0 PLANE2 PLANE3 PLANE3 PLANE0 PLANE0 PARTITION3 PARTITION2 PARTITION1 PARTITION0 1 1 Figure 4. Partition Configuration - 14 - 1 PLANE0 PLANE1 0 PARTITION0 PLANE1 0 1 PLANE2 0 1 PARTITION0 PLANE2 1 PLANE3 PARTITION1 PARTITION1 PARTITION0 PARTITION2 PARTITION1 PLANE3 0 1 PARTITION0 PLANE0 1 PLANE2 0 PLANE3 PARTITION1 PLANE1 1 1 PARTITION0 PLANE1 0 PLANE2 0 PLANE3 PARTITION1 0 PLANE0 0 PARTITION2 PLANE1 0 PLANE3 0 PLANE2 PARTITION0 PARTITIONING FOR DUAL WORK PLANE1 PC2 PC1 PC0 PLANE1 PARTITIONING FOR DUAL WORK PLANE3 PC2 PC1 PC0 111 = There are four partitions in this configuration. Each plane corresponds to each partition respectively. Dual work operation is available between any two partitions. W28F321BB/TB 4. ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings* Operating Temperature During Read, Erase and Program ..................................................................................... -40C to +85C(1) Storage Temperature During under Bias .............................. .................................................................................. -40C to +85C During non Bias .............................. .................................................................................. .. -65C to +125C Voltage On Any Pin (except VDD and VPP) ......... .......................................................................................... -0.5V to VDD +0.5V(2) VDD and VDDQ Supply Voltage......................... ........................................................................ -0.2V to +3.9V(2) VPP Supply Voltage..................................................................................................... .... -0.2V to +12.6V(2,3,4) Output Short Circuit Current............. .............................................................................. ...................100 mA(5) *WARNING: Stressing the device beyond the "Absolute Maximum Ratings" may cause permanent damage. These are stress ratings only. Operation beyond the "Operating Conditions" is not recommended and extended exposure beyond the "Operating Conditions" may affect device reliability. Notes: 1. Operating temperature is for extended temperature product defined by this specification. 2. All specified voltages are with respect to VSS. Minimum DC voltage is -0.5V on input/output pins and -0.2V on VDD and VPP pins. During transitions, this level may undershoot to -2.0V for periods <20 nS. Maximum DC voltage on input/output pins and VDD is VDD +0.5V, which, during transitions, may overshoot to VDD +2.0V for periods <20 nS. 3. Maximum DC voltage on VPP may overshoot to +13.0V for periods <20 nS. 4. VPP erase/program voltage is normally 2.7V to 3.6V. Applying 11.7V to 12.3V to VPP during erase/program can be done for a maximum of 1,000 cycles on the main blocks and 1,000 cycles on the parameter blocks. VPP may be connected to 11.7V to 12.3V for a total of 80 hours maximum. 5. Output shorted for no more than one second. No more than one output shorted at a time. Operating Conditions PARAMETER SYM. MIN. TYP. MAX. UNIT TA -40 +25 +85 C VDD Supply Voltage VDD 2.7 3.0 3.6 V 1 I/O Supply Voltage VDDQ 2.7 3.0 3.6 V 1 VPP Voltage when Used as a Logic Control VPPH1 1.65 3.0 3.6 V 1 VPP Supply Voltage VPPH2 11.7 12 12.3 V 1, 2 Operating Temperature Main Block Erase Cycling: VPP = 3.0V 100,000 Cycles Parameter Block Erase Cycling: VPP = 3.0V 100,000 Cycles Main Block Erase Cycling: VPP = 12V, 80 hrs. 1,000 Cycles Parameter Block Erase Cycling: VPP = 12V, 80 hrs. 1,000 Cycles 80 Hours Maximum VPP hours at 12V NOTE Notes: 1. See DC Characteristics tables for voltage range-specific specification. 2. Applying VPP = 11.7V to 12.3V during an erase or program can be done for a maximum of 1,000 cycles on the main blocks and 1,000 cycles on the parameter blocks. A permanent connection to VPP =11.7V to 12.3V is not allowed and can cause damage to the device. - 15 - Publication Release Date: February 17, 2003 Revision A2 W28F321BB/TB Capacitance(1) TA = +25 C, f = 1 MHz PARAMETER SYM. TYP. MAX. UNIT CONDITION CIN 6 8 pF VIN = 0.0V COUT 10 12 pF VOUT = 0.0V Input Capacitance Output Capacitance Note: Sampled, not 100% tested. AC Input/Output Test Conditions VDDQ TEST POINTS VDDQ/2 INPUT VDDQ/2 OUTPUT 0.0 AC test inputs are driven at VDD(min) for a Logic "1" and 0.0V for a Logic "0". Input timing begins, and output timing ends at VDD/2. Input rise and fall times (10% to 90%) < 5 nS. Worst case speed conditions are when VDD =VDD(min). Figure 5. Transient Input/Output Reference Waveform for VDD =2.7V to 3.6V VDDQ(min)/2 1N914 R L =3.3K ohm DEVICE UNDER TEST OUT C L Includes Jig Capacitance CL Figure 6. Transient Equivalent Testing Load Circuit Table 13. Configuration Capacitance Loading Value TEST CONFIGURATION CL(PF) VDD = 2.7V to 3.6V 50 - 16 - W28F321BB/TB DC Characteristics PARAMETER SYM. TEST CONDITIONS Input Load Current (note 1) ILI Output Leakage Current (note1) ILO VDD Standby Current (note 1) ICCS VDD = VDD Max. #CE = #RESET = VDDQ 0.2V, #WP = VDDQ or VSS VDD Automatic Power Saving Current (note 1, 4) ICCAS VDD Reset Power-Down Current (note 1) VDD = 2.7V to 3.6V Min. Typ. Max. UNIT -1.0 +1.0 A -1.0 +1.0 A 4 20 A VDD = VDD Max. #CE = VSS 0.2V, #WP = VDDQ or VSS 4 20 A ICCD #RESET = VSS 0.2V 4 20 A 15 25 mA ICCR VDD = VDD Max., #CE = VIL, #OE = VIH, f = 5 MHz 5 10 mA VPP = VPPH1 20 60 mA VPP = VPPH2 10 20 mA VPP = VPPH1 10 30 mA VPP = VPPH2 10 30 mA 10 200 A VPP VDD 2 5 A VPP = VPPH1 2 5 A VPP = VPPH2 10 30 mA VPP = VPPH1 2 5 A VPP = VPPH2 5 15 mA VPP = VPPH1 2 5 A VPP = VPPH2 10 200 A VPP = VPPH1 VPP Block Erase Suspend Current IPPES (note 1, 6, 7) VPP = VPPH2 2 5 A 10 200 A Average VDD Read Current Normal Mode (note1, 7) Average VDD Read Current Page Mode (note1, 7) 8 Word Read VDD (Page Buffer) Program Current (note 1, 5, 7) ICCW VDD Block Erase, Full Chip Erase Current (note 1, 5, 7) ICCE VDD (Page Buffer) Program or Block Erase Suspend Current (note 1, 2, 7) ICCWS #CE = VIH ICCES VPP Standby or Read Current (note 1, 6, 7) IPPS IPPR VPP (Page Buffer) Program Current (note 1, 5, 6, 7) IPPW VPP Block Erase, Full Chip Erase Current (note 1, 5, 6, 7) IPPE VPP (Page Buffer) Program Suspend Current (note 1, 6, 7) VDD = VDD Max., VDDQ = VDDQ Max., VIN/VOUT = VDDQ or VSS IPPWS - 17 - Publication Release Date: February 17, 2003 Revision A2 W28F321BB/TB DC Characteristics (continued) PARAMETER SYM. TEST CONDITIONS VDD = 2.7V - 3.6V Min. Typ. Max. UNIT Input Low Voltage (note 5) VIL -0.4 0.4 V Input High Voltage (note 5) VIH VDDQ -0.4 VDDQ +0.4 V Output Low Voltage (note 5) VOL VDD = VDD Min., VDDQ = VDDQ Min., IOL = 100 A 0.2 V Output High Voltage (note 5) VOH VDD = VDD Min., VDDQ = VDDQ Min., IOH = -100 A VDDQ -0.2 VPP Lockout during Normal Operations (note 3, 5, 6) VPPLK VPP during Block Erase, Full Chip Erase, (Page Buffer) Program or OTP Program Operations (note 6) VPPH1 1.65 VPP during Block Erase, (Page Buffer) Program or OTP Program Operations (note 6) VPPH2 11.7 VDD Lockout Voltage VLKO 1.5 V 0.4 V 3.0 3.6 V 12 12.3 V V Notes: 1. All currents are in RMS unless otherwise noted. Typical values are the reference values at VDD = 3.0V and TA = +25 C unless VDD is specified. 2. ICCWS and ICCES are specified with the device de-selected. If read or (page buffer) program while in block erase suspend mode, the device's current draw is the sum of ICCWS or ICCES and ICCR or ICCW , respectively. 3. Block erases, full chip erase, (page buffer) program and OTP program are inhibited when VPP VPPLK, and not guaranteed in the range between VPPLK (max.) and VPPH1 (min.), between VPPH1 (max.) and VPPH2 (min.) and above VPPH2 (max.). 4. The Automatic Power Savings (APS) feature automatically places the device in power save mode after read cycle completion. Standard address access timings (tAVQV) provide new data when address are changed. 5. Sampled, not 100% tested. 6. VPP is not used for power supply pin. With VPP VPPLK, block erase, full chip erase, (page buffer) program and OTP program cannot be executed and should not be attempted. Applying 12V0.3V to V VPP provides fast erasing or fast programming mode. In this mode, VPP is power supply pin and supplies the memory cell current for block erasing and (page buffer) programming. Use similar power supply trace widths and layout considerations given to the VDD power bus. Applying 12V0.3V to VPP during erase/program can only be done for a maximum of 1,000 cycles on each block. VPP may be connected to 12V0.3V for a total of 80 hours maximum. 7. The operating current in dual work is the sum of the operating current (read, erase, program) in each plane. - 18 - W28F321BB/TB AC Characteristics - Read-only Operations(1) VDD = 2.7V to 3.6V, TA = -40C to +85C PARAMETER SYM. MIN. MAX. UNIT Read Cycle Time tAVAV 70 Address to Output Delay tAVQV 70 nS #CE to Output Delay (note 3) tELQV 70 nS nS Page Address Access Time TAPA 25 nS #OE to Output Delay (note 3) tGLQV 20 nS #RESET High to Output Delay TPHQV 150 nS tEHQZ, tGHQZ, 20 nS #CE or #OE to Output in High Z, whichever Occurs First (note 2) #CE to Output in Low Z (note 2) TELQX 0 nS #OE to Output in Low Z (note 2) tGLQX 0 nS tOH 0 nS Output Hold from first Occurring Address, #CE or #OE Change (note 2) Notes: 1. See AC Input/Output Reference Waveform for timing measurements and maximum allowable input slew rate. 2. Sampled, not 100% tested. 3. #OE may be delayed up to tELQV to tGLQV after the falling edge of #CE without impact to tELQV. VIH A20-0(A) VIL Valid Address tEHQZ tGHQZ t AVQV VIH #CE(E) VIL t ELQV #OE(G) #WE(W) VIH VIL VIH t GLQV VIL VOH DQ15-0 (D/Q) VOL t OH tGLQX t ELQX HIGH Z Valid Output t PHQV #RESET(P) VIH VIL Figure 7. AC Waveform for Single Asynchronous Read Operations from Status Register, Identifier codes, OTP Block or Query Code - 19 - Publication Release Date: February 17, 2003 Revision A2 W28F321BB/TB A20-3(A) VIH Valid Address VIL t AVQV A2-0(A) VIH VIL Valid Address Valid Address Valid Address Valid Address VIH #CE(E) VIL t EHQZ t GHQZ t ELQV #OE(G) #WE(W) DQ15-0 (D/Q) VIH VIL VIH t GLQV VIL VOH t OH tAPA tGLQX t ELQX HIGH Z Valid Address VOL Valid Address Valid Address Valid Address t PHQV #RESET(P) VIH VIL Figure 8. AC Waveform for Asynchronous Page Mode Read Operations from Main Blocks or Parameter Blocks - 20 - W28F321BB/TB AC Characteristics - Write Operations(1,2) VDD = 2.7V to 3.6V, TA = -40C to +85C PARAMETER SYM. MIN. tAVAV 70 nS #RESET High Recovery to #WE(#CE) Going Low (note 3) tPHWL(tPHEL) 150 nS #CE(#WE) Setup to #WE(#CE) Going Low (note 4) tELWL(tWLEL) 0 nS #WE(#CE) Pulse Width (note 4) tWLWH(tELEH) 60 nS Data Setup to #WE(#CE) Going High (note 8) tDVWH(tDVEH) 40 nS Address Setup to #WE(#CE) Going High (note 8) tAVWH(tAVEH) 50 nS #CE(#WE) Hold from #WE(#CE) High tWHEH(tEHWH) 0 nS Data Hold from #WE(#CE) High tWHDX(tEHDX) 0 nS Address Hold from #WE(#CE) High tWHAX(tEHAX) 0 nS #WE(#CE) Pulse Width High (note 5) tWHWL(tEHEL) 30 nS #WP High Setup to #WE(#CE) Going High (note 3) tSHWH(tSHEH) 0 nS VPP Setup to #WE(#CE) Going High (note 3) tVVWH(tVVEH) 200 nS Write Recovery before Read tWHGL(tEHGL) 30 nS #WP High Hold from Valid SRD (note 3, 6) tQVSL 0 nS VPP Hold from Valid SRD (note 3, 6) tQVVL 0 nS Write Cycle Time #WE(#CE) High to SR.7 Going "0" (note 3, 7) tWHR0(tEHR0) MAX. tAVQV+40 UNIT nS Notes: 1. The timing characteristics for reading the status register during block erase, full chip erase, (page buffer) program and OTP program operations are the same as during read-only operations. Refer to AC Characteristics for read-only operations. 2. A write operation can be initiated and terminated with either #CE or #WE. 3. Sampled, not 100% tested. 4. Write pulse width (tWP) is defined from the falling edge of #CE or #WE (whichever goes low last) to the rising edge of #CE or #WE (whichever goes high first). Hence, tWP = tWLWH = tELEH = tWLEH = tELWH. 5. Write pulse width high (tWPH) is defined from the rising edge of #CE or #WE (whichever goes high first) to the falling edge of #CE or #WE (whichever goes low last). Hence, tWPH = tWHWL = tEHEL = tWHEL = tEHWL. 6. VPP should be held at VPP = VPPH1/2 until determination of block erase, (page buffer) program or OTP program success (SR.1/3/4/5 = 0) and held at VPP = VPPH1 until determination of full chip erase success (SR.1/3/5 = 0). 7. tWHR0 (tEHR0) after the Read Query or Read Identifier Codes/OTP command=tAVQV+100ns. 8. Refer to Table 6 for valid address and data for block erase, full chip erase, (page buffer) program, OTP program or lock bit configuration. - 21 - Publication Release Date: February 17, 2003 Revision A2 W28F321BB/TB A21-0(A) #CE(E) #OE(G) #WE(W) V IH Note 1 Note 2 V IL Valid Address Valid Address t AVAV t AVWH (t AVEH ) V IL t WHAX (t EHAX ) Note 5,6 t ELWL (t WLEL) t WHEH (t EHWH ) t WHGL (t EHGL) V IH V IL Note 5 Valid Address V IH t PHWL (t PHEL) Note 5,6 t WHWL (t EHEL) V IH V IL t DVWH (t DVEH) t WLWH (t ELEH) DQ15-0(D/Q) Note 4 Note 3 V IH V IL t WHQV1,2,3 (t EHQV1,2,3) t WHDX (t EHDX) D IN Valid D IN SRD t WHR0 (t EHR0) ("1") SR.7(R) #RESET(P) #WP(S) ("0") V IH V IL t SHWH(t SHEH) t QVSL t VVWH(t VVEH) t QVVL V IH V IL VPPH1,2 VPP (V) V PPLK V IL Figure 9. AC Waveform for Write Operations Notes: 1. VDD power-up and standby. 2. Write each first cycle command. 3. Write each second cycle command or valid address and data. 4. Automated erase or program delay. 5. Read status register data. 6. For read operation, #OE and #CE must be driven active, and #WE de-asserted. - 22 - W28F321BB/TB Reset Operations t PHQV #RESET(P) DQ15-0(D/Q) VIH VIL t PLPH VOH High Z t PLRH #RESET(P) DQ15-0(D/Q) Valid Output (A)Reset During Read Array Mode VOL SR.7="1" Abort Complete t PHQV VIH VIL t PLPH VOH High Z Valid Output (B)Reset During Erase or Program Mode VOL VDD (min) VDD Vss t VHQV t PHQV t 2VPH #RESET(P) DQ15-0(D/Q) VIH V IL VOH High Z VOL Valid Output (C)#RESET Rising Timing Figure 10. AC Waveform for Reset Operation Reset AC Specifications VDD = 2.7V to 3.6V, TA = -40C to +85C PARAMETER #RESET Low to Reset during Read (#RESET should be low during power-up.) (note 1, 2, 3) SYM. MIN. tPLPH 100 #RESET Low to Reset during Erase or Program (note 1, 3, 4) tPLRH VDD 2.7V to #RESET High (note 1, 3, 5) t2VPH VDD 2.7V to Output Delay (note 3) tVHQV MAX. UNIT nS 22 100 S nS 1 mS Notes: 1. A reset time, tPHQV, is required from the later of SR.7 going "1"(High Z) or #RESET going high until outputs are valid. Refer to AC Characteristics - Read-Only Operations for tPHQV. 2. tPLPH is <100ns the device may still reset but this is not guaranteed. 3. Sampled, not 100% tested. - 23 - Publication Release Date: February 17, 2003 Revision A2 W28F321BB/TB 4. If #RESET asserted while a block erase, full chip erase, (page buffer) program or OTP program operation is not executing, the reset will complete within 100ns. 5. When the device power-up, holding #RESET low minimum 100ns is required after VDD has been in predefined range and also has been in stable there. Block Erase, Full Chip Erase, (Page Buffer) Program and OTP Program Performance(3) VDD = 2.7V to 3.6V, TA = -40C to +85C PARAMETER SYM. 4K-Word Parameter Block Program Time (note 2) tWPB 32K-Word Main Block Program Time (note 2) tWMB PAGE BUFFER VPP = VPPH1 VPP = VPPH2 COMMAND IS (IN SYSTEM) (IN MANUFACTURING) UNIT USED OR NOT (1) (2) MIN. TYP.(1) MAX.(2) MIN. TYP. MAX. USED Not Used 0.05 0.3 0.04 0.12 S Used 0.03 0.12 0.02 0.06 S Not Used 0.38 2.4 0.31 1.0 S Used 0.24 1.0 0.17 0.5 S Not Used 11 200 9 185 S Used 7 100 5 90 S Word Program Time (note 2) tWHQV1/ tEHQV1 OTP Program Time (note 2) tWHOV1/ tEHOV1 Not Used 36 400 27 185 S 4K-Word Parameter Block Erase Time (note 2) tWHQV2/ tEHQV2 - 0.3 4 0.2 4 S 32K-Word Main Block Erase Time (note 2) tWHQV3/ tEHQV3 - 0.6 5 0.5 5 S 40 350 Full Chip Erase Time (note 2) (Page Buffer) Program Suspend Latency Time to Read (note 4) S tWHRH1/ tEHRH1 - 5 10 5 10 S Block Erase Suspend Latency tWHRH2/ Time to Read (note 4) tEHRH2 - 5 20 5 20 S Latency Time from Block Erase Resume Command to Block Erase Suspend Command (note 5) - tERES 500 500 S Notes: 1. Typical values measured at VDD = 3.0V, VPP = 3.0V or 12V, and TA=+25C. Assumes corresponding lock bits are not set. Subject to change based on device characterization. 2. Excludes external system-level overhead. 3. Sampled, but not 100% tested. 4. A latency time is required from writing suspend command (#WE or #CE going high) until SR.7 going "1". 5. If the interval time from a Block Erase Resume command to a subsequent Block Erase Suspend command is shorter than tERES and its sequence is repeated, the block erase operation may not be finished. - 24 - W28F321BB/TB 5. ADDITIONAL INFORMATION Recommended Operating Conditions At Device Power-Up AC timing illustrated in Figure A-1 is recommended for the supply voltages and the control signals at device power-up. If the timing in the figure is ignored, the device may not operate correctly. VDD #RESET (p) Vpp *1 Vss (E) #WE (W) #OE (G) #WP (S) DATA (D/Q) tVR t 2VPH t PHQV VIH V IL (V) V PPH1/2 Vss ADDRESS (A) #CE VDD (min) VIH tAVQV tR or tF tR or tF Valid Address VIL tF VIH t ELQV tR VIL VIH VIL tF t GLQV tR VIH VIL VIH VIL VOH VOL HIGH Z Valid Output *1 To prevent the unwanted writes, system designers should consider the design, which applies VPP to 0V during read operations and VPPH1/2 during write or erase operations. Figure A-1. AC Timing at Device Power-up For the AC specifications tVR, tR, tF in the figure, refer to the next page. See the "ELECTRICAL SPECIFICATIONS" described in specifications for the supply voltage range, the operating temperature and the AC specifications not shown in the next page. - 25 - Publication Release Date: February 17, 2003 Revision A2 W28F321BB/TB Rise and Fall Time PARAMETER SYMBOL MIN. MAX. UNIT VDD Rise Time (note 1) tVR 0.5 30000 S/ V Input Signal Rise Time (note1, 2) tR 1 S/ V Input Signal Fall Time (note1, 2) tF 1 S/ V Notes: 1. Sampled, not 100% tested. 2. This specification is applied for not only the device power-up but also the normal operations. Glitch Noises Do not input the glitch noises which are below VIH (Min.) or above VIL (Max.) on address, data, reset, and control signals, as shown in Figure A-2 (b). The acceptable glitch noises are illustrated in Figure A-2 (a). Input Singal Input Singal VIH(Min.) VIH(Min.) VIL (Max.) VIL (Max.) Input Singal Input Singal (a) Acceptable Glitch Noises (b) NOT Acceptable Glitch Noises Figure A-2. Waveform for Glitch Noises See the "DC CHARACTERISTICS" described in specifications for VIH (Min.) and VIL (Max.). - 26 - W28F321BB/TB 6. ORDERING INFORMATION ACCESS TIME OPERATING TEMPERATURE (nS) (C) W28F321BB70L 70 -40 C to 85 C Bottom Boot 48-Ball TFBGA W28F321TB70L 70 -40 C to 85 C Top Boot 48-Ball TFBGA PART NO. BOOT BLOCK PACKAGE Notes: 1. Winbond reserves the right to make changes to its products without prior notice. 2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications where personal injury might occur as a consequence of product failure. 7. PACKAGE DIMENSION 48-Ball TFBGA (7mm x 7mm) (measurements in millimeters) b CONTROL DIMENSIONS ARE IN MILLIMETERS 1 2 3 4 5 6 MILLIMETER SYMBOL H G F E D C B A MIN. NOM. MAX. - A e D2 D 0.042 0.30 0.008 0.010 0.012 D 6.80 7.00 7.20 0.272 0.280 0.288 3.75 BASIC 6.80 y SEATING PLANE - 0.25 E2 b A - 0.20 E E2 E 1.05 MIN. NOM. MAX. A1 D2 e - INCH e 7.00 7.20 0.272 0.280 0.288 5.25 BASIC 0.210 0.10 BASIC 0.37 0.40 0.75 BASIC 0.150 BASIC 0.004 BASIC 0.43 0.015 0.016 0.017 0.030 BASIC A1 - 27 - Publication Release Date: February 17, 2003 Revision A2 W28F321BB/TB 8. VERSION HISTORY VERSION DATE PAGE A1 Jan. 3, 2003 - A2 Feb. 17, 2003 27 DESCRIPTION Initial Issued Modify the package dimension drawing Headquarters Winbond Electronics Corporation America Winbond Electronics (Shanghai) Ltd. No. 4, Creation Rd. III, Science-Based Industrial Park, Hsinchu, Taiwan TEL: 886-3-5770066 FAX: 886-3-5665577 http://www.winbond.com.tw/ 2727 North First Street, San Jose, CA 95134, U.S.A. TEL: 1-408-9436666 FAX: 1-408-5441798 27F, 2299 Yan An W. Rd. Shanghai, 200336 China TEL: 86-21-62365999 FAX: 86-21-62365998 Taipei Office Winbond Electronics Corporation Japan Winbond Electronics (H.K.) Ltd. 9F, No.480, Rueiguang Rd., Neihu District, Taipei, 114, Taiwan, R.O.C. TEL: 886-2-8177-7168 FAX: 886-2-8751-3579 7F Daini-ueno BLDG, 3-7-18 Shinyokohama Kohoku-ku, Yokohama, 222-0033 TEL: 81-45-4781881 FAX: 81-45-4781800 Unit 9-15, 22F, Millennium City, No. 378 Kwun Tong Rd., Kowloon, Hong Kong TEL: 852-27513100 FAX: 852-27552064 Please note that all data and specifications are subject to change without notice. All the trade marks of products and companies mentioned in this data sheet belong to their respective owners. - 28 -