Fastrack Supreme User Guide
Technical Characteristics
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This document is the sole and exclusive property of Wavecom. Not to be distributed or divulged
without prior written agreement.
WA_DEV_Fastrk_UGD_001-004 February 5, 2008
Notes:
Short description of Class IE13 (
For more information see standard IEC 60721-3-1)
"Locations without controlled temperature and humidity, where heating may be used
to raise low temperatures, locations in buildings providing minimal protection against
daily variations of external climate, prone to receiving rainfall from carrying wind".
Short description of Class IE23 (
For more information, see standard IEC 60721-3-2)
"Transportation in unventilated compartments and in conditions without protection
against bad weather, in all sorts of trucks and trailers in areas of well developed road
network, in trains equipped with buffers specially designed to reduce shocks and by
boat".
Short description of Class IE35 (
For more information see standard IEC 60721-3-3)
"Locations with no control on heat or humidity where heating may be used to raise
low temperatures, to places inside a building to avoid extremely high temperatures,
to places such as hallways, building staircases, cellars, certain workshops,
equipment stations without surveillance".
Short description of Class IE73 (
For more information see standard IEC 60721-3-7)
"Transfer to places where neither temperature nor humidity are controlled but where
heating may be used to raise low temperatures, to places exposed to water droplets,
products can be subjected to ice formation, these conditions are found in hallways
and building staircases, garages, certain workshops, factory building and places for
industrial processes and hardware stations without surveillance".
Warning: The specification in the above table applies to the Fastrack Supreme
product only. Customers are advised to verify that the environmental specification of
the SIM Card used is compliant with the Fastrack Supreme environmental
specifications. Any application must be qualified by the customer with the SIM Card
in storage, transportation and operation.
The use of standard SIM cards may drastically reduce the environmental conditions in
which the Product can be used. These cards are particularly sensible to humidity and
temperature changes. These conditions may produce oxidation of the SIM card
metallic layers and cause, in the long term, electrical discontinuities. This is
particularly true in left alone applications, where no frequent extraction/insertion of
the SIM card is performed.
In case of mobility when the application is moved through different environments
with temperature variations, some condensation may appear. These events have a
negative impact on the SIM and may favor oxidation.
If the use of standard SIM card, with exposition to the environmental conditions
described above, can not be avoided, special care must be taken in the integration of
the final application in order to minimize the impact of these conditions. The solutions
that may be proposed are:
• Lubrication of the SIM card to protect the SIM Contact from oxidation.
• Putting the Fastrack Supreme Plug & Play in a waterproof enclosure with
desiccant bags.