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TOSHIBA BiCMOS INTEGRATED CIRCUIT SILICON MONOLITHIC
TB62706BN,TB62706BF
16BIT SHIFT REGISTER, LATCHES & CONSTANT CURRENT DRIVERS
The TB62706BN, TB62706BF is specifically designed for LED
and LED DISPLAY constant current drivers.
This constant current output circuits is able to set up external
resistor (IOUT = 5~90 mA). (Note)
This IC is monolithic integrated circuit designed to be used
together with Bi−CMOS process.
The devices consist of 16bit shift register, latch, AND−GATE and
Constant Current Drivers.
FEATURES
Constant Current Output : Can set up all output current
with one resister for 5 to 90
mA.
Maximum Clock Frequency : fCLK = 15 (MHz) (Cascade
Connected Operate, Topr =
25°C)
5 V C−MOS Compatible Input
Package : SDIP24−P−300−1.78~1.778mmPitch~ (TB62706BN)
SSOP24−P−300−1.00B~1.0mmPitch~ (TB62706BF)
Constant Output Current Matchong:
OUTPUTGND
VOLTAGE
CURRENT
MATCHING
OUTPUT
CURRENT
0.4 V ±6.0% 5~40 mA
0.7 V ±6.0% 5~90 mA (Note)
Note: TB62706BF can be used under limited PD
(PD 1.04 W, with PCB)
TB62706BN
TB62706BF
Weight
SDIP24-P-300-1.78: 1.22 g (typ.)
SSOP24-P-300-1.00B: 0.32 g (typ.)
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PIN CONNECTION (Top view)
BLOCK DIAGRAM
TIMING DIAGRAM
Note: Latches are level sensitive, not rising edges sensitive and not syncronus CLOCK.
Input of LATCHterminal to H Level, data passes latches, and input to L level, data hold latches.
Input of ENABLEterminal to H level, all output (OUT0~15) do off.
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TERMINAL DISCRIPTION
PIN No. PIN NAME FUNCTION
1 GND GND terminal for control logic.
2 SERIALIN Input terminal of a serialdata for shiftregister.
3 CLOCK Input terminal of a clock for data shift to upedge.
4 LATCH Input terminal of a data strobe. Latches passes data with “H” level input of
LATCH terminal, and hold data with "L" level input.
5~20 15~OUT0 Output terminals.
21 ENABLE Input terminal of output enable. All outputs (OUT0~15) do off with “H” level input of
ENABLE terminal, and do on with "L" level input.
22 SERIALOUT Output terminal of a serialdata for next SERIALIN terminal.
23 REXT Input terminal of connects with a resister for to set up all output current.
24 VDD 5 V Supply voltage terminal.
TRUTH TABLE
CLOCK LATCH ENABLE SERIALIN OUT0 ··· OUT7 ··· OUT15 SERIALOUT
UP H L Dn D
n ··· Dn7 ··· Dn15 D
n15
UP L L Dn+1 No change Dn14
UP H L Dn+2 D
n+2 ··· Dn5 ··· Dn13 D
n13
DOWN X L Dn+3 D
n+2 ··· Dn5 ··· Dn13 D
n13
DOWN X H Dn+3 Off Dn13
Note: 15~OUT0 = on in case of Dn = H level and 15~OUT0 = off in case of Dn = L level.
A resistor is connected with REXT and GND accompanied with outside, and it is necessary that a correct
power supply voltage is supplied.
EQUIVALENT CIRCUIT OF INPUTS AND OUTPUTS
1. ENABLE terminal 2. LATCH terminal
3. CLOCK, SERIAL−IN terminal 4. SERIAL−OUT terminal
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ABSOLUTE MAXIMUM RATINGS (Ta = 25°C)
CHARACTERISTIC SYMBOL RATING UNIT
Supply Voltage VDD 0~7.0 V
Input Voltage VIN 0.4~VDD + 0.4 V
Output Current IOUT 90 mA
Output Voltage VOUT 0.5~17.0 V
Clock Frequency fCK 15 MHz
GND Terminal Current IGND 1440 mA
1.78 (BNtype : ON PCB, Ta = 25°C )
Power Dissipation PD
1.00 (BFtype : ON PCB, Ta = 25°C )
W
BN : 70 (BNtype : ON PCB)
Tharmal Resistance Rth (ja)
BF : 120 (BFtype : ON PCB)
°C / W
Operating Temperature Topr 40~85 °C
Storage Temperature Tstg 55~150 °C
Note: BNtype : Ambient temperature delated above 25°C in the proportion of 14.2 mW / °C
BFtype : Ambient temperature delated above 25°C in the proportion of 8.3 mW / °C
RECOMMENDED OPERATING CONDITION (Ta = −40~85°C unless otherwise noted)
CHARACTERISTIC SYMBOL CONDITION MIN TYP. MAX UNIT
Supply Voltage VDD 4.5 5.0 5.5 V
Output Voltage VOUT 15.0 V
IO OUTn, DC 1 circuit 5 88
IOH SERIALOUT 1.0
Output Current
IOL SERIALOUT 1.0
mA
VIH 0.7
VDD VDD
+0.3
Input Voltage
VIL 0.3 0.3
VDD
V
LATCH Pulse Width tLATw 100 ns
CLOCK Pulse Width tw CLK 50 ns
ENABLE Pulse Width tENw 4500 ns
SetUp Time for DATA tsetup (D) 60 ns
Hold Time for DATA thold (D) 20 ns
SetUp Time for LATCH t
setup (L) 100 ns
Hold Time for LATCH thold (L)
VDD = 4.5~5.5 V
60 ns
Clock Frequency fCLK Cascade operation 10.0 MHz
Ta = 85°C (BNtype) 0.92
Power Dissipation PD
Ta = 85°C (BFtype) 0.50
W
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ELECTRICAL CHARACTERISTICS (VDD = 5.0 V, Ta = 25°C unless otherwise noted)
CHARACTERISTIC SYMBOL
TEST
CIR
CUIT
CONDITION MIN TYP. MAX UNIT
"H" Level VIH Ta = 40~85°C 0.7
VDD V
DD
Input Voltage
"L" Level VIL Ta = 40~85°C GND 0.3
VDD
V
Output Leakage Current IOH V
OH = 15.0 V 10 µA
VOL I
OL = 1.0 mA 0.4
Output Voltage SERIALOUT
VOH I
OH = 1.0 mA 4.6
V
IOL1 V
CE = 0.7 V 34.1 40.0 45.9
Output Current 1
IOL2 V
CE = 0.4 V
REXT = 470
(Include current
matching) 33.7 39.5 45.3
mA
Current Skew ∆ IOL1 IO = 40 mA,
VCE = 0.4 V REXT = 470 ±1.5 ±6.0 %
IOL3 V
CE = 1.0 V 64.2 75.5 86.8
Output Current 2
IOL4 V
CE = 0.7 V
REXT = 250
(Include current
matching) 63.8 75.0 86.2
mA
Current Skew IOL2 IO = 75 mA,
VCE = 0.7 V REXT = 250 ±1.5 ±6.0 %
Supply Voltage Regulation % / VDD REXT = 470 ,
Ta = 40~85°C 1.5 5.0 % / V
PullUp Resistor RIN (up) 150 300 600
PullDown Resistor RIN (down) 100 200 400
IDD (off) 1 REXT = OPEN,
15~OUT0 = off 0.6 1.2
IDD (off) 2 R
EXT = 470 , 15~OUT0 = off 3.5 5.8 8.0
"OFF"
IDD (off) 3 R
EXT = 250 , 15~OUT0 = off 6.5 10.7 15.0
IDD (on) 1 R
EXT = 470 , 15~OUT0 = on 10.0 16.0 22.0
Supply Current
"ON"
IDD (on) 2 R
EXT = 250 , 15~OUT0 = on 18.0 28.3 38.5
mA
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SWITCHING CHARACTERISTICS (Ta = 25°C unless otherwise noted)
CHARACTERISTIC SYMBOL
TEST
CIR
CUIT
CONDITION MIN TYP. MAX UNIT
CLKOUTn 1200 1500
OUTn LATCH－ 1200 1500
OUTn ENABLE － 1200 1500
Propagation
Delay Time
(“L” to “H”)
CLKSOUT
tpLH
15 30 70
ns
CLKOUTn 700 1000
OUTn LATCH－ 700 1000
OUTn ENABLE － 700 1000
Propagation
Delay Time
(“H” to “L”)
CLKSOUT
tpHL
15 30 70
ns
CLK tw CLK 20 30 ns
Pulse Width
LATCH tLATw 10 25 ns
LH tsetup (L) 25 50 ns
Setup Time
HL tsetup (C)
25 50 ns
LH thold (L) 0 15 ns
Hold Time
HL thold (C)
0 15 ns
Maximum CLOCK Rise Time tr 10 µs
Maximum CLOCK Fall Time tf 10 µs
Output Rise Time tor 150 300 600 ns
Output Fall Time tof
VDD = 5.0 V
VCE = 0.4 V
VIH = VDD
VIL = GND
REXT = 470
VL = 3.0 V
RL = 65
CL = 10.5 pF
150 300 600 ns
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TEST CIRCUIT
DC characteristic
AC characteristic
PRECAUTIONS for USING
Utmost care is necessary in the design of the output line, VCC (VDD) and GND line since IC may be destroyed
due to short−circuit between outputs, air contamination fault, or fault by improper grounding.
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TIMING WAVEFORM
1. CLOCK−SERIAL OUT, OUTn
2. CLOCK−LATCH
3. ENABLE −OUTn
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LED DRIVER TB6270X SERIES APPICATION NOTE
Fig.1
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[1] Output current (IOUT)
IOUT is set by the enternal resistor (R−EXT) as shown in Fig.1.
[2] Total supply voltage (VLED)
This device can operate 0.4~0.7V (VO).
When a higher voltage is input to the device, the excess voltage is consumed inside the device, that leads to
power dissipation.
In order to minimize power dissipation and loss, we would like to recommend to set the total supply voltage as
shown below,
VLED (total supply voltage) = VCE (Tr Vsat) + Vf (LED Forward voltage) + VO (IC supply voltage)
When the total supply is too high considering the power dissipation of this device, an additional R can
decrease the supply voltage (VO).
[3] Pattern layout
This device owns only one ground pin that means signal ground pin and power ground pin are common.
If ground pattern layout contains large inductance and impedance, and the voltage between ground and
LATCH, CLOCK terminals exceeds 2.5 V by switching noise in operation, this device may miss−operate. So we
would lile you to pay attention to pattern layout to minimize inductance.
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Package Dimensions
Weight: 1.22 g (typ.)
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Package Dimensions
Weight: 0.32 g (typ.)
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Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only.
Thorough evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
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IC Usage Considerations
Notes on Handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in
case of over current and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of
breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are
required.
(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power
OFF. IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,
smoke or ignition.
(4) Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation
or incorrectly even just one time.
(5) Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback condenser, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input
withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause
smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied
Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
Points to Remember on Handling of ICs
(1) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at
any time and condition. These ICs generate heat even during normal use. An inadequate IC heat
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown.
In addition, please design the device taking into considerate the effect of IC heat radiation with
peripheral components.
(2) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to
the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power
supply is small, the device’s motor power supply and output pins might be exposed to conditions
beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in
system design.
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RESTRICTIONS ON PRODUCT USE 060116EBA
• The information contained herein is subject to change without notice. 021023_D
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk. 021023_B
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others. 021023_C
• The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E
