RT9728A
®
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Copyright 2018 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Ordering Information
Note :
Richtek products are :
RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
Suitable for use in SnPb or Pb-free soldering processes.
Features
±±
±±
±10% Current Limit Accuracy @ 1.3A
Adjustable Current Limit : 75mA to 1.3A (typ.)
Meets USB Current Limiting Requirements
Operating Voltage Range : 2.5V to 5.5V
Reverse Input
Output Voltage Protection
Built-in Soft-Start
120mΩΩ
ΩΩ
Ω High-Side MOSFET
120μμ
μμ
μA Supply Current
RoHS Compliant and Halogen Free
120mΩΩ
ΩΩ
Ω, 1.3A Power Switch with Programmable Current Limit
General Description
The RT9728A is a cost effective, low voltage, single
P-MOSFET high-side power switch IC for USB application
with a programmable current limit feature. Low switch-on
resistance (typ.120mΩ) and low supply current (typ.
120μA) are realized in this IC. The RT9728A can offer a
programmable current limit threshold between 75mA and
1.3A (typ.) via an external resistor. The ±10% current limit
accuracy can be realized for all current limit settings. In
addition, a flag output is available to indicate fault
conditions to the local USB controller. Furthermore, the
chip also integrates an embedded delay function to prevent
mis-operation from happening due to high inrush current.
The RT9728A is an ideal solution for USB power supply
and can support flexible applications since it is functional
for various current limit requirements. It is available in
SOT-23-6 and WDFN-6L 2x2 packages.
Pin Configuration
(TOP VIEW)
SOT-23-6
Applications
USB Bus/Self Powered Hubs
USB Peripheral Ports
ACPI Power Distribution
Battery Power Equipment
3G/3.5G Data Card, Set-Top Boxes
VOUT ILIM
VIN GND
4
23
56
FAULT
EN/EN
VOUT
ILIM
VIN
GND
5
4
1
2
3
6
GND
7EN/ENFAULT
WDFN-6L 2x2
RT9728A
Package Type
E : SOT-23-6
QW : WDFN-6L 2x2
H : Chip Enable High
L : Chip Enable Low
Lead Plating System
G : Green (Halogen Free and Pb Free)
Z : ECO (Ecological Element with
Halogen Free and Pb free)
RT9728A
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Pin No. Pin Na m e Pin Function
SOT-23-6 WDFN-6L 2x2
1 6 VIN Input voltage.
2 5,
7 (Exposed Pad) GND Ground. The exposed pad must be soldered to a large PCB and
connected to GND for maximum power dissipation.
3 4
EN/EN Chip enable.
4 3
FAULT Active-low open-drain output. Asserted during over current, over
temperature, or reverse-voltage conditions.
5 2 ILIM
Current limit set pin. External resistor used to set current limit
threshold. Recommend 19.1k RILIM 232k.
6 1
VOUT Power switch output.
Functional Pin Description
Typical Application Circuit
VIN
RT9728A
VIN
ILIM
RILIM
VOUT
150µF
FAULT
EN/EN
RFAULT
CIN
VOUT
GND
FAULT Signal
100k
10µF
Chip Enable
Marking Information
19 : Product Code
W : Date Code
RT9728ALGQW
02=DNN
RT9728ALGE
02= : Product Code
DNN : Date Code
01=DNN
01= : Product Code
DNN : Date Code
RT9728AHGE
17 : Product Code
W : Date Code
RT9728AHGQW
19W17W
17 : Product Code
W : Date Code
RT9728AHZQW
19 : Product Code
W : Date Code
RT9728ALZQW
19W17W
RT9728A
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Functional Block Diagram
UVLO
Current
Limit
7.5ms
Deglitch
4ms
Deglitch
Thermal
Sense
Drive
Reverse Voltage
Comparator
Switch
well
Current
Sense
+
-
VOUT
ILIM
GND
EN/EN
VIN
FAULT
14
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Electrical Characteristics
(VIN = 3.6V, 19.1kΩ RILIM 232kΩ, TA = 25°C, unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Unit
EN Input Voltage
Logic-High VIH 1.1 -- --
V
Logic- Low VIL -- -- 0.66
Current Limit Threshold
Resistor Range RILIM (nominal 1%) from ILIM to GND 19.1 -- 232 k
Under Voltage Lockout
Threshold VUVLO VIN rising -- 2.3 -- V
VIN falling -- 2.1 --
Shutdown Current ISHDN V
IN = 5.5V, no load on VOUT, VEN = 0V -- 1 3 A
Quiescent Current IQ VIN = 5.5V,
no load on VOUT
RILIM = 20k -- 120 170
A
RILIM = 210k -- 120 170
Reverse Leakage Current IREV V
OUT = 5.5V, VIN = 0V -- 1 3 A
Thermal Shutdown
Temperature TSD -- 160 -- °C
Static Drain-Source On-State
Resistance RDS(ON) I
SW = 0.2A -- 120 -- m
Current Limit ILIM
RILIM = 20k 1190 1295 1400
mA
RILIM = 49.9k 468 520 572
RILIM = 210k 110 130 150
ILIM shorted to VIN 50 75 100
Absolute Maximum Ratings (Note 1)
Supply Input Voltage ------------------------------------------------------------------------------------------------------ 0.3V to 6V
Other Pin Voltage --------------------------------------------------------------------------------------------------------- 0.3V to 6V
Power Dissipation, PD @ TA = 25°C
SOT-23-6 -------------------------------------------------------------------------------------------------------------------- 0.4W
WDFN-6L 2x2 -------------------------------------------------------------------------------------------------------------- 0.606W
Package Thermal Resistance (Note 2)
SOT-23-6, θJA --------------------------------------------------------------------------------------------------------------- 250°C/W
WDFN-6L 2x2, θJA --------------------------------------------------------------------------------------------------------- 165°C/W
WDFN-6L 2x2, θJC -------------------------------------------------------------------------------------------------------- 7°C/W
Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------------- 260°C
Junction Temperature ----------------------------------------------------------------------------------------------------- 150°C
Storage Temperature Range -------------------------------------------------------------------------------------------- 65°C to 150°C
ESD Susceptibility (Note 3)
HBM (Human Body Model) ---------------------------------------------------------------------------------------------- 2kV
Recommended Operating Conditions (Note 4)
Supply Input Voltage, VIN ----------------------------------------------------------------------------------------------- 2.5V to 5.5V
Junction Temperature Range -------------------------------------------------------------------------------------------- 40°C to 125°C
Ambient Temperature Range -------------------------------------------------------------------------------------------- 40°C to 85°C
RT9728A
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Parameter Symbol Test Conditions Min Typ Max Unit
Reverse Voltage Comparator
Trip Point (VOUT VIN) -- 135 -- mV
FAULT Output Low Voltage VOL IFAULT = 1mA -- 180 -- mV
FAULT Off State Leakage VFAULT = 5.5V -- 1 -- A
FAULT Deglitch
FAULT assertion or de-assertion due to
over current condition 5 7.5 10
ms
FAULT assertion or de-assertion due to
reverse voltage condition 2 4 6
Note 1. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those
indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating
conditions may affect device reliability.
Note 2. θJA is measured at TA = 25°C on a low effective thermal conductivity single-layer test board per JEDEC 51-3. θJC is
measured at the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
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Typical Operating Characteristics
Supply Current vs. Temperature
80
90
100
110
120
130
140
150
-50 -25 0 25 50 75 100 125
Temperature (°C)
Supply Current (μA
)
Fault Deglitch Timing vs. Temperature
5
6
7
8
9
10
-50 -25 0 25 50 75 100 125
Temperature (°C)
Fault Deglitch Timing (ms
)
Under Voltage Lock out vs. Tem pe rature
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
-50 -25 0 25 50 75 100 125
Temperature (°C)
Under Voltage Lockout (V
)
Rising
Falling
EN/EN Threshold Voltage vs. Tem perature
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
-50 -25 0 25 50 75 100 125
Temperature (°C)
EN/EN Threshold Voltage (V) 1
Rising
Falling
On- Resistance v s. Temperature
60
70
80
90
100
110
120
130
140
150
-50-25 0 255075100125
Temperature (°C)
On-Resistance (m )
Ω
VIN = 3.6V
VIN = 5V
Current Lim it vs. Tempe rature
1.1
1.2
1.3
1.4
1.5
1.6
-50 -25 0 25 50 75 100 125
TemperatureC)
Current Limit (A)
RILIM = 20kΩ
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Current Limit
Time (2.5ms/Div)
Short Circuit to Full Load (5Ω)
VOUT
(2V/Div)
Fault
(5V/Div)
IIN
(1A/Div)
VIN = 5V, COUT = 150μF,
RILIM = 20kΩ
VOUT
(2V/Div)
Fault
(5V/Div)
IIN
(1A/Div)
Current Limit
Time (2.5ms/Div)
VIN = 5V, COUT = 150μF,
RILIM = 20kΩ
Full Load (5Ω) to Short Circuit
Power On from EN
Time (500μs/Div)
VOUT
(5V/Div)
VEN
(10V/Div)
IIN
(1A/Div)
RT9728AH, VIN = 5V, COUT = 150μF,
RILIM = 20kΩ, ROUT = 5Ω
Power Off from EN
Time (500μs/Div)
VOUT
(5V/Div)
VEN
(10V/Div)
IIN
(1A/Div)
RT9728AH, VIN = 5V, COUT = 150μF,
RILIM = 20kΩ, ROUT = 5Ω
Power Off from EN
Time (500μs/Div)
VOUT
(5V/Div)
VEN
(10V/Div)
IIN
(1A/Div)
RT9728AL, VIN = 5V, COUT = 150μF,
RILIM = 20kΩ, ROUT = 5Ω
Power On from EN
Time (500μs/Div)
VOUT
(5V/Div)
VEN
(10V/Div)
IIN
(1A/Div)
RT9728AL, VIN = 5V, COUT = 150μF,
RILIM = 20kΩ, ROUT = 5Ω
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Static Drain-Source Current vs. VIN - VOUT
0
20
40
60
80
100
120
140
160
0 200 400 600 800 1000
VIN - VOUT (mV)
Static Drain-Source Current (mA) 1
VIN = 5.5V, RILIM = 200kΩ
Static Drain-Source Current vs. VIN - VOUT
0
200
400
600
800
1000
1200
1400
1600
0 200 400 600 800 1000
VIN - VOUT (mV)
Static Drain-Source Current (mA)1
VIN = 5.5V, RILIM = 20kΩ
Current Limit
Time (2.5ms/Div)
No Load to Short Circuit
VOUT
(2V/Div)
Fault
(5V/Div)
IIN
(1A/Div)
VIN = 5V, COUT = 150μF,
RILIM = 20kΩ
Current Limit
Short Circuit to No Load
VOUT
(2V/Div)
Fault
(5V/Div)
IIN
(1A/Div)
VIN = 5V, COUT = 150μF,
RILIM = 20kΩ
Time (2.5ms/Div)
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Applications Information
The RT9728A is a single P-MOSFET high-side power
switch with active-high/low enable input, optimized for self-
powered and bus-powered Universal Serial Bus (USB)
applications. The switch's low RDS(ON) meets USB voltage
drop requirements and a flag output is available to indicate
fault conditions to the local USB controller.
Current Limiting and Short Circuit Protection
When a heavy load or short circuit situation occurs while
the switch is enabled, large transient current may flow
through the device. The RT9728A includes a current-limit
circuitry to prevent these large currents from damaging
the MOSFET switch and the hub downstream ports. The
RT9728A provides an adjustable current limit threshold
between 120mA and 1.3A (typ) via an external resistor,
RILIM, between 19.1kΩ and 232kΩ. However, if the ILIM
pin is connected to VIN, the current limit threshold will be
75mA (typ). Once the current limit threshold is exceeded, Figure 1. Current Limit Threshold vs RILIM
Current Limit Threshold vs. RILIM
0
200
400
600
800
1000
1200
1400
1600
20 50 80 110 140 170 200 230
RILIM (k )
Current Limit Threshold (mA
)
Ω
the device enters constant-current mode until either
thermal shutdown occurs or the fault is removed. The
table1 shows a recommended current limit value vs. RILIM
resistor.
Table 1. Recommended RILIM Resistor Selections
Des ired Nomina l
Current Limit
(mA)
Ideal Resist or
(k) Closet 1%
Resisto r (k )
Actual Limits (Include R Tolerance)
IOS M in (mA) I OS Nom (m A) IOS Max (mA)
75 Short ILIM to VIN 50.0 75.0 100.0
120 226.1 226.0 101.3 120.0 142.1
200 134.0 133.0 173.7 201.5 233.9
300 88.5 88.7 262.1 299.4 342.3
400 65.9 66.5 351.1 396.7 448.7
500 52.5 52.3 443.9 501.6 562.4
600 43.5 43.2 535.1 604.6 674.1
700 37.2 37.4 616.0 696.0 776.0
800 32.4 32.4 708.7 800.8 892.9
900 28.7 28.7 797.8 901.5 1005.2
1000 25.8 26.1 875.4 989.1 1102.8
1100 23.4 23.2 982.1 1109.7 1237.3
1200 21.4 21.5 1057.9 1195.4 1332.9
1300 19.7 19.6 1178.0 1308.5 1439.0
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Chip Enable Input
The RT9728AH/L will be disabled when the EN/EN pin is
in a logic-low/high condition. During this condition, the
internal circuitry and MOSFET are turned off, reducing
the supply current to 1μA typical. The maximum
guaranteed voltage for a logic-low at the EN/EN pin is
0.66V. A minimum guaranteed voltage of 1.1V at the EN/
EN pin will turn off the RT9728A. Floating the input may
cause unpredictable operation. EN/EN should not be
allowed to go negative with respect to GND.
Under Voltage Lockout
Under voltage lockout (UVLO) prevents the MOSFET
switch from turning on until input voltage exceeds
approximately 2.3V. If input voltage drops below
approximately 2.1V, UVLO turns off the MOSFET switch.
Fault Flag
The RT9728A provides a FAULT signal pin which is an N-
channel open drain MOSFET output. This open drain output
goes low when current exceeds current limit threshold,
VOUT VIN exceeds reverse voltage trip level, or the die
temperature exceeds 160°C approximately. The FAULT
output is capable of sinking a 1mA load to typically 180mV
above ground. The FAULT pin requires a pull-up resistor;
this resistor should be large in value to reduce energy
drain. A 100kΩ pull-up resistor works well for most
applications. In case of an over current condition, FAULT
will be asserted only after the flag response delay time,
tD, has elapsed. This ensures that FAULT is asserted upon
valid over current conditions and that erroneous error
reporting is eliminated. For example, false over current
conditions may occur during hot-plug events when
extremely large capacitive loads are connected, which
induces a high transient inrush current that exceeds the
current limit threshold. The FAULT response delay time,
tD, is typically 7.5ms.
Supply Filter/Bypa ss Ca pa citor
A 10μF low ESR ceramic capacitor connected from VIN to
GND and located close to the device is strongly
recommended to prevent input voltage drooping during hot-
plug events. However, higher capacitor values may be used
to further reduce the voltage droop on the input. Without
this bypass capacitor, an output short may cause sufficient
ringing on the input (from source lead inductance) to
destroy the internal control circuitry. Note that the input
transient voltage must never exceed 6V as stated in the
Absolute Maximum Ratings.
Output Filter Capacitor
A low ESR 150μF aluminum electrolytic capacitor
connected between VOUT and GND is strongly
recommended to meet the USB standard maximum droop
requirement for the hub, VBUS. Standard bypass methods
should be used to minimize inductance and resistance
between the bypass capacitor and the downstream
connector to reduce EMI and decouple voltage droop
caused by hot-insertion transients in downstream cables.
Ferrite beads in series with VBUS, the ground line and
the 0.1μF bypass capacitors at the power connector pins
are recommended for EMI and ESD protection. The bypass
capacitor itself should have a low dissipation factor to allow
decoupling at higher frequencies.
Thermal Considerations
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
dissipation depends on the thermal resistance of the IC
package, PCB layout, rate of surrounding airflow, and
difference between junction and ambient temperature. The
maximum power dissipation can be calculated by the
following formula :
PD(MAX) = (TJ(MAX) TA) / θJA
where TJ(MAX) is the maximum junction temperature, TA is
the ambient temperature, and θJA is the junction to ambient
thermal resistance.
For recommended operating condition specifications, the
maximum junction temperature is 125°C. The junction to
ambient thermal resistance, θJA, is layout dependent. For
SOT-23-6 packages, the thermal resistance, θJA, is 250°C/
W on a standard JEDEC 51-3 single-layer thermal test
board. For WDFN-6L 2x2 packages, the thermal
resistance, θJA, is 165°C/W on a standard JEDEC 51-3
single-layer thermal test board. The maximum power
dissipation at TA = 25°C can be calculated by the following
formula :
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Figure 2. Derating Curve of Maximum Power Dissipation
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
0.55
0.60
0.65
0 25 50 75 100 125
Ambient Temperature (°C)
Maximum Power Dissipation (W) 1
WDFN-6L 2x2
SOT-23-6
Single-Layer PCB
PD(MAX) = (125°C 25°C) / (250°C/W) = 0.400W for
SOT-23-6 package
PD(MAX) = (125°C 25°C) / (165°C/W) = 0.606W for
WDFN-6L 2x2 package
The maximum power dissipation depends on the operating
ambient temperature for fixed TJ(MAX) and thermal
resistance, θJA. The derating curves in Figure 2 allow the
designer to see the effect of rising ambient temperature
on the maximum power dissipation.
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Outline Dimension
AA1
e
b
B
D
C
H
L
SOT-23-6 Surface Mount Package
Dimensions In Millimeters Dimensions In Inches
Symbol Min Max Min Max
A 0.889 1.295 0.031 0.051
A1 0.000 0.152 0.000 0.006
B 1.397 1.803 0.055 0.071
b 0.250 0.560 0.010 0.022
C 2.591 2.997 0.102 0.118
D 2.692 3.099 0.106 0.122
e 0.838 1.041 0.033 0.041
H 0.080 0.254 0.003 0.010
L 0.300 0.610 0.012 0.024
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Richtek Technology Corporation
14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Customers should obtain the latest relevant information and data sheets before placing orders and should verify
that such information is current and complete. Richtek cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek
product. Information furnished by Richtek is believed to be accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use;
nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent
or patent rights of Richtek or its subsidiaries.
Dimensions In Millimeters Dimensions In Inch es
Symbol Min Max Min Max
A 0.700 0.800 0.028 0.031
A1 0.000 0.050 0.000 0.002
A3 0.175 0.250
0.007 0.010
b 0.200 0.350 0.008 0.014
D 1.950 2.050 0.077 0.081
D2 1.000 1.450 0.039 0.057
E 1.950 2.050 0.077 0.081
E2 0.500 0.850 0.020 0.033
e 0.650 0.026
L 0.300 0.400
0.012 0.016
W-Type 6L DFN 2x2 Package
D
1
E
A3
A
A1
eb
L
D2
E2
SEE DETAIL A
11
2
2
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
DETAIL A
Pin #1 ID and Tie Bar Mark Options