© Semiconductor Components Industries, LLC, 2017
March, 2017 − Rev. 0 1Publication Order Number:
NCV51460/D
NCV51460
20mA Micropower
Precision Voltage
Reference
The NCV51460 is a high performance, low power precision voltage
reference. This device combines very high accuracy, low power
dissipation and small package size. It can supply output current up to
20 mA at a 3.3 V fixed output voltage with excellent line and load
regulation characteristics making it ideal for precision regulator
applications. It is designed to be stable with or without an output
capacitor. The protective features include Short Circuit and Reverse
Input Voltage Protection. The NCV51460 is packaged in a 3−lead
surface mount SOT−23 package.
Features
•Fixed Output Voltage 3.3 V
•VOUT Accuracy 1% over −40°C to +125°C
•Wide Input Voltage Range up to 28 V
•Low Quiescent Current
•Low Noise
•Reverse Input Voltage Protection
•Stable Without an Output Capacitor
•Available in 3 leads SOT−23 Package
•NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
•Precision Regulators, High Accuracy
•Micropower Supplies
•Data Acquisition Systems
•Instrument Equipment
•Cameras, Camcorders, Sensors
NCV51460
GND
3.3 V
Figure 1. Typical Application Schematics
VOUT
VOUT
VIN
(3.3 V fixed)
CIN
0.1 mF
VIN = 4.2 to 28 V
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
ORDERING INFORMATION
SOT−23
SN1 SUFFIX
CASE 318
MARKING DIAGRAM
AND PIN ASSIGNMENT
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1
JJMG
G
JJ = Specific Device Code
M = Date Code
G= Pb−Free Package
(Note: Microdot may be in either location)
GND
VIN VOUT
2
3
(Top View)
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ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Table 1. PIN FUNCTION DESCRIPTION
ÁÁÁÁÁ
ÁÁÁÁÁ
Pin No.
ÁÁÁÁÁÁ
ÁÁÁÁÁÁ
Pin Name
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Description
ÁÁÁÁÁ
ÁÁÁÁÁ
1
ÁÁÁÁÁÁ
ÁÁÁÁÁÁ
VIN
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Positive Input Voltage
ÁÁÁÁÁ
ÁÁÁÁÁ
2
ÁÁÁÁÁÁ
ÁÁÁÁÁÁ
VOUT
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Regulated Output Voltage
ÁÁÁÁÁ
ÁÁÁÁÁ
3
ÁÁÁÁÁÁ
ÁÁÁÁÁÁ
GND
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Power Supply Ground; Device Substrate
Table 2. MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage (Note 1) VIN 30 V
Reverse Input Voltage VIN −15 V
Output Short Circuit Duration, TA = 25°C
VIN ≤ 27 V
VIN > 27 V
tSC R
50
sec
Operating Ambient Temperature Range TA−40 to 125 °C
Maximum Junction Temperature TJ(max) 150 °C
Storage Temperature Range TSTG −65 to 150 °C
ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V
ESD Capability, Machine Model (Note 2) ESDMM 200 V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be af fected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latch up Current Maximum Rating: ±150 mA per JEDEC standard: JESD78.
Table 3. THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Thermal Characteristics, SOT−23 package
Thermal Resistance, Junction−to−Ambient (Note 3) RqJA 246 °C/W
3. Soldered on 1 oz 50 mm2 FR4 copper area.
Table 4. RECOMMENDED OPERATING RANGES
Rating Symbol Min Max Unit
Operating Input Voltage (Note 4) VIN VOUT + 0.9 28 V
Operating Ambient Temperature Range TA−40 125 °C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
4. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
NCV51460
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Table 5. ELECTRICAL CHARACTERISTICS (VIN = VOUT + 2.5 V, IOUT = 0, CIN = 0.1 mF, COUT = 0 mF; For typical values TA =
25°C, for min/max values −40°C ≤ TA ≤ 125°C unless otherwise noted.) (Note 5).
Parameter Test Conditions Symbol Min Typ Max Unit
Output Voltage VOUT 3.267
(−1%) 3.3 3.333
(+1%) V
Line Regulation VIN = VOUT + 0.9 V to VOUT + 2.5 V
VIN = VOUT + 2.5 V to VOUT + 20 V RegLINE −
−150
65 500
130 ppm/V
Load Regulation IOUT = 0 to 100 mA
IOUT = 0 to 10 mA
IOUT = 0 to 20 mA
RegLOAD −
−
−
1100
150
120
4000
400
400
ppm/mA
Dropout Voltage Measured at VOUT − 2%
IOUT = 0 mA
IOUT = 10 mA
VDO −
−0.65
0.9 0.9
1.4
V
Quiescent Current IOUT = 0 mA, TA = 25°C
IOUT = 0 mA, 0°C ≤ TA ≤ 100°CIQ−
−140 200
220 mA
Output Short Circuit Current VOUT = 0 V, TA = 25°C ISC − 80 − mA
Reverse Leakage VIN = − 15 V, TA = 25°C ILEAK − 0.1 10 mA
Output Noise Voltage (Note 6) f = 0.1 Hz to 10 Hz
f = 10 Hz to 1 kHz VN− 12
18 −mVPP
mVrms
Output Voltage Temperature
Coefficient 0°C ≤ TA ≤ 100°C
−40°C ≤ TA ≤ 125°CTCO −
−18
34 −
−ppm/°C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
5. Performance guaranteed over the indicated operating temperature range by design and/or characterization, tested at TJ = TA = 25°C. Low
duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
6. The noise spectral density from 0.1 Hz to 10 Hz is measured, then the integral output noise voltage in this range is calculated. Finally the
peak to peak noise is calculated as 5x integral output noise.
TYPICAL CHARACTERISTICS
Figure 2. Output Voltage vs. Temperature Figure 3. Output Voltage vs. Temperature
TJ, JUNCTION TEMPERATURE (°C)
VOUT, OUTPUT VOLTAGE (V)
IOUT = 0 mA
COUT = 0 mF
VIN = VOUT + 20 V
3.267
3.272
3.277
3.282
3.287
3.292
3.297
3.302
3.307
3.312
3.317
3.322
3.327
3.332
−40 −20 0 20 40 60 80 100 120 140
VIN = VOUT + 2.5 V VIN = VOUT + 0.9 V
3.267
3.272
3.277
3.282
3.287
3.292
3.297
3.302
3.307
3.312
3.317
3.322
3.327
3.332
−40 −20 0 20 40 60 80 100 120 140
TJ, JUNCTION TEMPERATURE (°C)
VOUT, OUTPUT VOLTAGE (V)
VIN = VOUT + 2.5 V
COUT = 0 mF
IOUT = 0 mA
IOUT = 10 mA
IOUT = 20 mA
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TYPICAL CHARACTERISTICS
Figure 4. Output Voltage vs. Temperature Figure 5. Dropout Voltage
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
Figure 6. Quiescent Current Figure 7. Line Regulation
VIN, INPUT VOLTAGE (V) TJ, JUNCTION TEMPERATURE (°C)
VOUT, OUTPUT VOLTAGE (V)
VDROP, DROPOUT VOLTAGE (V)
IQ, QUIESCENT CURRENT (mA)
REGLINE, LINE REGULATION (mV)
3.267
3.272
3.277
3.282
3.287
3.292
3.297
3.302
3.307
3.312
3.317
3.322
3.327
3.332
−40 −20 0 20 40 60 80 100 120 140
VIN = 5.8 V
IOUT = 0 mA
COUT = 0 mF
Unit 1
Unit 2
Unit 3
Three Typical Parts
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
−40 −20 0 20 40 60 80 100 120 140
IO = 0 mA IO = 1 mA IO = 5 mA
IO = 10 mA
IO = 20 mA
0
50
100
150
200
250
300
350
400
450
0 2 4 6 8 10 12 14 16 18 20
IOUT = 0 mA
COUT = 0 mF
TJ = 25°C
TJ = −25°C
TJ = 125°C
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
−40 −20 0 20 40 60 80 100 120 140
VIN = 5.8 to 23.3 V
IOUT = 0 mA
COUT = 0 mF
VIN = 5.8 to 18.3 V
VIN = 5.8 to 15.3 V
VIN = 5.8 to 12.3 V
VIN = 5.8 to 9.3 V
12
10
8
6
4
2
0−40 −20 0 20 40 60 80 100 120 140
REGLOAD, LOAD REGULATION (mV)
Figure 8. Load Regulation Sourcing
TJ, JUNCTION TEMPERATURE (°C)
VIN = 5.8 V
COUT = 0 mF
IOUT = 0 to
20 mA
IOUT = 0 to
15 mA
IOUT = 0 to
5 mA
IOUT = 0 to
1 mA
IOUT = 0 to
10 mA
Figure 9. Load Regulation Sinking
TJ, JUNCTION TEMPERATURE (°C)
LOADREG, LOAD REGULATION (mV)
0
20
40
60
80
100
120
140
160
−40 −20 0 20 40 60 80 100 120 140
IOUT = 0 mA
down to −2 mA
IOUT = 0 mA
down to −1.50 mA
IOUT = 0 mA
down to −1.2 mA
IOUT = 0 mA
down to −500 mA
VIN = 5.8 V
COUT = 0 mF
COUT = 0 mF
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TYPICAL CHARACTERISTICS
Figure 10. Short Circuit Current Figure 11. Power Supply Rejection Ratio
Cout = 0 mF
TJ, JUNCTION TEMPERATURE (°C) f, FREQUENCY
I
SC
, SHORT CIRCUIT CURRENT (mA)
40
50
60
70
80
90
100
110
120
130
140
−40 −20 0 20 40 60 80 100 120 140
COUT = 0 mF
VIN = 28 V
VIN = 15 V
VIN = 5.8 V
0
10
20
30
40
50
60
70
80
10 100 1000 10k 100k 1
M
IOUT = 1 mA
IOUT = 0 mA
IOUT = 20 mA
VIN = 5.8 VDC $50 mVAC
COUT = 0 mF
TJ = 25°C
0
10
20
30
40
50
60
70
80
10 100 1000 10k 100k 1M
PSRR, POWER SUPPLY REJECTION RATIO (dB)
Figure 12. Power Supply Rejection Ratio
Cout = 0.1 mF
f, FREQUENCY
VIN = 5.8 VDC $50 mVAC
COUT = 0.1 mF MLCC
TJ = 25°C
IOUT = 1 mA
IOUT = 0 mA
IOUT = 20 mA
0
10
20
30
40
50
60
70
80
90
100
10 100 1000 10k 100k 1
M
IOUT = 1 mA
IOUT = 20 mA
IOUT = 0 mA
VIN = 5.8 VDC $50 mVAC
COUT = 1 mF MLCC
TJ = 25°C
Figure 13. Power Supply Rejection Ratio
Cout = 1 mF
f, FREQUENCY
PSRR, POWER SUPPLY REJECTION RATIO (dB) PSRR, POWER SUPPLY REJECTION RATIO (dB
)
0
10
20
30
40
50
60
70
80
90
4 5 6 7 8 9 10 11 12
PSRR, POWER SUPPLY REJECTION RATIO (dB)
Figure 14. Power Supply Rejection Ratio vs.
Input Voltage
VIN, INPUT VOLTAGE (V)
IOUT = 10 mA, COUT = 0 mF, TA = 25°C
fRIPPLE = 100 Hz
fRIPPLE = 10 kHz
fRIPPLE = 100 kHz
fRIPPLE = 1 MHz
0
10
20
30
40
50
60
70
80
4567891011
12
PSRR, POWER SUPPLY REJECTION RATIO (dB)
Figure 15. Power Supply Rejection Ratio vs.
Input Voltage
VIN, INPUT VOLTAGE (V)
fRIPPLE = 100 Hz
fRIPPLE = 10 kHz
fRIPPLE = 100 kHz
fRIPPLE = 1 MHz
IOUT = 20 mA, COUT = 0 mF, TA = 25°C
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TYPICAL CHARACTERISTICS
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
0.1 1 10
Figure 16. Output Voltage Noise 0.1 Hz − 10 Hz
f, FREQUENCY (Hz)
Vn, OUTPUT NOISE (mVrms/rtHz)
VIN = 5.8 V
IOUT = 0 mA,
COUT = 0 mF,
TA = 25°C
0.1 Hz − 10 Hz Integral Noise:
Vn = 2.28 mVrms
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
10 100 1000 10k 100k 1M
Figure 17. Output Voltage Noise 10 Hz − 1 MHz
f, FREQUENCY (Hz)
Vn, OUTPUT NOISE (mVrms/rtHz)
VIN = 5.8 V
IOUT = 0 mA to 20 mA,
COUT = 0 mF,
TA = 25°C
10 Hz − 1 kHz Integral Noise:
Vn = 18 mVrms
Vn, OUTPUT NOISE (mVrms/rtHz)
Figure 18. Output Voltage Noise 10 Hz − 1 MHz
COUT = 0.1 mF
f, FREQUENCY (Hz)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
10 100 1000 10k 100k 1M
IOUT = 1 mA
IOUT = 0 mA
IOUT = 10 mA
IOUT = 20 mA
VIN = 5.8 V
IOUT = 0 mA to 20 mA,
COUT = 0.1 mF MLCC,
TA = 25°C
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
10 100 1000 10k 100k 1M
Vn, OUTPUT NOISE (mVrms/rtHz)
Figure 19. Output Voltage Noise 10 Hz − 1 MHz
COUT = 1 mF
f, FREQUENCY (Hz)
IOUT = 1 mA
IOUT = 0 mA IOUT = 10 mA
IOUT = 20 mA
VIN = 5.8 V
IOUT = 0 mA to 20 mA,
COUT = 1 mF MLCC,
TA = 25°C
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
10 100 1000 10k 100k 1M
Vn, OUTPUT NOISE (mVrms/rtHz)
Figure 20. Output Voltage Noise 10 Hz − 1 MHz
COUT = 10 mF
f, FREQUENCY (Hz)
IOUT = 10 mA
IOUT = 20 mA
IOUT = 1 mA
IOUT = 0 mA
VIN = 5.8 V
IOUT = 0 mA to 20 mA,
COUT = 10 mF MLCC,
TA = 25°C
3.10
3.15
3.20
3.25
3.30
3.35
3.40
3.45
Figure 21. Load Transient Response 0 − 10 mA
TIME (20 ms/DIV)
VOUT, OUTPUT VOLTAGE
(50 mV/DIV)
VIN = 0 to 5.8 V, COUT = 0 mF,
trise_fall = 10 mA/1 ms, TA = 25°C
IOUT = 0 mA
IOUT = 10 mA
VOUT
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TYPICAL CHARACTERISTICS
2.7
2.9
3.1
3.3
3.5
3.7
3.9
4.1
Figure 22. Load Transient Response 0 − 20 mA
TIME (10 ms/DIV)
VOUT, OUTPUT VOLTAGE (200 mV/DIV)
VIN = 5.8 V, COUT = 0 mF,
trise_fall = 20 mA/1 ms, TA = 25°C
IOUT = 0 mA IOUT = 20 mA
VOUT
3.4
3.3
2.2
3.4
3.3
3.2
3.4
3.3
3.2
3.4
3.3
2.2
VOUT, OUTPUT VOLTAGE (100 mV/DIV)
Figure 23. Load Transient Responses COUT = 0
− 4.7 mF
TIME (50 ms/DIV)
COUT = 0 mF
COUT = 0.1 mF MLCC
COUT = 1 mF MLCC
COUT = 4.7 mF MLCC
VIN = 5.8 V, TA = 25°C,
trise_fall = 10 mA/1 ms
VOUT
VOUT
VOUT
VOUT
IOUT = 10 mA
IOUT = 0 mA
6
4
2
0
3
2
1
0
TIME (10 ms/DIV)
VOUT, OUTPUT VOLT-
AGE (1 V/DIV) VIN, INPUT VOLTAGE
(2 V/DIV)
VIN = 0 V to 5.8 V,
CIN = 0 mF, COUT = 0 mF,
IOUT = 0 mA, TA = 25°C,
trise = 20 ms
Figure 24. Turn−On
VOUT
VIN
0
1
2
3
4
0
2
6
TIME (50 ms/DIV)
VOUT, OUTPUT VOLT-
AGE (1 V/DIV) VIN, INPUT VOLTAGE
(2 V/DIV)
VIN = 5.8 V to 0 V,
COUT = CIN = 0 mF,
IOUT = 0 mA, TA = 25°C,
trise_fall = 25 ms
Figure 25. Turn−Off
VOUT
VIN
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APPLICATIONS INFORMATION
Input Decoupling Capacitor (CIN)
It is recommended to connect a 0.1 mF Ceramic capacitor
between V IN and GND pin of the device. This capacitor will
provide a low impedance path for unwanted AC signals or
noise present on the input voltage. The input capacitor will
also limit the influence of input trace inductances and Power
Supply resistance during sudden load current changes.
Higher capacitances will improve the Power Supply
Rejection Ratio and line transient response.
Output Decoupling Capacitor (COUT)
The NCV51460 was designed to be stable without an
additional output capacitor. Without the output capacitor the
VOUT settling times during Reference Turn−on or Turn−off
can be as short as 20 ms (Refer to Figure 24 and 25). The
Load Transient Responses without COUT (Figure 21 and 22)
show good stability of NCV51460 even for fast output
current changes from 0 mA to full load. If smaller VOUT
deviations during load current changes are required, it is
possible to add some external capacitance as shown on
Figure 26.
NCV51460
GND
3.3 V
CIN
0.1 mF
VIN = 4.2 to 28 V VIN VOUT VOUT
COUT
(3.3 V fixed)
Figure 26. Output Capacitor Connection
The COUT will reduce the overshoot and undershoot but
will increase the settling time and can introduce some
ringing of the output voltage during fast load transients.
NCV51460 behavior for different values of ceramic X7R
output capacitors is depicted on Figure 23.
The Output Voltage ringing and settling times can be
reduced by using some additional resistance in series with
the Ceramic Capacitor or by using Tantalum or Aluminum
Capacitors which have higher ESR values. Figure 27 below
shows the Load Transient improvement after adding an
additional 2 W series resistor to a 1 mF Ceramics Capacitor.
3.35
3.30
3.25
3.35
3.30
3.25
VOUT, OUTPUT VOLTAGE (50 mV/DIV)
Figure 27.
COUT = 1 mF MLCC + 2 W
VIN = 5.8 V, TA = 25°C,
trise_fall = 10 mA/1 ms
VOUT
IOUT = 10 mA
IOUT = 0 mA
COUT = 1 mF MLCC
TIME (50 ms/DIV)
The device was determined to be stable with Aluminum,
Ceramic and Tantalum Capacitors with capacitances
ranging from 0 to 100 mF at TA = 25°C.
Turn−On Response
It is possible to achieve very fast T urn−On time when fast
VIN ramp is applied to NCV51460 input as shown on
Figure 24. However if the Input Voltage change from 0 V to
nominal Input Voltage is extremely fast, the Output Voltage
settling time will increase. Figure 28 below shows this ef fect
when the Input Voltage change is 5.8 V / 2 ms.
0
1
2
3
0
2
4
6
TIME (10 ms/DIV)
VOUT, OUTPUT VOLT-
AGE (1 V/DIV) VIN, INPUT VOLTAGE
(2 V/DIV)
Figure 28.
VIN = 0 V to 5.8 V,
CIN = 0 mF,
COUT = 0 mF,
IOUT = 0 mA, TA = 25°C,
trise = 45 ms
VOUT
VIN
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A 0.1 mF or la r ger input capacitor will help to decrease the
dv/dt of the input voltage and improve stability during lar ge
load current changes.
During the Turn−On for certain conditions the output
voltage can exhibit an overshoot. The amount of the
overshoot strongly depends on application conditions i.e.
input voltage level, slew rate, input and output capacitors,
and output current. The maximum value of the overshoot
isn’t guaranteed for this device.
The figure below shows an example of the Turn−On
overshoot.
0
1
2
3
0
2
4
6
VOUT, OUTPUT VOLT-
AGE (1 V/DIV) VIN, INPUT VOLTAGE
(2 V/DIV)
TIME (10 ms/DIV)
Figure 29.
VIN = 0 V to 6 V,
COUT = 0 mF,
IOUT = 1 mA, TA = 25°C,
trise = 30 ms
Turn−Off Response
The Turn−Off response time is directly proportional to the
output capacitor value and inversely proportional to the load
value.
The NCV51460 device does not have any dedicated
internal circuitry to discharge the output capacitor when the
input voltage is turned−off or disconnected. This is why
when la rge output capacitors are used and very small output
current is drawn, it can take a considerable amount of time
to discharge the capacitor. If short turn−off times are
required, the output capacitor value should be minimized i.e.
with no output capacitor a 20 ms turn−off time can be
achieved.
Protection Features
The NCV51460 device is equipped with reverse input
voltage protection which will help to protect the device
when Input voltage polarity is reversed. In this circumstance
the Input current will be minimized to typically less than
0.1 mA.
The short circuit protection will protect the device under
the condition that the VOUT is suddenly shorted to ground.
The short circuit protection will work properly up to an Input
Voltage of 27 V at TA = 25°C. Depending on the PCB trace
width and thickness, air flow and process spread this value
can be slightly different and should be confirmed in the end
application.
No external voltage source should be connected directly
to the VOUT pin of NCV51460 regulator. If the external
source forces the output voltage to be greater than the
nominal output voltage level, the current will start to flow
from the Voltage Source to the VOUT pin. This current will
increase with the Output Voltage applied and can cause
damage to the device if VOUT > 10 V Typ. at 25°C
(Figure 30).
0
4
8
12
16
20
24
34567891
0
I
O
, CURRENT INTO V
OUT
PIN (mA)
VOUT, OUTPUT VOLTAGE (V)
Figure 30.
COUT = 0 mF,
TA = 25°C
Output Noise
The NCV51460 Output Voltage Noise strongly depends
on the output capacitor value and load value. This is caused
by the fact that the bandwidth of the Reference is inversely
proportional to t h e capacitor value and directly proportional
to the output current. The Reference bandwidth directly
determines the point where the output voltage noise starts to
fall. This can be observed at the Figure 31 below.
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
10 100 1000 10k 100k 1M
Vn, OUTPUT VOLTAGE NOISE (mVrms/rtHz)
f, FREQUENCY (Hz)
Figure 31.
COUT = 0.1 mF
VIN = 5.8 V
IOUT = 0 mA,
COUT = 0 − 10 mF MLCC,
TA = 25°C
COUT = 0 mF
COUT = 1.0 mF
COUT = 10 mF
NCV51460
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10
The peaks which are visible on the noise spectrum are
reflecting the stability of the NCV51460 device. In the
comparison in Figure 31 it can be noticed that 0 mF and
10 mF cases represents the best stability.
Thermal Characteristics
As power dissipation in the NCV51460 increases, it may
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. The board material
and the ambient temperature affect the rate of junction
temperature rise for the part. The maximum power
dissipation the NCV51460 can handle is given by:
PD(MAX) +[TJ(MAX) *TA]
RqJA (eq. 1)
Since T J is not recommended to exceed 100°C (TJ(MAX)),
then the NCV51460 can dissipate up to 305 mW when the
ambient temperature (TA) is 25°C.
The power dissipated by the NCV51460 can be calculated
from the following equations:
PD[VIN(IQ@IOUT))IOUT(VIN *VOUT)(eq. 2)
or
VIN(MAX) [PD(MAX) )(VOUT @IOUT)
IOUT )IQ(eq. 3)
PCB Layout Recommendations
VIN and GND printed circuit board traces should be as
wide as possible. When the impedance of these traces is
high, there is a chance to pick up noise and cause the
regulator to malfunction. Place external components,
especially the output capacitor, as close as possible to the
NCV51460, and make traces as short as possible.
ORDERING INFORMATION
Device Marking Package Shipping†
NCV51460SN33T1G JJ SOT−23
(Pb−Free) 3,000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
NCV51460
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11
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AP
D
A1
3
12
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
ǒmm
inchesǓ
SCALE 10:1
0.8
0.031
0.9
0.035
0.95
0.037
0.95
0.037
2.0
0.079
VIEW C
L
0.25
L1
q
e
EE
b
A
SEE VIEW C
DIM
AMIN NOM MAX MIN
MILLIMETERS
0.89 1.00 1.11 0.035
INCHES
A1 0.01 0.06 0.10 0.001
b0.37 0.44 0.50 0.015
c0.09 0.13 0.18 0.003
D2.80 2.90 3.04 0.110
E1.20 1.30 1.40 0.047
e1.78 1.90 2.04 0.070
L0.10 0.20 0.30 0.004
0.040 0.044
0.002 0.004
0.018 0.020
0.005 0.007
0.114 0.120
0.051 0.055
0.075 0.081
0.008 0.012
NOM MAX
L1
H
2.10 2.40 2.64 0.083 0.094 0.104
HE0.35 0.54 0.69 0.014 0.021 0.029
c
0 −−− 10 0 −−− 10
q°°°°
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
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