13PD300-TO
829 Flynn Road, Camarillo, CA 93012 • Phone: (805) 445-4500 • Fax: (805) 445-4502
Email: customerservice@telcomdevices.com • Website: www.telcomdevices.com
Sheet 1 of 3
Sheet 1 of 3
The 35PD300-TO, an InGaAs photodiode with a 300µm-diameter photosensitive region packaged in a TO-
46 header. This device is one of Telcom Devices' most versatile optoelectronic components, with
applications in high sensitivity instrumentation, laser back-facet monitoring, and moderate-bit-rate
telecomm and datacomm transmission.. Planar semiconductor design and dielectric passivation provide
superior noise performance. Reliability is assured by hermetic sealing and 100% purge burn-in (200°C, 15
hours, Vr = 20V). Headers are available with either a lensed or flat window cap. Chips can also be attached
and wire bonded to customer-supplied or other specified packages.
All Purpose InGaAs p-i-n Photodiode
Features:
• Planar Structure
• Dielectric Passivation
• 100% Purge Burn-in
• High Responsivity
Operating Voltage
Dark Current
Capacitance
Responsivity
Responsivity
Rise/Fall
Volts
nA
pF
A/W
ns
–15
10
3
4
0.9
1
0.75
–5V
–5V
1300nm
1500nm
Parameters Test Conditions Minimum
DEVICE CHARACTERISTICS
Typical Maximum Units
Reverse Voltage
Forward Current
Reverse Current
Operating Temperature
Storage Temperature
Soldering Temperature
20 Volts
25 mA
5 mA
–40°C to +85°C
–40°C to +85°C
250°C
ABSOLUTE MAXIMUM RATINGS
Standard TO-46 Lens
829 Flynn Road, Camarillo, CA 93012 • Phone: (805) 445-4500 • Fax: (805) 445-4502
Email: customerservice@telcomdevices.com • Website: www.telcomdevices.com
Sheet 2 of 3
Sheet 2 of 3
Mechanical Specifications
TO-46 Header Packages
Custom packaging is also available.
0.210
0.184
0.030
0.144
1.00
0.017 3X
0.050
0.040
0.040
22.5°CASE
CATHODE
(BIAS +)
ANODE
(BIAS –)
LENS
CHIP
TO-46 Ultra Flat Window
829 Flynn Road, Camarillo, CA 93012 • Phone: (805) 445-4500 • Fax: (805) 445-4502
Email: customerservice@telcomdevices.com • Website: www.telcomdevices.com
Sheet 3 of 3
Sheet 3 of 3
Mechanical Specifications
TO-46 Header Packages
Custom packaging is also available.
0.100 [2.54]
0.185 [4.70]
0.212 [5.38]
0.125 [3.17]
0.011 [0.28]
1.0 [25.4]
0.011 [0.28]
0.015 [0.38] TYP. 0.019 MAX.
WINDOW SURFACE TO CHIP SURFACE
CATHODE (BIAS +)
45°
CASE/GND
0.05 [1.27] 0.040 [1.02]
0.017 [0.43] 3X
0.05 [1.27]
0.049 [1.25] φ REF.
ANODE(BIAS –)
0.015 [0.38] TYP. 0.019 MAX
CHIP
A
- A -
NOT TO SCALE