[ /Title (CD74 HC192 , CD74 HC193 , CD74 HCT19 3) /Subject (High Speed CMOS Logic Preset- CD54/74HC192, CD54/74HC193, CD54/74HCT193 Data sheet acquired from Harris Semiconductor SCHS163F September 1997 - Revised October 2003 High-Speed CMOS Logic Presettable Synchronous 4-Bit Up/Down Counters Features Presetting the counter to the number on the preset data inputs (P0-P3) is accomplished by a LOW asynchronous parallel load input (PL). The counter is incremented on the low-to-high transition of the Clock-Up input (and a high level on the ClockDown input) and decremented on the low to high transition of the Clock-Down input (and a high level on the Clock-up input). A high level on the MR input overrides any other input to clear the counter to its zero state. The Terminal Count up (carry) goes low half a clock period before the zero count is reached and returns to a high level at the zero count. The Terminal Count Down (borrow) in the count down mode likewise goes low half a clock period before the maximum count (9 in the 192 and 15 in the 193) and returns to high at the maximum count. Cascading is effected by connecting the carry and borrow outputs of a less significant counter to the Clock-Up and Clock-Down inputs, respectively, of the next most significant counter. * Synchronous Counting and Asynchronous Loading * Two Outputs for N-Bit Cascading * Look-Ahead Carry for High-Speed Counting * Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads * Wide Operating Temperature Range . . . -55oC to 125oC * Balanced Propagation Delay and Transition Times * Significant Power Reduction Compared to LSTTL Logic ICs * HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V If a decade counter is preset to an illegal state or assumes an illegal state when power is applied, it will return to the normal sequence in one count as shown in state diagram. * HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il 1A at VOL, VOH Ordering Information PART NUMBER Description The 'HC192, 'HC193 and 'HCT193 are asynchronously presettable BCD Decade and Binary Up/Down synchronous counters, respectively. Pinout CD54HC192, CD54HC193, CD54HCT193 (CERDIP) CD74HC192 (PDIP, SOP, TSSOP) CD74HC193 (PDIP, SOIC) CD74HCT193 (PDIP) TOP VIEW P1 1 16 VCC Q1 2 15 P0 Q0 3 14 MR CPD 4 13 TCD CPU 5 12 TCU Q2 6 11 PL Q3 7 10 P2 GND 8 9 P3 (c) 2003, Texas Instruments Incorporated PACKAGE CD54HC192F3A -55 to 125 16 Ld CERDIP CD54HC193F3A -55 to 125 16 Ld CERDIP CD54HCT193F3A -55 to 125 16 Ld CERDIP CD74HC192E -55 to 125 16 Ld PDIP CD74HC192NSR -55 to 125 16 Ld SOP CD74HC192PW -55 to 125 16 Ld TSSOP CD74HC192PWR -55 to 125 16 Ld TSSOP CD74HC192PWT -55 to 125 16 Ld TSSOP CD74HC193E -55 to 125 16 Ld PDIP CD74HC193M -55 to 125 16 Ld SOIC CD74HC193MT -55 to 125 16 Ld SOIC CD74HC193M96 -55 to 125 16 Ld SOIC CD74HCT193E -55 to 125 16 Ld PDIP NOTE: When ordering, use the entire part number. The suffixes 96 and R denote tape and reel. The suffix T denotes a small-quantity reel of 250. CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright TEMP. RANGE (oC) 1 CD54/74HC192, CD54/74HC193, CD54/74HCT193 Functional Diagram BCD/BINARY PRESET P0 15 ASYN. PARALLEL LOAD ENABLE PL P1 1 P2 10 P3 9 3 11 Q0 2 MASTER 14 RESET CLOCK UP CLOCK DOWN Q1 6 Q2 7 5 BCD (192) BINARY (193) OUTPUTS Q3 12 TERMINAL COUNT UP 13 TERMINAL COUNT DOWN 4 TRUTH TABLE CLOCK UP CLOCK DOWN RESET PARALLEL LOAD H L H Count Up H L H Count Down X X H X Reset X X L L Load Preset Inputs FUNCTION H = High Voltage Level, L = Low Voltage Level, X = Don't Care, = Transition from Low to High Level 2 CD54/74HC192, CD54/74HC193, CD54/74HCT193 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .20mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .25mA DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .50mA Package Thermal Impedance, JA (see Note 1): E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67oC/W M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73oC/W NS (SOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64oC/W PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . 108oC/W Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. The package thermal impedance is calculated in accordance with JESD 51-7. DC Electrical Specifications TEST CONDITIONS PARAMETER SYMBOL VI (V) VIH - 25oC IO (mA) VCC (V) -40oC TO 85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 2 1.5 - - 1.5 - 1.5 - V 4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V HC TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads VIL VOH - VIH or VIL High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current - - 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V -0.02 2 1.9 - - 1.9 - 1.9 - V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -0.02 6 5.9 - - 5.9 - 5.9 - V -4 4.5 3.98 - - 3.84 - 3.7 - V -5.2 6 5.48 - - 5.34 - 5.2 - V 0.02 2 - - 0.1 - 0.1 - 0.1 V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 0.02 6 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V 5.2 6 - - 0.26 - 0.33 - 0.4 V II VCC or GND - 6 - - 0.1 - 1 - 1 A ICC VCC or GND 0 6 - - 8 - 80 - 160 A 3 CD54/74HC192, CD54/74HC193, CD54/74HCT193 DC Electrical Specifications (Continued) TEST CONDITIONS SYMBOL VI (V) High Level Input Voltage VIH - - Low Level Input Voltage VIL - High Level Output Voltage CMOS Loads VOH VIH or VIL PARAMETER 25oC IO (mA) VCC (V) -40oC TO 85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 4.5 to 5.5 2 - - 2 - 2 - V - 4.5 to 5.5 - - 0.8 - 0.8 - 0.8 V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -4 4.5 3.98 - - 3.84 - 3.7 - V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V HCT TYPES High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load II VCC to GND - 5.5 - - 0.1 - 1 - 1 A ICC VCC or GND - 5.5 - - 8 - 80 - 160 A ICC (Note 2) VCC - 2.1 - 4.5 to 5.5 - 100 360 - 450 - 490 A NOTE: 2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. HCT Input Loading Table INPUT UNIT LOADS P0-P3 0.4 MR 1.45 PL 0.85 CPU, CPD 1.45 NOTE: Unit Load is ICC limit specified in DC Electrical Specifications table, e.g. 360A max at 25oC. 4 CD54/74HC192, CD54/74HC193, CD54/74HCT193 Prerequisite For Switching Specifications PARAMETER SYMBOL HC TYPES Pulse Width tW CPU, CPD 192 tW CPU, CPD 193 PL tW MR tW Set-up Time tSU Pn to PL Hold Time tH Pn to PL Hold Time tH CPD to CPU or CPU to CPD Recovery Time tREC PL to CPU, CPD MR to CPU, CPD tREC Maximum Frequency fMAX CPU, CPD 192 fMAX CPU, CPD 193 HCT TYPES Pulse Width tW CPU, CPD 192 CPU, CPD tW 193 25oC -40oC TO 85oC -55oC TO 125oC VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS 2 115 - - 145 - 175 - ns 4.5 23 - - 29 - 35 - ns 6 20 - - 25 - 30 - ns 2 100 - - 125 - 150 - ns 4.5 20 - - 25 - 30 - ns 6 17 - - 21 - 26 - ns 2 80 - - 100 - 120 - ns 4.5 16 - - 20 - 24 - ns 6 14 - - 17 - 20 - ns 2 100 - - 125 - 150 - ns 4.5 20 - - 25 - 30 - ns 6 17 - - 21 - 26 - ns 2 80 - - 100 - 120 - ns 4.5 16 - - 20 - 24 - ns 6 14 - - 17 - 20 - ns 2 0 - - 0 - 0 - ns 4.5 0 - - 0 - 0 - ns 6 0 - - 0 - 0 - ns 2 80 - - 100 - 120 - ns 4.5 16 - - 20 - 24 - ns 6 14 - - 17 - 20 - ns 2 80 - - 100 - 120 - ns 4.5 16 - - 20 - 24 - ns 6 14 - - 17 - 20 - ns 2 5 - - 5 - 5 - ns 4.5 5 - - 5 - 5 - ns 6 5 - - 5 - 5 - ns 2 5 - - 4 - 3 - MHz 4.5 22 - - 18 - 15 - MHz 6 24 - - 21 - 18 - MHz 2 5 - - 4 - 3 - MHz 4.5 25 - - 20 - 17 - MHz 6 29 - - 24 - 20 - MHz 2 - - - - - - - ns 4.5 23 - - 29 - 35 - ns 6 - - - - - - - ns 2 - - - - - - - ns 4.5 23 - - 29 - 35 - ns 6 - - - - - - - ns 5 CD54/74HC192, CD54/74HC193, CD54/74HCT193 Prerequisite For Switching Specifications PARAMETER SYMBOL PL VCC (V) tW MR Hold Time Hold Time MR to CPU, CPD - - - - ns - 24 - ns 6 - - - - - - - ns 2 - - - - - - - ns 4.5 20 - - 25 - 30 - ns 6 - - - - - - - ns 2 - - - - - - - ns 4.5 15 - - 19 - 22 - ns 6 - - - - - - - ns 2 - - - - - - - ns 4.5 0 - - 0 - 0 - ns 6 - - - - - - - ns 2 - - - - - - - ns 4.5 16 - - 20 - 24 - ns 6 - - - - - - - ns 2 - - - - - - - ns 4.5 15 - - 19 - 22 - ns 6 - - - - - - - ns 2 - - - - - - - ns 4.5 5 - - 5 - 5 - ns 6 - - - - - - - ns 2 - - - - - - - MHz 4.5 22 - - 18 - 15 - MHz 6 - - - - - - - MHz fMAX 193 Switching Specifications PARAMETER HC TYPES Propagation Delay CPU to Qn 2 - - - - - - - MHz 4.5 22 - - 18 - 15 - MHz 6 - - - - - - - MHz Input tr, tf = 6ns SYMBOL tPLH, tPHL CPU to TCU CPD to TCD UNITS 20 192 CPU, CPD MAX - fMAX CPU, CPD MIN - tREC Maximum Frequency MAX - tREC PL to CPU, CPD MIN - CPU to CPD Recovery Time MAX - tH CPD to CPU or TYP -55oC TO 125oC 16 tH Pn to PL MIN -40oC TO 85oC 2 tSU Pn to PL 25oC 4.5 tW Set-up Time (Continued) tPLH, tPHL tPLH, tPHL TEST CONDITIONS 25oC -40oC TO 85oC -55oC TO 125oC VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS CL = 50pF 2 - - 125 - 155 - 190 ns CL = 50pF 4.5 - - 25 - 31 - 38 ns CL = 15pF 5 - 10 - - - - - ns CL = 50pF 6 - 21 - 26 - 32 ns CL = 50pF 2 - - 125 - 155 - 190 ns CL = 50pF 4.5 - - 25 - 31 - 38 ns CL = 15pF 5 - 10 - - - - - ns CL = 50pF 6 - - 21 - 26 - 32 ns CL = 50pF 2 - - 220 - 270 - 325 ns CL = 50pF 4.5 - - 43 - 54 - 65 ns CL = 15pF 5 - 18 - - - - - ns CL = 50pF 6 - - 37 - 46 - 55 ns 6 CD54/74HC192, CD54/74HC193, CD54/74HCT193 Switching Specifications PARAMETER CPD to Qn PL to Qn MR to Qn Transition Time Input tr, tf = 6ns (Continued) SYMBOL tPLH, tPHL CL = 50pF 2 CL = 50pF 4.5 CL = 15pF 5 - CL = 50pF 6 - CL = 50pF 2 - CL = 50pF 4.5 CL = 15pF 5 CL = 50pF 6 tPLH, tPHL tPHL tTLH, tTHL VCC (V) 25oC TEST CONDITIONS MIN -40oC TO 85oC -55oC TO 125oC TYP MAX MIN MAX MIN MAX UNITS - - 220 - 270 - 325 ns - - 43 - 54 - 65 ns 18 - - - - - 37 - 46 - 55 ns - 220 - 275 - 330 ns - - 44 - 55 - 66 ns - 18 - - - - - ns - - 37 - 47 - 56 ns ns CL = 50pF 2 - - 200 - 250 - 300 ns CL = 50pF 4.5 - - 40 - 50 - 60 ns CL = 15pF 5 - 17 - - - - - ns CL = 50pF 6 - - 34 - 43 - 51 ns CL = 50pF 2 - - 75 - 95 - 110 ns 4.5 - - 15 - 19 - 22 ns 6 - - 13 - 16 - 19 ns Q, TCU, TCD Input Capacitance CIN CL = 50pF - - - 10 - 10 - 10 pF Power Dissipation Capacitance (Notes 3, 4) CPD CL = 15pF 5 - 40 - - - - - pF CL = 50pF 4.5 - - 27 - 34 - 41 ns CL = 15pF 5 - 11 - - - - - ns CL = 50pF 4.5 - - 27 - 34 - 41 ns HCT TYPES Propagation Delay tPLH, tPHL CPU to TCU CPU to TCD tPLH, tPHL CPU to Qn tPLH, tPHL CPD to Qn tPLH, tPHL PL to Qn MR to Qn Transition Time tPLH, tPHL tPHL tTLH, tTHL CL = 15pF 5 - 11 - - - - - ns CL = 50pF 4.5 - - 40 - 50 - 60 ns CL = 15pF 5 - 17 - - - - - ns CL = 50pF 4.5 - - 40 - 50 - 60 ns CL = 15pF 5 - 17 - - - - - ns CL = 50pF 4.5 - - 46 - 58 - 69 ns CL = 15pF 5 - 21 - - - - - ns CL = 50pF 4.5 - - 43 - 54 - 65 ns CL = 15pF 5 - 18 - - - - - ns CL = 50pF 4.5 - - 15 - 19 - 22 ns Input Capacitance Q, TCU, TCD CIN CL = 50pF - - - 10 - 10 - 10 pF Power Dissipation Capacitance (Notes 3, 4) CPD CL = 15pF 5 - 50 - - - - - pF NOTES: 3. CPD is used to determine the dynamic power consumption, per gate. 4. PD = VCC2 fi + (CL VCC2) where fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage. 7 CD54/74HC192, CD54/74HC193, CD54/74HCT193 Test Circuits and Waveforms MASTER RESET ASYNCHRONOUS PARALLEL LOAD P0 PRESET DATA P1 P2 P3 SEQUENCES: 1. RESET OUTPUTS TO ZERO. CLOCK UP 2. LOAD (PRESET) TO BCD SEVEN. 3. COUNT UP TO EIGHT, NINE, CLOCK DOWN TERMINAL COUNT UP, ZERO, ONE AND TWO. Q0 4. COUNT DOWN TO ONE, ZERO, TERMINAL COUNT DOWN, NINE, Q1 EIGHT AND SEVEN. OUTPUTS Q2 Q3 TERMINAL COUNT UP TERMINAL COUNT DOWN 0 8 7 RESET PRESET 9 0 1 COUNT UP 2 1 0 9 8 7 COUNT DOWN FIGURE 1. 'HC192 SYNCHRONOUS DECADE COUNTERS, TYPICAL RESET, PRESET AND COUNT SEQUENCES 8 CD54/74HC192, CD54/74HC193, CD54/74HCT193 Test Circuits and Waveforms (Continued) MASTER RESET ASYNCHRONOUS PARALLEL LOAD P0 P1 PRESET DATA P2 P3 SEQUENCES: 1. RESET OUTPUTS TO ZERO. 2. LOAD (PRESET) TO BINARY THIRTEEN. CLOCK UP 3. COUNT UP TO FOURTEEN, CLOCK DOWN FIFTEEN, TERMINAL COUNT UP, ZERO, ONE AND TWO. 4. COUNT DOWN TO ONE, ZERO, Q0 TERMINAL COUNT DOWN, FIFTEEN, FOURTEEN AND Q1 THIRTEEN. OUTPUTS Q2 Q3 TERMINAL COUNT UP TERMINAL COUNT DOWN 0 NOTES: 1. Master reset overrides load data and clock inputs. 14 13 RESET PRESET 15 0 1 2 1 COUNT UP 0 15 14 13 COUNT DOWN 2. When counting up, clock-down input must be high. When counting down, clock-up input must be high. FIGURE 2. 'HC193 SYNCHRONOUS BINARY COUNTERS, TYPICAL RESET, PRESET AND COUNT SEQUENCES l/fMAX CPU OR CPD VS VS VS INPUT LEVEL INPUT LEVEL CPU OR CPD VS VS tW tPHL VS Qn VS FIGURE 4. CLOCK TO TERMINAL COUNT DELAYS INPUT LEVEL Pn tW VS tW VS VS VS tREC CPU OR CPD Qn VS TCU OR TCD VS FIGURE 3. CLOCK TO OUTPUT DELAYS AND CLOCK PULSE WIDTH PL tPLH tPHL tPLH MR INPUT LEVEL VS VS VS CPU OR CPD INPUT LEVEL VS tPHL Qn VS FIGURE 5. PARALLEL LOAD PULSE WIDTH, PARALLEL LOAD TO OUTPUT DELAYS, AND PARALLEL LOAD TO CLOCK RECOVERY TIME INPUT LEVEL tREC tW tPHL tPLH VS VS INPUT LEVEL FIGURE 6. MASTER RESET PULSE WIDTH, MASTER RESET TO OUTPUT DELAY AND MASTER RESET TO CLOCK RECOVERY TIME 9 Test Circuits and Waveforms (Continued) VS Pn tSU(H) PL Qn tH tSU(L) VS INPUT LEVEL tH VS INPUT LEVEL Q=p Q=p FIGURE 7. SET-UP AND HOLD TIMES DATA TO PARALLEL LOAD (PL) DATA INPUT UP CLOCK DOWN CLOCK ASYNCHRONOUS, PARALLEL LOAD P0 P1 P2 P3 TCU CPU TCD CPD PL MR Q0 Q1 Q2 Q3 P0 P1 P2 P3 TCU CPU TCD CPD PL MR Q0 Q1 Q2 Q3 BORROW CARRY RESET OUTPUT FIGURE 8. CASCADED UP/DOWN COUNTER WITH PARALLEL LOAD 0 4 0 15 5 15 5 14 6 14 6 13 7 13 7 8 12 12 1 11 2 10 3 9 1 11 2 10 3 9 4 8 COUNT DOWN COUNT UP NOTE: Illegal states in BCD counters corrected in one count. NOTE: Illegal states in BCD counters corrected in one or two counts. FIGURE 9. 'HC192, 'HCT193 STATE DIAGRAMS 10 PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) 5962-8780801EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8780801EA CD54HC192F3A 5962-9084801MEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9084801ME A CD54HCT193F3A 9084801MEAS2035 OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 CD54HC192F3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8780801EA CD54HC192F3A CD54HC193F3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8772401EA CD54HC193F3A CD54HCT193F3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9084801ME A CD54HCT193F3A CD74HC192E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD74HC192E CD74HC192EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD74HC192E CD74HC192NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC192M CD74HC192NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC192M CD74HC192NSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC192M CD74HC192PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HJ192 CD74HC192PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HJ192 CD74HC192PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HJ192 CD74HC192PWT ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HJ192 CD74HC192PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HJ192 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 25-Sep-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) CD74HC192PWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HJ192 CD74HC193E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD74HC193E CD74HC193EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD74HC193E CD74HC193M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC193M CD74HC193M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC193M CD74HC193M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC193M CD74HC193M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC193M CD74HC193ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC193M CD74HC193MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC193M CD74HC193MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC193M CD74HC193MTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC193M CD74HC193MTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC193M CD74HCT193E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD74HCT193E CD74HCT193EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD74HCT193E (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. 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OTHER QUALIFIED VERSIONS OF CD54HC192, CD54HC193, CD54HCT193, CD74HC192, CD74HC193, CD74HCT193 : * Catalog: CD74HC192, CD74HC193, CD74HCT193 * Military: CD54HC192, CD54HC193, CD54HCT193 NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Military - QML certified for Military and Defense Applications Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD74HC192NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 CD74HC192PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 CD74HC192PWT TSSOP PW 16 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 CD74HC193M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74HC192NSR SO NS 16 2000 367.0 367.0 38.0 CD74HC192PWR TSSOP PW 16 2000 367.0 367.0 35.0 CD74HC192PWT TSSOP PW 16 250 367.0 367.0 35.0 CD74HC193M96 SOIC D 16 2500 333.2 345.9 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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