85
Product Specification – March 21, 2018 V.9
DATA SHEET
SURFACE MOUNT MULTILAYER
CERAMIC CAPACITORS
Automotive grade
NP0/X7R
6.3 V TO 630 V
0.47 pF to 2.2 µF
RoHS compliant & Halogen Free
NP0/X7R
6.3 V to 630 V
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Mar. 22, 2018 V.9
Surface-Mount Ceramic Multilayer Capacitors
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Product specification
ORDERING INFORMATION - GLOBAL PART NUMBER
All part numbers are identified by the series, size, tolerance, TC material,
packing style, voltage, process code, termination and capacitance value.
GLOBAL PART NUMBER
AC
XXXX X X XXX X
B
X XXX
(1) (2) (3) (4) (5) (6) (7)
(1) SIZE – INCH BASED (METRIC)
0201 (0603) / 0402 (1005) / 0603 (1608) / 0805 (2012) / 1206 (3216)/ 1210 (3225) /
0508 (1220) / 0612 (1632)
(2) TOLERANCE
B = ± 0.1 pF
C = ± 0.25 pF
D = ± 0.5 pF
F = ± 1%
G = ± 2%
J = ± 5%
K = ± 10%
M = ± 20%
(3) PACKING STYLE
R = Paper/PE taping reel; Reel 7 inch
K = Blister taping reel; Reel 7 inch
P = Paper/PE taping reel; Reel 13 inch
F = Blister taping reel; Reel 13 inch
(4) TC MATERIAL
NPO
X7R
(5) RATED VOLTAGE
5 = 6.3 V
6 = 10 V
7 = 16 V
8 = 25 V
9 = 50 V
0 = 100 V
A = 200 V
Y = 250 V
B = 500 V
Z = 630 V
(6) PROCESS
N = NP0
B = Class 2 MLCC
(7) CAPACITANCE VALUE
2 significant digits+number of zeros
The 3rd digit signifies the multiplying factor, and letter R is decimal point
Example: 121 = 12 x 101 = 120 pF
SCOPE
This specification describes
Automotive grade NP0/X7R series
chip capacitors with lead-free
terminations and used for
automotive equipments.
APPLICATIONS
All general purpose applications
Entertainment applications
Comfort / security applications
Information applications
FEATURES
AEC-Q200 qualified
MSL class: MSL 1
AC series soldering is
compliant with J-STD-020D
Halogen free epoxy
RoHS compliant
Reduce environmentally
hazardous waste
High component and
equipment reliability
Save PCB space
The capacitors are 100%
performed by automatic optical
inspection prior to taping.
NP0/X7R
6.3 V to 630 V
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Mar. 22, 2018 V.9
Surface-Mount Ceramic Multilayer Capacitors
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Product specification
CONSTRUCTION
The capacitor consists of a
rectangular block of ceramic
dielectric in which a number of
interleaved metal electrodes are
contained. This structure gives
rise to a high capacitance per
unit volume.
The inner electrodes are
connected to the two end
terminations and finally covered
with a layer of plated tin (Matte
Sn). The terminations are lead-
free. A cross section of the
structure is shown in Fig.1.
Fig. 1 Surface mounted multilayer ceramic capacitor construction
TYPE
L1 (mm)
W (mm)
T (MM)
L2 / L3 (mm)
L4 (mm)
min.
max.
min.
0201
0.6 ± 0.03
0.3 ± 0.03
Refer to
table 3 to 12
0.10
0.20
0.20
0402
1.0 ± 0.05
0.5 ± 0.05
0.15
0.30
0.40
0603
1.6 ± 0.10
0.8 ± 0.10
0.20
0.60
0.40
0805
2.0 ± 0.20
1.25 ± 0.20
0.25
0.75
0.70
1206
3.2 ± 0.30
1.6 ± 0.20
0.25
0.75
1.40
1210
3.2 ± 0.30
2.5 ± 0.20
0.25
0.75
1.40
1812
4.5± 0.40
3.2± 0.40
0.25
0.75
2.20
Table 1 For outlines see fig. 2
DIMENSION
O
OU
UT
TL
LI
IN
NE
ES
S
For dimension see Table 1
Fig. 2 Surface mounted multilayer
ceramic capacitor dimension
O
OU
UT
TL
LI
IN
NE
ES
S
For dimensions see Table 2
Fig. 3 Surface mounted multilayer ceramic capacitor dimension
TYPE
0508
(4 X 0402)
0612
(4 X 0603)
L (mm)
2.0 ± 0.15
3.2 ± 0.15
W (mm)
1.25 ± 0.15
1.60 ± 0.15
Tmin. (mm)
0.50
0.70
Tmax. (mm)
0.70
0.90
A (mm)
0.28 ± 0.10
0.4 ± 0.10
B (mm)
0.2 ± 0.10
0.3 ± 0.20
P (mm)
0.5 ± 0.10
0.8 ± 0.10
Table 2 For outlines see fig. 3
NP0/X7R
6.3 V to 630 V
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Surface-Mount Ceramic Multilayer Capacitors
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Product specification
CAPACITANCE RANGE & THICKNESS FOR NP0
Table 3 Sizes from 0402 to 0805
CAP.
0603
50 V
250 V
100 V
0.47 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
0.56 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
0.68 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
0.82 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
1.0 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
1.2 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
1.5 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
1.8 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
2.2 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
2.7 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
3.3 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
3.9 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
4.7 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
5.6 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
6.8 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
8.2 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
10 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
12 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
15 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
18 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
22 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
27 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
33 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
39 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
47 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
56 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
68 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
82 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
100 pF
0.8± 0.1
0.8± 0.1
0.6± 0.1
NOTE
1. Values in shaded cells indicate thickness class in mm
NP0/X7R
6.3 V to 630 V
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Surface-Mount Ceramic Multilayer Capacitors
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Product specification
CAPACITANCE RANGE & THICKNESS FOR NP0
Table 4 Sizes from 0402 to 0805 (continued)
CAP.
0402
0603
0805
50 V
50 V
100 V
250 V
50 V
100 V
250 V
120 pF
0.5± 0.05
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.6± 0.1
0.6± 0.1
0.6± 0.1
150 pF
0.5± 0.05
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.6± 0.1
0.6± 0.1
0.6± 0.1
180 pF
0.5± 0.05
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.6± 0.1
0.6± 0.1
0.6± 0.1
220 pF
0.5± 0.05
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.6± 0.1
0.6± 0.1
0.85± 0.1
270 pF
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.6± 0.1
0.6± 0.1
0.85± 0.1
330 pF
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.6± 0.1
0.6± 0.1
0.85± 0.1
390 pF
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.6± 0.1
0.6± 0.1
0.85± 0.1
470 pF
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.6± 0.1
0.6± 0.1
0.85± 0.1
560 pF
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.6± 0.1
0.85± 0.1
0.85± 0.1
680 pF
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.6± 0.1
0.85± 0.1
0.85± 0.1
820 pF
0.6± 0.1
0.85± 0.1
0.85± 0.1
1.0 nF
0.8± 0.1
0.6± 0.1
0.85± 0.1
0.85± 0.1
NOTE
Values in shaded cells indicate thickness class in mm
NP0/X7R
6.3 V to 630 V
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Surface-Mount Ceramic Multilayer Capacitors
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Product specification
CAPACITANCE RANGE & THICKNESS FOR NP0
Table 5 Sizes from 1206 to 1210
CAP.
1206
1210
50 V
100 V
250 V
500 V
630 V
50 V
100 V
250 V
500 V
10 pF
0.6± 0.1
0.6± 0.1
0.6± 0.1
0.6± 0.1
1.25± 0.2
12 pF
0.6± 0.1
0.6± 0.1
0.6± 0.1
0.6± 0.1
1.25± 0.2
15 pF
0.6± 0.1
0.6± 0.1
0.6± 0.1
0.6± 0.1
1.25± 0.2
18 pF
0.6± 0.1
0.6± 0.1
0.6± 0.1
0.6± 0.1
1.25± 0.2
22 pF
0.6± 0.1
0.6± 0.1
0.6± 0.1
0.6± 0.1
1.25± 0.2
27 pF
0.6± 0.1
0.6± 0.1
0.6± 0.1
0.6± 0.1
1.25± 0.2
33 pF
0.6± 0.1
0.6± 0.1
0.6± 0.1
0.6± 0.1
1.25± 0.2
39 pF
0.6± 0.1
0.6± 0.1
0.6± 0.1
0.6± 0.1
1.25± 0.2
47 pF
0.6± 0.1
0.6± 0.1
0.6± 0.1
0.6± 0.1
1.25± 0.2
56 pF
0.6± 0.1
0.6± 0.1
0.6± 0.1
0.6± 0.1
1.25± 0.2
68 pF
0.6± 0.1
0.6± 0.1
0.6± 0.1
0.6± 0.1
1.25± 0.2
82 pF
0.6± 0.1
0.6± 0.1
0.6± 0.1
0.6± 0.1
1.25± 0.2
100 pF
0.6± 0.1
0.6± 0.1
0.6± 0.1
0.6± 0.1
1.25± 0.2
120 pF
0.6± 0.1
0.6± 0.1
0.6± 0.1
0.6± 0.1
1.25± 0.2
150 pF
0.6± 0.1
0.6± 0.1
0.6± 0.1
0.6± 0.1
1.25± 0.2
180 pF
0.6± 0.1
0.6± 0.1
0.6± 0.1
0.6± 0.1
1.25± 0.2
220 pF
0.6± 0.1
0.6± 0.1
0.6± 0.1
0.6± 0.1
1.25± 0.2
270 pF
0.6± 0.1
0.6± 0.1
0.6± 0.1
0.6± 0.1
1.25± 0.2
330 pF
0.6± 0.1
0.6± 0.1
0.6± 0.1
0.6± 0.1
1.25± 0.2
390 pF
0.6± 0.1
0.6± 0.1
0.6± 0.1
0.6± 0.1
1.25± 0.2
470 pF
0.6± 0.1
0.6± 0.1
0.6± 0.1
0.6± 0.1
1.25± 0.2
560 pF
0.6± 0.1
0.6± 0.1
0.6± 0.1
0.6± 0.1
1.25± 0.2
680 pF
0.6± 0.1
0.6± 0.1
0.6± 0.1
0.6± 0.1
1.25± 0.2
820 pF
0.6± 0.1
0.6± 0.1
0.85± 0.1
0.85± 0.1
1.25± 0.2
1.0 nF
0.6± 0.1
0.6± 0.1
0.85± 0.1
0.85± 0.1
1.25± 0.2
1.25± 0.2
1.25± 0.2
1.25± 0.2
1.25± 0.2
1.2 nF
0.6± 0.1
0.6± 0.1
0.85± 0.1
1.25± 0.2
1.25± 0.2
1.25± 0.2
1.25± 0.2
1.5 nF
0.6± 0.1
0.6± 0.1
0.85± 0.1
1.25± 0.2
1.25± 0.2
1.25± 0.2
1.25± 0.2
1.8 nF
0.6± 0.1
0.6± 0.1
1.25± 0.2
1.25± 0.2
1.25± 0.2
1.25± 0.2
2.2 nF
0.6± 0.1
0.6± 0.1
1.25± 0.2
1.25± 0.2
1.25± 0.2
2.7 nF
0.6± 0.1
0.6± 0.1
1.25± 0.2
1.25± 0.2
1.25± 0.2
NOTE
Values in shaded cells indicate thickness class in mm
NP0/X7R
6.3 V to 630 V
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Surface-Mount Ceramic Multilayer Capacitors
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Product specification
Table 6 Sizes from 0201 to 0603
CAPACITANCE RANGE & THICKNESS FOR X7R
CAP.
0201
0402
0603
25V
10V
16 V
25 V
50 V
10V
16 V
25 V
50 V
100 V
100 pF
0.3± 0.03
150 pF
0.3± 0.03
220 pF
0.3± 0.03
0.5± 0.05
0.5± 0.05
0.5± 0.05
0.5± 0.05
330 pF
0.3± 0.03
0.5± 0.05
0.5± 0.05
0.5± 0.05
0.5± 0.05
470 pF
0.3± 0.03
0.5± 0.05
0.5± 0.05
0.5± 0.05
0.5± 0.05
680 pF
0.3± 0.03
0.5± 0.05
0.5± 0.05
0.5± 0.05
0.5± 0.05
1.0 nF
0.3± 0.03
0.5± 0.05
0.5± 0.05
0.5± 0.05
0.5± 0.05
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
1.5 nF
0.3± 0.03
0.5± 0.05
0.5± 0.05
0.5± 0.05
0.5± 0.05
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
2.2 nF
0.3± 0.03
0.5± 0.05
0.5± 0.05
0.5± 0.05
0.5± 0.05
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
3.3 nF
0.3± 0.03
0.5± 0.05
0.5± 0.05
0.5± 0.05
0.5± 0.05
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
4.7 nF
0.3± 0.03
0.5± 0.05
0.5± 0.05
0.5± 0.05
0.5± 0.05
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
6.8 nF
0.3± 0.03
0.5± 0.05
0.5± 0.05
0.5± 0.05
0.5± 0.05
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
10 nF
0.3± 0.03
0.5± 0.05
0.5± 0.05
0.5± 0.05
0.5± 0.05
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
15 nF
0.5± 0.05
0.5± 0.05
0.5± 0.05
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
22 nF
0.5± 0.05
0.5± 0.05
0.5± 0.05
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
33 nF
0.5± 0.05
0.5± 0.05
0.5± 0.05
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
47 nF
0.5± 0.05
0.5± 0.05
0.5± 0.05
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
68 nF
0.5± 0.05
0.5± 0.05
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
100 nF
0.5± 0.05
0.5± 0.05
0.5± 0.05
0.5± 0.05
0.8± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
150 nF
0.8± 0.1
0.8± 0.1
220 nF
0.8± 0.1
0.8± 0.1
0.8± 0.1
330 nF
0.8± 0.1
0.8± 0.1
470 nF
0.8± 0.1
0.8± 0.1
680 nF
1 µF
0.8± 0.1
NOTE
Values in shaded cells indicate thickness class in mm
NP0/X7R
6.3 V to 630 V
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Surface-Mount Ceramic Multilayer Capacitors
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Product specification
CAPACITANCE RANGE & THICKNESS FOR X7R
Table 8 Size 0805
CAP.
0805
10 V
16 V
25 V
50 V
100 V
250 V
500 V
1.0 nF
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
1.5 nF
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
2.2 nF
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
3.3 nF
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
4.7 nF
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
6.8 nF
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
1.25± 0.2
10 nF
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
1.25± 0.2
15 nF
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
1.25± 0.2
22 nF
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
1.25± 0.2
33 nF
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
1.25± 0.2
47 nF
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
1.25± 0.2
68 nF
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
1.25± 0.2
1.25± 0.2
100 nF
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
1.25± 0.2
1.25± 0.2
150 nF
0.85± 0.1
0.85± 0.1
0.85± 0.1
1.25± 0.2
220 nF
0.85± 0.1
0.85± 0.1
0.85± 0.1
1.25± 0.2
330 nF
1.25± 0.2
1.25± 0.2
1.25± 0.2
1.25± 0.2
470 nF
1.25± 0.2
1.25± 0.2
1.25± 0.2
1.25± 0.2
680 nF
1.25± 0.2
1.25± 0.2
1.25± 0.2
1 µF
1.25± 0.2
1.25± 0.2
1.25± 0.2
2.2 µF
1.25± 0.2
NOTE
Values in shaded cells indicate thickness class in mm
NP0/X7R
6.3 V to 630 V
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Surface-Mount Ceramic Multilayer Capacitors
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Product specification
Table 9 Size 1206
CAPACITANCE RANGE & THICKNESS FOR X7R
CAP.
1206
6.3 V
10V
16V
25V
50 V
100 V
250 V
22 nF
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
1.25± 0.2
33 nF
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
47 nF
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
68 nF
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
1.25± 0.2
100 nF
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
1.25± 0.2
150 nF
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
1.25± 0.2
1.25± 0.2
220 nF
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
1.25± 0.2
1.25± 0.2
330 nF
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
1.60± 0.2
470 nF
1.00± 0.1
1.00± 0.1
1.00± 0.1
1.00± 0.1
1.60± 0.2
680 nF
1.15± 0.1
1.15± 0.1
1.15± 0.1
1.60± 0.2
1.60± 0.2
1 µF
1.15± 0.1
1.15± 0.1
1.15± 0.1
1.60± 0.2
1.60± 0.2
2.2 µF
1.60± 0.2
1.60± 0.2
1.60± 0.2
1.60± 0.2
1.60± 0.2
NOTE
Values in shaded cells indicate thickness class in mm
NP0/X7R
6.3 V to 630 V
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Product specification
CAP.
1210
1812
6.3V
10 V
16 V
25 V
50V
100 V
250 V
50V
100V
100 nF
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
1.25± 0.2
150 nF
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
1.25± 0.2
1.25± 0.2
220 nF
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
1.25± 0.2
1.25± 0.2
330 nF
0.85± 0.1
0.85± 0.1
0.85± 0.1
0.85± 0.1
1.25± 0.2
2.0± 0.2
470 nF
1.25± 0.2
1.25± 0.2
1.25± 0.2
1.25± 0.2
1.25± 0.2
2.0± 0.2
1.60± 0.2
1.60± 0.2
680 nF
1.25± 0.2
1.25± 0.2
1.25± 0.2
1.25± 0.2
1.25± 0.2
2.0± 0.2
1.60± 0.2
1.60± 0.2
1 µF
1.25± 0.2
1.25± 0.2
1.25± 0.2
1.25± 0.2
1.25± 0.2
2.0± 0.2
1.60± 0.2
1.60± 0.2
2.2 µF
2.0± 0.2
2.0± 0.2
NOTE
Values in shaded cells indicate thickness class in mm
CAPACITANCE RANGE & THICKNESS FOR X7R
Table 10 Size 1210
NP0/X7R
6.3 V to 630 V
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Product specification
CAPACITANCE RANGE & THICKNESS FOR 4C-ARRAY
Table 11 Temperature characteristic material from NP0
CAPACITANCE
0508 (4 x 0402)
0612 (4 x 0603)
50 V
50 V
10 pF
0.6± 0.1
0.8± 0.1
15 pF
0.6± 0.1
0.8± 0.1
18 pF
0.6± 0.1
0.8± 0.1
22 pF
0.6± 0.1
0.8± 0.1
33 pF
0.6± 0.1
0.8± 0.1
39 pF
0.6± 0.1
0.8± 0.1
47 pF
0.6± 0.1
0.8± 0.1
56 pF
0.6± 0.1
0.8± 0.1
68 pF
0.6± 0.1
0.8± 0.1
82 pF
0.6± 0.1
0.8± 0.1
100 pF
0.6± 0.1
0.8± 0.1
120 pF
0.8± 0.1
150 pF
0.8± 0.1
180 pF
0.8± 0.1
220 pF
0.8± 0.1
270 pF
0.8± 0.1
330 pF
0.8± 0.1
390 pF
0.8± 0.1
470 pF
0.8± 0.1
560 pF
680 pF
820 pF
1.0 nF
NOTE
Values in shaded cells indicate thickness class in mm
NP0/X7R
6.3 V to 630 V
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Product specification
CAPACITANCE RANGE & THICKNESS FOR 4C-ARRAY
Table 12 Temperature characteristic material from X7R
CAPACITANCE
0508 (4 x 0402)
0612 (4 x 0603)
16 V
25 V
50 V
16 V
25 V
50 V
220 pF
0.8± 0.1
0.8± 0.1
0.8± 0.1
330 pF
0.8± 0.1
0.8± 0.1
0.8± 0.1
470 pF
0.8± 0.1
0.8± 0.1
0.8± 0.1
680 pF
0.8± 0.1
0.8± 0.1
0.8± 0.1
1.0 nF
0.6± 0.1
0.6± 0.1
0.6± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
1.5 nF
0.6± 0.1
0.6± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
2.2 nF
0.6± 0.1
0.6± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
3.3 nF
0.6± 0.1
0.6± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
4.7 nF
0.6± 0.1
0.6± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
6.8 nF
0.6± 0.1
0.6± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
10 nF
0.6± 0.1
0.6± 0.1
0.8± 0.1
0.8± 0.1
0.8± 0.1
15 nF
0.6± 0.1
0.8± 0.1
0.8± 0.1
22 nF
0.6± 0.1
0.8± 0.1
0.8± 0.1
33 nF
0.6± 0.1
0.8± 0.1
0.8± 0.1
47 nF
0.6± 0.1
0.8± 0.1
0.8± 0.1
68 nF
0.6± 0.1
100 nF
0.6± 0.1
NOTE
Values in shaded cells indicate thickness class in mm
NP0/X7R
6.3 V to 630 V
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Product specification
Table 13
THICKNESS CLASSES AND PACKING QUANTITY
SIZE
CODE
THICKNESS
CLASSIFICATION
TAPE WIDTH
QUANTITY PER REEL
Ø 180 MM / 7 INCH
Ø 330 MM / 13 INCH
Paper
Blister
Paper
Blister
0201
0.3 ± 0.03 mm
8 mm
15,000
---
50,000
---
0402
0.5 ± 0.05 mm
8 mm
10,000
---
50,000
---
0603
0.8 ± 0.1 mm
8 mm
4,000
---
15,000
---
0805/0508
0.6 ± 0.1 mm
8 mm
4,000
---
20,000
---
0.85 ± 0.1 mm
8 mm
4,000
---
15,000
---
1.25 ± 0.2 mm
8 mm
---
3,000
---
10,000
1206/0612
0.6 ± 0.1 mm
8 mm
4,000
---
20,000
---
0.85 ± 0.1 mm
8 mm
4,000
---
15,000
---
1.0/1.15 ± 0.1 mm
8 mm
---
3,000
---
10,000
1.25 ± 0.2 mm
8 mm
---
3,000
---
10,000
1.6 ± 0.2 mm
8 mm
---
2,000
---
10,000
1210
0.85 ± 0.1 mm
8 mm
---
4,000
---
10,000
1.15 ± 0.1 mm
8 mm
---
3,000
---
10,000
1.25 ± 0.2 mm
8 mm
---
3,000
---
10,000
1812
0.6 / 0.85± 0.1 mm
12 mm
---
2,000
---
---
1.15± 0.1 mm
12 mm
---
1,000
---
---
1.25± 0.2 mm
12 mm
---
1,000
---
---
NP0/X7R
6.3 V to 630 V
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Product specification
ELECTRICAL CHARACTERISTICS
N
NP
P0
0/
/X
X7
7R
R
D
DI
IE
EL
LE
EC
CT
TR
RI
IC
C
C
CA
AP
PA
AC
CI
IT
TO
OR
RS
S;
;
N
NI
I/
/S
SI
IN
N
T
TE
ER
RM
MI
IN
NA
AT
TI
IO
ON
NS
S
Unless otherwise specified, all test and measurements shall be made under standard atmospheric conditions
for testing as given in 5.3 of IEC 60068-1:
- Temperature: 15 °C to 35 °C
- Relative humidity: 25% to 75%
- Air pressure: 86 kPa to 106 kPa
Before the measurements are made, the capacitor shall be stored at the measuring temperature for a time
sufficient to allow the entire capacitor to reach this temperature.
The period as prescribed for recovery at the end of a test is normally sufficient for this purpose.
Table 14
DESCRIPTION
VALUE
Capacitance range
0.47 pF to 1 µF
Capacitance tolerance
NP0
C < 10 pF
± 0.25 pF, ± 0.5 pF
C ≥ 10 pF
± 2%, ± 5%
X7R
±5% (1), ±10%, ± 20%
Dissipation factor (D.F.)
NP0
C < 30 pF
≤ 1 / ( 400 + 20C )
C ≥ 30 pF
≤ 0.1 %
X7R
0201
0402
0603
0805
1206
1210
1812
0508
(Array)
0612
(Array)
≤10V
220pF to 100nF
1nF to 1uF
1nF to 2.2uF
22nF to 2.2uF
100nF to 1uF
≤ 5%
≤ 10%
16V
220pF to 22nF
1nF to 220nF
1nF to 470nF
22nF to 1uF
100nF to 1uF
1nF to 10nF
220pF to 47nF
≤ 3.5%
27nF to 100nF
470nF
680nF to 1uF
2.2 uF
15nF to 100nF
≤ 5%
25V
100pF to 470pF
220pF to 10nF
1nF to 39nF
1nF to 180nF
22nF to 680nF
100nF to 1uF
1nF to 10nF
220pF to 47nF
≤ 2.5%
12nF to 47nF
47nF to 220nF
220nF to 470nF
1uF
≤ 3.5%
560pF to 10nF
680nF to 1uF
2.2 uF
≤ 5%
50V
220pF to 10nF
1nF to 39nF
1nF to 180nF
22nF to 470nF
100nF to 1uF
470nF to 1uF
1nF
220pF to 10nF
≤ 2.5%
47nF to 100nF
220nF to 470nF
≤ 3.5%
680nF to 2.2uF
2.2uF
≤ 5%
100V
1nF to 10nF
1nF to 100nF
22nF to 220nF
100nF to 220nF
470nF to 1uF
≤ 2.5%
12nF to 47nF
330nF to 2.2uF
≤ 5%
250V
1nF to 22nF
22nF
100nF
≤ 2.5%
500V
1nF to 4.7nF
≤ 2.5%
Insulation resistance after 1 minute at Ur (DC)
IR ≥ 10 GΩ or I.R × C ≥ 500 seconds whichever is less
Maximum capacitance change as a function of temperature
(temperature characteristic/coefficient):
NP0
± 30 ppm/°C
X7R
± 15%
Operating temperature range:
NP0/X7R
–55 °C to +125 °C
NOTE
1. Capacitance tolerance ±5% doesn't available for X7R full product range, please contact local sales force before order
NP0/X7R
6.3 V to 630 V
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Product specification
SOLDERING CONDITIONS
The lead free MLCCs are able to stand the reflow soldering conditions as below:
Temperature: above 220 °C
Endurance: 95 to 120 seconds
Cycles: 3 times
The test of "soldering heat resistance" is carried out in accordance with the schedule of "MIL-STD-202F-method 210F", "The robust
construction of chip capacitors allows them to be completely immersed in a solder bath of 270 °C for 10 seconds". Therefore, it is possible
to mount MLCCs on one side of a PCB and other discrete components on the reverse (mixed PCBs). Surface Mount Capacitors are tested
for solderability at 245 °C during 2 seconds. The test condition for no leaching is 260°C for 30 seconds.
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Mounting
IEC 60384-
21/22
4.3
The capacitors may be mounted on printed-circuit boards or
ceramic substrates
No visible damage
Capacitance
IEC 60384-
21/22
4.5.1
Class 1:
At 20 °C, 24 hours after annealing
f = 1 MHz for C ≤ 1nF, measuring at voltage 1 Vrms at 20 °C
f = 1 KHz for C > 1nF, measuring at voltage 1 Vrms at 20 °C
Class 2:
At 20 °C, 24 hours after annealing
f = 1 KHz, measuring at voltage 1 Vrms at 20 °C
Within specified tolerance
Dissipation
Factor (D.F.)
IEC 60384-
21/22
4.5.2
Class 1:
At 20 °C, 24 hours after annealing
f = 1 MHz for C ≤ 1nF, measuring at voltage 1 Vrms at 20 °C
f = 1 KHz for C > 1nF, measuring at voltage 1 Vrms at 20 °C
Class 2:
At 20 °C, 24 hours after annealing
f = 1 KHz, measuring at voltage 1 Vrms at 20 °C
In accordance with
specification
Insulation
Resistance
IEC 60384-
21/22
4.5.3
At Ur (DC) for 1 minute
In accordance with
specification
SOLDERING RECOMMENDATION
Table 15
SOLDERING
METHOD
SIZE
0402
0603
0805
1206
≥ 1210
Reflow
≥ 0.1 µF
≥ 1.0 µF
≥ 2.2 µF
≥ 4.7 µF
Reflow only
Reflow/Wave
< 0.1 µF
< 1.0 µF
< 2.2 µF
< 4.7 µF
---
TESTS AND REQUIREMENTS
Table 16 Test procedures and requirements
NP0/X7R
6.3 V to 630 V
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Product specification
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Temperature
coefficient
4.6
Capacitance shall be measured by the steps shown in the
following table.
The capacitance change should be measured after 5 min at
each specified temperature stage.
Step
Temperature(℃)
a
25± 2
b
Lower temperature± 3℃
c
25± 2
d
Upper Temperature± 2℃
e
25± 2
(1) Class I
Temperature Coefficient shall be calculated from the formula
as below
Temp, Coefficient =
6
10
T xC1
C1-C2
Δ
[ppm/℃]
C1: Capacitance at step c
C2: Capacitance at 125℃
∆T: 100℃(=125℃-25℃)
(2) Class II
Capacitance Change shall be calculated from the formula as
below
∆C =
C1
C1-C2
x 100%
C1: Capacitance at step c
C2: Capacitance at step b or d
<General purpose series>
Class1:
∆ C/C: ± 30ppm
Class2:
X7R: ∆ C/C: ±15%
<High Capacitance series>
Class2:
X7R/X5R: ∆ C/C: ±15%
High
Temperature
Exposure
AEC-Q200
3
Unpowered ; 1000hours @ T=150℃
Measurement at 24± 2 hours after test conclusion.
No visual damage
ΔC/C：
Class1:
NP0: within ± 0.5% or 0.5 pF
whichever is greater
Class2:
X7R: ± 10%
D.F.:
within initial specified value
IR:
within initial specified value
NP0/X7R
6.3 V to 630 V
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Product specification
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Temperature
Cycling
AEC-Q200
4
Preconditioning;
150 +0/–10 °C for 1 hour, then keep for
24 ± 1 hours at room temperature
1000 cycles with following detail:
30 minutes at lower category temperature
30 minutes at upper category temperature
Recovery time 24 ± 2 hours
No visual damage
∆C/C
Class1:
NP0: Within ± 1% or 0.5pF,
whichever is greater.
Class2:
X7R: ±10%
D.F. meet initial specified value
IR meet initial specified value
Destructive
Physical Analysis
AEC-Q200
5
10ea X 3 lots.
Note: Only applies to SMD ceramics.
Electrical test not required.
Moisture
Resistance
AEC-Q200
6
T=24 hrs/per cycle; 10 continuous cycles unpowered.
Measurement at 24 ± 2 hours after test condition.
No visual damage
∆C/C
NP0: Within ± 3% or 3 pF,
whichever is greater
X7R: ± 15%
D.F.
Within initial specified value
IR
NP0: ≥ 10,000 MΩ
X7R: Meet initial specified
value
Fig. 4 Moisture resistant
NP0/X7R
6.3 V to 630 V
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Product specification
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Biased Humidity
AEC-Q200
7
1. Preconditioning, class 2 only:
150 +0/-10 °C /1 hour, then keep for
24 ± 1 hour at room temp
2. Initial measure:
Parameter: IR
Measuring voltage: 1.5V ± 0.1 VDC
Note: Series with 100 KΩ & 6.8 KΩ
3. Test condition:
85 °C, 85% R.H. connected with 100 KΩ resistor, applied
1.5V/Ur for 1,000 hours.
4. Recovery:
Class1: 6 to 24 hours
Class2: 24 ± 2 hours
5. Final measure: IR
No visual damage after
recovery
Initial requirement:
Class1:
- Connected to 100 KΩ:
C ≤ 10 nF: I.R ≥ 10,000 MΩ
or
C > 10 nF: (I.R-100 KΩ) x C
≥ 100s.
- Connected to 6.8 KΩ:
C ≤ 10 nF: I.R ≥ 10,000 MΩ
or
C > 10 nF: (I.R-6.8 KΩ) x C
≥ 100s.
Class2:
- Connected to 100 KΩ:
C ≤ 25 nF: I.R ≥ 4,000 MΩ or
C > 25 nF: (I.R-100 KΩ) x C
≥ 100s.
- Connected to 6.8 KΩ:
C ≤ 25 nF: I.R ≥ 10,000 MΩ
or
C > 25 nF: (I.R-6.8 KΩ) x C
≥ 100s.
Final measurement:
The insulation resistance shall
be greater than 0.1 time initial
value.
NP0/X7R
6.3 V to 630 V
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Product specification
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Operational Life
AEC-Q200
8
1. Preconditioning, class 2 only:
150 +0/-10 °C /1 hour, then keep for
24 ± 1 hour at room temp
2. Initial measure:
Spec: refer to initial spec C, D, IR
3. Endurance test:
Temperature: X7R: 125 °C
Specified stress voltage applied for 1,000 hours:
Applied 2.0 x Ur for general products
Applied 1.5 x Ur for high cap. Products
High voltage series follows with below
stress condition:
Applied 1.5 x Ur for 200V, 250V series
Applied 1.3 x Ur for 500V, 630V series
Applied 1.2 x Ur for 1KV, 2KV, 3KV series
4. Recovery time: 24 ± 2 hours
5. Final measure: C, D, IR
Note: If the capacitance value is less than the minimum value
permitted, then after the other measurements have been
made the capacitor shall be preconditioned according to “IEC
60384 4.1” and then the requirement shall be met.
No visual damage
∆C/C
NP0: Within ± 2% or 1 pF,
whichever is greater
X7R: ± 15%
D.F.
NP0: ≤ 2 x specified value.
X7R: ≤ 16V: ≤ 7% or specified
value whichever is greater
≥ 25V: ≤ 5% or specified
value whichever is greater
IR
NP0: ≥ 4,000 MΩ or IR x Cr ≥
40s whichever is less
X7R: ≥ 1,000 MΩ or IRx Cr ≥
50s whichever is less
External Visual
AEC-Q200
9
Any applicable method using × 10 magnification
In accordance with
specification
Physical
Dimension
AEC-Q200
10
Verify physical dimensions to the applicable device
specification.
In accordance with
specification
Mechanical
Shock
AEC-Q200
13
Three shocks in each direction shall be applied along the three
mutually perpendicular axes of the test specimen (18 shocks)
Peak value: 1,500 g’s
Duration: 0.5 ms
Velocity change: 15.4 ft/s
Waveform: Half-sin
∆C/C
NP0: Within ± 0.5% or 0.5 pF,
whichever is greater
X7R: ± 10%
D.F.
Within initial specified value
IR
Within initial specified value
Vibration
AEC-Q200
14
5 g’s for 20 minutes, 12 cycles each of 3 orientations.
Note:
Use 8” x 5” PCB. 0.31” thick 7 secure points on one long side
and 2 secure points at corners of opposite sides. Parts
mounted within 2” from any secure point. Test from
10-2000 Hz.
∆C/C
NP0: Within ± 0.5% or 0.5 pF,
whichever is greater
X7R: ± 10%
D.F: meet initial specified value
IR meet initial specified value
NP0/X7R
6.3 V to 630 V
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Product specification
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Resistance to
Soldering Heat
AEC-Q200
15
Precondition: 150 +0/–10 °C for 1 hour, then keep for 24 ± 1
hours at room temperature
Preheating: for size ≤ 1206: 120 °C to 150 °C for 1 minute
Preheating: for size >1206: 100 °C to 120 °C for 1 minute
and 170 °C to 200 °C for 1 minute
Solder bath temperature: 260 ± 5 °C
Dipping time: 10 ± 0.5 seconds
Recovery time: 24 ±2 hours
Dissolution of the end face
plating shall not exceed 25% of
the length of the edge
concerned
∆C/C
Class1:
NP0: Within ± 1% or 0.5 pF,
whichever is greater.
Class2:
X7R: ± 10%
D.F. within initial specified
value
IR within initial specified value
Thermal Shock
AEC-Q200
16
1. Preconditioning, class 2 only:
150 +0/-10 °C /1 hour, then keep for 24 ± 1 hour at room
temp
2. Initial measure:
Spec: refer to initial spec C, D, IR
3. Rapid change of temperature test:
NP0/X7R: -55 °C to +125 °C; 300 cycles
15 minutes at lower category temperature; 15 minutes at
upper category temperature.
4. Recovery time:
Class1: 6 to 24 hours
Class2: 24 ± 2 hours
5. Final measure: C, D, IR
No visual damage
∆C/C
NP0: Within ± 1% or 1 pF,
whichever is greater
X7R: ± 15%
D.F: meet initial specified value
IR meet initial specified value
ESD
AEC-Q200
17
Per AEC-Q200-004
A component passes a voltage
level if all components stressed
at that voltage level pass.
Solderability
AEC-Q200
18
Preheated to a temperature of 80 °C to 140 °C and
maintained for 30 seconds to 60 seconds.
Test conditions for lead containing solder alloy
Temperature: 235 ± 5 °C
Dipping time: 2 ± 0.2 seconds
Depth of immersion: 10 mm
Alloy Composition: 60/40 Sn/Pb
Number of immersions: 1
Test conditions for lead-free containing solder alloy
Temperature: 245 ± 5 °C
Dipping time: 3 ± 0.3 seconds
Depth of immersion: 10 mm
Alloy Composition: SAC305
Number of immersions: 1
The solder should cover over
95% of the critical area of each
termination.
NP0/X7R
6.3 V to 630 V
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Surface-Mount Ceramic Multilayer Capacitors
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24
Product specification
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Electrical
Characterization
AEC-Q200
19
Parametrically test per lot and sample size requirements,
summary to show Min, Max, Mean and Standard deviation at
room as well as Min and Max operating temperatures.
∆C/C
Class 1:
NP0: ± 30 ppm/°C
Class2:
X7R: ± 15%
Class 1:
NP0: -55 °C to +125 °C
Normal temperature: 20 °C
Class 2:
X7R: -55 °C to +125 °C
Normal temperature: 20 °C
Board Flex
AEC-Q200
21
Part mounted on a 100 mm X 40 mm FR4 PCB board, which
is 1.6 ± 0.2 mm thick and has a layer-thickness 35 µm ± 10
µm.
Part should be mounted using the following soldering reflow
profile.
Conditions:
Class1:
Bending 3 mm at a rate of 1 mm/s, radius jig 340 mm
Class2:
Bending 2 mm at a rate of 1 mm/s, radius jig 340 mm
Test Substrate:
100
40
b
C
a
4.5 YNSC147
unit: mm
No visible damage
∆C/C
Class1:
NP0: Within ± 1% or 0.5 pF,
whichever is greater
Class2:
X7R: ± 10%
Dimension(mm)
Type
a
b
c
0201
0.3
0.9
0.3
0402
0.4
1.5
0.5
0603
1.0
3.0
1.2
0805
1.2
4.0
1.65
1206
2.2
5.0
1.65
1210
2.2
5.0
2.0
1808
3.5
7.0
3.7
Terminal
Strength
AEC-Q200
22
With the component mounted on a PCB obtained with the
device to be tested, apply a 17.7N (1.8Kg) force to the side of
a device being tested.
This force shall be applied for 60+1 seconds.
Also the force shall be applied gradually as not to apply a
shock to the component being tested.
* Apply 2N force for 0402 size.
Magnification of 20X or greater
may be employed for
inspection of the mechanical
integrity of the device body,
terminals and body/terminal
junction.
Before, during and after the
test, the device shall comply
with all electrical requirements
stated in this specification.
NP0/X7R
6.3 V to 630 V
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Surface-Mount Ceramic Multilayer Capacitors
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Product specification
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Beam Load Test
AEC-Q200
23
Place the part in the beam load fixture. Apply a force until the
part breaks or the minimum acceptable force level required in
the user specification(s) is attained.
≤ 0805
Thickness > 0.5mm: 20N
Thickness ≤ 0.5mm: 8N
≥ 1206
Thickness ≥1.25 mm: 54N
Thickness < 1.25 mm: 15N
Voltage Proof
1. Specified stress voltage applied for 1~5 seconds
2. Ur ≤ 100 V: series applied 2.5 Ur
3. 100 V < Ur ≤ 200 V series applied (1.5 Ur + 100)
4. 200 V < Ur ≤ 500 V series applied (1.3 Ur + 100)
5. Ur > 500 V: 1.3 Ur
6. Ur ≥ 1000 V: 1.2 Ur
Charge/Discharge current is less than 50 mA
No breakdown or flashover
Note: Classify the components according to the highest ESD voltage level survived during
ESD testing.
Fig. 5 Passive component HBM ESD test flow diagram (DC = Direct Contact Discharge, AD = Air Discharge)
NP0/X7R
6.3 V to 630 V
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Mar. 22, 2018 V.9
Surface-Mount Ceramic Multilayer Capacitors
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Product specification
REVISION HISTORY
REVISION
DATE
CHANGE NOTIFICATION
DESCRIPTION
Version 9
Mar. 22, 2018
-
- Add 0402 X7R 100nF 25~50V
Version 8
Nov. 22, 2017
-
- Add X7R/0201/25V/100pF~10nF
Version 7
Jul. 7, 2017
-
- Add X7R/0805/330nF to 470nF/50V, X7R/1206/10uF/6.3V
Version 6
Mar. 31, 2017
-
- Add NPO/0603/1nF/50V, X7R/0603/1uF/10V, X7R/0603/470nF/16V,
X7R/0603/220nF/25V
Version 5
Nov. 15, 2016
-
- Add Soldering Condition
Version 4
Jun. 14, 2016
-
- Add X7R/0805/2.2uF/10V and NPO/1206/1.2nF to 1.5nF/250V
Version 3
Jul. 21, 2015
-
- Tests and Requirements update
Version 2
Jul. 17, 2014
-
- Tests and Requirements update
Version 1
Apr. 19, 2013
-
- Capacitance range update
Version 0
Dec. 25, 2012
-
- New
NP0/X7R
6.3 V to 630 V
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Product specification
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inaccuracies or incompleteness contained in any product related information, including but not limited to
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