High CMR, High Speed TTL Compatible Optocouplers 6N137 HCNW137 HCNW2601 HCNW2611 HCPL-0600 HCPL-0601 HCPL-0611 HCPL-0630 Technical Data Features * 5 kV/s Minimum Common Mode Rejection (CMR) at VCM = 50 V for HCPL-X601/ X631, HCNW2601 and 10 kV/ s Minimum CMR at VCM = 1000 V for HCPLX611/X661, HCNW2611 * High Speed: 10 MBd Typical * LSTTL/TTL Compatible * Low Input Current Capability: 5 mA * Guaranteed ac and dc Performance over Temperature: -40C to +85C * Available in 8-Pin DIP, SOIC-8, Widebody Packages * Strobable Output (Single Channel Products Only) * Safety Approval UL Recognized - 2500 V rms for 1 minute and 5000 V rms* for 1 minute per UL1577 CSA Approved VDE 0884 Approved with VIORM = 630 V peak for HCPL-2611 Option 060 and VIORM = 1414 V peak for HCNW137/26X1 BSI Certified (HCNW137/26X1 Only) * MIL-STD-1772 Version Available (HCPL-56XX/ 66XX) Applications * Isolated Line Receiver * Computer-Peripheral Interfaces * Microprocessor System Interfaces * Digital Isolation for A/D, D/A Conversion * Switching Power Supply * Instrument Input/Output Isolation * Ground Loop Elimination * Pulse Transformer Replacement HCPL-0631 HCPL-0661 HCPL-2601 HCPL-2611 HCPL-2630 HCPL-2631 HCPL-4661 * Power Transistor Isolation in Motor Drives * Isolation of High Speed Logic Systems Description The 6N137, HCPL-26XX/06XX/ 4661, HCNW137/26X1 are optically coupled gates that combine a GaAsP light emitting diode and an integrated high gain photo detector. An enable input allows the detector to be strobed. The output of the detector IC is Functional Diagram 6N137, HCPL-2601/2611 HCPL-0600/0601/0611 HCNW137/2601/2611 HCPL-2630/2631/4661 HCPL-0630/0631/0661 NC 1 8 VCC ANODE 2 7 CATHODE 3 NC 4 SHIELD ANODE 1 1 8 VCC VE CATHODE 1 2 7 VO1 6 VO CATHODE 2 3 6 VO2 5 GND ANODE 2 4 5 GND TRUTH TABLE (POSITIVE LOGIC) LED ON OFF ON OFF ON OFF ENABLE H H L L NC NC OUTPUT L H H H L H SHIELD TRUTH TABLE (POSITIVE LOGIC) LED ON OFF OUTPUT L H *5000 V rms/1 Minute rating is for HCNW137/26X1 and Option 020 (6N137, HCPL-2601/11/30/31, HCPL-4661) products only. A 0.1 F bypass capacitor must be connected between pins 5 and 8. CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. 2 an open collector Schottkyclamped transistor. The internal shield provides a guaranteed common mode transient immunity specification of 5,000 V/s for the HCPL-X601/X631 and HCNW2601, and 10,000 V/s for the HCPL-X611/X661 and HCNW2611. This unique design provides maximum ac and dc circuit isolation while achieving TTL compatibility. The optocoupler ac and dc operational parameters are guaranteed from -40C to +85C allowing troublefree system performance. The 6N137, HCPL-26XX, HCPL06XX, HCPL-4661, HCNW137, and HCNW26X1 are suitable for high speed logic interfacing, input/output buffering, as line receivers in environments that conventional line receivers cannot tolerate and are recommended for use in extremely high ground or induced noise environments. Selection Guide Minimum CMR dV/dt (V/s) VCM (V) NA NA 8-Pin DIP (300 Mil) Input OnCurrent Output (mA) Enable 5 YES Single Channel Package 6N137 NO 5,000 50 YES 10,000 1,000 YES HCPL-2631 YES HCPL-2602[1] 3, 500 300 YES HCPL-2612[1] 1,000 50 YES HCPL-261A[1] 1,000 YES NO 1,000 50 12.5 HCNW2601 HCPL-0631 HCNW2611 HCPL-0661 HCPL-061A[1] HCPL-263A[1] NO Single Channel Package Hermetic Single and Dual Channel Packages HCNW137 HCPL-0611 HCPL-4661 50 Widebody (400 Mil) HCPL-0630 HCPL-0601 HCPL-2611 1,000 Dual Channel Package HCPL-0600 HCPL-2601 NO 1,000[2] Single Channel Package HCPL-2630 NO 3 Dual Channel Package Small-Outline SO-8 HCPL-261N[1] HCPL-063A[1] HCPL-061N[1] HCPL-263N[1] [3] Notes: 1. Technical data are on separate Agilent publications. 2. 15 kV/s with VCM = 1 kV can be achieved using Agilent application circuit. 3. Enable is available for single channel products only, except for HCPL-193X devices. HCPL-063N[1] HCPL-193X[1] HCPL-56XX[1] HCPL-66XX[1] 3 Ordering Information Specify Part Number followed by Option Number (if desired). Example: HCPL-2611#XXX 020 = 5000 V rms/1 minute UL Rating Option* 060 = VDE 0884 VIORM = 630 Vpeak Option** 300 = Gull Wing Surface Mount Option 500 = Tape and Reel Packaging Option Option data sheets available. Contact Agilent sales representative or authorized distributor for information. *For 6N137, HCPL-2601/11/30/31 and HCPL-4661 (8-pin DIP products) only. **For HCPL-2611 only. Combination of Option 020 and Option 060 is not available. Gull wing surface mount option applies to through hole parts only. Schematic IF 6N137, HCPL-2601/2611 HCPL-0600/0601/0611 HCNW137, HCNW2601/2611 HCPL-2630/2631/4661 HCPL-0630/0631/0661 ICC 1 ICC 8 2+ IO 6 VCC VO 8 IF1 IO1 + 7 VCC VO1 VF1 - 2 VF SHIELD - 3 SHIELD IE 5 7 VE USE OF A 0.1 F BYPASS CAPACITOR CONNECTED BETWEEN PINS 5 AND 8 IS RECOMMENDED (SEE NOTE 5). GND 3 IF2 IO2 - 6 VO2 VF2 + 4 SHIELD 5 GND 4 Package Outline Drawings 8-pin DIP Package** (6N137, HCPL-2601/11/30/31, HCPL-4661) 7.62 0.25 (0.300 0.010) 9.65 0.25 (0.380 0.010) 8 TYPE NUMBER 7 6 5 6.35 0.25 (0.250 0.010) OPTION CODE* DATE CODE A XXXXZ YYWW RU 1 2 3 4 UL RECOGNITION 1.78 (0.070) MAX. 1.19 (0.047) MAX. + 0.076 0.254 - 0.051 + 0.003) (0.010 - 0.002) 5 TYP. 4.70 (0.185) MAX. 0.51 (0.020) MIN. 2.92 (0.115) MIN. 0.65 (0.025) MAX. 1.080 0.320 (0.043 0.013) 2.54 0.25 (0.100 0.010) DIMENSIONS IN MILLIMETERS AND (INCHES). *MARKING CODE LETTER FOR OPTION NUMBERS "L" = OPTION 020 "V" = OPTION 060 OPTION NUMBERS 300 AND 500 NOT MARKED. **JEDEC Registered Data (for 6N137 only). 8-pin DIP Package with Gull Wing Surface Mount Option 300 (6N137, HCPL-2601/11/30/31, HCPL-4661) PAD LOCATION (FOR REFERENCE ONLY) 9.65 0.25 (0.380 0.010) 8 7 6 1.016 (0.040) 1.194 (0.047) 5 4.826 TYP. (0.190) 6.350 0.25 (0.250 0.010) 1 2 3 9.398 (0.370) 9.906 (0.390) 4 1.194 (0.047) 1.778 (0.070) 1.19 (0.047) MAX. 1.780 (0.070) MAX. 9.65 0.25 (0.380 0.010) 7.62 0.25 (0.300 0.010) 4.19 MAX. (0.165) 1.080 0.320 (0.043 0.013) 0.635 0.130 2.54 (0.025 0.005) (0.100) BSC DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES). 0.381 (0.015) 0.635 (0.025) 0.635 0.25 (0.025 0.010) + 0.076 0.254 - 0.051 + 0.003) (0.010 - 0.002) 12 NOM. 5 Small-Outline SO-8 Package (HCPL-0600/01/11/30/31/61) 8 7 6 5 5.994 0.203 (0.236 0.008) XXX YWW 3.937 0.127 (0.155 0.005) TYPE NUMBER (LAST 3 DIGITS) DATE CODE PIN ONE 1 2 3 4 0.406 0.076 (0.016 0.003) 1.270 BSG (0.050) * 5.080 0.127 (0.200 0.005) 7 3.175 0.127 (0.125 0.005) 45 X 0.432 (0.017) 0 ~ 7 0.228 0.025 (0.009 0.001) 1.524 (0.060) 0.203 0.102 (0.008 0.004) * TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH) 5.207 0.254 (0.205 0.010) 0.305 MIN. (0.012) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX. 8-Pin Widebody DIP Package (HCNW137, HCNW2601/11) 11.00 MAX. (0.433) 11.15 0.15 (0.442 0.006) 8 7 6 9.00 0.15 (0.354 0.006) 5 TYPE NUMBER A HCNWXXXX DATE CODE YYWW 1 2 3 4 10.16 (0.400) TYP. 1.55 (0.061) MAX. 7 TYP. + 0.076 0.254 - 0.0051 + 0.003) (0.010 - 0.002) 5.10 MAX. (0.201) 3.10 (0.122) 3.90 (0.154) 0.51 (0.021) MIN. 2.54 (0.100) TYP. 1.78 0.15 (0.070 0.006) 0.40 (0.016) 0.56 (0.022) DIMENSIONS IN MILLIMETERS (INCHES). 6 8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW137, HCNW2601/11) 11.15 0.15 (0.442 0.006) 8 7 6 PAD LOCATION (FOR REFERENCE ONLY) 5 6.15 (0.242)TYP. 9.00 0.15 (0.354 0.006) 12.30 0.30 (0.484 0.012) 1 2 3 4 1.3 (0.051) 0.9 (0.035) 12.30 0.30 (0.484 0.012) 1.55 (0.061) MAX. 11.00 MAX. (0.433) 4.00 MAX. (0.158) 1.78 0.15 (0.070 0.006) 1.00 0.15 (0.039 0.006) 0.75 0.25 (0.030 0.010) 2.54 (0.100) BSC + 0.076 0.254 - 0.0051 + 0.003) (0.010 - 0.002) DIMENSIONS IN MILLIMETERS (INCHES). 7 NOM. LEAD COPLANARITY = 0.10 mm (0.004 INCHES). TEMPERATURE - C Solder Reflow Temperature Profile (HCPL-06XX and Gull Wing Surface Mount Option 300 Parts) 260 240 220 200 180 160 T = 145C, 1C/SEC T = 115C, 0.3C/SEC 140 120 100 80 60 40 20 0 T = 100C, 1.5C/SEC 0 1 2 3 4 5 6 7 8 9 10 11 12 TIME - MINUTES Note: Use of nonchlorine activated fluxes is highly recommended. 7 Regulatory Information The 6N137, HCPL-26XX/06XX/ 46XX, and HCNW137/26XX have been approved by the following organizations: UL Recognized under UL 1577, Component Recognition Program, File E55361. CSA Approved under CSA Component Acceptance Notice #5, File CA 88324. VDE Approved according to VDE 0884/06.92. (HCPL-2611 Option 060 and HCNW137/26X1 only) BSI Certification according to BS415:1994 (BS EN60065:1994), BS7002:1992 (BS EN60950:1992) and EN41003:1993 for Class II applications. (HCNW137/26X1 only) Insulation and Safety Related Specifications Parameter Minimum External Air Gap (External Clearance) Minimum External Tracking (External Creepage) Minimum Internal Plastic Gap (Internal Clearance) Minimum Internal Tracking (Internal Creepage) Tracking Resistance (Comparative Tracking Index) Isolation Group Symbol L(101) 8-pin DIP (300 Mil) Value 7.1 SO-8 Value 4.9 L(102) 7.4 4.8 10.0 mm 0.08 0.08 1.0 mm NA NA 4.0 mm 200 200 200 Volts IIIa IIIa IIIa CTI Widebody (400 Mil) Value Units 9.6 mm Conditions Measured from input terminals to output terminals, shortest distance through air. Measured from input terminals to output terminals, shortest distance path along body. Through insulation distance, conductor to conductor, usually the direct distance between the photoemitter and photodetector inside the optocoupler cavity. Measured from input terminals to output terminals, along internal cavity. DIN IEC 112/VDE 0303 Part 1 Material Group (DIN VDE 0110, 1/89, Table 1) Option 300 - surface mount classification is Class A in accordance with CECC 00802. 8 VDE 0884 Insulation Related Characteristics (HCPL-2611 Option 060 Only) Description Installation classification per DIN VDE 0110/1.89, Table 1 for rated mains voltage 300 V rms for rated mains voltage 450 V rms Climatic Classification Pollution Degree (DIN VDE 0110/1.89) Maximum Working Insulation Voltage Input to Output Test Voltage, Method b* VIORM x 1.875 = VPR, 100% Production Test with tm = 1 sec, Partial Discharge < 5 pC Input to Output Test Voltage, Method a* VIORM x 1.5 = VPR, Type and sample test, tm = 60 sec, Partial Discharge < 5 pC Highest Allowable Overvoltage* (Transient Overvoltage, tini = 10 sec) Safety Limiting Values (Maximum values allowed in the event of a failure, also see Figure 16, Thermal Derating curve.) Case Temperature Input Current Output Power Insulation Resistance at TS, VIO = 500 V Symbol Characteristic Units VIORM I-IV I-III 55/85/21 2 630 V peak VPR 1181 V peak VPR 945 V peak VIOTM 6000 V peak TS IS,INPUT PS,OUTPUT RS 175 230 600 109 C mA mW *Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section (VDE 0884), for a detailed description. Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application. VDE 0884 Insulation Related Characteristics (HCNW137/2601/2611 Only) Description Installation classification per DIN VDE 0110/1.89, Table 1 for rated mains voltage 600 V rms for rated mains voltage 1000 V rms Climatic Classification (DIN IEC 68 part 1) Pollution Degree (DIN VDE 0110/1.89) Maximum Working Insulation Voltage Input to Output Test Voltage, Method b* VIORM x 1.875 = VPR, 100% Production Test with tm = 1 sec, Partial Discharge < 5 pC Input to Output Test Voltage, Method a* VIORM x 1.5 = VPR, Type and sample test, tm = 60 sec, Partial Discharge < 5 pC Highest Allowable Overvoltage* (Transient Overvoltage, tini = 10 sec) Safety Limiting Values (Maximum values allowed in the event of a failure, also see Figure 16, Thermal Derating curve.) Case Temperature Input Current Output Power Insulation Resistance at TS, VIO = 500 V Symbol Characteristic Units VIORM I-IV I-III 55/100/21 2 1414 V peak VPR 2651 V peak VPR 2121 V peak VIOTM 8000 V peak TS IS,INPUT PS,OUTPUT RS 150 400 700 109 C mA mW *Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section (VDE 0884), for a detailed description. Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application. 9 Absolute Maximum Ratings* (No Derating Required up to 85C) Parameter Storage Temperature Operating Temperature Average Forward Input Current Symbol TS TA IF Reverse Input Voltage VR Input Power Dissipation Supply Voltage (1 Minute Maximum) Enable Input Voltage (Not to Exceed VCC by more than 500 mV) Enable Input Current Output Collector Current Output Collector Voltage (Selection for Higher Output Voltages up to 20 V is Available.) Output Collector Power Dissipation PI VCC Lead Solder Temperature (Through Hole Parts Only) VE Package** Min. -55 -40 Single 8-Pin DIP Single SO-8 Widebody Dual 8-Pin DIP Dual SO-8 8-Pin DIP, SO-8 Widebody Widebody Single 8-Pin DIP Single SO-8 Widebody T LS Single 8-Pin DIP Single SO-8 Widebody Dual 8-Pin DIP Dual SO-8 8-Pin DIP Widebody Solder Reflow Temperature Profile (Surface Mount Parts Only) SO-8 and Option 300 Units C C mA 15 IE IO VO PO Max. 125 85 20 Note 2 1, 3 5 3 40 7 V mW V VCC + 0.5 V 5 50 7 mA mA V 85 mW 60 1 1 1 1, 4 260C for 10 sec., 1.6 mm below seating plane 260C for 10 sec., up to seating plane See Package Outline Drawings section *JEDEC Registered Data (for 6N137 only). **Ratings apply to all devices except otherwise noted in the Package column. 0C to 70C on JEDEC Registration. Recommended Operating Conditions Parameter Input Current, Low Level Input Current, High Level[1] Power Supply Voltage Low Level Enable Voltage High Level Enable Voltage Operating Temperature Fan Out (at RL = 1 k)[1] Output Pull-up Resistor Symbol IFL* IFH** VCC VEL VEH TA N RL Min. 0 5 4.5 0 2.0 -40 330 Max. 250 15 5.5 0.8 VCC 85 5 4k Units A mA V V V C TTL Loads *The off condition can also be guaranteed by ensuring that VFL 0.8 volts. **The initial switching threshold is 5 mA or less. It is recommended that 6.3 mA to 10 mA be used for best performance and to permit at least a 20% LED degradation guardband. For single channel products only. 10 Electrical Specifications Over recommended temperature (T A = -40C to +85C) unless otherwise specified. All Typicals at VCC = 5 V, TA = 25C. All enable test conditions apply to single channel products only. See note 5. Parameter Sym. Package Typ. Max. Units Test Conditions Fig. Note High Level Output Current IOH* All 5.5 100 A VCC = 5.5 V, VE = 2.0 V, VO = 5.5 V, I F = 250 A 1 1, 6, 19 Input Threshold Current ITH Single Channel Widebody Dual Channel 2.0 5.0 mA VCC = 5.5 V, VE = 2.0 V, V O = 0.6 V, IOL (Sinking) = 13 mA 2, 3 19 0.6 V VCC = 5.5 V, VE = 2.0 V, IF = 5 mA, IOL (Sinking) = 13 mA 2, 3, 4, 5 1, 19 mA VE = 0.5 V VCC = 5.5 V V E = VCC IF = 0 mA Both Channels 7 mA VE = 0.5 V VCC = 5.5 V V E = VCC IF = 10 mA Both Channels 8 Low Level Output Voltage High Level Supply Current VOL * ICCH Min. 2.5 8-Pin DIP SO-8 Widebody 0.35 Single Channel 7.0 6.5 10 10.0* 13.0* Dual Channel 9.0 8.5 13 Single Channel -0.7 -1.6 mA VCC = 5.5 V, VE = 2.0 V -0.9 -1.6 mA VCC = 5.5 V, VE = 0.5 V 0.4 Dual Channel Low Level Supply Current ICCL High Level Enable Current IEH Low Level Enable Current IEL* High Level Enable Voltage VEH Low Level Enable Voltage VEL Input Forward Voltage VF Input Reverse Breakdown Voltage BVR * Input Diode Temperature Coefficient VF / TA Input Capacitance CIN Single Channel 15 21 2.0 8-Pin DIP SO-8 Widebody 1.4 1.3 1.25 1.2 8-Pin DIP SO-8 Widebody 5 8-Pin DIP SO-8 Widebody 8-Pin DIP SO-8 Widebody 9 V 1.5 1.64 0.8 V 1.75* 1.80 1.85 2.05 V 19 TA = 25C IF = 10 mA 6, 7 1 TA = 25C V IR = 10 A 1 IR = 100 A, TA = 25C 3 -1.6 mV/C IF = 10 mA 7 1 -1.9 60 pF f = 1 MHz, VF = 0 V 70 *JEDEC registered data for the 6N137. The JEDEC Registration specifies 0C to +70C. Agilent specifies -40C to +85C. 1 11 Switching Specifications (AC) Over Recommended Temperature (TA = -40C to +85C), VCC = 5 V, IF = 7.5 mA unless otherwise specified. All Typicals at TA = 25C, VCC = 5 V. Parameter Propagation Delay Time to High Output Level Sym. tPLH Propagation Delay Time to Low Output Level tPHL Pulse Width Distortion |tPHL - tPLH| Propagation Delay Skew Package** Min. Typ. 20 48 25 8-Pin DIP SO-8 Widebody Max. 75* 100 Units Test Conditions Fig. Note ns TA = 25C RL = 350 8, 9, 1, 10, CL = 15 pF 10 19 50 75* 100 ns TA = 25C 3.5 35 ns 8, 9, 13, 19 10, 11 ns 12, 13, 19 40 tPSK 40 1, 11, 19 Output Rise Time (10-90%) tr 24 ns 12 1, 19 Output Fall Time (90-10%) tf 10 ns 12 1, 19 13, 14 14 Propagation Delay Time of Enable from VEH to VEL tELH Single Channel 30 ns Propagation Delay Time of Enable from VEL to VEH tEHL Single Channel 20 ns RL = 350 , CL = 15 pF, VEL = 0 V, VEH = 3 V 15 *JEDEC registered data for the 6N137. **Ratings apply to all devices except otherwise noted in the Package column. Parameter Sym. Logic High |CMH| Common Mode Transient Immunity Logic Low Common Mode Transient Immunity |CML| Device 6N137 HCPL-2630 HCPL-0600/0630 HCNW137 HCPL-2601/2631 HCPL-0601/0631 HCNW2601 HCPL-2611/4661 HCPL-0611/0661 HCNW2611 6N137 HCPL-2630 HCPL-0600/0630 HCNW137 HCPL-2601/2631 HCPL-0601/0631 HCNW2601 HCPL-2611/4661 HCPL-0611/0661 HCNW2611 Min. Typ. Units 10,000 V/s Test Conditions |VCM| = 10 V VCC = 5 V, IF = 0 mA, VO(MIN) = 2 V, RL = 350 , TA = 25C 5,000 10,000 |VCM| = 50 V 10,000 15,000 |VCM| = 1 kV 10,000 5,000 V/s |VCM| = 10 V 10,000 |VCM| = 50 V 10,000 15,000 |VCM| = 1 kV VCC = 5 V, IF = 7.5 mA, VO(MAX) = 0.8 V, RL = 350 , TA = 25C Fig. 15 Note 1, 16, 18, 19 15 1, 17, 18, 19 12 Package Characteristics All Typicals at TA = 25C. Parameter Sym. Package Input-Output Insulation II-O* Single 8-Pin DIP Single SO-8 Input-Output Momentary Withstand Voltage** VISO 8-Pin DIP, SO-8 Widebody OPT 020 Input-Output Resistance RI-O 8-Pin DIP, SO-8 Widebody Input-Output Capacitance CI-O Min. Typ. Max. Units 1 A 2500 5000 5000 1012 1011 V rms 0.6 0.5 20, 21 20, 22 VI-O = 500 V dc pF f = 1 MHz, TA = 25C RH 45%, t = 5 s, VI-I = 500 V 0.6 II-I Dual Channel 0.005 A Resistance (Input-Input) RI-I Dual Channel 1011 Capacitance (Input-Input) CI-I Dual 8-Pin DIP Dual SO-8 0.03 0.25 pF Note RH 50%, t = 1 min, TA = 25C TA = 25C TA = 100C Input-Input Insulation Leakage Current Fig. 20, 21 1012 1013 8-Pin DIP, SO-8 Widebody Test Conditions 45% RH, t = 5 s, VI-O = 3 kV dc, TA = 25C 1, 20, 23 1, 20, 23 24 24 f = 1 MHz 24 *JEDEC registered data for the 6N137. The JEDEC Registration specifies 0C to 70C. HP specifies -40C to 85C. **The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating refer to the VDE 0884 Insulation Characteristics Table (if applicable), your equipment level safety specification or Agilent Application Note 1074 entitled "Optocoupler Input-Output Endurance Voltage." For 6N137, HCPL-2601/2611/2630/2631/4661 only. Notes: 1. Each channel. 2. Peaking circuits may produce transient input currents up to 50 mA, 50 ns maximum pulse width, provided average current does not exceed 20 mA. 3. Peaking circuits may produce transient input currents up to 50 mA, 50 ns maximum pulse width, provided average current does not exceed 15 mA. 4. Derate linearly above 80C free-air temperature at a rate of 2.7 mW/C for the SOIC-8 package. 5. Bypassing of the power supply line is required, with a 0.1 F ceramic disc capacitor adjacent to each optocoupler as illustrated in Figure 17. Total lead length between both ends of the capacitor and the isolator pins should not exceed 20 mm. 6. The JEDEC registration for the 6N137 specifies a maximum IOH of 250 A. HP guarantees a maximum IOH of 100 A. 7. The JEDEC registration for the 6N137 specifies a maximum ICCH of 15 mA. HP guarantees a maximum I CCH of 10 mA. 8. The JEDEC registration for the 6N137 specifies a maximum ICCL of 18 mA. HP guarantees a maximum I CCL of 13 mA. 9. The JEDEC registration for the 6N137 specifies a maximum IEL of -2.0 mA. HP guarantees a maximum IEL of -1.6 mA. 10. The tPLH propagation delay is measured from the 3.75 mA point on the falling edge of the input pulse to the 1.5 V point on the rising edge of the output pulse. 11. The tPHL propagation delay is measured from the 3.75 mA point on the rising edge of the input pulse to the 1.5 V point on the falling edge of the output pulse. 12. tPSK is equal to the worst case difference in tPHL and/or tPLH that will be seen between units at any given temperature and specified test conditions. 13. See application section titled "Propagation Delay, Pulse-Width Distortion and Propagation Delay Skew" for more information. 14. The tELH enable propagation delay is measured from the 1.5 V point on the falling edge of the enable input pulse to the 1.5 V point on the rising edge of the output pulse. 15. The tEHL enable propagation delay is measured from the 1.5 V point on the rising edge of the enable input pulse to the 1.5 V point on the falling edge of the output pulse. 16. CMH is the maximum tolerable rate of rise of the common mode voltage to assure that the output will remain in a high logic state (i.e., VO > 2.0 V). 17. CML is the maximum tolerable rate of fall of the common mode voltage to assure that the output will remain in a low logic state (i.e., VO < 0.8 V). 18. For sinusoidal voltages, (|dVCM | / dt)max = f CMVCM(p-p). 13 8-PIN DIP, SO-8 6 VCC = 5.5 V VO = 5.5 V VE = 2.0 V* IF = 250 A 10 * FOR SINGLE CHANNEL PRODUCTS ONLY 5 0 -60 -40 -20 0 20 40 60 5 4 RL = 1 K 2 RL = 4 K 1 0 TA - TEMPERATURE - C 8-PIN DIP, SO-8 6 5 VCC = 5.0 V VO = 0.6 V 4 RL = 350 K 3 RL = 1 K 2 1 RL = 4 K 0 -60 -40 -20 0 20 40 60 80 100 TA - TEMPERATURE - C 1 2 3 4 6 5 IF - FORWARD INPUT CURRENT - mA VCC = 5 V TA = 25 C 5 4 RL = 350 3 RL = 1 K 2 RL = 4 K 1 0 0 1 2 WIDEBODY 6 5 VCC = 5.0 V VO = 0.6 V 4 3 RL = 1 K RL = 350 2 1 RL = 4 K 0 -60 -40 -20 0 20 40 60 80 100 TA - TEMPERATURE - C Figure 3. Typical Input Threshold Current vs. Temperature. 3 4 5 6 IF - FORWARD INPUT CURRENT - mA Figure 2. Typical Output Voltage vs. Forward Input Current. ITH - INPUT THRESHOLD CURRENT - mA ITH - INPUT THRESHOLD CURRENT - mA Figure 1. Typical High Level Output Current vs. Temperature. RL = 350 3 0 80 100 WIDEBODY 6 VCC = 5 V TA = 25 C VO - OUTPUT VOLTAGE - V 15 VO - OUTPUT VOLTAGE - V IOH - HIGH LEVEL OUTPUT CURRENT - A 19. No external pull up is required for a high logic state on the enable input. If the VE pin is not used, tying VE to VCC will result in improved CMR performance. For single channel products only. 20. Device considered a two-terminal device: pins 1, 2, 3, and 4 shorted together, and pins 5, 6, 7, and 8 shorted together. 21. In accordance with UL1577, each optocoupler is proof tested by applying an insulation test voltage 3000 V rms for one second (leakage detection current limit, I I-O 5 A). This test is performed before the 100% production test for partial discharge (Method b) shown in the VDE 0884 Insulation Characteristics Table, if applicable. 22. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage 6000 V rms for one second (leakage detection current limit, I I-O 5 A). This test is performed before the 100% production test for partial discharge (Method b) shown in the VDE 0884 Insulation Characteristics Table, if applicable. 23. Measured between the LED anode and cathode shorted together and pins 5 through 8 shorted together. For dual channel products only. 24. Measured between pins 1 and 2 shorted together, and pins 3 and 4 shorted together. For dual channel products only. 0.7 VCC = 5.5 V VE = 2.0 V* IF = 5.0 mA * FOR SINGLE CHANNEL PRODUCTS ONLY 0.6 0.5 IO = 16 mA IO = 12.8 mA 0.4 0.3 0.2 IO = 9.6 mA IO = 6.4 mA 0.1 0 -60 -40 -20 0 20 40 60 80 100 WIDEBODY 0.8 VCC = 5.5 V VE = 2.0 V IF = 5.0 mA 0.7 0.6 IO = 16 mA 0.5 IO = 12.8 mA 0.4 0.3 IO = 9.6 mA IO = 6.4 mA 0.2 0.1 0 -60 -40 -20 TA - TEMPERATURE - C 20 0 40 60 80 100 8-PIN DIP, SO-8 10 IF - FORWARD CURRENT - mA IF - FORWARD CURRENT - mA TA = 25 C 100 IF + VF - 1.0 0.1 0.01 0.001 1.1 1.2 1.3 1.4 1.5 1.6 TA = 25 C 100 IF + VF - 10 1.0 0.1 0.01 0.001 1.2 VF - FORWARD VOLTAGE - V 1.3 1.4 1.5 1.6 1.7 VF - FORWARD VOLTAGE - V 8-PIN DIP, SO-8 dVF/dT - FORWARD VOLTAGE TEMPERATURE COEFFICIENT - mV/C dVF/dT - FORWARD VOLTAGE TEMPERATURE COEFFICIENT - mV/C Figure 6. Typical Input Diode Forward Characteristic. -2.4 -2.2 -2.0 -1.8 -1.6 -1.4 -1.2 0.1 1 10 100 IF - PULSE INPUT CURRENT - mA WIDEBODY -2.3 -2.2 -2.1 -2.0 -1.9 -1.8 0.1 1 VCC = 5.0 V VE = 2.0 V* VOL = 0.6 V * FOR SINGLE CHANNEL PRODUCTS ONLY 60 IF = 10-15 mA 50 IF = 5.0 mA 40 20 -60 -40 -20 0 20 40 60 80 100 Figure 5. Typical Low Level Output Current vs. Temperature. WIDEBODY 110 70 TA - TEMPERATURE - C TA - TEMPERATURE - C Figure 4. Typical Low Level Output Voltage vs. Temperature. 1000 IOL - LOW LEVEL OUTPUT CURRENT - mA 8-PIN DIP, SO-8 0.8 VOL - LOW LEVEL OUTPUT VOLTAGE - V VOL - LOW LEVEL OUTPUT VOLTAGE - V 14 10 100 IF - PULSE INPUT CURRENT - mA Figure 7. Typical Temperature Coefficient of Forward Voltage vs. Input Current. 15 PULSE GEN. Z O = 50 t f = t r = 5 ns SINGLE CHANNEL PULSE GEN. ZO = 50 t f = t r = 5 ns IF 1 INPUT MONITORING NODE DUAL CHANNEL +5 V 2 7 3 6 4 5 0.1F BYPASS OUTPUT VO MONITORING NODE GND 1 VCC 8 2 7 3 6 4 5 RL INPUT MONITORING NODE RL *CL RM RM IF = 7.50 mA INPUT IF IF = 3.75 mA t PHL t PLH OUTPUT VO 1.5 V Figure 8. Test Circuit for tPHL and tPLH. 80 tPLH , RL = 4 K tPHL , RL = 350 1 K 60 4 K tPLH , RL = 1 K 40 20 tPLH , RL = 350 0 -60 -40 -20 tP - PROPAGATION DELAY - ns tP - PROPAGATION DELAY - ns 105 VCC = 5.0 V IF = 7.5 mA 40 60 30 VCC = 5.0 V IF = 7.5 mA 20 RL = 350 0 RL = 1 k 40 60 80 100 TA - TEMPERATURE - C Figure 11. Typical Pulse Width Distortion vs. Temperature. 5 7 9 11 13 15 Figure 10. Typical Propagation Delay vs. Pulse Input Current. tr, tf - RISE, FALL TIME - ns PWD - PULSE WIDTH DISTORTION - ns RL = 4 k 20 tPHL , RL = 350 1 K 4 K IF - PULSE INPUT CURRENT - mA 40 0 tPLH , RL = 1 K 45 80 100 Figure 9. Typical Propagation Delay vs. Temperature. -10 -60 -40 -20 tPLH , RL = 350 60 TA - TEMPERATURE - C 10 tPLH , RL = 4 K 75 30 20 0 VCC = 5.0 V TA = 25C 90 VCC = 5.0 V IF = 7.5 mA tRISE tFALL RL = 4 k 300 290 60 RL = 1 k 40 RL = 350 20 0 -60 -40 -20 0.1F BYPASS CL* *CL IS APPROXIMATELY 15 pF WHICH INCLUDES PROBE AND STRAY WIRING CAPACITANCE. 100 +5 V IF VCC 8 RL = 350 , 1 k, 4 k 0 20 40 60 80 100 TA - TEMPERATURE - C Figure 12. Typical Rise and Fall Time vs. Temperature. GND OUTPUT VO MONITORING NODE 16 PULSE GEN. Z O = 50 t f = t r = 5 ns INPUT VE MONITORING NODE +5 V 7.5 mA IF 3.0 V VCC 8 1 2 0.1 F BYPASS 7 3 RL *C L GND 1.5 V t EHL OUTPUT VO MONITORING NODE 6 4 INPUT VE t ELH OUTPUT VO 1.5 V 5 *C L IS APPROXIMATELY 15 pF WHICH INCLUDES PROBE AND STRAY WIRING CAPACITANCE. tE - ENABLE PROPAGATION DELAY - ns Figure 13. Test Circuit for tEHL and tELH. 120 VCC = 5.0 V VEH = 3.0 V VEL = 0 V 90 IF = 7.5 mA tELH, RL = 4 k 60 tELH, RL = 1 k 30 tELH, RL = 350 tEHL, RL = 350 , 1 k, 4 k 0 -60 -40 -20 0 20 40 60 80 100 TA - TEMPERATURE - C Figure 14. Typical Enable Propagation Delay vs. Temperature. IF SINGLE CHANNEL IF 1 VCC 8 B A VFF 2 7 3 6 4 GND DUAL CHANNEL B +5 V 0.1 F BYPASS 1 A VCC 8 RL 2 7 3 6 VFF OUTPUT VO MONITORING NODE 5 4 VCM GND VCM + - PULSE GENERATOR Z O = 50 + - PULSE GENERATOR Z O = 50 VCM (PEAK) VCM VO VO 0V 5V SWITCH AT A: IF = 0 mA CMH VO (MIN.) SWITCH AT B: IF = 7.5 mA VO (MAX.) 0.5 V +5 V RL CML Figure 15. Test Circuit for Common Mode Transient Immunity and Typical Waveforms. 5 0.1 F BYPASS OUTPUT VO MONITORING NODE HCPL-2611 OPTION 060 800 PS (mW) 700 IS (mA) 600 500 400 300 200 100 0 0 25 50 75 100 125 150 175 200 TS - CASE TEMPERATURE - C OUTPUT POWER - PS, INPUT CURRENT - IS OUTPUT POWER - PS, INPUT CURRENT - IS 17 HCNWXXXX PS (mW) IS (mA) 800 700 600 500 400 300 200 100 0 0 25 50 75 100 125 150 175 TS - CASE TEMPERATURE - C Figure 16. Thermal Derating Curve, Dependence of Safety Limiting Value with Case Temperature per VDE 0884. GND BUS (BACK) VCC BUS (FRONT) NC ENABLE 0.1F NC OUTPUT 10 mm MAX. (SEE NOTE 5) SINGLE CHANNEL DEVICE ILLUSTRATED. Figure 17. Recommended Printed Circuit Board Layout. 18 SINGLE CHANNEL DEVICE VCC1 5V 5V 8 VCC2 390 470 IF 2 6 + D1* VF - GND 1 0.1 F BYPASS 3 5 SHIELD GND 2 VE 7 1 2 *DIODE D1 (1N916 OR EQUIVALENT) IS NOT REQUIRED FOR UNITS WITH OPEN COLLECTOR OUTPUT. DUAL CHANNEL DEVICE CHANNEL 1 SHOWN VCC1 5 V 5V 8 VCC2 390 470 IF 1 7 + D1* 0.1 F BYPASS VF - GND 1 2 5 GND 2 SHIELD 1 Figure 18. Recommended TTL/LSTTL to TTL/LSTTL Interface Circuit. 2 19 Propagation Delay, PulseWidth Distortion and Propagation Delay Skew Propagation delay is a figure of merit which describes how quickly a logic signal propagates through a system. The propagation delay from low to high (tPLH) is the amount of time required for an input signal to propagate to the output, causing the output to change from low to high. Similarly, the propagation delay from high to low (tPHL) is the amount of time required for the input signal to propagate to the output causing the output to change from high to low (see Figure 8). Pulse-width distortion (PWD) results when tPLH and tPHL differ in value. PWD is defined as the difference between tPLH and tPHL and often determines the maximum data rate capability of a transmission system. PWD can be expressed in percent by dividing the PWD (in ns) by the minimum pulse width (in ns) being transmitted. Typically, PWD on the order of 20-30% of the minimum pulse width is tolerable; the exact figure depends on the particular application (RS232, RS422, T-l, etc.). Propagation delay skew, tPSK, is an important parameter to consider in parallel data applica- tions where synchronization of signals on parallel data lines is a concern. If the parallel data is being sent through a group of optocouplers, differences in propagation delays will cause the data to arrive at the outputs of the optocouplers at different times. If this difference in propagation delays is large enough, it will determine the maximum rate at which parallel data can be sent through the optocouplers. signals at the inputs and outputs of the optocouplers. To obtain the maximum data transmission rate, both edges of the clock signal are being used to clock the data; if only one edge were used, the clock signal would need to be twice as fast. Propagation delay skew is defined as the difference between the minimum and maximum propagation delays, either tPLH or tPHL, for any given group of optocouplers which are operating under the same conditions (i.e., the same drive current, supply voltage, output load, and operating temperature). As illustrated in Figure 19, if the inputs of a group of optocouplers are switched either ON or OFF at the same time, t PSK is the difference between the shortest propagation delay, either tPLH or tPHL, and the longest propagation delay, either tPLH or tPHL. Propagation delay skew represents the uncertainty of where an edge might be after being sent through an optocoupler. Figure 20 shows that there will be uncertainty in both the data and the clock lines. It is important that these two areas of uncertainty not overlap, otherwise the clock signal might arrive before all of the data outputs have settled, or some of the data outputs may start to change before the clock signal has arrived. From these considerations, the absolute minimum pulse width that can be sent through optocouplers in a parallel application is twice tPSK. A cautious design should use a slightly longer pulse width to ensure that any additional uncertainty in the rest of the circuit does not cause a problem. As mentioned earlier, tPSK can determine the maximum parallel data transmission rate. Figure 20 is the timing diagram of a typical parallel data application with both the clock and the data lines being sent through optocouplers. The figure shows data and clock The tPSK specified optocouplers offer the advantages of guaranteed specifications for propagation delays, pulsewidth distortion and propagation delay skew over the recommended temperature, input current, and power supply ranges. DATA IF INPUTS 50% CLOCK 1.5 V VO IF DATA 50% OUTPUTS VO 1.5 V t PSK CLOCK t PSK Figure 19. Illustration of Propagation Delay Skew - tPSK. t PSK Figure 20. Parallel Data Transmission Example. www.semiconductor.agilent.com Data subject to change. Copyright (c) 1999 Agilent Technologies Obsoletes 5965-3594E 5968-1084E (11/99)