137
Detector
Slide
Push
Rotary
Encoders
Power
Dual-in-line
Package Type
TACT SwitchTM
Horizontal
Type
Vertical
Type
Soldering time
SPEH
Series
Series
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2 φ CA (K) or CC (T) at soldering portion (copper foil surface).
A heat resisting tape should be used for fixed measurement.
3. Temperature profile
300
200
100
A max.
B
E
D
Time (s)
C
Pre-heating
F max.
Room
temperature
Temperature (˚C )
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where
the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size,
thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is
highly recommended.
Notes
Push Switches Soldering Conditions
260
Series(Reow type)
230 40 180 150 120
SPEG
SPEJ
SPEF
A
(℃)
3s max. B
(℃) C
(s)
D
(℃)
E
(℃) F
(s)
10±1s
Soldering temperature Duration of immersionPreheating temperature
Preheating time
SPPJ2, SPPH1, SPED2, SPED4, SPEF
SPUJ, SPUP, SPPH2, SPPH4
SPUN
SPPJ3 100℃ max. 60s max. 260±5℃5±1s
100℃ max. 60s max. 260±5℃10±1s
——— 260±5℃5±1s
——— 260±5℃
Items Dip soldering
Reference for Dip Soldering
(For PC board terminal types)
300±5℃
SPUJ, SPUP 3+1/0s
350℃ max.
SPEH
SPEG, SPPH2, SPEF
SPEJ
SPED2, SPED4
SPPJ3, SPPJ2, SPUN, SPPH4, SPPH1 350±5℃3+1/0s
350±5℃3±1s
350±5℃4s max.
350±10℃3s max.
3s max.
Soldering temperature
Reference for Hand Soldering
For PC board 端子タイプに適用