ASMT-Mxx4 Moonstone(R) 1W Power LED Light Source Data Sheet Description Features The Moonstone(R) 1W Power LED Light Source is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design has excellent heat transfer from the package to the motherboard. x Available in Cool White & Warm White color The low profile package design is suitable for a wide variety of applications especially where height is a constraint. x High current operation The package is compatible with reflow soldering. This will give more freedom and flexibility to the light source designer. x Wide viewing angle The 1W Power LED light source can be mounted onto metal core PCB enabling optimum heat dissipation and ease of installation. x MSL 2a products x Energy efficient x Exposed pad for excellent heat transfer x Suitable for reflow soldering process x Long operation life x Silicone encapsulation x Non-ESD sensitive (threshold > 16KV) Specifications Applications x InGaN Technology x Sign backlight, billboard illumination or backlight x 3.5 V (max) at 350 mA x Exit sign or emergency sign lightings x Commercial lightings x Accent and marker lightings x Pathway lighting x Task lighting x Reading lights x Decorative lighting x Garden lighting x Architectural lighting x Portable (flash light, bicycle head light x 110 viewing angle Package Dimension for Moonstone(R) 10.00 1 Anode 2 Cathode 3 Heat Sink 3.30 8.50 1.27 Metal Slug 3 O 5.26 LED 10.60 + ZENER - 8.50 O 8.00 2.00 5.25 1.30 2 1 5.08 0.81 Figure 1. Moonstone(R) package outline drawing. Notes: 1. All dimensions are in millimeters. 2. Tolerance is 0.1 mm unless otherwise specified. 3. Terminal finish: Ag plating. Package Dimension for Moonstone(R) on MCPCB 1 16.00 2.50 Anode 60 2 Cathode 3 Heat Sink 5.00 3.00 20.00 14.00 19.00 R 1.60 4.00 3.00 19.00 1.40 2.30 1.60 1.30 4.60 24.00 Figure 2. MCPCB I package outline drawing. Notes: 1. All dimensions in millimeters. 2. Tolerance is 0.1 mm unless otherwise specified. 2 4.90 3.30 19.90 Figure 3. MCPCB II package outline drawing. Part Numbering System ASMT-M x1 x2 4 - N x 3 x4 x5 x6 Packaging Option Color Bin Selection Max Flux Bin Selection Min Flux Bin Selection Moonstone(R)Type 0 - Non-diffused B - Diffused A - Non-diffused on MCPCB I C - Diffused on MCPCB I K - Non-diffused on MCPCB II L - Diffused on MCPCB II Color W - Cool White Y - Warm White Note: 1. Please refer to Page 9 for selection details. Device Selection Guide (Tj = 25C) Luminous Flux, V [1,2] (lm) Part Number [3] Color Min. Typ. Max. Test Current (mA) ASMT-MWx24-NKL00 Cool White 56.0 75.0 95.0 350 ASMT-MWx24-NKM00 Dice Technology Electrically Isolated Metal Slug InGaN Yes 56.0 80.0 124.0 350 ASMT-MYx24-NKL00 Warm White 56.0 70.0 95.0 350 InGaN Yes ASMT-MWx24-NKL00 Cool White Diffused 56.0 70.0 95.0 350 InGaN Yes 56.0 75.0 124.0 350 56.0 65.0 95.0 350 ASMT-MWx24-NKM00 ASMT-MYx24-NKL00 Warm White Diffused Notes: 1. V is the total luminous flux output as measured with an integrating sphere at 25ms mono pulse condition. 2. Flux tolerance is 10 %. 3. Flux performance for respective part number is similar when device on MCPCB I or MCPCB II. 3 Yes Yes InGaN Yes Absolute Maximum Ratings (TA = 25C) Parameter ASMT-Mxx4 Units DC Forward Current [1] 350 mA Peak Pulsing Current [2] 1000 mA Power Dissipation 1225 mW LED Junction Temperature 125 C LED Junction Temperature for short term application 145 C Operating Ambient Temperature Range -40 to +110 C Storage Temperature Range -40 to +120 C Soldering Temperature Refer to Figure 13 Reverse Voltage [3] Not recommended Notes: 1. Derate linearly based on Figure 11. 2. Pulse condition duty factor = 10%, Frequency = 1kHz. 3. Not recommended for reverse bias operation. Optical Characteristics at 350 mA (TJ = 25C) Part Number Color ASMT-MWx24-NKL00 Cool White ASMT-MWx24-NKM00 ASMT-MYx24-NKL00 Warm White ASMT-MWx24-NKL00 Cool White Diffused ASMT-MWx24-NKM00 ASMT-MYx24-NKL00 Warm White Diffused Correlated Color Temperature, CCT (Kelvin) Viewing Angle, 21/2 [2] () Luminous Efficiency (lm/W) Min. Typ Typ Max. 4000 10000 110 67 4000 10000 110 71 2600 4000 110 63 4000 10000 110 63 4000 10000 110 67 2600 4000 110 58 Notes: 1. T1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Electrical Characteristic at 350 mA (TJ = 25C) Forward Voltage VF (Volts) at IF = 350mA Thermal Resistance R j-ms ( C/W) [1] Dice type Min. Typ. Max. Typ. InGaN 2.8 3.2 3.5 10 Note: 1. RTj-ms is the Thermal Resistance from LED junction to metal slug. 4 1.4 1.2 WARM WHITE COOL WHITE RELATIVE LUMINOUS FLUX (NORMALIZED AT 350 mA) RELATIVE INTENSITY 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 480 530 580 630 WAVELENGTH - nm 680 730 0 0.5 1 3 3.5 4 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 1.4 tp D= 0.05 0.10 0.25 0.50 1.00 IF T 1.0 1.2 0.8 0.6 0.4 0.2 0.0 0.00001 0.0001 0.001 0.01 0.1 1 PULSE DURATION, tp - sec -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 90 Figure 7. Radiation Pattern. PULSE CURRENT, IP - A t D= p T 50 100 150 200 250 300 350 400 450 500 DC FORWARD CURRENT - mA Figure 5. Relative Luminous Flux vs. Mono Pulse Current. 1.4 PULSE CURRENT, IP - A 0.4 780 NORMALIZED INTENSITY FORWARD CURRENT - mA 1.5 2 2.5 FORWARD VOLTAGE - V Figure 6. Forward Current vs. Forward Voltage. D= tp T tp IF T 1.0 0.8 D= 0.05 0.10 0.25 0.50 1.00 0.6 0.4 0.2 10 100 Figure 8. Maximum pulse current vs. ambient temperature. Derated based on TA = 25C, RTJ-A = 50C/W. 5 0.6 0 430 500 450 400 350 300 250 200 150 100 50 0 1.2 0.8 0.2 Figure 4. Relative Intensity vs. Wavelength. 0 1 0.0 0.00001 0.0001 0.001 0.01 0.1 1 PULSE DURATION, tp - sec 10 100 Figure 9. Maximum pulse current vs. ambient temperature. Derated based on TA = 85C, RTJ-A = 50C/W. RELATIVE LIGHT OUTPUT (NORMALIZED AT 25C) 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 WARM WHITE COOL WHITE -50 -25 0 25 50 75 JUNCTION TEMPERATURE, TJ - C 100 125 Figure 10. Relative Light Output vs. Junction Temperature. 400 MAX ALLOWABLE DC CURRENT - mA MAX ALLOWABLE DC CURRENT - mA 400 350 300 250 200 RTJ-A = 30C/W RTJ-A = 40C/W RTJ-A = 50C/W 150 100 50 350 300 250 200 RTJ-MS = 10C/W 150 100 50 0 0 0 20 40 60 80 100 AMBIENT TEMPERATURE, TA - C 120 140 Figure 11. Maximum Forward Current vs. Ambient Temperature. Derated based on TJMAX = 125C, RTJ-A = 30C/W, 40C/W and 50C/W. 0 20 40 60 80 100 120 METAL SLUG TEMPERATURE, TMS - C 140 Figure 12. Maximum Forward Current vs. Metal Slug Temperature. Derated based on TJMAX = 125C, RTJ-MS = 10C/W. 10.700.10 TEMPERATURE 10 - 30 SEC. 217C 200C 8.400.10 255 - 260C 3C/SEC. MAX. 6C/SEC. MAX. 150C 17.000.20 1.000.10 3C/SEC. MAX. 3.10.10 100 SEC. MAX. 60 - 120 SEC. 5.080.10 TIME Figure 13. Recommended Reflow Soldering. (Acc. to J-STD-020C) Figure 14. Recommended soldering land pattern. Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN1060 Surface Mounting SMT LED Indicator Components. 6 Option Selection Details Flux Bin Limit [x3, x4] Luminous Flux (lm) at IF = 350mA ASMT-Mx1 x2 4 - N x3 x4 x5 x6 x3 - Minimum Flux Bin x4 - Maximum Flux Bin x5 - Color Bin Selection x6 - Packaging Option Bin Min. Max. K 56.0 73.0 L 73.0 95.0 M 95.0 124.0 Tolerance for each bin limits is 10%. Color Bin Selections [x5] Individual reel will contain parts from one full bin only. Cool White Warm White O Full Distribution O Full Distribution A A only A A only B B only B B only C C only C C only D D only D D only E E only E E only F F only F F only G G only N A and C only H H only P B and D only L A and G only Q E and C only M B and H only R F and D only N A and C only U E and F only P B and D only W C and D only Q E and C only Z A and B only R F and D only 1 A, B, C and D only S G and H only 4 C, D, E and F only U E and F only W C and D only Z A and B only 1 A, B, C and D only 2 G, H, A and B only 4 C, D, E and F only 7 Color Bin Limit Cool White Color Limits (Chromaticity Coordinates) Warm White Color Limits (Chromaticity Coordinates) Bin A X Y 0.367 0.400 0.362 0.372 0.329 0.345 0.329 0.369 Bin A X Y 0.452 0.434 0.488 0.447 0.470 0.414 0.438 0.403 Bin B X Y 0.362 0.372 0.356 0.330 0.329 0.302 0.329 0.345 Bin B X Y 0.438 0.403 0.470 0.414 0.452 0.384 0.424 0.376 Bin C X Y 0.329 0.369 0.329 0.345 0.305 0.322 0.301 0.342 Bin C X Y 0.407 0.393 0.418 0.422 0.452 0.434 0.438 0.403 Bin D X Y 0.329 0.345 0.329 0.302 0.311 0.285 0.305 0.322 Bin D X Y 0.395 0.362 0.407 0.393 0.438 0.403 0.424 0.376 Bin E X Y 0.303 0.333 0.307 0.311 0.283 0.284 0.274 0.301 Bin E X Y 0.381 0.377 0.387 0.404 0.418 0.422 0.407 0.393 Bin F X Y 0.307 0.311 0.311 0.285 0.290 0.265 0.283 0.284 Bin F X Y 0.373 0.349 0.381 0.377 0.407 0.393 0.395 0.362 Bin G X Y 0.388 0.417 0.379 0.383 0.362 0.372 0.367 0.400 Tolerance: 0.01 Bin H X Y 0.379 0.383 0.369 0.343 0.356 0.330 0.362 0.372 0.44 0.42 0.40 G 0.38 A 4.0k 0.36 4.5k C B H 0.34 5.6k Black Body Curve 0.32 7k D E 0.30 10k F 0.28 0.26 0.24 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 X - COORDINATE 0.48 0.46 0.44 Y - COORDINATE Y - COORDINATE Tolerance: 0.01 A 0.42 0.40 0.38 0.36 C E 4.0k F 3.5k D 2.6k Black Body Curve 0.34 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.52 X - COORDINATE Figure 15. Color bins (Cool White). Figure 16. Color bins (Warm White). Packaging Option [x6] Example Selection Option ASMT-MW04-NKLZ1 0 Tube (for Moonstone(R) only) Tray (for Moonstone(R) on MCPCB only) 1 Tape and Reel ASMT-MW04-Nxxxx - X3 = K - X4 = L - X5 = Z - X6 = 1 - 8 3.0k B Cool White, Non-diffused Minimum Flux Bin K Maximum Flux Bin L Color Bin A and B only Tape and Reel Option Packing Tube - Option 0 1.00 5.80 4.65 5.50 37.00 5.45 10.10 8.30 535.00 SIDE VIEW TOP VIEW Figure 17. Tube dimensions. Tape and Reel - Option 1 B Bo W F E A 2.5 B A Ko P SECTION A Dim Value AO 8.80 0.10 BO 16.45 0.10 KO 3.60 0.10 E 1.75 0.10 F 11.50 0.10 W 24.0 0.10 P 16.0 0.10 Quantity/ Reel 250 units All dimensions in millimeters. Ao SECTION B Figure 18. Carrier tape dimensions. END MINIMUM OF 160 mm OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS MINIMUM OF 390 mm OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 19. Carrier tape leader and trailer dimensions. 9 +1.00 24.0 -0.00 2.30 2.30 0 0 60. 99.50 1.00 R10.0 2.50 0.50 0 .50 268.00 R10 13.50 330.00 1.00 120.0 Figure 20. Reel dimensions. Packing Tray - Option 0 (for Moonstone(R) on MCPCB only) Figure 21. Tray dimensions. 10 0.5 0.50 Handling Precaution The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly of handling, the unit should be held on the body only. Please refer to Avago Application Note AN 5288 for detail information. B. Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30C / 60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours. C. Control for unfinished reel Moisture Sensitivity This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use - Unopen moisture barrier bag (MBB) can be stored at <40C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity indicator card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is not recommended to open the MBB prior to assembly (e.g. for IQC). - For any unused LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembly boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 672 hours. E. Baking is required if - HIC "10%" indicator is not blue and "5%" indicator is pink. - The LEDs are exposed to condition of >30C / 60% RH at any time. - The LED floor life exceeded 672hrs. Recommended baking condition: 605C for 20hrs. DISCLAIMER: Avago's products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against Avago or its suppliers, for all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright (c) 2005-2010 Avago Technologies. All rights reserved. AV02-1673EN - October 5, 2010