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LM34
SNIS161D –MARCH 2000–REVISED JANUARY 2016
LM34 Precision Fahrenheit Temperature Sensors
1 Features 3 Description
The LM34 series devices are precision integrated-
1• Calibrated Directly in Degrees Fahrenheit circuit temperature sensors, whose output voltage is
• Linear 10.0 mV/°F Scale Factor linearly proportional to the Fahrenheit temperature.
• 1.0°F Accuracy Assured (at 77°F) The LM34 device has an advantage over linear
temperature sensors calibrated in degrees Kelvin,
• Rated for Full −50° to 300°F Range because the user is not required to subtract a large
• Suitable for Remote Applications constant voltage from its output to obtain convenient
• Low Cost Due to Wafer-Level Trimming Fahrenheit scaling. The LM34 device does not
require any external calibration or trimming to provide
• Operates From 5 to 30 Volts typical accuracies of ±1/2°F at room temperature and
• Less Than 90-μA Current Drain ±1-1⁄2°F over a full −50°F to 300°F temperature
• Low Self-Heating, 0.18°F in Still Air range. Lower cost is assured by trimming and
• Nonlinearity Only ±0.5°F Typical calibration at the wafer level. The low output
impedance, linear output, and precise inherent
• Low-Impedance Output, 0.4 Ωfor 1-mA Load calibration of the LM34 device makes interfacing to
readout or control circuitry especially easy. It can be
2 Applications used with single power supplies or with plus and
• Power Supplies minus supplies. Because the LM34 device draws only
75 µA from its supply, the device has very low self-
• Battery Management heating, less than 0.2°F in still air.
• HVAC The LM34 device is rated to operate over a −50°F to
• Appliances 300°F temperature range, while the LM34C is rated
for a −40°F to 230°F range (0°F with improved
accuracy). The LM34 devices are series is available
packaged in hermetic TO-46 transistor packages;
while the LM34C, LM34CA, and LM34D are available
in the plastic TO-92 transistor package. The LM34D
device is available in an 8-lead, surface-mount, small-
outline package. The LM34 device is a complement
to the LM35 device (Centigrade) temperature sensor.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
SOIC (8) 4.90 mm × 3.91 mm
LM34 TO-92 (3) 4.30 mm × 4.30 mm
TO-46 (3) 4.699 mm × 4.699 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Basic Fahrenheit Temperature Sensor (5°F to Full-Range Fahrenheit Temperature Sensor
300°F)
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
7.3 Feature Description................................................. 11
1 Features.................................................................. 17.4 Device Functional Modes........................................ 12
2 Applications ........................................................... 18 Application and Implementation ........................ 13
3 Description............................................................. 18.1 Application Information............................................ 13
4 Revision History..................................................... 28.2 Typical Application.................................................. 13
5 Pin Configuration and Functions......................... 38.3 System Examples ................................................... 14
6 Specifications......................................................... 49 Power Supply Recommendations...................... 16
6.1 Absolute Maximum Ratings ...................................... 410 Layout................................................................... 16
6.2 ESD Ratings.............................................................. 410.1 Layout Guidelines ................................................. 16
6.3 Recommended Operating Conditions....................... 410.2 Layout Example .................................................... 17
6.4 Thermal Information.................................................. 411 Device and Documentation Support................. 18
6.5 Electrical Characteristics: LM34A and LM34CA....... 511.1 Trademarks........................................................... 18
6.6 Electrical Characteristics: LM34, LM34C, and
LM34D........................................................................ 711.2 Electrostatic Discharge Caution............................ 18
6.7 Typical Characteristics.............................................. 911.3 Glossary................................................................ 18
7 Detailed Description............................................ 11 12 Mechanical, Packaging, and Orderable
Information........................................................... 18
7.1 Overview................................................................. 11
7.2 Functional Block Diagram....................................... 11
4 Revision History
Changes from Revision C (January 2015) to Revision D Page
• Changed NDV Package (TO-46) pinout from Top View to Bottom View............................................................................... 3
Changes from Revision B (November 2000) to Revision C Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section.................................................................................................. 1
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+VSVOUT GND
+VS
VOUT
GND
N.C.
N.C.
N.C.
N.C.
N.C.
1
2
3
4
8
7
6
5
+VSVOUT
GND t
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5 Pin Configuration and Functions
NDV Package
3-PIn TO-46
(Bottom View)
Case is connected to negative pin (GND)
D Package
8-PIn SO8
(Top View)
N.C. = No connection
LP Package
3-Pin TO-92
(Bottom View)
Pin Functions
PIN TYPE DESCRIPTION
NAME TO46/NDV TO92/LP SO8/D
+VS— — 8 POWER Positive power supply pin
VOUT — — 1 O Temperature Sensor Analog Output
GND — — 4 GND Device ground pin, connect to power supply negative terminal
2
3
N.C. — — 5 — No Connection
6
7
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6 Specifications
6.1 Absolute Maximum Ratings(1)(2)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
Supply voltage 35 –0.2 V
Output voltage 6 –1 V
Output current 10 mA
TO-46 Package −76 356
Storage temperature, Tstg TO-92 Package −76 300 °F
SO-8 Package −65 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
6.2 ESD Ratings VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
LM34, LM34A –50 300
Specified operating temperature range LM34C, LM34CA –40 230 °F
(TMIN ≤TA≤TMAX)LM34D 32 212
Supply Voltage Range (+VS) 4 30 V
6.4 Thermal Information LM34
THERMAL METRIC(1) NDV (TO-46) LP (TO-92) D (SO8) UNIT
3 PINS 3 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 720 324 400 °F/W
RθJC Junction-to-case thermal resistance 43 — —
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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6.5 Electrical Characteristics: LM34A and LM34CA
Unless otherwise noted, these specifications apply: −50°F ≤TJ≤300°F for the LM34 and LM34A; −40°F ≤TJ≤230°F for the
LM34C and LM34CA; and 32°F ≤TJ≤212°F for the LM34D. VS= 5 Vdc and ILOAD = 50 µA in the circuit of Full-Range
Fahrenheit Temperature Sensor; 6 Vdc for LM34 and LM34A for 230°F ≤TJ≤300°F. These specifications also apply from
5°F to TMAX in the circuit of Basic Fahrenheit Temperature Sensor (5°F to 300°F).LM34A LM34CA
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX
Tested Limit(2) –1 1 –1 1
TA= 77°F Design Limit(3) °F
±0.4 ±0.4
Tested Limit
TA= 0°F Design Limit –2 2 °F
±0.6 ±0.6
Accuracy(1) Tested Limit –2 2 –2 2
TA= TMAX Design Limit °F
±0.8 ±0.8
Tested Limit –2 2
TA= TMIN Design Limit –3 3 °F
±0.8 ±0.8
Tested Limit
Nonlinearity (4) Design Limit –0.7 0.7 –0.6 0.6 °F
TA= 77°F ±0.35 ±0.3
Tested Limit 9.9 10.1
Sensor gain (Average Design Limit +9.9 10.1 mV/°F
Slope) TA= 77°F +10 10
Tested Limit –1 1 –1 1
TA= 77°F Design Limit mV/mA
0≤IL≤1 mA ±0.4 ±0.4
Load regulation(5) Tested Limit
0≤IL≤1 mA Design Limit –3 3 –3 3 mV/mA
±0.5 ±0.5
Tested Limit –0.05 0.05 –0.05 0.05
TA= 77°F Design Limit mV/V
5 V ≤VS≤30 V ±0.01 ±0.01
Line regulation(5) Tested Limit
5 V ≤VS≤30 V Design Limit –0.1 0.1 –0.1 0.1 mV/V
±0.02 ±0.02
(1) Accuracy is defined as the error between the output voltage and 10 mV/°F times the device’s case temperature at specified conditions of
voltage, current, and temperature (expressed in °F).
(2) Tested limits are specified and 100% tested in production.
(3) Design limits are specified (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are
not used to calculate outgoing quality levels.
(4) Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line over the rated
temperature range of the device.
(5) Regulation is measured at constant junction temperature using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
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Electrical Characteristics: LM34A and LM34CA (continued)
Unless otherwise noted, these specifications apply: −50°F ≤TJ≤300°F for the LM34 and LM34A; −40°F ≤TJ≤230°F for the
LM34C and LM34CA; and 32°F ≤TJ≤212°F for the LM34D. VS= 5 Vdc and ILOAD = 50 µA in the circuit of Full-Range
Fahrenheit Temperature Sensor; 6 Vdc for LM34 and LM34A for 230°F ≤TJ≤300°F. These specifications also apply from
5°F to TMAX in the circuit of Basic Fahrenheit Temperature Sensor (5°F to 300°F).LM34A LM34CA
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX
Tested Limit 90 90
VS= 5 V, TA= 77°F Design Limit µA
75 75
Tested Limit
VS= 5 V Design Limit 160 139 µA
131 116
Quiescent current(6) Tested Limit 92 92
VS= 30 V, TA= 77°F Design Limit µA
76 76
Tested Limit
VS= 30 V Design Limit 163 142 µA
132 117
Tested Limit 2 2
4 V ≤VS≤30 V, TA= 77°F Design Limit µA
0.5 0.5
Change of quiescent
current(5) Tested Limit
5 V ≤VS≤30 V Design Limit 3 3 µA
1 1
Tested Limit
Temperature coefficient Design Limit 0.5 0.5 µA/°F
of quiescent current 0.3 0.3
Tested Limit
In circuit of Basic Fahrenheit
Minimum temperature for Temperature Sensor (5°F to Design Limit 5 5 °F
rated accuracy 300°F), IL= 0
TA= 77°F 3 3
Long-term stability TJ= TMAX for 1000 hours ±0.16 ±0.16 °F
(6) Quiescent current is defined in the circuit of Basic Fahrenheit Temperature Sensor (5°F to 300°F).
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6.6 Electrical Characteristics: LM34, LM34C, and LM34D
Unless otherwise noted, these specifications apply: −50°F ≤TJ≤300°F for the LM34 and LM34A; −40°F ≤TJ≤230°F for the
LM34C and LM34CA; and +32°F ≤TJ≤212°F for the LM34D. VS= 5 Vdc and ILOAD = 50 µA in the circuit of Full-Range
Fahrenheit Temperature Sensor; 6 Vdc for LM34 and LM34A for 230°F ≤TJ≤300°F. These specifications also apply from
5°F to TMAX in the circuit of Basic Fahrenheit Temperature Sensor (5°F to 300°F).LM34 LM34C, LM34D
PARAMETER CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX
Tested Limit(2) –2 2 –2 2
TA= 77°F Design Limit(3) °F
±0.8 ±0.8
Tested Limit
TA= 0°F Design Limit –3 3 °F
±1 ±1
Accuracy, LM34,
LM34C(1) Tested Limit –3 3
TA= TMAX Design Limit –3 3 °F
±1.6 ±1.6
Tested Limit
TA= TMIN Design Limit –3 3 –4 4 °F
±1.6 ±1.6
Tested Limit –3 3
TA= 77°F Design Limit °F
±1.2
Tested Limit
Accuracy, LM34D(1) TA= TMAX Design Limit –4 4 °F
±1.8
Tested Limit
TA= TMIN Design Limit –4 4 °F
±1.8
Tested Limit
Nonlinearity (4) Design Limit –1.0 1 –1 1 °F
±0.6 ±0.4
Tested Limit 9.8 10.2
Sensor gain (Average Design Limit 9.8 10.2 mV/°F
Slope) 10 10
TA= 77°F Tested Limit –2.5 2.5 –2.5 2.5
0≤IL≤1 mA Design Limit mV/mA
±0.4 ±0.4
Load regulation(5) Tested Limit
TMIN ≤TA≤150°F Design Limit –6.0 6 –6 6 mV/mA
0≤IL≤1 mA ±0.5 ±0.5
Tested Limit –0.1 0.1 –0.1 0.1
TA= 77°F, Design Limit mV/V
5 V ≤VS ≤30 V ±0.01 ±0.01
Line regulation(5) Tested Limit
5 V ≤VS≤30 V Design Limit –0.2 0.2 –0.2 0.2 mV/V
±0.02 ±0.02
(1) Accuracy is defined as the error between the output voltage and 10 mV/˚F times the device’s case temperature at specified conditions of
voltage, current, and temperature (expressed in ˚F).
(2) Tested limits are specified and 100% tested in production.
(3) Design limits are specified (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are
not used to calculate outgoing quality levels.
(4) Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line over the rated
temperature range of the device.
(5) Regulation is measured at constant junction temperature using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
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Electrical Characteristics: LM34, LM34C, and LM34D (continued)
Unless otherwise noted, these specifications apply: −50°F ≤TJ≤300°F for the LM34 and LM34A; −40°F ≤TJ≤230°F for the
LM34C and LM34CA; and +32°F ≤TJ≤212°F for the LM34D. VS= 5 Vdc and ILOAD = 50 µA in the circuit of Full-Range
Fahrenheit Temperature Sensor; 6 Vdc for LM34 and LM34A for 230°F ≤TJ≤300°F. These specifications also apply from
5°F to TMAX in the circuit of Basic Fahrenheit Temperature Sensor (5°F to 300°F).LM34 LM34C, LM34D
PARAMETER CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX
Tested Limit 100 100
VS= 5 V, TA= 77°F Design Limit µA
75 75
Tested Limit
VS= 5 V Design Limit 176 154 µA
131 116
Quiescent current(6) Tested Limit 103 103
VS= 30 V, TA= 77°F Design Limit µA
76 76
Tested Limit
VS= 30 V Design Limit 181 159 µA
132 117
Tested Limit 3 3
4 V ≤VS≤30 V, Design Limit µA
TA= +77°F 0.5 0.5
Change of quiescent
current(5) Tested Limit
5 V ≤VS≤30 V Design Limit 5 5 µA
1 1
Tested Limit
Temperature coefficient Design Limit 0.7 0.7 µA/°F
of quiescent current 0.3 0.3
Tested Limit
In circuit of Basic
Minimum temperature Fahrenheit Design Limit 5.0 5 °F
for rated accuracy Temperature Sensor
(5°F to 300°F), IL= 0 3 3
Long-term stability TJ= TMAX for 1000 hours ±0.16 ±0.16 °F
(6) Quiescent current is defined in the circuit of Basic Fahrenheit Temperature Sensor (5°F to 300°F).
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6.7 Typical Characteristics
Figure 2. Thermal Time Constant
Figure 1. Thermal Resistance Junction to Air
Figure 4. Thermal Response in Stirred Oil Bath
Figure 3. Thermal Response in Still Air
Figure 6. Quiescent Current vs Temperature (in Circuit of
Figure 5. Minimum Supply Voltage vs Temperature Basic Fahrenheit Temperature Sensor (5°F to 300°F))
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Typical Characteristics (continued)
Figure 7. Quiescent Current vs Temperature Figure 8. Accuracy vs Temperature (Specified)
(in Circuit of Full-Range Fahrenheit Temperature Sensor;
−VS=−5V, R1 = 100k)
Figure 10. Noise Voltage
Figure 9. Accuracy vs Temperature (Specified)
Figure 11. Start-Up Response
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7 Detailed Description
7.1 Overview
The LM34 series devices are precision integrated-circuit temperature sensors, whose output voltage is linearly
proportional to the Fahrenheit temperature. The LM34 device has an advantage over linear temperature sensors
calibrated in degrees Kelvin, because the user is not required to subtract a large constant voltage from its output
to obtain convenient Fahrenheit scaling. The LM34 device does not require any external calibration or trimming
to provide typical accuracies of ±1/2°F at room temperature and ±1-1⁄2°F over a full −50°F to 300°F temperature
range. Lower cost is assured by trimming and calibration at the wafer level. The low output impedance, linear
output, and precise inherent calibration of the LM34 device makes interfacing to readout or control circuitry
especially easy. It can be used with single power supplies or with plus and minus supplies. Because the LM34
device draws only 75 µA from its supply, the device has very low self-heating, less than 0.2°F in still air.
The temperature sensing element is comprised of a simple base emitter junction that is forward biased by a
current source. The temperature sensing element is buffered by an amplifier and provided to the OUT pin. The
amplifier has a simple class-A output stage thus providing a low impedance output that can source 16 μA and
sink 1 μA.
The temperature sensing element is comprised of a delta-VBE architecture. The temperature sensing element is
then buffered by an amplifier and provided to the VOUT pin. The amplifier has a simple class A output stage with
typical 0.5-Ωoutput impedance as shown in the Functional Block Diagram. Therefore, the LM34 device can only
source current and the sinking capability of the device is limited to 1 µA.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Capacitive Drive Capability
Like most micropower circuits, the LM34 device has a limited ability to drive heavy capacitive loads. The LM34
device, by itself, is able to drive 50 pF without special precautions. If heavier loads are anticipated, it is easy to
isolate or decouple the load with a resistor; see Figure 12. You can improve the tolerance of capacitance with a
series R-C damper from output to ground; see Figure 13. When the LM34 is applied with a 499-Ωload resistor
(as shown Figure 18 and Figure 19), the device is relatively immune to wiring capacitance because the
capacitance forms a bypass from ground to input, not on the output. However, as with any linear circuit
connected to wires in a hostile environment, its performance can be affected adversely by intense
electromagnetic sources such as relays, radio transmitters, motors with arcing brushes, transients of the SCR,
and so on, as the wiring of the device can act as a receiving antenna and the internal junctions can act as
rectifiers. For best results in such cases, a bypass capacitor from VIN to ground and a series R-C damper, such
as 75 Ωin series with 0.2 μF or 1 μF from output to ground, are often useful. See Figure 23,Figure 24 and
Figure 26 for more details.
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Feature Description (continued)
Figure 12. LM34 With Decoupling from Capacitive Figure 13. LM34 With R-C Damper
Load
7.3.2 LM34 Transfer Function
The accuracy specifications of the LM34 devices are given with respect to a simple linear transfer function shown
in Equation 1:
VOUT = 10 mV/°F × T °F
where
• VOUT is the LM34 output voltage
• T is the temperature in °F (1)
7.4 Device Functional Modes
The only functional mode of the LM34 device is that it has an analog output directly proportional to temperature.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The features of the LM34 device make it suitable for many general temperature sensing applications. Multiple
package options expand on flexibility of the device.
8.2 Typical Application
8.2.1 Basic Fahrenheit Temperature Sensor Application
Figure 14. Basic Fahrenheit Temperature Sensor (5°F to 300°F)
8.2.1.1 Design Requirements
Table 1. Key Requirements
PARAMETER VALUE
Accuracy at 77°F ±2°F
Accuracy from –50°F to 300°F ±3°F
Temperature Slope 10 mV/°F
8.2.1.2 Detailed Design Procedure
Because the LM34 is a simple temperature sensor that provides an analog output, design requirements related
to layout are more important than electrical requirements (see Layout).
8.2.1.3 Application Curve
Figure 15. Temperature Error
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8.3 System Examples
Figure 16. Full-Range Fahrenheit Temperature Figure 17. Full Range Farenheit Sensor (–50 °F to
Sensor 300 °F)
VOUT = 10 mV/°F (TA+3°F) from 3°F to 100°F
Figure 18. Two-Wire Remote Temperature Sensor Figure 19. Two-Wire Remote Temperature Sensor
(Grounded Sensor) (Output Referred to Ground)
Figure 20. 4- to -20 mA Current Source (0°F to Figure 21. Fahrenheit Thermometer (Analog Meter)
100°F)
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∗= 1% or 2% film resistor
— Trim R for V = 3.525V
B B
— Trim R for V = 2.725V
C C
— Trim R for V = 0.085V + 40 mV/°F x T
— Example, V = 3.285V at 80°F
A A AMBIENT
A
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System Examples (continued)
Figure 22. Expanded Scale Thermometer Figure 23. Temperature-to-Digital Converter
(50°F to 80°F, for Example Shown) (Serial Output, 128°F Full Scale)
Figure 24. LM34 With Voltage-to-Frequency Figure 25. Bar-Graph Temperature Display
Converter and Isolated Output (Dot Mode)
(3°F to 300°F; 30 Hz to 3000 Hz)
Figure 26. Temperature-to-Digital Converter Figure 27. Temperature Controller
(Parallel TRI-STATE Outputs for Standard Data Bus
to µP Interface, 128°F Full Scale)
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9 Power Supply Recommendations
It may be necessary to add a bypass filter capacitor in noisy environments, as shown in as shown in Figure 13.
10 Layout
10.1 Layout Guidelines
The LM34 device can be easily applied in the same way as other integrated-circuit temperature sensors. The
device can be glued or cemented to a surface and its temperature will be within about 0.02°F of the surface
temperature. This presumes that the ambient air temperature is almost the same as the surface temperature; if
the air temperature were much higher or lower than the surface temperature, the actual temperature of the LM34
die would be at an intermediate temperature between the surface temperature and the air temperature. This is
especially true for the TO-92 plastic package, where the copper leads are the principal thermal path to carry heat
into the device, so its temperature might be closer to the air temperature than to the surface temperature.
To minimize this problem, be sure that the wiring to the LM34, as it leaves the device, is held at the same
temperature as the surface of interest. The easiest way to do this is to cover up these wires with a bead of
epoxy, which will insure that the leads and wires are all at the same temperature as the surface, and that the die
temperature of the LM34 device will not be affected by the air temperature.
The TO-46 metal package can be soldered to a metal surface or pipe without damage. In the case where
soldering is used, the V−terminal of the circuit will be grounded to that metal. Alternatively, the LM34 device can
be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole
in a tank. As with any IC, the LM34 and accompanying wiring and circuits must be kept insulated and dry, to
avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where
condensation can occur. Printed-circuit coatings and varnishes such as a conformal coating and epoxy paints or
dips are often used to insure that moisture cannot corrode the LM34 or its connections.
These devices are sometimes soldered to a small, light-weight heat fin to decrease the thermal time constant
and speed up the response in slowly-moving air. On the other hand, a small thermal mass may be added to the
sensor to give the steadiest reading despite small deviations in the air temperature.
Table 2. Temperature Rise of LM34 Due to Self-Heating (Thermal Resistance)
TO-46, TO-92,
TO-46 TO-92, SO-8 SO-8
CONDITIONS SMALL HEAT SMALL HEAT
NO HEAT SINK NO HEAT SINK NO HEAT SINK SMALL HEAT Fin
Fin(1) Fin(2)
Still air 720°F/W 180°F/W 324°F/W 252°F/W 400°F/W 200°F/W
Moving air 180°F/W 72°F/W 162°F/W 126°F/W 190°F/W 160°F/W
Still oil 180°F/W 72°F/W 162°F/W 126°F/W — —
Stirred oil 90°F/W 54°F/W 81°F/W 72°F/W — —
(Clamped to metal, (43°F/W ) — — (95°F/W )
infinite heart sink)
(1) Wakefield type 201 or 1-inch disc of 0.020-inch sheet brass, soldered to case, or similar.
(2) TO-92 and SO-8 packages glued and leads soldered to 1-inch square of 1/16 inches printed circuit board with 2 oz copper foil, or
similar.
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LM34
SNIS161D –MARCH 2000–REVISED JANUARY 2016
www.ti.com
11 Device and Documentation Support
11.1 Trademarks
All trademarks are the property of their respective owners.
11.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.3 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
18 Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated
Product Folder Links: LM34
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM34AH ACTIVE TO NDV 3 500 Non-RoHS &
Non-Green Call TI Call TI -45.6 to 148.9 ( LM34AH, LM34AH)
LM34AH/NOPB ACTIVE TO NDV 3 500 RoHS & Green Call TI Level-1-NA-UNLIM -45.6 to 148.9 ( LM34AH, LM34AH)
LM34CAH ACTIVE TO NDV 3 500 Non-RoHS &
Non-Green Call TI Call TI -40 to 110 ( LM34CAH, LM34CAH
)
LM34CAH/NOPB ACTIVE TO NDV 3 500 RoHS & Green Call TI Level-1-NA-UNLIM -40 to 110 ( LM34CAH, LM34CAH
)
LM34CAZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type -40 to 110 LM34
CAZ
LM34CZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type -40 to 110 LM34
CZ
LM34DH ACTIVE TO NDV 3 1000 Non-RoHS &
Non-Green Call TI Call TI 0 to 100 ( LM34DH, LM34DH)
LM34DH/NOPB ACTIVE TO NDV 3 1000 RoHS & Green Call TI Level-1-NA-UNLIM 0 to 100 ( LM34DH, LM34DH)
LM34DM NRND SOIC D 8 95 Non-RoHS
& Green Call TI Call TI 0 to 100 LM34D
M
LM34DM/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM 0 to 100 LM34D
M
LM34DMX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM 0 to 100 LM34D
M
LM34DZ/LFT7 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type LM34
DZ
LM34DZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type 0 to 100 LM34
DZ
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 2
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM34DMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Apr-2016
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM34DMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Apr-2016
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
( 2.54)
1.16
0.92
4.95
4.55
0.76 MAX 2.67 MAX
0.64 MAX
UNCONTROLLED
LEAD DIA
3X
12.7 MIN
3X 0.483
0.407
-5.565.32
1.22
0.72
45
TO-CAN - 2.67 mm max heightNDV0003H
TO-46
4219876/A 01/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-46.
1
2
3
SCALE 1.250
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ALL AROUND
0.07 MAX
TYP
( 1.2)
METAL
2X ( 1.2)
METAL
3X ( 0.7) VIA
(R0.05) TYP
(2.54)
(1.27)
TO-CAN - 2.67 mm max heightNDV0003H
TO-46
4219876/A 01/2017
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE:12X
2X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
1
2
3
www.ti.com
PACKAGE OUTLINE
3X 2.67
2.03
5.21
4.44
5.34
4.32
3X
12.7 MIN
2X 1.27 0.13
3X 0.55
0.38
4.19
3.17
3.43 MIN
3X 0.43
0.35
(2.54)
NOTE 3
2X
2.6 0.2
2X
4 MAX
SEATING
PLANE
6X
0.076 MAX
(0.51) TYP
(1.5) TYP
TO-92 - 5.34 mm max heightLP0003A
TO-92
4215214/B 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Lead dimensions are not controlled within this area.
4. Reference JEDEC TO-226, variation AA.
5. Shipping method:
a. Straight lead option available in bulk pack only.
b. Formed lead option available in tape and reel or ammo pack.
c. Specific products can be offered in limited combinations of shipping medium and lead options.
d. Consult product folder for more information on available options.
EJECTOR PIN
OPTIONAL
PLANE
SEATING
STRAIGHT LEAD OPTION
321
SCALE 1.200
FORMED LEAD OPTION
OTHER DIMENSIONS IDENTICAL
TO STRAIGHT LEAD OPTION
SCALE 1.200
www.ti.com
EXAMPLE BOARD LAYOUT
0.05 MAX
ALL AROUND
TYP
(1.07)
(1.5) 2X (1.5)
2X (1.07)
(1.27)
(2.54)
FULL R
TYP
( 1.4)0.05 MAX
ALL AROUND
TYP
(2.6)
(5.2)
(R0.05) TYP
3X ( 0.9) HOLE
2X ( 1.4)
METAL
3X ( 0.85) HOLE
(R0.05) TYP
4215214/B 04/2017
TO-92 - 5.34 mm max heightLP0003A
TO-92
LAND PATTERN EXAMPLE
FORMED LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
SOLDER MASK
OPENING
METAL
2X
SOLDER MASK
OPENING
123
LAND PATTERN EXAMPLE
STRAIGHT LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
METAL
TYP
SOLDER MASK
OPENING
2X
SOLDER MASK
OPENING
2X
METAL
12 3
www.ti.com
TAPE SPECIFICATIONS
19.0
17.5
13.7
11.7
11.0
8.5
0.5 MIN
TYP-4.33.7
9.75
8.50
TYP
2.9
2.4 6.75
5.95
13.0
12.4
(2.5) TYP
16.5
15.5
32
23
4215214/B 04/2017
TO-92 - 5.34 mm max heightLP0003A
TO-92
FOR FORMED LEAD OPTION PACKAGE
www.ti.com
PACKAGE OUTLINE
C
.228-.244 TYP
[5.80-6.19]
.069 MAX
[1.75]
6X .050
[1.27]
8X .012-.020
[0.31-0.51]
2X
.150
[3.81]
.005-.010 TYP
[0.13-0.25]
0 - 8 .004-.010
[0.11-0.25]
.010
[0.25]
.016-.050
[0.41-1.27]
4X (0 -15 )
A
.189-.197
[4.81-5.00]
NOTE 3
B .150-.157
[3.81-3.98]
NOTE 4
4X (0 -15 )
(.041)
[1.04]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
18
.010 [0.25] C A B
5
4
PIN 1 ID AREA
SEATING PLANE
.004 [0.1] C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
www.ti.com
EXAMPLE BOARD LAYOUT
.0028 MAX
[0.07]
ALL AROUND
.0028 MIN
[0.07]
ALL AROUND
(.213)
[5.4]
6X (.050 )
[1.27]
8X (.061 )
[1.55]
8X (.024)
[0.6]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED
METAL
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
1
45
8
SEE
DETAILS
SYMM
www.ti.com
EXAMPLE STENCIL DESIGN
8X (.061 )
[1.55]
8X (.024)
[0.6]
6X (.050 )
[1.27] (.213)
[5.4]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
SYMM
SYMM
1
45
8
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