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This document contains information on a product under development. American Microsystems, Inc. reserves the right to change or discontinue this product without notice. 2.4.99
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1.0 Features
On-board crystal oscillator
Phase-locked loop (PLL) synthesizes desired CLK
frequency
Internal loop filter
Internal crystal oscillator load capacitance (16pF
nominal)
Only external components required are decoupling
capacitors
Minimal board footprint (8-pin 0.150" SOIC package)
2.0 Description
The FS611 8 is a m onolithic CM OS fr equenc y s ynthesizer
IC designed for cost sensitive or space limited applica-
tions.
An on-board crystal oscillator accepts a quartz crystal
and provides a different, synthesized frequency on the
CLK output. The device is packaged in an 8-pin SOIC
package for a minimal board footprint.
Custom factory-programmed clock frequencies are avail-
able. Please contact your local AMI sales representative
for more information.
Figure 1: Block Diagram
XIN
FS6118
CLK
Crystal
Oscillator Phase-
Lock ed Loo p
XOUT
Figure 2: Pin Configuration
1 8
2
3
4
7
6
5
VSS
XOUT
XIN
VDD
CLK
VSS
n/c
VDD
8-pin 0.150" SOIC
FS6118
Table 1: Pin Descriptions
Key: AI = Analog Input; AO = Analog Output; DI = Digital Input; DIU = Input with Internal Pull-Up;
DID = Input with Internal Pull-Down; DIO = Digital Input/Output; DI-3 = Three-Level Digital Input,
DO = Digital Output; P = Power/Ground; # = Active Low pin
PIN TYPE NAME DESCRIPTION
1 P VSS Ground
2 AO XOUT Crystal oscillator feedback
3 AI XIN Crystal oscillator drive
4 P VDD Power supply (+5V)
5 -- N/C No Connecti on
6 P VSS Ground
7 DO CLK Clock Output
8 P VDD Power Supply (+5V)
Table 2: Font Description
DEVICE CRYSTAL FRE Q UENCY
(MHz) CLK F RE Q UENCY
(MHz)
FS6118-01 14.31818 40.0000
Custom frequencies available – contact AMI for more information
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3.0 Electrical Specifications
Table 3: Absolute Maximum Ratings
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These conditions represent a stress rating only, and functional operation of the device at
these or any other conditions above the operational limits noted in this specification is not implied. Exposure to maximum rating conditions for extended conditions may affect device performance,
functionality, and reliability.
PARAMETER SYMBOL MIN. MAX. UNITS
Supply Voltage (VSS = ground) VDD VSS-0.5 7 V
Input Voltage, dc VIVSS-0.5 VDD+0.5 V
Output Voltage, dc VOVSS-0.5 VDD+0.5 V
Input Clamp Current, dc (V I < 0 or VI > VDD)I
IK -50 50 mA
Output Clamp Current, dc (VI < 0 or VI > VDD)I
OK -50 50 mA
Storage Temperature Range (non-condensing) TS-65 150 °C
Ambient Temperature Range, Under Bias TA-55 125 °C
Junction Temperature TJ125 °C
Lead Temperature (soldering, 10s) 260 °C
Input Static Disc harge Volt age Prot ection (MIL-S TD 883E, Method 3015.7) 2 kV
CAUTION: ELECTROSTATIC SENSITIVE DEVICE
Permanent damage res ulting in a loss of functi onality or performance may occur if this devic e is subjected to a high-energy elec-
trostatic discharge.
Table 4: Operating Conditions
PARAMETER SYMBOL CONDITIONS/DESCRIPTION MIN. TYP. MAX. UNITS
Supply Voltage VDD 5V ± 10% 4.5 5.0 5.5 V
Ambient Operating Temperature Range TA070°C
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4.0 Package Information
Table 5: 8-pin SOIC (0.150") Package Dimensions
DIMENSIONS
INCHES MILLIMETERS
MIN. MAX. MIN. MAX.
A 0.061 0.068 1.55 1.73
A1 0.004 0.0098 0.102 0.249
A2 0.055 0.061 1.40 1.55
B 0.013 0.019 0.33 0.49
C 0.0075 0.0098 0.191 0.249
D 0.189 0.196 4.80 4.98
E 0.150 0.157 3.81 3.99
e 0.050 BSC 1.27 BSC
H 0.230 0.244 5.84 6.20
h 0.010 0.016 0.25 0.41
L 0.016 0.035 0.41 0.89
Θ0°8°0°8°
B
DA
1
SEATING
PLANE
HE
8
1ALL RADI I:
0.005" TO 0.01"
BASE
PLANE
A
2
e
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A
R
C
L
θ
7° typ .h x 45°
Table 6: 8-pin SOIC (0.150") Package Characteristics
PARAMETER SYMBOL CONDITIONS/DESCRIPTION TYP. UNITS
Thermal Impedance, Junction to Free-Air ΘJA Air flow = 0 m/s 173 °C/W
Corner lead 2.0
Lead Inductance, S elf L11 Center lead 1.6 nH
Lead Inductance, Mutual L12 Any lead to any adjacent lead 0.4 nH
Lead Capacitance, Bulk C11 Any lead to VSS 0.27 pF
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5.0 Ordering Information
ORDERING CODE DEVICE NUMBER PACKAGE TYPE OPERATING
TEMPERATURE RANGE SHIPPING
CONFIGURATION
11640-802 FS6118-01 8-pin (0.150”) S OIC
(Small Outl i ne Package) 0°C to 70°C (Commercial) Tape-and-Reel
11640-812 FS6118-01 8-pin (0.150”) S OIC
(Small Outl i ne Package) 0°C to 70°C (Commercial) Tubes
Copyright © 1998 American Microsystems, Inc.
Devices sold by AMI are covered b y the warranty and pat ent indem nific ation pro visions ap pearing in its T erms of Sale
only. AMI m akes no warr ant y, express, s tatutory implied or by desc ript ion, regar ding the in form ation s et for th herein or
regarding t he freedom of the des cr ibed de vic es f rom patent inf r ingement. AMI makes no warranty of m er chantabi l it y or
fitness for any purpos es. AMI reser ves the right to d iscont inue produc tion and c hange spec ific ations and prices a t any
time and without notice. AMI’s products are intended for use in commercial applications. Applications requiring ex-
tended tem perature range, unus ual environm enta l requirem ents, or h igh reliab ilit y applicat ions, such as m ilitary, m edi-
cal life-s uppor t or life-sust ain i ng e qu ipment, are sp ec if ic ally not recom mended witho ut add it ional proc es sing by AMI for
such applications.
American Microsystems, Inc., 2300 Buckskin Rd., Pocatello, ID 83201, (208) 233-4690, FAX (208) 234-6796,
WWW Address: http://www.amis.com E-mail: tgp@amis.com