BGSX212MA18
DP12T Diversity Cross Switch for Carrier Aggregation
Data Sheet
Revision 3.1 - 2016-11-03
Power Management & Multimarket
Edition 2016-11-03
Published by Infineon Technologies AG
81726 Munich, Germany
c
2016 Infineon Technologies AG
All Rights Reserved.
LEGAL DISCLAIMER
The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics.
With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding
the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,
including without limitation, warranties of non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon
Technologies Office (www.infineon.com).
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the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to
assume that the health of the user or other persons may be endangered.
BGSX212MA18
Revision History
Document No.: BGSX212MA18__v3.1.pdf
Revision History: Rev. v3.1
Previous Version: 3.0
Page Subjects (major changes since last revision)
9 RF performance updated in Table 5
13 Application information updated in Table 12
Trademarks of Infineon Technologies AG
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EconoDUALTM , EconoPACKTM , EconoPIMTM , EiceDRIVERTM , eupecTM , FCOSTM , GaNpowIRTM , HEXFETTM , HITFETTM ,
HybridPACKTM , iMOTIONTM , IRAMTM , ISOFACETM , IsoPACKTM , LEDrivIRTM , LITIXTM , MIPAQTM , ModSTACKTM , my-dTM ,
NovalithICTM , OPTIGATM , OptiMOSTM , ORIGATM , PowIRaudioTM , PowIRStageTM , PrimePACKTM , PrimeSTACKTM , PROFETTM ,
PRO-SILTM , RASICTM , REAL3TM , SmartLEWISTM , SOLID FLASHTM , SPOCTM , StrongIRFETTM , SupIRBuckTM , TEMPFETTM ,
TRENCHSTOPTM , TriCoreTM , UHVICTM , XHPTM , XMCTM .
Other Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
Trademarks updated November 2015
Data Sheet 3 Revision 3.1 - 2016-11-03
BGSX212MA18
Contents
1 Features 5
2 Product Description 5
3 Maximum Ratings 6
4 Operation Ranges 8
5 RF Characteristics 9
6 MIPI RFFE Specification 10
7 Application Information 13
8 Package Information 14
List of Figures
1 BGSX212MA18Blockdiagram ........................................ 6
2 BGSX212MA18 Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3 BGSX212MA18 Pin Configuration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4 ATSLP-18 Package Outline (top, side and bottom views) . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5 LandPatternandStencilMask ........................................ 15
6 LaserMarking(topview)............................................ 16
7 CarrierTape................................................... 16
List of Tables
1 MaximumRatings,TableI........................................... 6
2 MaximumRatings,TableII........................................... 7
3 OperationRanges ............................................... 8
4 RFInputPower................................................. 8
5 RFCharacteristics ............................................... 9
6 MIPIFeatures.................................................. 10
7 StartupBehavior ................................................ 10
8 RegisterMapping................................................ 10
9 TruthTable,SwitchA.............................................. 12
10 TruthTable,SwitchB.............................................. 12
11 TruthTable,CrossPorts ............................................ 12
12 Bill of Materials for frequency range 2500 to 2700MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
13 Bill of Materials for frequency range 3400 to 3800MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
14 PinDefinitionandFunction .......................................... 14
Data Sheet 4 Revision 3.1 - 2016-11-03
BGSX212MA18
BGSX212MA18 DP12T Diversity Cross Switch for Carrier Aggregation
1 Features
•RF CMOS DP12T diversity switch with power handling capability
of up to 27 dBm
•Industry’s first flexible carrier aggregation switch via cross switch
functionality of two ports
•Device configurations SP6T/SP6T, SP5T/SP7T, and SP7T/SP5T
featured via cross switch functionality
•Suitable for LTE carrier aggregation applications
•Ultra-low insertion loss and harmonics generation
•0.1 to 3.8 GHz coverage
•High port-to-port-isolation
•No decoupling capacitors required if no DC applied on RF lines
•Integrated MIPI RFFE interface operating in 1.1 to 1.95 V voltage
range
•Software programmable MIPI RFFE USID
•Leadless and halogen free package ATSLP-18 with lateral size of
2.0 mm x 2.4 mm and thickness of 0.6 mm
•No power supply blocking required
•High EMI robustness
•RoHS and WEEE compliant package
2 Product Description
The BGSX212MA18 RF CMOS switch is specifically designed for LTE carrier aggregation applications. This DP12T
offers low insertion loss and low harmonic generation. In addition, two ports feature cross functionality enabling
higher flexibility for carrier aggregation applications.
The switch is controlled via a MIPI RFFE controller. The on-chip controller allows power-supply voltages from
1.1 to 1.95 V. The switch features direct-connect-to-battery functionality and DC-free RF ports. Unlike GaAs tech-
nology, external DC blocking capacitors at the RF Ports are only required if DC voltage is applied externally. The
BGSX212MA18 RF Switch is manufactured in Infineon’s patented MOS technology, offering the performance of
GaAs with the economy and integration of conventional CMOS including the inherent higher ESD robustness. The
device has a very small size of only 2.0 x 2.4 mm2and a maximum thickness of 0.6 mm.
Data Sheet 5 Revision 3.1 - 2016-11-03
BGSX212MA18
TRXA1
TRXA2
TRXA3
TRXA4
TRXA5
TRXA6
ANT_A ANT_B
SP6T SP6T
MIPI-RFFE
Control Interface SCLK
SDATA
VIO
GND
VDD
SP6T/SP6T
TRXB1
TRXB2
TRXB3
TRXB4
TRXB5
TRXB6
Figure 1: BGSX212MA18 Block diagram
3 Maximum Ratings
Table 1: Maximum Ratings, Table I at TA= 25 ◦C, unless otherwise specified
Parameter Symbol Values Unit Note / Test Condition
Min. Typ. Max.
Frequency Range f 0.1 – 3.8 GHz 1)
Supply voltage VDD -0.5 – 3.6 V –
Storage temperature range TSTG -55 – 150 ◦C –
Junction temperature Tj– – 125 ◦C –
RF input power at all TRX
ports
PRF – – 32 dBm CW
ESD capability, HBM2) VESDHBM -1 – +1 kV
ESD capability, system level3) VESDANT -8 – +8 kV ANT versus system GND,
with 27 nH shunt inductor
1)Switch has no highpass response. There is also a DC connection between switched paths. The DC voltage at RF ports VRFDC has to be
0V.
2)ANSI/ESDA/JEDEC JS-001-2012 (R=1.5 kΩ, C=100 pF).
3)IEC 61000-4-2 (R=330 Ω, C=150 pF), contact discharge.
Data Sheet 6 Revision 3.1 - 2016-11-03
BGSX212MA18
Table 2: Maximum Ratings, Table II at TA= 25 ◦C, unless otherwise specified
Parameter Symbol Values Unit Note / Test Condition
Min. Typ. Max.
Maximum DC-voltage on RF-
Ports and RF-Ground
VRFDC 0 – 0 V No DC voltages allowed on
RF-Ports
RFFE Supply Voltage VIO -0.5 – 3.6 V –
RFFE Control Voltage Levels VSCLK,
VSDATA
-0.7 – VIO+0.7
(max.
3.6)
V –
Data Sheet 7 Revision 3.1 - 2016-11-03
BGSX212MA18
4 Operation Ranges
Table 3: Operation Ranges
Parameter Symbol Values Unit Note / Test Condition
Min. Typ. Max.
Supply voltage VDD 2.5 – 3.4 V –
Supply current2) IDD – 90 200 µA –
Supply current in standby
mode2)
IDD – 0.5 1 µA VIO=low or MIPI low-power
mode
RFFE supply voltage VIO 1.1 1.8 1.95 V –
RFFE input high voltage1) VIH 0.7*VIO – VIO V –
RFFE input low voltage1) VIL 0 – 0.3*VIO V –
RFFE output high voltage1) VOH 0.8*VIO – VIO V –
RFFE output low voltage1) VOL 0 – 0.2*VIO V –
RFFE control input capaci-
tance
CCtrl – – 2 pF –
RFFE supply current IVIO – 15 – µA Idle State
Ambient temperature TA-30 25 85 ◦C –
1)SCLK and SDATA
2)TA= −30 ◦C ... 85 ◦C, VDD = 2.5 ... 3.4 V
Table 4: RF Input Power
Parameter Symbol Values Unit Note / Test Condition
Min. Typ. Max.
TRX ports (50 Ω) PRF – – 27 dBm –
Data Sheet 8 Revision 3.1 - 2016-11-03
BGSX212MA18
5 RF Characteristics
Table 5: RF Characteristics at TA= −30 ◦C...85 ◦C, PIN = 0 dBm, Supply Voltage VDD= 2.5 V...3.4 V, unless
otherwise specified
Parameter Symbol Values Unit Note / Test Condition
Min. Typ. Max.
Insertion Loss1)
All TRX ports IL
– 0.30 0.45 dB 100 to 960MHz
– 0.45 0.75 dB 960 to 2170MHz
– 0.65 0.90 dB 2170 to 2700MHz2)
– 0.90 1.35 dB 3400 to 3800MHz3)
Insertion Loss
All TRX ports IL
– 0.30 0.50 dB 100 to 960MHz
– 0.45 0.85 dB 960 to 2170MHz
– 0.65 1.00 dB 2170 to 2700MHz2)
– 0.90 1.45 dB 3400 to 3800MHz3)
Return Loss
All TRX ports RL
17 24 – dB 100 to 960MHz
14 21 – dB 960 to 2170MHz
12 16 – dB 2170 to 2700MHz2)
10 15 – dB 3400 to 3800MHz3)
Isolation
Adjacent TRX ports A-A/B-B ISO
26 36 – dB 100 to 960MHz
19 26 – dB 960 to 2170MHz
16 21 – dB 2170 to 2700MHz
Opposite TRX ports A-B/B-A ISO
38 48 – dB 100 to 960MHz
31 41 – dB 960 to 2170MHz
29 39 – dB 2170 to 2700MHz
Harmonic Generation4)
All TRX ports, H2 PHarm 80 90 – dBc 25 dBm, 50 Ω, CW mode
All TRX ports, H3 PHarm 80 90 – dBc 25 dBm, 50 Ω, CW mode
Intermodulation Distortion in Rx Band1) 4) (TA= 25 ◦C, VDD= 3.0 V)
IMD2, low IMD2low – -105 -100 dBm Tx = 20 dBm,
Interferer = −15 dBm, 50 Ω
IMD3 IMD3 – -115 -110 dBm
IMD2, high IMD2high – -105 -100 dBm
Switching Time
MIPI to RF time1) tINT – 1.5 3 µs50 % last SCLK falling edge to
90 % ON
Power up settling time1) tPUP – 10 25 µs After power down mode
1)Measured at 25◦C.
2)On application board with application circuit according to Fig. 2 and Tab. 12.
3)On application board with application circuit according to Fig. 2 and Tab. 13.
4)Measured at Band 5.
Data Sheet 9 Revision 3.1 - 2016-11-03
BGSX212MA18
6 MIPI RFFE Specification
All sequences are implemented according to the ’MIPI Alliance Specification for RF Front-End Control Interface’
document version 1.10 - 26. July 2011.
Table 6: MIPI Features
Feature Supported Comment
Register write command sequence Yes
Register read command sequence Yes
Extended register write command sequence No Up to 4 Bytes
Extented register read command sequence No Up to 4 Bytes
Register 0 write command sequence Yes
Trigger function Yes Trigger assignment to each control register is sup-
ported
Programmable USID Yes 3 register command sequence
Status Register Yes Register for debugging
Reset Yes By VIO, Power Mode and RFFE_STATUS
Group SID Yes
USID_Sel pin No External pin for changing USID is not implemented
Full speed write Yes
Half speed read Yes
Full speed read Yes
Table 7: Startup Behavior
Feature State Comment
Power status LOW POWER The chip is in low power mode after startup
Trigger function ENABLED Trigger function is enabled after startup. Trigger function can be dis-
abled via PM_TRIG register.
Table 8: Register Mapping
Register
Address
Register Name Data
Bits
Function Description Default Broadcast_ID
Support
Trigger
Support
R/W
0x0000 REGISTER_0 7:0 MODE_CTRL Switch control 00000000 No Yes R/W
0x0001 REGISTER_1 7:0 MODE_CTRL Switch control 00000000 No Yes R/W
0x001D PRODUCT_ID 7:0 PRODUCT_ID This is a read-only register. However,
during the programming of the USID
a write command sequence is per-
formed on this register, even though
the write does not change its value.
11011111 No No R
0x001E MANUFACTURER_ID 7:0 MANUFACTURER_ID [7:0] This is a read-only register. However,
during the programming of the USID,
a write command sequence is per-
formed on this register, even though
the write does not change its value.
00011010 No No R
Continued on next page
Data Sheet 10 Revision 3.1 - 2016-11-03
BGSX212MA18
Table 8: Register Mapping – Continued from previous page
Register
Address
Register Name Data
Bits
Function Description Default Broadcast_ID
Support
Trigger
Support
R/W
0x001C PM_TRIG 7:6 PWR_MODE 00: Normal operation 10 Yes No R/W
01: Default settings (STARTUP)
10: Low power (LOW POWER)
11: Reserved
5 TRIGGER_MASK_2 If this bit is set, trigger 2 is disabled.
When all triggers disabled, if writing to
a register that is associated to trigger
2, the data goes directly to the desti-
nation register.
0 No No
4 TRIGGER_MASK_1 If this bit is set, trigger 1 is disabled.
When all triggers disabled, if writing to
a register that is associated to trigger
1, the data goes directly to the desti-
nation register.
0 No No
3 TRIGGER_MASK_0 If this bit is set, trigger 0 is disabled.
When all triggers disabled, if writing to
a register that is associated to trigger
0, the data goes directly to the desti-
nation register.
0 No No
2 TRIGGER_2 A write of a one to this bit loads trigger
2’s registers.
0 Yes No
1 TRIGGER_1 A write of a one to this bit loads trigger
1’s registers.
0 Yes No R/W
0 TRIGGER_0 A write of a one to this bit loads trigger
0’s registers.
0 Yes No
0x001F MAN_USID 7:6 SPARE These are read-only bits that are re-
served and yield a value of 0b00 at
readback.
00 No No R/W
5:4 MANUFACTURER_ID [9:8] These bits are read-only. However,
during the programming of the USID,
a write command sequence is per-
formed on this register even though
the write does not change its value.
01
3:0 USID Programmable USID. Performing a
write to this register using the de-
scribed programming sequences will
program the USID in devices support-
ing this feature. These bits store the
USID of the device.
1010
0x001A RFFE_STATUS 7 SOFTWARE RESET 0: Normal operation 0 No No R/W
1: Software reset
6 COMMAND_FRAME_
PARITY_ERR
Command sequence received with
parity error - discard command.
0 No No R
5 COMMAND_LENGTH_ERR Command length error 0
4 ADDRESS_FRAME_
PARITY_ERR
Address frame parity error = 1 0
3 DATA_FRAME_
PARITY_ERR
Data frame with parity error 0
2 READ_UNUSED_REG Read command to an invalid address 0
1 WRITE_UNUSED_REG Write command to an invalid address 0
0 BID_GID_ERR Read command with a BROAD-
CAST_ID or GROUP_SID
0
0x001B GROUP_SID 7:4 RESERVED 0 No No R/W
3:0 GROUP_SID Group slave ID 0
Data Sheet 11 Revision 3.1 - 2016-11-03
BGSX212MA18
Table 9: Modes of Operation (Truth Table, Switch A)
REGISTER_1 Bits
State Mode D7 D6 D5 D4 D3 D2 D1 D0
1 All Isolation 0 0 0 0 0 0 0 0
2 TRXA1 x x x 0 0 0 0 1
3 TRXA2 x x x 0 0 0 1 0
4 TRXA3 x x x 0 0 0 1 1
5 TRXA4 x x x 0 0 1 0 0
6 TRXA5 x x x 0 0 1 0 1
7 TRXA6 x x x 0 0 1 1 0
8 TRXA6+TRXA5 x x x 0 0 1 1 1
9 TRXA6+TRXA4 x x x 0 1 0 0 0
10 TRXA6+TRXA3 x x x 0 1 0 0 1
11 TRXA6+TRXA2 x x x 0 1 0 1 0
12 TRXA6+TRXA1 x x x 0 1 0 1 1
13 TRXA5+TRXA4 x x x 0 1 1 0 0
14 TRXA5+TRXA3 x x x 0 1 1 0 1
15 TRXA5+TRXA2 x x x 0 1 1 1 0
16 TRXA5+TRXA1 x x x 0 1 1 1 1
17 TRXA4+TRXA3 x x x 1 0 0 0 0
18 TRXA4+TRXA2 x x x 1 0 0 0 1
19 TRXA4+TRXA1 x x x 1 0 0 1 0
20 TRXA3+TRXA2 x x x 1 0 0 1 1
21 TRXA3+TRXA1 x x x 1 0 1 0 0
22 TRXA2+TRXA1 x x x 1 0 1 0 1
23-32 All Isolation 0x16 - 0x1F
Table 10: Modes of Operation (Truth Table, Switch B)
REGISTER_0 Bits
State Mode D7 D6 D5 D4 D3 D2 D1 D0
33 All Isolation 0 0 0 0 0 0 0 0
34 TRXB1 x x x 0 0 0 0 1
35 TRXB2 x x x 0 0 0 1 0
36 TRXB3 x x x 0 0 0 1 1
37 TRXB4 x x x 0 0 1 0 0
38 TRXB5 x x x 0 0 1 0 1
39 TRXB6 x x x 0 0 1 1 0
40 TRXB6+TRXB5 x x x 0 0 1 1 1
41 TRXB6+TRXB4 x x x 0 1 0 0 0
42 TRXB6+TRXB3 x x x 0 1 0 0 1
43 TRXB6+TRXB2 x x x 0 1 0 1 0
44 TRXB6+TRXB1 x x x 0 1 0 1 1
45 TRXB5+TRXB4 x x x 0 1 1 0 0
46 TRXB5+TRXB3 x x x 0 1 1 0 1
47 TRXB5+TRXB2 x x x 0 1 1 1 0
48 TRXB5+TRXB1 x x x 0 1 1 1 1
49 TRXB4+TRXB3 x x x 1 0 0 0 0
50 TRXB4+TRXB2 x x x 1 0 0 0 1
51 TRXB4+TRXB1 x x x 1 0 0 1 0
52 TRXB3+TRXB2 x x x 1 0 0 1 1
53 TRXB3+TRXB1 x x x 1 0 1 0 0
54 TRXB2+TRXB1 x x x 1 0 1 0 1
55-64 All Isolation 0x16 - 0x1F
Table 11: Modes of Operation (Truth Table, Cross Ports)
REGISTER_2 Bits
State Mode D7 D6 D5 D4 D3 D2 D1 D0
65 ANT_A-TRXB1 x x x x x x x 1
66 ANT_B-TRXA5 x x x x x x 1 x
Data Sheet 12 Revision 3.1 - 2016-11-03
BGSX212MA18
7 Application Information
Application Board Configuration
SCLK
SDATA
VIO=1.8V
TRXA1
N1
VDD=3.0V
GND
C4
(optional)
C5
(optional)
ANT_A ANT_B
SP6T SP6T
SP6T/SP6T
MIPI-RFFE
Control Interface
L1
C1
L2
C2
TRXA2
TRXA3
TRXA4
TRXA5
TRXA6
L3
C3
TRXB1
TRXB2
TRXB3
TRXB4
TRXB5
TRXB6
Figure 2: BGSX212MA18 Application Schematic
Table 12: Bill of Materials Table for frequency range 2500 to 2700MHz
Name Value Package Manufacturer Function
C1=C2=C3 0.8 pF 0402 Various Impedance Matching
C4=C5 (optional) 1 nF 0402 Various Impedance Matching
L1=L2=L3 2.1 nH 0402 Various Impedance Matching
N1 BGSX212MA18 ATSLP-18 Infineon RF CMOS Switch
Table 13: Bill of Materials Table for frequency range 3400 to 3800MHz
Name Value Package Manufacturer Function
C1=C2=C3 0.8 pF 0402 Various Impedance Matching
C4=C5 (optional) 1 nF 0402 Various Impedance Matching
L1=L2=L3 1 nH 0402 Various Impedance Matching
N1 BGSX212MA18 ATSLP-18 Infineon RF CMOS Switch
Data Sheet 13 Revision 3.1 - 2016-11-03
BGSX212MA18
8 Package Information
Pin Configuration and Function
118 17 15 14
13
12
11
109876
5
4
3
2
16
TRXB2
TRXB3
TRXB4
TRXB5
TRXB6
TRXB1
ANT_B
ANT_A
TRXA1
TRXA2
TRXA3
TRXA4
TRXA5
TRXA6
VDD
SDATA
VIO
SCLK
19
GND
Figure 3: BGSX212MA18 Pin Configuration (top view)
Table 14: Pin Definition and Function
Pin No. Name Function
1 TRXB2 TRX port B2
2 TRXB3 TRX port B3
3 TRXB4 TRX port B4
4 TRXB5 TRX port B5
5 TRXB6 TRX port B6
6 VDD Power supply
7 VIO MIPI RFFE power supply
8 SDATA MIPI RFFE data
9 SCLK MIPI RFFE clock
10 TRXA6 TRX port A6
11 TRXA5 TRX port A5
12 TRXA4 TRX port A4
13 TRXA3 TRX port A3
14 TRXA2 TRX port A2
15 TRXA1 TRX port A1
16 ANT_A Antenna port A
17 ANT_B Antenna port B
18 TRXB1 TRX port B1
19 GND RF ground
Data Sheet 14 Revision 3.1 - 2016-11-03
BGSX212MA18
12345
11 12 13
14
15
16
17
18
10
Pin 1 marking
6
7
8
9
0.4
4 x 0.4 = 1.6
5 x 0.4 = 2
0.02 MAX.
0.6
STANDOFF
±0.05
2±0.05
A
0.4
2.4 ±0.05
B
18x
0.2 ±0.05
0.1 B
0.5 ±0.05
0.1 B
0.2
18x
±0.05
0.1 A
0.7±0.05
0.1 A
Top view Bottom view
Figure 4: ATSLP-18 Package Outline (top, side and bottom views)
18x 0.25 0.8 0.8
18x 0.25
0.7
0.4
18x 0.25
18x 0.25
1
1
0.65
0.4
0.4
0.5
0.4
0.45
Stencil apertures
(stencil thickness max. 100 µm)
Copper Solder mask
Optional solder mask dam
Figure 5: Land Pattern and Stencil Mask
Data Sheet 15 Revision 3.1 - 2016-11-03
BGSX212MA18
Pin 1 marking
Type code
12
Date code
(YW)
Figure 6: Laser Marking (top view)
2.2
8
2.6
0.75
4
Pin 1
marking
Figure 7: Carrier Tape
Data Sheet 16 Revision 3.1 - 2016-11-03
w w w . i n f i n e o n . c o m