EP7309-IR-C - Cirrus Logic, Inc.

DS507PP1

P.O. Box 17847, Austin, Texas 78760

(512) 445 7222 FAX: (512) 445 7581

http://www.cirrus.com

High-Performance,

Low-Power System on Chip

Enhanced

Digital Audio Interface

EP7309 Data Sheet

OVERVIEW

BLOCK DIAGRAM

FEATURES

(cont.) (cont.)

■ARM720T Processor

—ARM7TDMI CPU

— 8 KB of four-way set-associative cache

— MMU with 64-entry TLB

— Thumb code support enabled

■Ultra low power

— 90 mW at 74 MHz typical

— 30 mW at 18 MHz typical

— 10 mW in the Idle State

— <1 mW in the Standby State

■Advanced audio decoder/decompression capability

— Supports bit streams with adaptive bit rates

— Allows for support of multiple audio

decompression algorithms (MP3, WMA, AAC,

ADPCM, Audible, etc.)

LCD

Controller

Boot

ROM

MaverickKeyTM

ARM720T

ARM7TDMI CPU Core

MMU

8 KB

Cache

Write

Buffer

Internal Data Bus

EPB Bus

SRAM &

FLASH I/F

On-chip SRAM

48 KB

ICE-JTAG

Clocks &

Timers

Keypad&

Touch

Screen I/F

Interrupts,

PWM & GPIO

Bus

Bridge

(2) UARTs

w/ IrDA

Power

Management

Serial

Interface

Digital

Audio

Interface

The Maverick™ EP7309 is designed for ultra-low-power

applications such as digital music players, internet

appliances, smart cellular phones or any hand-held

device that features the added capability of digital audio

decompression. The core-logic functionality of the device

is built around an ARM720T processor with 8 KB of four-

way set-associative unified cache and a write buffer.

Incorporated into the ARM720T is an enhanced memory

management unit (MMU) which allows for support of

sophisticated operating systems like Microsoft®

Windows® CE and Linux®.

MEMORY AND STORAGE

USER INTERFACE

SERIAL PORTS

EP7309

High-Performance, Low-Power System on Chip

FEATURES (cont)

■Dynamically programmable clock speeds of 18, 36, 49,

and 74 MHz

■48 KB of on-chip SRAM

■MaverickKey™ IDs

— 32-bit unique ID can be used for SDMI compliance

— 128-bit random ID

■LCD controller

— Interfaces directly to a single-scan panel

monochrome STN LCD

— Interfaces to a single-scan panel color STN LCD

with minimal external glue logic

■Full JTAG boundary scan and Embedded ICE

support

■Integrated Peripheral Interfaces

— 8/32/16-bit SRAM/FLASH/ROM Interface

— Digital Audio Interface providing glueless

interface to low-power DACs, ADCs and CODECs

— Two Synchronous Serial Interfaces (SSI1, SSI2)

— CODEC Sound Interface

—8×8Keypad Scanner

— 27 General Purpose Input/Output pins

— Dedicated LED flasher pin from the RTC

■Internal Peripherals

— Two 16550 compatible UARTs

—IrDA Interface

—Two PWM Interfaces

—Real-time Clock

— Two general purpose 16-bit timers

— Interrupt Controller

—Boot ROM

■Package

— 208-Pin LQFP

—256-Ball PBGA

—204-Ball TFBGA

■The fully static EP7309 is optimized for low power

dissipation and is fabricated on a 0.25 micron CMOS

process

OVERVIEW (cont.)

The EP7309 is designed for ultra-low-power operation.

Its core operates at only 2.5 V, while its I/O has an

operation range of 2.5 V–3.3 V. The device has three basic

power states: operating, idle and standby.

MaverickKey unique hardware programmed IDs are a

solution to the growing concern over secure web content

and commerce. With Internet security playing an

important role in the delivery of digital media such as

books or music, traditional software methods are quickly

becoming unreliable. The MaverickKey unique IDs

provide OEMs with a method of utilizing specific

hardware IDs such as those assigned for SDMI (Secure

Digital Music Initiative) or any other authentication

mechanism.

The EP7309 integrates an interface to enable a direct

connection to many low cost, low power, high quality

audio converters. In particular, the DAI can directly

interface with the Crystal‚ CS43L41/42/43 low-power

audio DACs and the Crystal‚ CS53L32 low-power ADC.

Some of these devices feature digital bass and treble

boost, digital volume control and compressor-limiter

functions.

Simply by adding desired memory and peripherals to the

highly integrated EP7309 completes a low-power system

solution. All necessary interface logic is integrated on-

chip.

Contacting Cirrus Logic Support

For a complete listing of Direct Sales, Distributor, and Sales Representative contacts, visit the Cirrus Logic web site at:

http://www.cirrus.com/corporate/contacts

Preliminary product information describes products which are in production, but for which full characterization data is not yet available. Advance product information de-

scribes products which are in development and subject to development changes. Cirrus Logic, Inc. has made best efforts to ensure that the information contained in this

document is accurate and reliable. However, the information is subject to change without notice and is provided “AS IS” without warranty of any kind (express or implied).

No responsibility is assumed by Cirrus Logic, Inc. for the use of this information, nor for infringements of patents or other rights of third parties. This document is the property

of Cirrus Logic, Inc. and implies no license under patents, copyrights, trademarks, or trade secrets. No part of this publication may be copied, reproduced, stored in a retrieval

system, or transmitted, in any form or by any means (electronic, mechanical, photographic, or otherwise) without the prior written consent of Cirrus Logic, Inc. Items from

any Cirrus Logic website or disk may be printed for use by the user. However, no part of the printout or electronic files may be copied, reproduced, stored in a retrieval

system, or transmitted, in any form or by any means (electronic, mechanical, photographic, or otherwise) without the prior written consent of Cirrus Logic, Inc.Furthermore,

no part of this publication may be used as a basis for manufacture or sale of any items without the prior written consent of Cirrus Logic, Inc. The names of products of Cirrus

Logic, Inc. or other vendors and suppliers appearing in this document may be trademarks or service marks of their respective owners which may be registered in some

jurisdictions. A list of Cirrus Logic, Inc. trademarks and service marks can be found at http://www.cirrus.com.

EP7309

High-Performance, Low-Power System on Chip

Processor Core - ARM720T

The EP7309 incorporates an ARM 32-bit RISC

microcontroller that controls a wide range of on-chip

peripherals. The processor utilizes a three-stage pipeline

consisting of fetch, decode and execute stages. Key

features include:

•ARM (32-bit) and Thumb (16-bit compressed)

instruction sets

•Enhanced MMU for Microsoft Windows CE and other

operating systems

•8 KB of 4-way set-associative cache.

•Translation Look Aside Buffers with 64 Translated

Entries

Power Management

The EP7309 is designed for ultra-low-power operation.

Its core operates at only 2.5 V, while its I/O has an

operation range of 2.5 V–3.3 V allowing the device to

achieve a performance level equivalent to 60 MIPS. The

device has three basic power states:

•Operating — This state is the full performance

state. All the clocks and peripheral logic are

enabled.

•Idle — This state is the same as the Operating

State, except the CPU clock is halted while

waiting for an event such as a key press.

•Standby — This state is equivalent to the

computer being switched off (no display), and

the main oscillator shut down. An event such as

a key press can wake-up the processor.

MaverickKey™ Unique ID

MaverickKey unique hardware programmed IDs are a

solution to the growing concern over secure web content

and commerce. With Internet security playing an

important role in the delivery of digital media such as

books or music, traditional software methods are quickly

becoming unreliable. The MaverickKey unique IDs

provide OEMs with a method of utilizing specific

hardware IDs such as those assigned for SDMI (Secure

Digital Music Initiative) or any other authentication

mechanism.

Both a specific 32-bit ID as well as a 128-bit random ID is

programmed into the EP7309 through the use of laser

probing technology. These IDs can then be used to match

secure copyrighted content with the ID of the target

device the EP7309 is powering, and then deliver the

copyrighted information over a secure connection. In

addition, secure transactions can benefit by also

matching device IDs to server IDs. MaverickKey IDs

provide a level of hardware security required for today’s

Internet appliances.

Memory Interfaces

The EP7309 is equiped with a ROM/SRAM/FLASH-

style interface that has programmable wait-state timings

and includes burst-mode capability, with six chip selects

decoding six 256 MB sections of addressable space. For

maximum flexibility, each bank can be specified to be 8-,

16-, or 32-bits wide. This allows the use of 8-bit-wide

boot ROM options to minimize overall system cost. The

on-chip boot ROM can be used in product manufacturing

to serially download system code into system FLASH

memory. To further minimize system memory

requirements and cost, the ARM Thumb instruction set is

supported, providing for the use of high-speed 32-bit

operations in 16-bit op-codes and yielding industry-

leading code density.

Digital Audio Capability

The EP7309 uses its powerful 32-bit RISC processing

engine to implement audio decompression algorithms in

software. The nature of the on-board RISC processor, and

the availability of efficient C-compilers and other

software development tools, ensures that a wide range of

audio decompression algorithms can easily be ported to

and run on the EP7309

Pin Mnemonic I/O Pin Description

BATOK I Battery ok input

nEXTPWR I External power supply sense

input

nPWRFL I Power fail sense input

nBATCHG I Battery changed sense input

Table A. Power Management Pin Assignments

Pin Mnemonic I/O Pin Description

nCS[5:0] O Chip select out

A[27:0] O Address output

D[31:0] I/O Data I/O

nMOE O ROM expansion OP enable

nMWE O ROM expansion write enable

HALFWORD O Halfword access select

output

WORD O Word access select output

WRITE O Transfer direction

Table B. Static Memory Interface Pin Assignments

EP7309

High-Performance, Low-Power System on Chip

Universal Asynchronous

Receiver/Transmitters (UARTs)

The EP7309 includes two 16550-type UARTs for RS-232

serial communications, both of which have two 16-byte

FIFOs for receiving and transmitting data. The UARTs

support bit rates up to 115.2 kbps. An IrDA SIR protocol

encoder/decoder can be optionally switched into the

RX/TX signals to/from UART 1 to enable these signals

to drive an infrared communication interface directly.

Digital Audio Interface (DAI)

The EP7309 integrates an interface to enable a direct

connection to many low cost, low power, high quality

audio converters. In particular, the DAI can directly

interface with the Crystal‚ CS43L41/42/43 low-power

audio DACs and the Crystal‚ CS53L32 low-power ADC.

Some of these devices feature digital bass and treble

boost, digital volume control and compressor-limiter

functions.

Note: See Table Q on page 7 for information on pin

multiplexes.

CODEC Interface

The EP7309 includes an interface to telephony-type

CODECs for easy integration into voice-over-IP and

other voice communications systems. The CODEC

interface is multiplexed to the same pins as the DAI and

SSI2.

Note: See Table Q on page 7 for information on pin

multiplexes.

SSI2 Interface

An additional SPI/Microwire1-compatible interface is

available for both master and slave mode

communications. The SSI2 unit shares the same pins as

the DAI and CODEC interfaces through a multiplexer.

•Synchronous clock speeds of up to 512 kHz

•Separate 16 entry TX and RX half-word wide FIFOs

•Half empty/full interrupts for FIFOs

•Separate RX and TX frame sync signals for

asymmetric traffic

Note: See Table Q on page 7 for information on pin

multiplexes.

Pin Mnemonic I/O Pin Description

TXD[1] O UART 1 transmit

RXD[1] I UART 1 receive

CTS I UART 1 clear to send

DCD I UART 1 data carrier detect

DSR I UART 1 data set ready

TXD[2] O UART 2 transmit

RXD[2] I UART 2 receive

LEDDRV O Infrared LED drive output

PHDIN I Photo diode input

Table C. Universal Asynchronous Receiver/Transmitters Pin

Assignments

Pin Mnemonic I/O Pin Description

SCLK O Serial bit clock

SDOUT O Serial data out

SDIN I Serial data in

LRCK O Sample clock

MCLKIN I Master clock input

MCLKOUT O Master clock output

Table D. DAI Interface Pin Assignments

Pin Mnemonic I/O Pin Description

PCMCLK O Serial bit clock

PCMOUT O Serial data out

PCMIN I Serial data in

PCMSYNC O Frame sync

Table E. CODEC Interface Pin Assignments

Pin Mnemonic I/O Pin Description

SSICLK I/O Serial bit clock

SSITXDA O Serial data out

SSIRXDA I Serial data in

SSITXFR I/O Transmit frame sync

SSIRXFR I/O Receive frame sync

Table F. SSI2 Interface Pin Assignments

EP7309

High-Performance, Low-Power System on Chip

Synchronous Serial Interface

•ADC (SSI) Interface: Master mode only; SPI and

Microwire1-compatible (128 kbps operation)

•Selectable serial clock polarity

LCD Controller

A DMA address generator is provided that fetches video

display data for the LCD controller from memory. The

display frame buffer start address is programmable,

allowing the LCD frame buffer to be in SDRAM, internal

SRAM or external SRAM.

•Interfaces directly to a single-scan panel monochrome

STN LCD

•Interfaces to a single-scan panel color STN LCD with

minimal external glue logic

•Panel width size is programmable from 32 to 1024

pixels in 16-pixel increments

•Video frame buffer size programmable up to

128 KB

•Bits per pixel of 1, 2, or 4 bits

64-Keypad Interface

Matrix keyboards and keypads can be easily read by the

EP7309. A dedicated 8-bit column driver output

generates strobes for each keyboard column signal. The

pins of Port A, when configured as inputs, can be

selectively OR'ed together to provide a keyboard

interrupt that is capable of waking the system from a

STANDBY or IDLE state.

•Column outputs can be individually set high with the

remaining bits left at high-impedance

•Column outputs can be driven all-low, all-high, or all-

high-impedance

•Keyboard interrupt driven by OR'ing together all Port

A bits

•Keyboard interrupt can be used to wake up the

system

•8×8 keyboard matrix usable with no external logic,

extra keys can be added with minimal glue logic

Interrupt Controller

When unexpected events arise during the execution of a

program (i.e., interrupt or memory fault) an exception is

usually generated. When these exceptions occur at the

same time, a fixed priority system determines the order

in which they are handled. The EP7309 interrupt

controller has two interrupt types: interrupt request

(IRQ) and fast interrupt request (FIQ). The interrupt

controller has the ability to control interrupts from 22

different FIQ and IRQ sources.

•Supports 22 interrupts from a variety of sources (such

as UARTs, SSI1, and key matrix.)

•Routes interrupt sources to the ARM720T’s IRQ or

FIQ (Fast IRQ) inputs

•Five dedicated off-chip interrupt lines operate as level

sensitive interrupts

Note: Pins are multiplexed. See Table R on page 7 for more

information.

Real-Time Clock

The EP7309 contains a 32-bit Real Time Clock (RTC) that

can be written to and read from in the same manner as

the timer counters. It also contains a 32-bit output match

interrupt.

Pin Mnemonic I/O Pin Description

ADCLK O SSI1 ADC serial clock

ADCIN I SSI1 ADC serial input

ADCOUT O SSI1 ADC serial output

nADCCS O SSI1 ADC chip select

SMPCLK O SSI1 ADC sample clock

Table G. Serial Interface Pin Assignments

Pin Mnemonic I/O Pin Description

CL1 O LCD line clock

CL2 O LCD pixel clock out

DD[3:0] O LCD serial display data bus

FRM O LCD frame synchronization pulse

M O LCD AC bias drive

Table H. LCD Interface Pin Assignments

Pin Mnemonic I/O Pin Description

COL[7:0] O Keyboard scanner column drive

Table I. Keypad Interface Pin Assignments

Pin Mnemonic I/O Pin Description

nEINT[2:1] I External interrupt

EINT[3] I External interrupt

nEXTFIQ I External Fast Interrupt input

nMEDCHG/nBROM (Note) I Media change interrupt input

Table J. Interrupt Controller Pin Assignments

EP7309

High-Performance, Low-Power System on Chip

•Driven byan external 32.768 kHz crystal oscillator

PLL and Clocking

•Processor and Peripheral Clocks operate from a single

3.6864 MHz crystal or external 13 MHz clock

•Programmable clock speeds allow the peripheral bus

to run at 18 MHz when the processor is set to 18 MHz

and at 36 MHz when the processor is set to 36, 49 or

74 MHz

DC-to-DC converter interface (PWM)

•Provides two 96 kHz clock outputs with

programmable duty ratio (from 1-in-16 to 15-in-16)

that can be used to drive a positive or negative DC to

DC converter

Timers

•Internal (RTC) timer

•Two internal 16-bit programmable hardware count-

down timers

General Purpose Input/Output (GPIO)

•Three 8-bit and one 3-bit GPIO ports

•Supports scanning keyboard matrix

Note: Pins are multiplexed. See Table R on page 7 for more

information.

Hardware debug Interface

•Full JTAG boundary scan and Embedded ICE

support

LED Flasher

A dedicated LED flasher module can be used to generate

a low frequency signal on Port D pin 0 for the purpose of

blinking an LED without CPU intervention. The LED

flasher feature is ideal as a visual annunciator in battery

powered applications, such as a voice mail indicator on a

portable phone or an appointment reminder on a PDA.

•Software adjustable flash period and duty cycle

•Operates from 32 kHz RTC clock

•Will continue to flash in IDLE and STANDBY states

•4 mA drive current

Note: Pins are multiplexed. See Table R on page 7 for more

information.

Pin Mnemonic Pin Description

RTCIN Real-Time Clock Oscillator Input

RTCOUT Real-Time Clock Oscillator Output

VDDRTC Real-Time Clock Oscillator Power

VSSRTC Real-Time Clock Oscillator Ground

Table K. Real-Time Clock Pin Assignments

Pin Mnemonic Pin Description

MOSCIN Main Oscillator Input

MOSCOUT Main Oscillator Output

VDDOSC Main Oscillator Power

VSSOSC Main Oscillator Ground

Table L. PLL and Clocking Pin Assignments

Pin Mnemonic I/O Pin Description

DRIVE[1:0] I/O PWM drive output

FB[1:0] I PWM feedback input

Table M. DC-to-DC Converter Interface Pin Assignments

Pin Mnemonic I/O Pin Description

PA[7:0] I GPIO port A

PB[7:0] I GPIO port B

PD[0]/LEDFLSH (Note) I/O GPIO port D

PD[5:1] I/O GPIO port D

PD[7:6]/SDQM[1:0] (Note) I/O GPIO port D

PE[1:0]/BOOTSEL[1:0] (Note) I GPIO port E

PE[2]/CLKSEL (Note) I GPIO port E

Table N. General Purpose Input/Output Pin Assignments

Pin Mnemonic I/O Pin Description

TCLK I JTAG clock

TDI I JTAG data input

TDO O JTAG data output

nTRST I JTAG async reset input

TMS I JTAG mode select

Table O. Hardware Debug Interface Pin Assignments

Pin Mnemonic I/O Pin Description

PD[0]/LEDFLSH (Note) O LED flasher driver

Table P. LED Flasher Pin Assignments

EP7309

High-Performance, Low-Power System on Chip

Internal Boot ROM

The internal 128 byte Boot ROM facilitates download of

saved code to the on-board SRAM/FLASH.

Packaging

The EP7309 is available in a 208-pin LQFP package, 256-

ball PBGA package or a 204-ball TFBGA package.

Pin Multiplexing

The following table shows the pin multiplexing of the

DAI, SSI2 and the CODEC. The selection between SSI2

and the CODEC is controlled by the state of the SERSEL

bit in SYSCON2. The choice between the SSI2, CODEC,

and the DAI is controlled by the DAISEL bit in SYSCON3

(see the EP7309 User’s Manual for more information).

The following table shows the pins that have been

multiplexed in the EP7309.

Mnemonic I/O DAI SSI2 CODEC

SSICLK I/O SCLK SSICLK PCMCLK

SSITXDA O SDOUT SSITXDA PCMOUT

SSIRXDA I SDIN SSIRXDA PCMIN

Table Q. DAI/SSI2/CODEC Pin Multiplexing

SSITXFR I/O LRCK SSITXFR PCMSYNC

SSIRXFR I MCLKIN SSIRXFR p/u

BUZ O MCLKOUT

Signal Block Signal Block

RUN System

Configuration CLKEN System

Configuration

nMEDCHG Interrupt

Controller nBROM Boot ROM

select

PD[0] GPIO LEDFLSH LED Flasher

PE[1:0] GPIO BOOTSEL[1:0] System

Configuration

PE[2] GPIO CLKSEL System

Configuration

Table R. Pin Multiplexing

Mnemonic I/O DAI SSI2 CODEC

Table Q. DAI/SSI2/CODEC Pin Multiplexing

EP7309

High-Performance, Low-Power System on Chip

System Design

As shown in system block diagram, simply adding

desired memory and peripherals to the highly integrated

EP7309 completes a low-power system solution. All

necessary interface logic is integrated on-chip.

Figure 1. A Maximum EP7309 Based System

Note: A system can only use one of the following peripheral

interfaces at any given time: SSI2,CODEC or DAI.

LCD

KEYBOARD

BATTERY

DC-TO-DC

CONVERTERS

ADC DIGITIZER

IR LED AND

PHOTODIODE

2× RS-232

TRANSCEIVERS

ADDITIONAL I/O

PC CARD

CONTROLLER

PC CARD

SOCKET

nCS[4]

PB0

EXPCLK

DD[0-3]

CL1

CL2

FRM

D[0-31]

A[0-27]

COL[0-7]

PA[0-7]

INPUT

nMOE

WRITE

PB[0-7]

PD[0-7]

PE[0-2]

nPOR

nPWRFL

BATOK

nEXTPWR

nBATCHG

RUN

WAKEUP

nCS[0]

nCS[1]

DRIVE[0-1]

FB[0-1]

EP7309

ADCCLK

nADCCS

ADCOUT

ADCIN

SMPCLK

LEDDRV

PHDIN

RXD1/2

TXD1/2

DSR

CTS

DCD

CS[n]

WORD

nCS[2]

nCS[3]

×16

FLASH

×16

FLASH

×16

FLASH

EXTERNAL MEMORY-

MAPPED EXPANSION BUFFERS

BUFFERS

AND

LATCHES

×16

FLASH

POWER

SUPPLY UNIT

AND

COMPARATORS

CRYSTAL

CODEC/SSI2/

DAI

SSICLK

SSITXFR

SSITXDA

SSIRXDA

SSIRXFR

RTCIN

LEDFLSH

CRYSTAL MOSCIN

EP7309

High-Performance, Low-Power System on Chip

ELECTRICAL SPECIFICATIONS

Absolute Maximum Ratings

Recommended Operating Conditions

DC Characteristics

All characteristics are specified at VDD = 2.5 V and VSS = 0 V over an operating temperature of 0°C to +70°C for all

frequencies of operation. The current consumption figures relate to typical conditions at 2.5 V, 18.432 MHz operation

with the PLL switched “on.”

DC Core, PLL, and RTC Supply Voltage 2.9 V

DC I/O Supply Voltage (Pad Ring) 3.6 V

DC Pad Input Current ±10 mA/pin; ±100 mA cumulative

Storage Temperature, No Power –40°C to +125°C

DC core, PLL, and RTC Supply Voltage 2.5 V ± 0.2 V

DC I/O Supply Voltage (Pad Ring) 2.3 V - 3.6 V

DC Input / Output Voltage O–I/O supply voltage

Operating Temperature Extended -20°C to +70°C; Commercial 0°C to +70°C;

Industrial -40°C to +85°C

Symbol Parameter Min Typ Max Unit Conditions

VIH CMOS input high voltage 0.65 × VDDIO VDDIO + 0.3 VVDDIO = 2.5 V

VIL CMOS input low voltage -0.3 0.25 × VDDIO VVDDIO = 2.5 V

VT+ Schmitt trigger positive going

threshold 1.6 (Typ) 2.0 V

VT- Schmitt trigger negative going

threshold 0.8 1.2 (Typ) V

Vhst Schmitt trigger hysteresis 0.1 0.4 V VIL to VIH

VOH

CMOS output high voltagea

Output drive 1a

Output drive 2a

VDD – 0.2

2.5

IOH = 0.1 mA

IOH = 4 mA

IOH = 12 mA

VOL

CMOS output low voltagea

Output drive 1a

Output drive 2a

0.3

0.5

IOL = –0.1 mA

IOL = –4mA

IOL = –12 mA

IIN Input leakage current 1.0 µA VIN = VDD or GND

IOZ Bidirectional 3-state leakage

currentb c 25 100 µA VOUT = VDD or GND

CIN Input capacitance 8 10.0 pF

EP7309

High-Performance, Low-Power System on Chip

Note: 1) All power dissipation values can be derived from taking the particular IDD current and multiplying by 2.5 V.

2) The RTC of the EP7309 should be brought up at room temperature. This is required because the RTC OSC will NOT function

properly if it is brought up at –40°C. Once operational, it will continue to operate down to –20°C extended and 0°C

commercial.

3) A typical design will provide 3.3 V to the I/O supply (i.e., VDDIO), and 2.5 V to the remaining logic. This is to allow the I/O to be

compatible with 3.3 V powered external logic.

4) Pull-up current = 50 µA typical at VDD = 3.3 V.

COUT Output capacitance 8 10.0 pF

CI/O Transceiver capacitance 8 10.0 pF

IDDstandby

Standby current consumption

Core, Osc, RTC @2.5 V

I/O @ 3.3 V

TBD

300 µA

Only 32 kHz oscillator running,

Cache disabled, all other I/O

static, VIH = VDD ± 0.1 V,

VIL = GND ± 0.1 V

IDDidle

Idle current consumption

Core, Osc, RTC @2.5 V

I/O @ 2.5 V

TBD

4.2 mA

Both oscillators running, CPU

static, Cache disabled, LCD

refresh active, VIH = VDD ± 0.1 V,

VIL = GND ± 0.1 V

At 13 MHz

IDDoperatin

Operating current consumption

Core, Osc, RTC @2.5 V

I/O @ 3.3 V

TBD

All system active, running typical

program, cache disabled, and

LCD inactive

VDDstandby Standby supply voltage TBD V

Minimum standby voltage for

state retention and RTC

operation only

a. See Table S on page 23.

b. Assumes buffer has no pull-up or pull-down resistors.

c. The leakage value given assumes that the pin is configured as an input pin but is not currently being driven.

Symbol Parameter Min Typ Max Unit Conditions

EP7309

High-Performance, Low-Power System on Chip

Timings

Timing Diagram Conventions

This data sheet contains one or more timing diagrams. The following key explains the components used in these

diagrams. Any variations are clearly labelled when they occur. Therefore, no additional meaning should be attached

unless specifically stated.

Timing Conditions

Unless specified otherwise, the following conditions are true for all timing measurements. All characteristics are

specified at VDD = 2.3 - 2.7 V and VSS = 0 V over an operating temperature of 0°C to +70°C. Those characteristics

marked with a # will be significantly different for 13 MHz mode because the EXPCLK is provided as an input rather

than generated internally. These timings are estimated at present. The timing values are referenced to 1/2 VDD.

Clock

High to Low

High/Low to High

Bus Change

Bus Valid

Undefined/Invalid

Valid Bus to Tristate

Bus/Signal Omission

EP7309

High-Performance, Low-Power System on Chip

Static Memory

Figure 2 through Figure 5 define the timings associated with all phases of the Static Memory. The following table

contains the values for the timings of each of the Static Memory modes.

Parameter Symbol Min Typ Max Unit

EXPCLK rising edge to nCS assert delay time tCSd TBD 8 TBD ns

EXPCLK falling edge to nCS deassert hold time tCSh TBD 4 TBD ns

EXPCLK rising edge to A assert delay time tAd TBD 4 TBD ns

EXPCLK falling edge to A deassert hold time tAh TBD 8 TBD ns

EXPCLK rising edge to nMWE assert delay time tMWd TBD 4 TBD ns

EXPCLK rising edge to nMWE deassert hold time tMWh TBD 4 TBD ns

EXPCLK falling edge to nMOE assert delay time tMOEd TBD 4 TBD ns

EXPCLK falling edge to nMOE deassert hold time tMOEh TBD 4 TBD ns

EXPCLK falling edge to HALFWORD deassert delay time tHWd TBD 4 TBD ns

EXPCLK falling edge to WORD assert delay time tWDd TBD 4 TBD ns

EXPCLK rising edge to data valid delay time tDv TBD 20 TBD ns

EXPCLK falling edge to data invalid delay time tDnv TBD 8 TBD ns

Data setup to EXPCLK falling edge time tDs TBD - TBD ns

EXPCLK falling edge to data hold time tDh TBD - TBD ns

EXPCLK rising edge to WRITE assert delay time tWRd TBD 8 TBD ns

EXPREADY setup to EXPCLK falling edge time tEXs TBD - TBD ns

EXPCLK falling edge to EXPREADY hold time tEXh TBD - TBD ns

EP7309

High-Performance, Low-Power System on Chip

Static Memory Single Read Cycle

Note: 1. The cycle time can be extended by integer multiples of the clock period (27 ns at 36 MHz, 54 ns at 18.432 MHz, and

77 ns at 13 MHz), by either driving EXPRDY low and/or by programming a number of wait states. EXPRDY is sampled on

the falling edge of EXPCLK before the data transfer. If low at this point, the transfer is delayed by one clock period where

EXPRDY is sampled again. EXPCLK need not be referenced when driving EXPRDY, but is shown for clarity.

Figure 2. Static Memory Single Read Cycle Timing Measurement

EXPCLK

nCS

nMWE

HALF

WORD

WRITE

nMOE

tCSd

tAd

tCSh

tMOEh

tDh

tDs

tHWd

tWDd

tWRd

tMOEd

EXPRDY

tEXh

tEXs

EP7309

High-Performance, Low-Power System on Chip

Static Memory Single Write Cycle

Note: 1. The cycle time can be extended by integer multiples of the clock period (27 ns at 36 MHz, 54 ns at 18.432 MHz, and

77 ns at 13 MHz), by either driving EXPRDY low and/or by programming a number of wait states. EXPRDY is sampled on

the falling edge of EXPCLK before the data transfer. If low at this point, the transfer is delayed by one clock period where

EXPRDY is sampled again. EXPCLK need not be referenced when driving EXPRDY, but is shown for clarity.

2. Zero wait states for sequential writes is not permitted for memory devices which use nMWE pin, as this cannot be driven with

valid timing under zero wait state conditions.

Figure 3. Static Memory Single Write Cycle Timing Measurement

EXPCLK

nCS

nMWE

HALF

WORD

WRITE

tHWd

tWDd

tCSd

tAd

tMWd

tDv

tMWh

tCSh

nMOE

EXPRDY

tEXh

tEXs

EP7309

High-Performance, Low-Power System on Chip

Static Memory Burst Read Cycle

Note: 1. Four cycles are shown in the above diagram (minimum wait states, 1-0-0-0). This is the maximum number of consecutive

cycles that can be driven. The number of consecutive cycles can be programmed from 2 to 4, inclusively.

2. The cycle time can be extended by integer multiples of the clock period (27 ns at 36 MHz, 54 ns at 18.432 MHz, and

77 ns at 13 MHz), by either driving EXPRDY low and/or by programming a number of wait states. EXPRDY is sampled on

the falling edge of EXPCLK before the data transfer. If low at this point, the transfer is delayed by one clock period where

EXPRDY is sampled again. EXPCLK need not be referenced when driving EXPRDY, but is shown for clarity.

3. Consecutive reads with sequential access enabled are identical except that the sequential access wait state field is used to

determine the number of wait states, and no idle cycles are inserted between successive non-sequential ROM/expansion

cycles. This improves performance so the SQAEN bit should always be set where possible.

Figure 4. Static Memory Burst Read Cycle Timing Measurement

EXPCLK

nCS

nMOE

HALF

WORD

nMWE

EXPRDY

WRITE

tCSd

tAd tAh

tAh tAh

tCSh

tMOEh

tMOEd

tEXs tEXh

tDs tDh tDs tDs tDs

tDh tDh tDh

tWRd

tHWd

tWDd

EP7309

High-Performance, Low-Power System on Chip

Static Memory Burst Write Cycle

Note: 1. Four cycles are shown in the above diagram (minimum wait states, 1-1-1-1). This is the maximum number of consecutive

cycles that can be driven. The number of consecutive cycles can be programmed from 2 to 4, inclusively.

2. The cycle time can be extended by integer multiples of the clock period (27 ns at 36 MHz, 54 ns at 18.432 MHz, and

77 ns at 13 MHz), by either driving EXPRDY low and/or by programming a number of wait states. EXPRDY is sampled on

the falling edge of EXPCLK before the data transfer. If low at this point, the transfer is delayed by one clock period where

EXPRDY is sampled again. EXPCLK need not be referenced when driving EXPRDY, but is shown for clarity.

3. Zero wait states for sequential writes is not permitted for memory devices which use nMWE pin, as this cannot be driven with

valid timing under zero wait state conditions.

Figure 5. Static Memory Burst Write Cycle Timing Measurement

EXPCLK

nCS

nMOE

HALF

WORD

nMWE

EXPRDY

WRITE

tCSd

tAd

tMWd

tMWh

tMWd tMWd tMWd

tMWh tMWh tMWh

tAh tAh tAh

tEXs tEXh

tCSh

tDv tDv tDv

tDnv tDnv tDnv tDv

tHWd

tWDd

EP7309

High-Performance, Low-Power System on Chip

SSI1 Interface

Parameter Symbol Min Max Unit

ADCCLK falling edge to nADCCSS deassert delay time tCd TBD TBD ns

ADCIN data setup to ADCCLK rising edge time tINs TBD TBD ns

ADCIN data hold from ADCCLK rising edge time tINh TBD TBD ns

ADCCLK falling edge to data valid delay time tOvd TBD TBD ns

ADCCLK falling edge to data invalid delay time tOd TBD TBD ns

Figure 6. SSI1 Interface Timing Measurement

ADC

CLK

nADC

CSS

ADCIN

ADC

OUT

tINs tINh

tCd

tOd

tOvd

EP7309

High-Performance, Low-Power System on Chip

SSI2 Interface

Parameter Symbol Min Max Unit

SSICLK period (slave mode) tclk_per 0 512 ns

SSICLK high time tclk_high 925 1025 ns

SSICLK low time tclk_low 925 1025 ns

SSICLK rise/fall time tclkrf 7ns

SSICLK rising edge to RX and/or TX frame sync high time tFRd 528 ns

SSICLK rising edge to RX and/or TX frame sync low time tFRa 448 ns

SSIRXFR and/or SSITXFR period tFR_per 750 ns

SSIRXDA setup to SSICLK falling edge time tRXs 30 ns

SSIRXDA hold from SSICLK falling edge time tRXh 40 ns

SSICLK rising edge to SSITXDA data valid delay time tTXd 80 ns

SSITXDA valid time tTXv ns

Figure 7. SSI2 Interface Timing Measurement

SSI

CLK

SSIRXFR/

SSITXFR

SSI

TXDA

SSI

RXDA D1D7

D2 D1

tclk_per tclk_high tclk_low

tFRd tFR_per

tRXs

tTXd

tFRa

tRXh

tclkrf

tTXv

EP7309

High-Performance, Low-Power System on Chip

LCD Interface

Parameter Symbol Min Max Unit

CL[1] falling to CL[2] falling time tclk 200 6,950 ns

LCD CL[2] low time tclk_low 80 3,475 ns

LCD CL[2] high time tclk_high 80 3,475 ns

CL[2] falling to CL[1] rising delay time tCL1d 025ns

CL[1] falling to CL[2] rising delay time tCL2d 80 3,475 ns

LCD CL[1] high time tCL2h 80 3,475 ns

CL[1] falling to FRM transition time tFRMd 300 10,425 ns

CL[1] falling to M transition time tMd − 10 20 ns

CL[2] rising to DD (display data) transition time tDDd − 10 20 ns

Figure 8. LCD Controller Timing Measurement

CL[2]

CL[1]

FRM

DD [3:0]

tCL1d

tFRMd

tCL2h

tMd

tDDd

tCL2d

tclk tclk_high

tclk_low

EP7309

High-Performance, Low-Power System on Chip

JTAG

Parameter Symbol Min Max Units

TCK clock period tclk_per 100 - ns

TCK clock high time tclk_high 50 - ns

TCK clock low time tclk_low 50 - ns

JTAG port setup time tJPs 20 - ns

JTAG port hold time tJPh 45 - ns

JTAG port clock to output tJPco -25ns

JTAG port high impedance to valid output tJPzx -25ns

JTAG port valid output to high impedance tJPxz -25ns

Figure 9. JTAG Timing Measurement

TDO

TCK

TDI

TMS

tJPh

tclk_high tclk_low

tJPzx tJPco tJPxz

tclk_per

tJPs

EP7309

High-Performance, Low-Power System on Chip

Packages

208-Pin LQFP Package Characteristics

208-Pin LQFP Package Specifications

Note: 1) Dimensions are in millimeters (inches), and controlling dimension is millimeter.

2) Drawing above does not reflect exact package pin count.

3) Before beginning any new design with this device, please contact Cirrus Logic for the latest package information.

4) For pin locations, please see Figure 11. For pin descriptions see the EP7309 User’s Manual.

Figure 10. 208-Pin LQFP Package Outline Drawing

Pin 1 Indicator

29.60 (1.165)

30.40 (1.197)

0.17 (0.007)

0.27 (0.011)

27.80 (1.094)

28.20 (1.110)

0.50

(0.0197)

BSC

29.60 (1.165)

30.40 (1.197)

27.80 (1.094)

28.20 (1.110)

1.35 (0.053)

1.45 (0.057)

0° MIN

7° MAX

0.09 (0.004)

0.20 (0.008)

1.40 (0.055)

0.45 (0.018)

0.75 (0.030)

0.05 (0.002)

1.00 (0.039) BSC

Pin 1

Pin 208

1.60 (0.063) 0.15 (0.006)

EP7309

208-Pin LQFP

EP7309

High-Performance, Low-Power System on Chip

208-Pin LQFP Pin Diagram

Note: 1. N/C should not be grounded but left as no connects.

2. Pin differences between the EP7212 and the EP7309 are bolded.

160

159

158

157

106

107

108

109

110

112

113

114

115

116

117

118

119

120

121

100

101

102

103

104

122

124

125

126

127

128

129

130

105

131

132

133

134

156

155

154

153

152

151

150

149

148

147

146

145

144

143

140

139

138

137

136

141

142

135

161

162

163

164

165

166

167

168

169

170

171

172

173

174

180

181

182

183

184

185

186

187

188

189

190

191

192

193

194

195

196

197

198

199

201

202

203

204

205

206

207

208

200

175

176

177

178

179

123

111

EP7309

208-Pin LQFP

(Top View)

nEXTPWR

BATOK

nPOR

VSSOSC

VDDOSC

MOSCIN

MOSCOUT

nURESET

WAKEUP

A[6]

D[6]

A[5]

D[5]

VDDIO

VSSIO

A[4]

D[4]

A[3]

D[3]

nPWRFL

A[2]

D[2]

A[1]

A[0]

D[0]

VDDCORE

VSSIO

VDDIO

CL[2]

CL[1]

FRM

DD[2]

DD[1]

DD[0]

N/C

VDDIO

VSSIO

N/C

nMWE

nMOE

nCS[0]

nCS[1]

nCS[2]

nCS[3]

D[7]

A[7]

D[8]

A[8]

D[9]

D[10]

A[10]

VSSIO

VDDIO

A[11]

D[12]

A[12]

D[13]

A[13]

D[14]

DD[3]

D[17]

D[15]

A[17]

nTRST

VSSIO

VDDIO

D[18]

A[18

D[19]

A[19]

D[20]

VSSIO

A[21]

D[22]

D[23]

A[23]

D[24]

VSSIO

VDDIO

A[24]

HALFWORD

A[14]

nBATCHG

A[25]

D[25]

D[27]

A[27]

VSSIO

D[28]

D[29]

D[30]

D[31]

BUZ

COL[0]

COL[1]

TCLK

VDDIO

COL[2]

COL[3]

COL[4]

COL[5]

COL[6]

COL[7]

FB[0]

VSSIO

FB[1]

ADCOUT

ADCCLK

DRIVE[0]

VDDIO

PD[2]

VSSIO

VSSCORE

nADCCS

ADCIN

SSIRXDA

SSIRXFR

SSITXDA

SSITXFR

VSSIO

SSICLK

PD[0]/LEDFLSH

PD[1]

PD[3]

A[22]

PD[4]

VDDIO

PD[5]

PD[6]

DRIVE[1]

PD[7]

D[26]

A[15]

D[16]

A[16]

nCS[4]

VDDCORE

A[26]

D[21]

TMS

A[20]

SMPCLK

D[11]

A[9]

D[1]

VSSCORE

N/C

VSSIO

EXPCLK

WORD

WRITE

RUN/CLKEN

EXPRDY

PB[7]

PB[6]

PB[5]

PB[4]

PB[3]

PB[2]

PB[1]

VSSIO

TDI

VDDIO

TDO

PE[2]/CLKSEL

nEXTFIQ

PA[6]

PA[5]

PA[4]

PA[3]

PA[2]

PA[1]

PA[0]

LEDDRV

TXD[2]

PHDIN

CTS

RXD[2]

DCD

DSR

RTCOUT

RTCIN

VSSIO

PA[7]

VDDIO

VSSIO

nCS[5]

PB[0]

TXD[1]

RXD[1]

nTEST[1]

nTEST[0]

EINT[3]

nEINT[2]

nEINT[1]

PE[1]BOOTSEL[1]

PE[0]BOOTSEL[0]

N/C

VSSRTC

VDDRTC

Figure 11. 208-Pin LQFP (Low Profile Quad Flat Pack) Pin Diagram

nMEDCHG/nBROM

EP7309

High-Performance, Low-Power System on Chip

208-Pin LQFP Numeric Pin Listing

Table S. 208-Pin LQFP Numeric Pin Listing

No. Signal Type Strength Reset

State

1 nCS[5] O 1 High

2 VDDIO Pad Pwr

3 VSSIO Pad Gnd

4 EXPCLK I/O 1

5WORD Out 1 Low

6WRITE Out 1 Low

7 RUN/CLKEN O 1 Low

8EXPRDY I 1

9 TXD[2] O 1 High

10 RXD[2] I

11 TDI I with p/u*

12 VSSIO Pad Gnd

13 PB[7] I/O 1 Input

14 PB[6] I/O 1 Input

15 PB[5] I/O 1 Input

16 PB[4] I/O 1 Input

17 PB[3] I/O 1 Input

18 PB[2] I/O 1 Input

19 PB[1]/PRDY2 I/O 1 Input

20 PB[0]/PRDY1 I/O 1 Input

21 VDDIO Pad Pwr

22 TDO O 1 Three state

23 PA[7] I/O 1 Input

24 PA[6] I/O 1 Input

25 PA[5] I/O 1 Input

26 PA[4] I/O 1 Input

27 PA[3] I/O 1 Input

28 PA[2] I/O 1 Input

29 PA[1] I/O 1 Input

30 PA[0] I/O 1 Input

31 LEDDRV O 1 Low

32 TXD[1] O 1 High

33 VSSIO Pad Gnd 1 High

34 PHDIN I

35 CTS I

36 RXD[1] I

37 DCD I

38 DSR I

39 nTEST[1] I With p/u*

40 nTEST[0] I With p/u*

41 EINT[3] I

42 nEINT[2] I

43 nEINT[1] I

44 nEXTFIQ I

45 PE[2]/CLKSEL I/O 1 Input

46 PE[1]/

BOOTSEL[1] I/O 1 Input

47 PE[0]/

BOOTSEL[0] I/O 1 Input

48 VSSRTC RTC Gnd

49 RTCOUT O

50 RTCIN I

51 VDDRTC RTC power

52 N/C

53 PD[7] I/O 1 Low

54 PD[6] I/O 1 Low

55 PD[5] I/O 1 Low

56 PD[4] I/O 1 Low

57 VDDIO Pad Pwr

58 TMS I with p/u*

59 PD[3] I/O 1 Low

60 PD[2] I/O 1 Low

61 PD[1] I/O 1 Low

62 PD[0]/LEDFLSH I/O 1 Low

63 SSICLK I/O 1 Input

64 VSSIO Pad Gnd

65 SSITXFR I/O 1 Low

66 SSITXDA O 1 Low

67 SSIRXDA I

68 SSIRXFR I/O Input

69 ADCIN I

70 nADCCS O 1 High

71 VSSCORE Core Gnd

72 VDDCORE Core Pwr

73 VSSIO Pad Gnd

Table S. 208-Pin LQFP Numeric Pin Listing (Continued)

No. Signal Type Strength Reset

State

EP7309

High-Performance, Low-Power System on Chip

74 VDDIO Pad Pwr

75 DRIVE[1] I/O 2 High /

Low

76 DRIVE[0] I/O 2 High /

Low

77 ADCCLK O 1 Low

78 ADCOUT O 1 Low

79 SMPCLK O 1 Low

80 FB[1] I

81 VSSIO Pad Gnd

82 FB[0] I

83 COL[7] O 1 High

84 COL[6] O 1 High

85 COL[5] O 1 High

86 COL[4] O 1 High

87 COL[3] O 1 High

88 COL[2] O 1 High

89 VDDIO Pad Pwr

90 TCLK I

91 COL[1] O 1 High

92 COL[0] O 1 High

93 BUZ O 1 Low

94 D[31] I/O 1 Low

95 D[30] I/O 1 Low

96 D[29] I/O 1 Low

97 D[28] I/O 1 Low

98 VSSIO Pad Gnd

99 A[27] O 2 Low

100 D[27] I/O 1 Low

101 A[26] O 2 Low

102 D[26] I/O 1 Low

103 A[25] O 2 Low

104 D[25] I/O 1 Low

105 HALFWORD O 1 Low

106 A[24] O 1 Low

107 VDDIO Pad Pwr —

108 VSSIO Pad Gnd —

109 D[24] I/O 1 Low

110 A[23] O 1 Low

Table S. 208-Pin LQFP Numeric Pin Listing (Continued)

No. Signal Type Strength Reset

State

111 D[23] I/O 1 Low

112 A[22] O 1 Low

113 D[22] I/O 1 Low

114 A[21] O 1 Low

115 D[21] I/O 1 Low

116 VSSIO Pad Gnd

117 A[20] O 1 Low

118 D[20] I/O 1 Low

119 A[19] O 1 Low

120 D[19] I/O 1 Low

121 A[18] O 1 Low

122 D[18] I/O 1 Low

123 VDDIO Pad Pwr

124 VSSIO Pad Gnd

125 nTRST I

126 A[17] O 1 Low

127 D[17] I/O 1 Low

128 A[16] O 1 Low

129 D[16] I/O 1 Low

130 A[15] O 1 Low

131 D[15] I/O 1 Low

132 A[14] O 1 Low

133 D[14] I/O 1 Low

134 A[13] O 1 Low

135 D[13] I/O 1 Low

136 A[12] O 1 Low

137 D[12] I/O 1 Low

138 A[11] O 1 Low

139 VDDIO Pad Pwr

140 VSSIO Pad Gnd

141 D[11] I/O 1 Low

142 A[10] O 1 Low

143 D[10] I/O 1 Low

144 A[9] O 1 Low

145 D[9] I/O 1 Low

146 A[8] O 1 Low

147 D[8] I/O 1 Low

148 A[7] O 1 Low

Table S. 208-Pin LQFP Numeric Pin Listing (Continued)

No. Signal Type Strength Reset

State

EP7309

High-Performance, Low-Power System on Chip

*With p/u’ means with internal pull-up on the pin.

149 VSSIO Pad Gnd

150 D[7] I/O 1 Low

151 nBATCHG I

152 nEXTPWR I

153 BATOK I

154 nPOR I Schmitt

155 nMEDCHG/

nBROM I

156 nURESET I Schmitt

157 VDDOSC Osc Pwr

158 MOSCIN Osc

159 MOSCOUT Osc

160 VSSOSC Osc Gnd

161 WAKEUP I Schmitt

162 nPWRFL I

163 A[6] O 1 Low

164 D[6] I/O 1 Low

165 A[5] Out 1 Low

166 D[5] I/O 1 Low

167 VDDIO Pad Pwr

168 VSSIO Pad Gnd

169 A[4] O 1 Low

170 D[4] I/O 1 Low

171 A[3] O 2 Low

172 D[3] I/O 1 Low

173 A[2] O 2 Low

174 VSSIO Pad Gnd

175 D[2] I/O 1 Low

176 A[1] O 2 Low

177 D[1] I/O 1 Low

178 A[0] O 2 Low

179 D[0] I/O 1 Low

180 VSS CORE Core Gnd

181 VDD CORE Core Pwr

182 VSSIO Pad Gnd

183 VDDIO Pad Pwr

184 CL[2] O 1 Low

185 CL[1] O 1 Low

186 FRM O 1 Low

Table S. 208-Pin LQFP Numeric Pin Listing (Continued)

No. Signal Type Strength Reset

State

187 M O 1 Low

188 DD[3] I/O 1 Low

189 DD[2] I/O 1 Low

190 VSSIO Pad Gnd

191 DD[1] I/O 1 Low

192 DD[0] I/O 1 Low

193 N/C O 1 High

194 N/C O 1 High

195 N/C I/O 2 Low

196 N/C I/O 2 Low

197 VDDIO Pad Pwr

198 VSSIO Pad Gnd

199 N/C I/O 2 Low

200 N/C I/O 2 Low

201 nMWE O 1 High

202 nMOE O 1 High

203 VSSIO Pad Gnd

204 nCS[0] O 1 High

205 nCS[1] O 1 High

206 nCS[2] O 1 High

207 nCS[3] O 1 High

208 nCS[4] O 1 High

Table S. 208-Pin LQFP Numeric Pin Listing (Continued)

No. Signal Type Strength Reset

State

EP7309

High-Performance, Low-Power System on Chip

204-Ball TFBGA Package Characteristics

204-Ball TFBGA Package Specifications

Figure 12. 204-Ball TFBGA Package

Ø0.25~0.35(204X)

Ø0.15 M C A B

Ø0.08 M C

0.15(4X) C

0.20~0.30

1.20 MAX.

SEATING PLANE

0.36 0.53±0.05

0.20 C

TOP VIEW BOTTOM VIEW

13±0.05

0.10 C

Ball Diameter :

Ball Pitch :

0.530.3

Substrate Thickness :

Mold Thickness :

0.65 0.36

0.65

19181716151413121110987654321

12.35

0.65

17 19 20181614 1512 139101178456231

A1 CORNER A1 CORNER

12.35

EP7309

High-Performance, Low-Power System on Chip

204-Ball TFBGA Pinout (Top View)

1 2 345 6 7 8 910111213141516 17 18 19 20

A VDDR EXPCLK nCS3 nCS1 nMWE N/C N/C DD2 FRM CL1 GNDD D1 A2 D4 A5 nPWRFL MOSCOUT GNDR GNDR GNDR A

B WORD VDDR nCS5 nCS2 nMOE N/C N/C DD1 M CL2 D0 A1 D3 A4 D6 WAKEUP MOSCIN GNDR GNDR nURESET B

CRUN/

CLKEN EXPRDY VDDR nCS4 nCS0 N/C N/C DD0 DD3 VDDD A0 D2 A3 D5 A6 GNDO VDDO GNDR BATOK nPOR C

D PB7 RXD2 VDDR GNDR nBATCHG A7 D

EPB4 TXD2WRITE nMEDCHG

/nBROM nEXTPWR D9 E

FPB3 PB6 TDI D7 A8 D10 F

G PB1 PB2 PB5 D8 A9 D11 G

H PA7 TDO PB0 A10 D12 A12 H

J PA4 PA5 PA6 A11 D13 A13 J

K PA1 PA2 VDDR D14 A14 D15 K

L TXD1 LEDDRV PA3 VDDR D16 A16 L

MRXD1 CTS PA0 A15 A17 nTRST M

N DSR nTEST1 PHDIN D17 D19 A18 N

P EINT3 nEINT2 DCD D18 A20 D20 P

RnEXTFIQ PE2/

CLKSEL nTEST0 A19 D22 A21 R

PE1/

BOOT

SEL1

PE0/

BOOT

SEL0

nEINT1 D21 D23 A22 T

U GNDC RTCOUT RTCIN HALF

WORD D24 A23 U

V VDDC GNDR GNDR PD7 PD4 PD2 SSICLK SSIRXDAnADCCS VDDR ADCCLK COL7 COL4 TCLK BUZ D29 A26 VDDR VDDR A24 V

W GNDR GNDR GNDR PD6 TMS PD1 SSITXFR SSIRXFR GNDD1 DRIVE1 ADCOUT FB0 COL5 COL2 COL0 D30 A27 D26 VDDR D25 W

Y GNDR GNDR GNDR PD5 PD3

PD0/

LED

FLSH

SSITXDA ADCIN VDD1 DRIVE0 SMPLCK FB1 COL6 COL3 COL1 D31 D28 D27 A25 VDDR Y

EP7309

High-Performance, Low-Power System on Chip

TFBGA Ball List

Table T. 204-Ball TFBGA Ball List

Die Pad Bond Pad Package Ball Signal

U2.1 1 B3 nCS5

U2.2 2 Y20 VDDR

U2.3 3 B18 GNDR

U2.4 4 A2 EXPCLK

U2.5 5 B1 WORD

U2.6 6 E3 WRITE

U2.7 7 C1 RUN/CLKEN

U2.8 8 C2 EXPRDY

U2.9 9 E2 TXD2

U2.10 10 D2 RXD2

U2.11 11 F3 TDI

U2.12 12 B18 GNDR

U2.13 13 D1 PB7

U2.14 14 F2 PB6

U2.15 15 G3 PB5

U2.16 16 E1 PB4

U2.17 17 F1 PB3

U2.18 18 G2 PB2

U2.19 19 G1 PB1

U2.20 20 H3 PB0

U2.21 21 Y20 VDDR

U2.22 22 H2 TDO

U2.23 23 H1 PA7

U2.24 24 J3 PA6

U2.25 25 J2 PA5

U2.26 26 J1 PA4

U2.27 27 L3 PA3

U2.28 28 K2 PA2

U2.29 29 K1 PA1

U2.30 30 M3 PA0

U2.31 31 L2 LEDDRV

U2.32 32 L1 TXD1

U2.33 33 B18 GNDR

U2.34 34 N3 PHDIN

U2.35 35 M2 CTS

U2.36 36 M1 RXD1

U2.37 37 P3 DCD

U2.38 38 N1 DSR

U2.39 39 N2 nTEST1

U2.40 40 R3 nTEST0

U2.41 41 P1 EINT3

U2.42 42 P2 nEINT2

U2.43 43 T3 nEINT1

U2.44 44 R1 nEXTFIQ

U2.45 45 R2 PE2/CLKSEL

U2.46 46 T1 PE1/BOOTSEL1

U2.47 47 T2 PE0/BOOTSEL0

U2.48 48 U1 GNDC

U2.49 49 U2 RTCOUT

U2.50 50 U3 RTCIN

U2.51 51 V1 VDDC

U2.53 52 V4 PD7

U2.54 53 W4 PD6

U2.55 54 Y4 PD5

U2.56 55 V5 PD4

U2.57 56 L18 VDDR

U2.58 57 W5 TMS

U2.59 58 Y5 PD3

U2.60 59 V6 PD2

U2.61 60 W6 PD1

U2.62 61 Y6 PD0/LEDFLSH

U2.63 62 V7 SSICLK

U2.64 63 D18 GNDR

U2.65 64 W7 SSITXFR

U2.66 65 Y7 SSITXDA

U2.67 66 V8 SSIRXDA

U2.68 67 W8 SSIRXFR

U2.69 68 Y8 ADCIN

U2.70 69 V9 nADCCS

U2.71 70 W9 GNDD1

U2.72 71 Y9 VDD1

U2.73 72 W3 GNDR

U2.74 73 V10 VDDR

U2.75 74 L18 VDDR

U2.76 75 W10 DRIVE1

Table T. 204-Ball TFBGA Ball List (Continued)

Die Pad Bond Pad Package Ball Signal

EP7309

High-Performance, Low-Power System on Chip

U2.77 76 Y10 DRIVE0

U2.78 77 V11 ADCCLK

U2.79 78 W11 ADCOUT

U2.80 79 Y11 SMPLCK

U2.81 80 Y12 FB1

U2.82 81 Y3 GNDR

U2.83 82 W12 FB0

U2.84 83 V12 COL7

U2.85 84 Y13 COL6

U2.86 85 W13 COL5

U2.87 86 V13 COL4

U2.88 87 Y14 COL3

U2.89 88 W14 COL2

U2.90 89 A1 VDDR

U2.91 90 V14 TCLK

U2.92 91 Y15 COL1

U2.93 92 W15 COL0

U2.94 93 V15 BUZ

U2.95 94 Y16 D31

U2.96 95 W16 D30

U2.97 96 V16 D29

U2.98 97 Y17 D28

U2.99 98 Y3 GNDR

U2.100 99 W17 A27

U2.101 100 Y18 D27

U2.102 101 V17 A26

U2.103 102 W18 D26

U2.104 103 Y19 A25

U2.105 104 W20 D25

U2.106 105 U18 HALFWORD

U2.107 106 V20 A24

U2.108 107 A1 VDDR

U2.109 108 Y3 GNDR

U2.110 109 U19 D24

U2.111 110 U20 A23

U2.112 111 T19 D23

U2.113 112 T20 A22

U2.114 113 R19 D22

U2.115 114 R20 A21

Table T. 204-Ball TFBGA Ball List (Continued)

Die Pad Bond Pad Package Ball Signal

U2.116 115 T18 D21

U2.117 116 Y3 GNDR

U2.118 117 P19 A20

U2.119 118 P20 D20

U2.120 119 R18 A19

U2.121 120 N19 D19

U2.122 121 N20 A18

U2.123 122 P18 D18

U2.124 123 A1 VDDR

U2.125 124 Y3 GNDR

U2.126 125 M20 nTRST

U2.127 126 M19 A17

U2.128 127 N18 D17

U2.129 128 L20 A16

U2.130 129 L19 D16

U2.131 130 M18 A15

U2.132 131 K20 D15

U2.133 132 K19 A14

U2.134 133 K18 D14

U2.135 134 J20 A13

U2.136 135 J19 D13

U2.137 136 H20 A12

U2.138 137 H19 D12

U2.139 138 J18 A11

U2.140 139 K3 VDDR

U2.141 140 Y3 GNDR

U2.142 141 G20 D11

U2.143 142 H18 A10

U2.144 143 F20 D10

U2.145 144 G19 A9

U2.146 145 E20 D9

U2.147 146 F19 A8

U2.148 147 G18 D8

U2.149 148 D20 A7

U2.150 149 Y3 GNDR

U2.151 150 F18 D7

U2.152 151 D19 nBATCHG

U2.153 152 E19 nEXTPWR

U2.154 153 C19 BATOK

Table T. 204-Ball TFBGA Ball List (Continued)

Die Pad Bond Pad Package Ball Signal

EP7309

High-Performance, Low-Power System on Chip

U2.155 154 C20 nPOR

U2.156 155 E18 nMEDCHG/nBROM

U2.157 156 B20 nURESET

U2.158 157 C17 VDDO

U2.159 158 B17 MOSCIN

U2.160 159 A17 MOSCOUT

U2.161 160 C16 GNDO

U2.162 161 B16 WAKEUP

U2.163 162 A16 nPWRFL

U2.164 163 C15 A6

U2.165 164 B15 D6

U2.166 165 A15 A5

U2.167 166 C14 D5

U2.168 167 A1 VDDR

U2.169 168 Y3 GNDR

U2.170 169 B14 A4

U2.171 170 A14 D4

U2.172 171 C13 A3

U2.173 172 B13 D3

U2.174 173 A13 A2

U2.175 174 Y3 GNDR

U2.176 175 C12 D2

U2.177 176 B12 A1

U2.178 177 A12 D1

U2.179 178 C11 A0

U2.180 179 B11 D0

U2.181 180 A11 GNDD

U2.182 181 C10 VDDD

U2.183 182 Y3 GNDR

U2.184 183 Y20 VDDR

U2.185 184 B10 CL2

U2.186 185 A10 CL1

U2.187 186 A9 FRM

U2.188 187 B9 M

U2.189 188 C9 DD3

U2.190 189 A8 DD2

U2.191 190 Y3 GNDR

U2.192 191 B8 DD1

U2.193 192 C8 DD0

Table T. 204-Ball TFBGA Ball List (Continued)

Die Pad Bond Pad Package Ball Signal

U2.194 193 A7 N/C

U2.195 194 B7 N/C

U2.196 195 C7 N/C

U2.197 196 A6 N/C

U2.198 197 V18 VDDR

U2.199 198 B18 GNDR

U2.200 199 B6 N/C

U2.201 200 C6 N/C

U2.202 201 A5 nMWE

U2.203 202 B5 nMOE

U2.204 203 B18 GNDR

U2.205 204 C5 nCS0

U2.206 205 A4 nCS1

U2.207 206 B4 nCS2

U2.208 207 A3 nCS3

U2.209 208 C4 nCS4

A1 VDDR

B2 VDDR

C3 VDDR

D3 VDDR

K3 VDDR

L18 VDDR

V18 VDDR

V19 VDDR

W19 VDDR

Y20 VDDR

A18 GNDR

A19 GNDR

A20 GNDR

B18 GNDR

B19 GNDR

C18 GNDR

D18 GNDR

V2 GNDR

V3 GNDR

W1 GNDR

W2 GNDR

W3 GNDR

Table T. 204-Ball TFBGA Ball List (Continued)

Die Pad Bond Pad Package Ball Signal

EP7309

High-Performance, Low-Power System on Chip

256-Ball PBGA Package Characteristics

256-Ball PBGA Package Specifications

Figure 13. 256-Ball PBGA Package

Note: 1) For pin locations see Tabl e U .

2) Dimensions are in millimeters (inches), and controlling dimension is millimeter

3) Before beginning any new EP7309 design, contact Cirrus Logic for the latest package information.

Y1 GNDR

Y2 GNDR

Y3 GNDR

Table T. 204-Ball TFBGA Ball List (Continued)

Die Pad Bond Pad Package Ball Signal

EP7309

High-Performance, Low-Power System on Chip

TOP VIEW

17.00 (0.669)

15.00 (0.590)

SIDE VIEW

BOTTOM VIEW

1.00 (0.040)

Pin 1 Indicator

Pin 1 Corner

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

15.00 (0.590)

2 Layer

17.00 (0.669)

1.00 (0.040)

30° TYP

REF

0.50

3 Places

0.85 (0.034)

±0.05 (.002)

0.40 (0.016)

±0.05 (.002)

0.36 (0.014)

17.00 (0.669)

±0.20 (.008)

±0.09 (0.004)

JEDEC #: MO-151

Ball Diameter: 0.50 mm ± 0.10 mm

17 ¥ 17 ¥ 1.61 mm body

EP7309

High-Performance, Low-Power System on Chip

256-Ball PBGA Pinout (Top View))

256-Ball PBGA Ball Listing

The list is ordered by ball location.

1 2 3 4 5 6 7 8 910111213141516

A VDDIO nCS[4] nCS[1] N/C N/C DD[1] M VDDIO D[0] D[2] A[3] VDDIO A[6] MOSCOUT VDDOSC VSSIO A

B nCS[5] VDDIO nCS[3] nMOE VDDIO N/C DD[2] CL[1] VDDCORE D[1] A[2] A[4] A[5] WAKEUP VDDIO nURESET B

C VDDIO EXPCLK VSSIO VDDIO VSSIO VSSIO VSSIO VDDIO VSSIO VSSIO VSSIO VDDIO VSSIO VSSIO nPOR nEXTPWR C

D WRITE EXPRDY VSSIO VDDIO nCS[2] nMWE N/C CL[2] VSSRTC D[4] nPWRFL MOSCIN VDDIO VSSIO D[7] D[8] D

E RXD[2] PB[7] TDI WORD VSSIO nCS[0] N/C FRM A[0] D[5] VSSOSC VSSIO nMEDCHG/

nBROM VDDIO D[9] D[10] E

F PB[5] PB[3] VSSIO TXD[2] RUN/

CLKEN VSSIO N/C DD[3] A[1] D[6] VSSRTC BATOK nBATCHG VSSIO D[11] VDDIO F

G PB[1] VDDIO TDO PB[4] PB[6] VSSRTC VSSRTC DD[0] D[3] VSSRTC A[7] A[8] A[9] VSSIO D[12] D[13] G

H PA[7] PA[5] VSSIO PA[4] PA[6] PB[0] PB[2] VSSRTC VSSRTC A[10] A[11] A[12] A[13] VSSIO D[14] D[15] H

J PA[3] PA[1] VSSIO PA[2] PA[0] TXD[1] CTS VSSRTC VSSRTC A[17] A[16] A[15] A[14] nTRST D[16] D[17] J

K LEDDRV PHDIN VSSIO DCD nTEST[1] EINT[3] VSSRTC ADCIN COL[4] TCLK D[20] D[19] D[18] VSSIO VDDIO VDDIO K

L RXD[1] DSR VDDIO nEINT[1] PE[2]/

CLKSEL VSSRTC PD[0]/

LEDFLSH VSSRTC COL[6] D[31] VSSRTC A[22] A[21] VSSIO A[18] A[19] L

M nTEST[0] nEINT[2] VDDIO PE[0]/

BOOTSEL[0] TMS VDDIO SSITXFR DRIVE[1] FB[0] COL[0] D[27] VSSIO A[23] VDDIO A[20] D[21] M

N nEXTFIQ PE[1]/

BOOTSEL[1] VSSIO VDDIO PD[5] PD[2] SSIRXDA ADCCLK SMPCLK COL[2] D[29] D[26] HALFWORD VSSIO D[22] D[23] N

P VSSRTC RTCOUT VSSIO VSSIO VDDIO VSSIO VSSIO VDDIO VSSIO VDDIO VSSIO VSSIO VDDIO VSSIO D[24] VDDIO P

R RTCIN VDDIO PD[4] PD[1] SSITXDA nADCCS VDDIO ADCOUT COL[7] COL[3] COL[1] D[30] A[27] A[25] VDDIO A[24] R

T VDDRTC PD[7] PD[6] PD[3] SSICLK SSIRXFR VDDCORE DRIVE[0] FB[1] COL[5] VDDIO BUZ D[28] A[26] D[25] VSSIO T

Table U. 256-Ball PBGA Ball Listing

Ball Location Name Type Description

A1 VDDIO Pad power Digital I/O power, 3.3V

A2 nCS[4] O Chip select out

A3 nCS[1] O Chip select out

A4 N/C O

A5 N/C O

A6 DD[1] O LCD serial display data

A7 M O LCD AC bias drive

A8 VDDIO Pad power Digital I/O power, 3.3V

A9 D[0] I/O Data I/O

A10 D[2] I/O Data I/O

A11 A[3] O System byte address

A12 VDDIO Pad power Digital I/O power, 3.3V

A13 A[6] O System byte address

A14 MOSCOUT O Main oscillator out

A15 VDDOSC Oscillator

power Oscillator power in, 2.5V

A16 VSSIO Pad ground I/O ground

B1 nCS[5] O Chip select out

B2 VDDIO Pad power I/O ground

B3 nCS[3] O Chip select out

B4 nMOE O ROM, expansion OP enable

B5 VDDIO Pad power Digital I/O power, 3.3V

B6 N/C O

Table U. 256-Ball PBGA Ball Listing (Continued)

Ball Location Name Type Description

EP7309

High-Performance, Low-Power System on Chip

B7 DD[2] O LCD serial display data

B8 CL[1] O LCD line clock

B9 VDDCORE Core power Digital core power, 2.5V

B10 D[1] I/O Data I/O

B11 A[2] O System byte address

B12 A[4] O System byte address

B13 A[5] O System byte address

B14 WAKEUP I System wake up input

B15 VDDIO Pad power Digital I/O power, 3.3V

B16 nURESET I User reset input

C1 VDDIO Pad power Digital I/O power, 3.3V

C2 EXPCLK I Expansion clock input

C3 VSSIO Pad ground I/O ground

C4 VDDIO Pad power Digital I/O power, 3.3V

C5 VSSIO Pad ground I/O ground

C6 VSSIO Pad ground I/O ground

C7 VSSIO Pad ground I/O ground

C8 VDDIO Pad power Digital I/O power, 3.3V

C9 VSSIO Pad ground I/O ground

C10 VSSIO Pad ground I/O ground

C11 VSSIO Pad ground I/O ground

C12 VDDIO Pad power Digital I/O power, 3.3V

C13 VSSIO Pad ground I/O ground

C14 VSSIO Pad ground I/O ground

C15 nPOR I Power-on reset input

C16 nEXTPWR I External power supply sense input

D1 WRITE O Transfer direction

D2 EXPRDY I Expansion port ready input

D3 VSSIO Pad ground I/O ground

D4 VDDIO Pad power Digital I/O power, 3.3V

D5 nCS[2] O Chip select out

D6 nMWE O ROM, expansion write enable

D7 N/C O

D8 CL[2] O LCD pixel clock out

D9 VSSRTC Core ground Real time clock ground

D10 D[4] I/O Data I/O

D11 nPWRFL I Power fail sense input

D12 MOSCIN I Main oscillator input

D13 VDDIO Pad power Digital I/O power, 3.3V

D14 VSSIO Pad ground I/O ground

D15 D[7] I/O Data I/O

D16 D[8] I/O Data I/O

E1 RXD[2] I UART 2 receive data input

E2 PB[7] I GPIO port B

E3 TDI I JTAG data input

E4 WORD O Word access select output

E5 VSSIO Pad ground I/O ground

E6 nCS[0] O Chip select out

Table U. 256-Ball PBGA Ball Listing (Continued)

Ball Location Name Type Description

E7 N/C O

E8 FRM O LCD frame synchronization pulse

E9 A[0] O System byte address

E10 D[5] I/O Data I/O

E11 VSSOSC Oscillator

ground PLL ground

E12 VSSIO Pad ground I/O ground

E13 nMEDCHG/nBROM I Media change interrupt input / internal

rom boot enable

E14 VDDIO Pad power Digital I/O power, 3.3V

E15 D[9] I/O Data I/O

E16 D[10] I/O Data I/O

F1 PB[5] I GPIO port B

F2 PB[3] I GPIO port B

F3 VSSIO Pad ground I/O ground

F4 TXD[2] O UART 2 transmit data output

F5 RUN/CLKEN O Run output / clock enable output

F6 VSSIO Pad ground I/O ground

F7 N/C O

F8 DD[3] O LCD serial display data

F9 A[1] O System byte address

F10 D[6] I/O Data I/O

F11 VSSRTC RTC ground Real time clock ground

F12 BATOK I Battery ok input

F13 nBATCHG I Battery changed sense input

F14 VSSIO Pad ground I/O ground

F15 D[11] I/O Data I/O

F16 VDDIO Pad power Digital I/O power, 3.3V

G1 PB[1]/PRDY[2] I GPIO port B / CL-PS6700 interface

signal

G2 VDDIO Pad power Digital I/O power, 3.3V

G3 TDO O JTAG data out

G4 PB[4] I GPIO port B

G5 PB[6] I GPIO port B

G6 VSSRTC Core ground Real time clock ground

G7 VSSRTC RTC ground Real time clock ground

G8 DD[0] O LCD serial display data

G9 D[3] I/O Data I/O

G10 VSSRTC RTC ground Real time clock ground

G11 A[7] O System byte address

G12 A[8] O System byte address

G13 A[9] O System byte address

G14 VSSIO Pad ground I/O ground

G15 D[12] I/O Data I/O

G16 D[13] I/O Data I/O

H1 PA[7] I GPIO port A

H2 PA[5] I GPIO port A

H3 VSSIO Pad ground I/O ground

H4 PA[4] I GPIO port A

H5 PA[6] I GPIO port A

Table U. 256-Ball PBGA Ball Listing (Continued)

Ball Location Name Type Description

EP7309

High-Performance, Low-Power System on Chip

H6 PB[0]/PRDY[1] I GPIO port B / CL-PS6700 interface

signal

H7 PB[2] I GPIO port B

H8 VSSRTC RTC ground Real time clock ground

H9 VSSRTC RTC ground Real time clock ground

H10 A[10] O System byte address

H11 A[11] O System byte address

H12 A[12] O System byte address

H13 A[13] O System byte address

H14 VSSIO Pad ground I/O ground

H15 D[14] I/O Data I/O

H16 D[15] I/O Data I/O

J1 PA[3] I GPIO port A

J2 PA[1] I GPIO port A

J3 VSSIO Pad ground I/O ground

J4 PA[2] I GPIO port A

J5 PA[0] I GPIO port A

J6 TXD[1] O UART 1 transmit data out

J7 CTS I UART 1 clear to send input

J8 VSSRTC RTC ground Real time clock ground

J9 VSSRTC RTC ground Real time clock ground

J10 A[17] O System byte address

J11 A[16] O System byte address

J12 A[15] O System byte address

J13 A[14] O System byte address

J14 nTRST I JTAG async reset input

J15 D[16] I/O Data I/O

J16 D[17] I/O Data I/O

K1 LEDDRV O IR LED drivet

K2 PHDIN I Photodiode input

K3 VSSIO Pad ground I/O ground

K4 DCD I UART 1 data carrier detect

K5 nTEST[1] I Test mode select input

K6 EINT[3] I External interrupt

K7 VSSRTC RTC ground Real time clock ground

K8 ADCIN I SSI1 ADC serial input

K9 COL[4] O Keyboard scanner column drive

K10 TCLK I JTAG clock

K11 D[20] I/O Data I/O

K12 D[19] I/O Data I/O

K13 D[18] I/O Data I/O

K14 VSSIO Pad ground I/O ground

K15 VDDIO Pad power Digital I/O power, 3.3V

K16 VDDIO Pad power Digital I/O power, 3.3V

L1 RXD[1] I UART 1 receive data input

L2 DSR I UART 1 data set ready input

L3 VDDIO Pad power Digital I/O power, 3.3V

L4 nEINT[1] I External interrupt input

L5 PE[2]/CLKSEL I GPIO port E / clock input mode select

Table U. 256-Ball PBGA Ball Listing (Continued)

Ball Location Name Type Description

L6 VSSRTC RTC ground Real time clock ground

L7 PD[0]/LEDFLSH I/O GPIO port D / LED blinker output

L8 VSSRTC Core ground Real time clock ground

L9 COL[6] O Keyboard scanner column drive

L10 D[31] I/O Data I/O

L11 VSSRTC RTC ground Real time clock ground

L12 A[22] O System byte address

L13 A[21] O System byte address

L14 VSSIO Pad ground I/O ground

L15 A[18] O System byte address

L16 A[19] O System byte address

M1 nTEST[0] I Test mode select input

M2 nEINT[2] I External interrupt input

M3 VDDIO Pad power Digital I/O power, 3.3V

M4 PE[0]/BOOTSEL[0] I GPIO port E / Boot mode select

M5 TMS I JTAG mode select

M6 VDDIO Pad power Digital I/O power, 3.3V

M7 SSITXFR I/O DAI/CODEC/SSI2 frame sync

M8 DRIVE[1] I/O PWM drive output

M9 FB[0] I PWM feedback input

M10 COL[0] O Keyboard scanner column drive

M11 D[27] I/O Data I/O

M12 VSSIO Pad ground I/O ground

M13 A[23] O System byte address

M14 VDDIO Pad power Digital I/O power, 3.3V

M15 A[20] O System byte address

M16 D[21] I/O Data I/O

N1 nEXTFIQ I External fast interrupt input

N2 PE[1]/BOOTSEL[1] I GPIO port E / boot mode select

N3 VSSIO Pad ground I/O ground

N4 VDDIO Pad power Digital I/O power, 3.3V

N5 PD[5] I/O GPIO port D

N6 PD[2] I/O GPIO port D

N7 SSIRXDA I/O DAI/CODEC/SSI2 serial data input

N8 ADCCLK O SSI1 ADC serial clock

N9 SMPCLK O SSI1 ADC sample clock

N10 COL[2] O Keyboard scanner column drive

N11 D[29] I/O Data I/O

N12 D[26] I/O Data I/O

N13 HALFWORD O Halfword access select output

N14 VSSIO Pad ground I/O ground

N15 D[22] I/O Data I/O

N16 D[23] I/O Data I/O

P1 VSSRTC RTC ground Real time clock ground

P2 RTCOUT O Real time clock oscillator output

P3 VSSIO Pad ground I/O ground

P4 VSSIO Pad ground I/O ground

P5 VDDIO Pad power Digital I/O power, 3.3V

Table U. 256-Ball PBGA Ball Listing (Continued)

Ball Location Name Type Description

EP7309

High-Performance, Low-Power System on Chip

P6 VSSIO Pad ground I/O ground

P7 VSSIO Pad ground I/O ground

P8 VDDIO Pad power Digital I/O power, 3.3V

P9 VSSIO Pad ground I/O ground

P10 VDDIO Pad power Digital I/O power, 3.3V

P11 VSSIO Pad ground I/O ground

P12 VSSIO Pad ground I/O ground

P13 VDDIO Pad power Digital I/O power

P14 VSSIO Pad ground I/O ground

P15 D[24] I/O Data I/O

P16 VDDIO Pad power Digital I/O power, 3.3V

R1 RTCIN I/O Real time clock oscillator input

R2 VDDIO Pad power Digital I/O power, 3.3V

R3 PD[4] I/O GPIO port D

R4 PD[1] I/O GPIO port D

R5 SSITXDA O DAI/CODEC/SSI2 serial data output

R6 nADCCS O SSI1 ADC chip select

R7 VDDIO Pad power Digital I/O power, 3.3V

R8 ADCOUT O SSI1 ADC serial data output

R9 COL[7] O Keyboard scanner column drive

R10 COL[3] O Keyboard scanner column drive

R11 COL[1] O Keyboard scanner column drive

R12 D[30] I/O Data I/O

R13 A[27] O System byte address

R14 A[25] O System byte address

R15 VDDIO Pad power Digital I/O power, 3.3V

R16 A[24] O System byte address

T1 VDDRTC RTC power Real time clock power, 2.5V

T2 PD[7] I/O GPIO port D

T3 PD[6] I/O GPIO port D

T4 PD[3] I/O GPIO port D

T5 SSICLK I/O DAI/CODEC/SSI2 serial clock

T6 SSIRXFR – DAI/CODEC/SSI2 frame sync

T7 VDDCORE Core power Core power, 2.5V

T8 DRIVE[0] I/O PWM drive output

T9 FB[1] I PWM feedback input

T10 COL[5] O Keyboard scanner column drive

T11 VDDIO Pad power Digital I/O power, 3.3V

T12 BUZ O Buzzer drive output

T13 D[28] I/O Data I/O

T14 A[26] O System byte address

T15 D[25] I/O Data I/O

T16 VSSIO Pad ground I/O ground

Table U. 256-Ball PBGA Ball Listing (Continued)

Ball Location Name Type Description

EP7309

High-Performance, Low-Power System on Chip

JTAG Boundary Scan Signal Ordering

Table V. JTAG Boundary Scan Signal Ordering

LQFP

Pin No.

TFBGA

Ball

PBGA

Ball Signal Type Position

1B3B1 nCS[5] O 1

4 A2 C2 EXPCLK I/O 3

5B1E4 WORD O 6

6E3D1 WRITE O 8

7 C1 F5 RUN/CLKEN O 10

8 C2 D2 EXPRDY I 13

9E2F4 TXD2 O 14

10 D2 E1 RXD2 I 16

13 F3 E2 PB[7] I/O 17

14 D1 G5 PB[6] I/O 20

15 F2 F1 PB[5] I/O 23

16 G3 G4 PB[4] I/O 26

17 E1 F2 PB[3] I/O 29

18 F1 H7 PB[2] I/O 32

19 G2 G1 PB[1]/PRDY2 I/O 35

20 G1 H6 PB[0]/PRDY1 I/O 38

23 H3 H1 PA[7] I/O 41

24 H1 H5 PA[6] I/O 44

25 J3 H2 PA[5] I/O 47

26 J2 H4 PA[4] I/O 50

27 J1 J1 PA[3] I/O 53

28 L3 J4 PA[2] I/O 56

29 K2 J2 PA[1] I/O 59

30 K1 J5 PA[0] I/O 62

31 M3 K1 LEDDRV O 65

32 L2 J6 TXD1 O 67

34 L1 K2 PHDIN I 69

35 N3 J7 CTS I 70

36 M2 L1 RXD1 I 71

37 M1 K4 DCD I 72

38 P3 L2 DSR I 73

39 N1 K5 nTEST1 I 74

40 N2 M1 nTEST0 I 75

41 R3 K6 EINT3 I 76

42 P1 M2 nEINT2 I 77

43 P2 L4 nEINT1 I 78

EP7309

High-Performance, Low-Power System on Chip

44 T3 N1 nEXTFIQ I 79

45 R1 L5 PE[2]/CLKSEL I/O 80

46 R2 N2 PE[1]/BOOTSEL1 I/O 83

47 T1 M4 PE[0]/BOOTSEL0 I/O 86

53 T2 T2 PD[7] I/O 89

54 V4 T3 PD[6] I/O 92

55 W4 N5 PD[5] I/O 95

56 Y4 R3 PD[4] I/O 98

59 V5 T4 PD[3] I/O 101

60 W5 N6 PD[2] I/O 104

61 Y5 R4 PD[1] I/O 107

62 V6 L7 PD[0]/LEDFLSH O 110

68 W6 T6 SSIRXFR I/O 122

69 Y6 K8 ADCIN I 125

70 W8 R6 nADCCS O 126

75 Y8 M8 DRIVE1 I/O 128

76 V9 T8 DRIVE0 I/O 131

77 W10 N8 ADCCLK O 134

78 Y10 R8 ADCOUT O 136

79 V11 N9 SMPCLK O 138

80 W11 T9 FB1 I 140

82 Y11 M9 FB0 I 141

83 Y12 R9 COL7 O 142

84 W12 L9 COL6 O 144

85 V12 T10 COL5 O 146

86 Y13 K9 COL4 O 148

87 W13 R10 COL3 O 150

88 V13 N10 COL2 O 152

91 Y14 R11 COL1 O 154

92 W14 M10 COL0 O 156

93 A1 T12 BUZ O 158

94 V14 L10 D[31] I/O 160

95 Y15 R12 D[30] I/O 163

96 W15 N11 D[29] I/O 166

97 V15 T13 D[28] I/O 169

99 Y16 R13 A[27] Out 172

100 W16 M11 D[27] I/O 174

101 V16 T14 A[26] O 177

Table V. JTAG Boundary Scan Signal Ordering (Continued)

LQFP

Pin No.

TFBGA

Ball

PBGA

Ball Signal Type Position

EP7309

High-Performance, Low-Power System on Chip

102 Y17 N12 D[26] I/O 179

103 W17 R14 A[25] O 182

104 Y18 T15 D[25] I/O 184

105 V17 N13 HALFWORD O 187

106 W18 R16 A[24] O 189

109 Y19 P15 D[24] I/O 191

110 W20 M13 A[23] O 194

111 U18 N16 D[23] I/O 196

112 V20 L12 A[22] O 199

113 U19 N15 D[22] I/O 201

114 U20 L13 A[21] O 204

115 T19 M16 D[21] I/O 206

117 T20 M15 A[20] O 209

118 R19 K11 D[20] I/O 211

119 R20 L16 A[19] O 214

120 T18 K12 D[19] I/O 216

121 P19 L15 A[18] O 219

122 P20 K13 D[18] I/O 221

126 R18 J10 A[17] O 224

127 N19 J16 D[17] I/O 226

128 N20 J11 A[16] O 229

129 P18 J15 D[16] I/O 231

130 M19 J12 A[15] O 234

131 N18 H16 D[15] I/O 236

132 L20 J13 A[14] O 239

133 L19 H15 D[14] I/O 241

134 M18 H13 A[13] O 244

135 K20 G16 D[13] I/O 246

136 K19 H12 A[12] O 249

137 K18 G15 D[12] I/O 251

138 J20 H11 A[11] O 254

141 J19 F15 D[11] I/O 256

142 H20 H10 A[10] O 259

143 H19 E16 D[10] I/O 261

144 J18 G13 A[9] O 264

145 K3 E15 D[9] I/O 266

146 Y3 G12 A[8] O 269

147 G20 D16 D[8] I/O 271

Table V. JTAG Boundary Scan Signal Ordering (Continued)

LQFP

Pin No.

TFBGA

Ball

PBGA

Ball Signal Type Position

EP7309

High-Performance, Low-Power System on Chip

148 H18 G11 A[7] O 274

150 F20 D15 D[7] I/O 276

151 G19 F13 nBATCHG I 279

152 E20 C16 nEXTPWR I 280

153 F19 F12 BATOK I 281

154 G18 C15 nPOR I 282

155 D20 E13 nMEDCHG/nBROM I 283

156 F18 B16 nURESET I 284

161 D19 B14 WAKEUP I 285

162 E19 D11 nPWRFL I 286

163 C19 A13 A[6] O 287

164 C20 F10 D[6] I/O 289

165 E18 B13 A[5] O 292

166 B20 E10 D[5] I/O 294

169 B16 B12 A[4] O 297

170 A16 D10 D[4] I/O 299

171 C15 A11 A[3] O 302

172 B15 G9 D[3] I/O 304

173 A15 B11 A[2] O 307

175 C14 A10 D[2] I/O 309

176 B14 F9 A[1] O 312

177 A14 B10 D[1] I/O 314

178 C13 E9 A[0] O 317

179 B13 A9 D[0] I/O 319

184 A13 D8 CL2 O 322

185 C12 B8 CL1 O 324

186 B12 E8 FRM O 326

187 A12 A7 M O 328

188 C11 F8 DD[3] I/O 330

189 B11 B7 DD[2] I/O 333

191 B10 A6 DD[1] I/O 336

192 A10 G8 DD[0] I/O 339

193 A9 B6 N/C O 342

194 B9 D7 N/C O 344

195 C9 A5 N/C I/O 346

196 A8 E7 N/C I/O 349

199 B8 F7 N/C I/O 352

200 C8 A4 N/C I/O 355

Table V. JTAG Boundary Scan Signal Ordering (Continued)

LQFP

Pin No.

TFBGA

Ball

PBGA

Ball Signal Type Position

EP7309

High-Performance, Low-Power System on Chip

1) See EP7309 Users’ Manual for pin naming / functionality.

2) For each pad, the JTAG connection ordering is input,

output, then enable as applicable.

201 A7 D6 nMWE O 358

202 B7 B4 nMOE O 360

204 C7 E6 nCS[0] O 362

205 A6 A3 nCS[1] O 364

206 B6 D5 nCS[2] O 366

207 C6 B3 nCS[3] O 368

208 A5 A2 nCS[4] O 370

Table V. JTAG Boundary Scan Signal Ordering (Continued)

LQFP

Pin No.

TFBGA

Ball

PBGA

Ball Signal Type Position

EP7309

High-Performance, Low-Power System on Chip

CONVENTIONS

This section presents acronyms, abbreviations, units of

measurement, and conventions used in this data sheet.

Acronyms and Abbreviations

Table W lists abbreviations and acronyms used in this

data sheet.

Units of Measurement

Table W. Acronyms and Abbreviations

Acronym/

Abbreviation Definition

A/D analog-to-digital

ADC analog-to-digital converter

CODEC coder / decoder

D/A digital-to-analog

DMA direct-memory access

EPB embedded peripheral bus

FCS frame check sequence

FIFO first in / first out

FIQ fast interrupt request

GPIO general purpose I/O

ICT in circuit test

IR infrared

IRQ standard interrupt request

IrDA Infrared Data Association

JTAG Joint Test Action Group

LCD liquid crystal display

LED light-emitting diode

LQFP low profile quad flat pack

LSB least significant bit

MIPS millions of instructions per second

MMU memory management unit

MSB most significant bit

PBGA plastic ball grid array

PCB printed circuit board

PDA personal digital assistant

PLL phase locked loop

p/u pull-up resistor

RISC reduced instruction set computer

RTC Real-Time Clock

SIR slow (9600–115.2 kbps) infrared

SRAM static random access memory

SSI synchronous serial interface

TAP test access port

TLB translation lookaside buffer

UART universal asynchronous receiver

Table X. Unit of Measurement

Symbol Unit of Measure

°Cdegree Celsius

fs sample frequency

Hz hertz (cycle per second)

kbps kilobits per second

KB kilobyte (1,024 bytes)

kHz kilohertz

kΩkilohm

Mbps megabits (1,048,576 bits) per second

MB megabyte (1,048,576 bytes)

MBps megabytes per second

MHz megahertz (1,000 kilohertz)

µA microampere

µFmicrofarad

µWmicrowatt

µs microsecond (1,000 nanoseconds)

mA milliampere

mW milliwatt

ms millisecond (1,000 microseconds)

ns nanosecond

Vvolt

Wwatt

Table W. Acronyms and Abbreviations (Continued)

Acronym/

Abbreviation Definition

EP7309

High-Performance, Low-Power System on Chip

General Conventions

Hexadecimal numbers are presented with all letters in

uppercase and a lowercase “h” appended or with a 0x at

the beginning. For example, 0x14 and 03CAh are

hexadecimal numbers. Binary numbers are enclosed in

single quotation marks when in text (for example, ‘11’

designates a binary number). Numbers not indicated by

an “h”, 0x or quotation marks are decimal.

Registers are referred to by acronym, with bits listed in

brackets separated by a colon (:) (for example,

CODR[7:0]), and are described in the EP7309 User’s

Manual. The use of “TBD” indicates values that are “to

be determined,” “n/a” designates “not available,” and

“n/c” indicates a pin that is a “no connect.”

Pin Description Conventions

Abbreviations used for signal directions are listed in

Table Y.

Table Y. Pin Description Conventions

Abbreviation Direction

I Input

OOutput

I/O Input or Output

EP7309

High-Performance, Low-Power System on Chip

ORDERING INFORMATION

The order number for the device is:

Note: Contact Cirrus Logic for up-to-date information on revisions. Go to the Cirrus Logic Internet site at

http://cirrus.com/corporate/contacts to find contact information for your local sales representative.

EP7309 — CV — C

Product Line:

Embedded Processor

Part Number

Temperature Range:

Package Type:

V = Low Profile Quad Flat Pack

B = Plastic Ball Grid Array (17 mm x 17 mm)

Revision †

R = Reduced Ball Grid Array (13 mm x 13 mm)

C = Commercial

E = Extended Operating Version

I = Industrial Operating Version

• Notes •