BAP64-02.115 - NXP SEMICONDUCTORS

BAP64-02

Silicon PIN diode

Rev. 11 — 20 March 2019 Product data sheet

1 Product profile

1.1 General description

Planar PIN diode in a SOD523 ultra small plastic SMD package.

1.2 Features and benefits

•High voltage, current controlled

•RF resistor for RF attenuators and switches

•Low diode capacitance

•Low diode forward resistance

•Very low series inductance

•For applications up to 6 GHz

•AEC-Q101 qualified

1.3 Applications

•RF attenuators and switches

2 Pinning information

Table 1. Discrete pinning

Pin Description Simplified outline Symbol

1 cathode [1]

2 anode

sym006

[1] The marking bar indicates the cathode.

3 Ordering information

Table 2. Ordering information

PackageType number

Name Description Version

BAP64-02 - plastic surface-mounted package; 2 leads SOD523

NXP Semiconductors BAP64-02

Silicon PIN diode

Product data sheet Rev. 11 — 20 March 2019

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4 Marking

Table 3. Marking

Type number Marking code

BAP64-02 S

5 Limiting values

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VRreverse voltage - 175 V

IFforward current - 100 mA

Ptot total power dissipation Tsp = 90 °C - 715 mW

Tstg storage temperature -65 +150 °C

Tjjunction temperature -65 +150 °C

6 Thermal characteristics

Table 5. Thermal characteristics

Symbol Parameter Conditions Typ Unit

Rth(j-sp) thermal resistance from junction

to solder point

85 K/W

7 Characteristics

Table 6. Characteristics

Tj = 25 °C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VFforward voltage IF = 50 mA - 0.95 1.1 V

VR = 60 V - - 10 μAIRreverse current

VR = 20 V - - 1 μA

see Figure 1; f = 1 MHz;

VR = 0 V - 0.48 - pF

VR = 1 V - 0.35 - pF

Cddiode capacitance

VR = 20 V - 0.23 0.35 pF

see Figure 2; f = 100 MHz; [1]

IF = 0.5 mA - 20 40 Ω

IF = 1 mA - 10 20 Ω

IF = 10 mA - 2.0 3.8 Ω

rDdiode forward resistance

IF = 100 mA - 0.7 1.35 Ω

NXP Semiconductors BAP64-02

Silicon PIN diode

Product data sheet Rev. 11 — 20 March 2019

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Symbol Parameter Conditions Min Typ Max Unit

τLcharge carrier life time when switched from IF = 10 mA to IR =

6 mA; RL = 100 Ω; measured at IR = 3

- 1.55 - μs

LSseries inductance - 0.6 - nH

[1] Guaranteed on AQL basis: inspection level S4, AQL 1.0.

0 20

500

200

100

400

300

VR(V)

(fF)

128 16

mgl857

f = 1 MHz; Tj = 25 °C.

Figure 1. Diode capacitance as a function of reverse

voltage; typical values

102

10-1

mgl856

10-1 1IF(mA)

( )

10 102

f = 100 MHz; Tj = 25 °C.

Figure 2. Forward resistance as a function of forward

current; typical values

NXP Semiconductors BAP64-02

Silicon PIN diode

Product data sheet Rev. 11 — 20 March 2019

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aaa-016189

0 1 2 3 4 5 6

-30

-25

-20

-15

-10

-5

f (GHz)

ISLISL

(dB)(dB)

Tamb = 25 °C

Diode zero biased and inserted in series with a 50 Ω

stripline circuit

Figure 3. Isolation of the diode as a function of

frequency; typical values

aaa-016195

0 1 2 3 4 5 6

-5

-4

-3

-2

-1

f (GHz)

Lins

(dB)(dB)

(1)(1)

(2)(2)

(3)(3)

(4)(4)

Tamb = 25 °C

1. IF = 100 mA

2. IF = 10 mA

3. IF = 1 mA

4. IF = 0.5 mA

Diode inserted in series with a 50 Ω stripline circuit and

biased via the analyzer Tee network

Figure 4. Insertion loss of the diode as a function of

frequency; typical values

NXP Semiconductors BAP64-02

Silicon PIN diode

Product data sheet Rev. 11 — 20 March 2019

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8 Package outline

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOD523 SC-79 02-12-13

06-03-16

Plastic surface-mounted package; 2 leads SOD523

0 0.5 1 mm

scale

1 2

Ebp

vMA

UNIT bpc D E v

A HE

DIMENSIONS (mm are the original dimensions)

Note

1. The marking bar indicates the cathode.

(1)

0.34

0.26

0.17

0.11 0.1

0.85

0.75

1.25

1.15

0.65

0.58

1.65

1.55

Figure 5. Package outline SOD523

9 Abbreviations

Table 7. Abbreviations

Acronym Description

AQL acceptable quality level

PIN P-type, intrinsic, N-type

SMD surface mounted device

S4 special inspection level 4

10 Revision history

Table 8. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BAP64-02 v.11 20190311 Product data sheet - BAP64-02 v.10

Modifications: •changed VR condition of IR from 175 V to 60 V

BAP64-02 v.10 20150512 Product data sheet - BAP64-02 v.9

Modifications: •AEC-Q101 qualified

BAP64-02 v.9 20141215 Product data sheet - BAP64-02 v.8

NXP Semiconductors BAP64-02

Silicon PIN diode

Product data sheet Rev. 11 — 20 March 2019

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Document ID Release date Data sheet status Change notice Supersedes

BAP64-02 v.8 20140428 Product data sheet - BAP64-02 v.7

BAP64-02 v.7 20140211 Product data sheet - BAP64-02_N v.6

BAP64-02_N v.6 20080109 Product data sheet - BAP64-02 v.5

BAP64-02 v.5 (9397 750

06912)

20000323 Product specification - BAP64-02 v.4

BAP64-02 v.4 (9397 750

06418)

19990921 Preliminary specification - BAP64-02_N v.3

BAP64-02_N v.3 (9397

750 06086)

19990616 Preliminary specification - BAP64-02 v.2

BAP64-02 v.2 (9397 750

05556)

19990510 Objective specification - BAP64-02_N v.1

BAP64-02_N v.1 (9397

750 05492)

19981204 Objective specification - -

NXP Semiconductors BAP64-02

Silicon PIN diode

Product data sheet Rev. 11 — 20 March 2019

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11 Legal information

11.1 Data sheet status

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product

development.

Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple

devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

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Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those

given in the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

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malfunction of an NXP Semiconductors product can reasonably be expected

NXP Semiconductors BAP64-02

Silicon PIN diode

Product data sheet Rev. 11 — 20 March 2019

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to result in personal injury, death or severe property or environmental

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NXP Semiconductors BAP64-02

Silicon PIN diode

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section 'Legal information'.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 20 March 2019

Document identifier: BAP64-02

Contents

1 Product profile .................................................... 1

1.1 General description ............................................1

1.2 Features and benefits ........................................1

1.3 Applications ........................................................1

2 Pinning information ............................................ 1

3 Ordering information .......................................... 1

4 Marking .................................................................2

5 Limiting values ....................................................2

6 Thermal characteristics ......................................2

7 Characteristics .................................................... 2

8 Package outline ...................................................5

9 Abbreviations ...................................................... 5

10 Revision history .................................................. 5

11 Legal information ................................................ 7