PACKAGE INFORMATION Page Index DBS DIP HDIP LQFP PLCC QFP SDIP SIL SO SSOP SQFP VSO Soldering nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DBS (DIL-bent-SIL) DBS13P plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6 DBS17P plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1 DIP (dual in-line package) DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1; SOT97DE DIP14 plastic dual in-line package; 14 leads (300 mil) SOT27-1 DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1; SOT38GG6 DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4 DIP18 plastic dual in-line package; 18 leads (300 mil) SOT102-1; SOT102 DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1 HDIP (heat-dissipating dual in-line package) HDIP18 plastic heat-dissipating dual in-line package; 18 leads SOT398-1 LQFP48 plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-1 LQFP48 plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-2 LQFP64 plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm SOT314-2 LQFP80 plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm SOT315-1 LQFP PLCC (plastic leaded chip carrier) PLCC68 plastic leaded chip carrier; 68 leads SOT188-2 PLCC84 plastic leaded chip carrier; 84 leads SOT189-2 QFP (quad flat package) QFP44 plastic quad flat package; 44 leads (lead length 2.35 mm); body 14 x 14 x 2.2 mm SOT205-1 QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm SOT307-2; SOT307 QFP64 plastic quad flat package; 64 leads (lead length 1.95 mm); body 14 x 20 x 2.7 mm; high stand-off height SOT319-1 QFP64 plastic quad flat package; 64 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm SOT319-2 QFP64 plastic quad flat package; 64 leads (lead length 1.6 mm); body 14 x 14 x 2.7 mm SOT393-1 QFP80 plastic quad flat package; 80 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm SOT318-2 QFP128 plastic quad flat package; 128 leads (lead length 1.95 mm); body 28 x 28 x 3.4 mm; high stand-off height SOT320-1 1996 Jul 23 2 PAGE Philips Semiconductors Package information NAME Package outlines DESCRIPTION VERSION SDIP (shrink dual in-line package) SDIP32 plastic shrink dual in-line package; 32 leads (400 mil) SOT232-1 SDIP42 plastic shrink dual in-line package; 42 leads (600 mil) SOT270-1; SOT270AG SIL (single in-line) SIL9MP plastic single in-line medium power package; 9 leads SOT142-1 SIL9MPF plastic single in-line medium power package with fin; 9 leads SOT110-1 SO (small outline) SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1; SOT96AG SO8 plastic small outline package; 8 leads (straight); body width 3.9 mm SOT96-2 SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1; SOT162A SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1; SOT163A SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1; SOT137A SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1; SOT136A SO32 plastic small outline package; 32 leads; body width 7.5 mm SOT287-1 SSOP (shrink small outline package) SSOP28 plastic shrink small outline package; 28 leads; body width 5.3 mm SOT341-1 SQFP (shrink quad flat package) SQFP128 plastic shrink quad flat package; 128 leads (lead length 1.6 mm); body 14 x 20 x 2.8 mm SOT387-2 VSO (very small outline) VSO40 plastic very small outline package; 40 leads VSO40 plastic very small outline package; 40 leads; face down SOT158-2 VSO56 plastic very small outline package; 56 leads SOT190-1; SOT190 1996 Jul 23 3 SOT158-1 PAGE Philips Semiconductors Package information Package outlines DBS DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L3 L Q c 1 v M 13 e1 Z e bp e2 m w M 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 bp c D (1) d Dh E (1) e e1 e2 Eh j L L3 m Q v w x Z (1) mm 17.0 15.5 4.6 4.2 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 12.2 11.8 3.4 1.7 5.08 6 3.4 3.1 12.4 11.0 2.4 1.6 4.3 2.1 1.8 0.8 0.25 0.03 2.00 1.45 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-03-11 97-12-16 SOT141-6 1996 Jul 23 EUROPEAN PROJECTION 4 Philips Semiconductors Package information Package outlines DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L3 L Q c 1 v M 17 e1 Z bp e e2 m w M 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 bp c D (1) d Dh E (1) e mm 17.0 15.5 4.6 4.2 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 12.2 11.8 2.54 e1 e2 1.27 5.08 Eh j L L3 m Q v w x Z (1) 6 3.4 3.1 12.4 11.0 2.4 1.6 4.3 2.1 1.8 0.8 0.4 0.03 2.00 1.45 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-03-11 97-12-16 SOT243-1 1996 Jul 23 EUROPEAN PROJECTION 5 Philips Semiconductors Package information Package outlines DIP DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.020 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT97-1 050G01 MO-001AN 1996 Jul 23 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-02-04 6 Philips Semiconductors Package information Package outlines DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b MH 8 14 pin 1 index E 1 7 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.13 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 2.2 inches 0.17 0.020 0.13 0.068 0.044 0.021 0.015 0.014 0.009 0.77 0.73 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT27-1 050G04 MO-001AA 1996 Jul 23 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-03-11 7 Philips Semiconductors Package information Package outlines DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 2.2 inches 0.19 0.020 0.15 0.055 0.045 0.021 0.015 0.013 0.009 0.86 0.84 0.26 0.24 0.10 0.30 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT38-1 050G09 MO-001AE 1996 Jul 23 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-10-02 95-01-19 8 Philips Semiconductors Package information Package outlines DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.30 0.53 0.38 1.25 0.85 0.36 0.23 19.50 18.55 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 0.76 inches 0.17 0.020 0.13 0.068 0.051 0.021 0.015 0.049 0.033 0.014 0.009 0.77 0.73 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.030 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-01-14 SOT38-4 1996 Jul 23 EUROPEAN PROJECTION 9 Philips Semiconductors Package information Package outlines DIP18: plastic dual in-line package; 18 leads (300 mil) SOT102-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 10 18 pin 1 index E 1 9 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 1.40 1.14 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 0.85 inches 0.19 0.020 0.15 0.055 0.044 0.021 0.015 0.055 0.044 0.013 0.009 0.86 0.84 0.26 0.24 0.10 0.30 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.033 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 93-10-14 95-01-23 SOT102-1 1996 Jul 23 EUROPEAN PROJECTION 10 Philips Semiconductors Package information Package outlines DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 11 20 pin 1 index E 1 10 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c mm 4.2 0.51 3.2 1.73 1.30 0.53 0.38 0.36 0.23 26.92 26.54 inches 0.17 0.020 0.13 0.068 0.051 0.021 0.015 0.014 0.009 1.060 1.045 D e e1 L ME MH w Z (1) max. 6.40 6.22 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 2.0 0.25 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.078 (1) E (1) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT146-1 1996 Jul 23 REFERENCES IEC JEDEC EIAJ SC603 11 EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-05-24 Philips Semiconductors Package information Package outlines HDIP HDIP18: plastic heat-dissipating dual in-line package; 18 leads SOT398-1 D seating plane ME A2 A A1 L e Z c w M b1 (e 1) b2 b 10 18 MH pin 1 index E 9 1 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.67 0.50 1.05 0.75 0.47 0.38 21.85 21.35 6.5 6.2 2.54 7.62 3.9 3.1 8.32 8.02 8.7 7.7 0.25 1.0 inches 0.19 0.02 0.15 0.06 0.04 0.03 0.02 0.04 0.03 0.02 0.01 0.87 0.84 0.26 0.24 0.10 0.30 0.15 0.12 0.33 0.32 0.34 0.30 0.01 0.04 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 94-04-13 95-01-25 SOT398-1 1996 Jul 23 EUROPEAN PROJECTION 12 Philips Semiconductors Package information Package outlines LQFP LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-1 c y X 36 25 A 37 24 ZE Q e E HE A A2 (A 3) A1 w M pin 1 index bp Lp L 13 48 1 detail X 12 ZD e v M A w M bp D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp Q v w y mm 1.70 0.20 0.04 1.50 1.30 0.25 0.26 0.14 0.18 0.12 7.1 6.9 7.1 6.9 0.5 9.3 8.7 9.3 8.7 1.0 0.7 0.3 0.66 0.56 0.2 0.15 0.1 Z D (1) Z E (1) 0.95 0.55 7 0o 0.95 0.55 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 93-03-23 94-02-04 SOT313-1 1996 Jul 23 EUROPEAN PROJECTION 13 o Philips Semiconductors Package information Package outlines LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-2 c y X 36 25 A 37 24 ZE e E HE A A2 (A 3) A1 w M pin 1 index bp Lp L 13 48 detail X 12 1 ZD e v M A w M bp D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 1.60 0.20 0.05 1.45 1.35 0.25 0.27 0.17 0.18 0.12 7.1 6.9 7.1 6.9 0.5 9.15 8.85 9.15 8.85 1.0 0.75 0.45 0.2 0.12 0.1 Z D (1) Z E (1) 0.95 0.55 7 0o 0.95 0.55 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 94-12-19 97-08-01 SOT313-2 1996 Jul 23 EUROPEAN PROJECTION 14 Philips Semiconductors Package information Package outlines LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm SOT314-2 c y X A 48 33 49 32 ZE e E HE A A2 (A 3) A1 wM bp pin 1 index 64 Lp L 17 detail X 16 1 ZD e v M A wM bp D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 1.60 0.20 0.05 1.45 1.35 0.25 0.27 0.17 0.18 0.12 10.1 9.9 10.1 9.9 0.5 HD HE 12.15 12.15 11.85 11.85 L Lp v w y 1.0 0.75 0.45 0.2 0.12 0.1 Z D (1) Z E (1) 1.45 1.05 7 0o 1.45 1.05 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-12-19 97-08-01 SOT314-2 1996 Jul 23 EUROPEAN PROJECTION 15 Philips Semiconductors Package information Package outlines LQFP80: plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm SOT315-1 c y X A 60 41 40 Z E 61 e E HE A A2 (A 3) A1 w M bp L pin 1 index 80 Lp 21 detail X 20 1 ZD e v M A w M bp D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 1.6 0.16 0.04 1.5 1.3 0.25 0.27 0.13 0.18 0.12 12.1 11.9 12.1 11.9 0.5 HD HE 14.15 14.15 13.85 13.85 L Lp v w y 1.0 0.75 0.30 0.2 0.15 0.1 Z D (1) Z E (1) 1.45 1.05 7 0o 1.45 1.05 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-12-19 97-07-15 SOT315-1 1996 Jul 23 EUROPEAN PROJECTION 16 Philips Semiconductors Package information Package outlines PLCC PLCC68: plastic leaded chip carrier; 68 leads SOT188-2 eD eE y X 60 A 44 43 Z E 61 bp b1 w M 68 1 HE E pin 1 index A e A4 A1 (A 3) 9 k1 27 Lp k detail X 10 26 e v M A ZD D B HD v M B 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A A1 min. A3 A4 max. bp b1 mm 4.57 4.19 0.51 0.25 3.30 0.53 0.33 0.81 0.66 0.180 inches 0.020 0.01 0.165 D (1) E (1) e eD eE HD HE k 24.33 24.33 23.62 23.62 25.27 25.27 1.22 1.27 24.13 24.13 22.61 22.61 25.02 25.02 1.07 k1 max. Lp v w y 0.51 1.44 1.02 0.18 0.18 0.10 Z D(1) Z E (1) max. max. 2.16 2.16 45 o 0.930 0.930 0.995 0.995 0.048 0.057 0.021 0.032 0.958 0.958 0.020 0.05 0.007 0.007 0.004 0.085 0.085 0.13 0.890 0.890 0.985 0.985 0.042 0.040 0.013 0.026 0.950 0.950 Note 1. Plastic or metal protrusions of 0.01 inches maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT188-2 112E10 MO-047AC 1996 Jul 23 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-03-11 17 Philips Semiconductors Package information Package outlines PLCC84: plastic leaded chip carrier; 84 leads SOT189-2 eD eE y X 74 A 54 53 Z E 75 bp b1 w M 84 1 HE E pin 1 index e A A4 A1 (A 3) 11 k1 33 Lp k detail X 12 32 e v M A ZD D B HD v M B 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A A1 min. A3 A4 max. bp b1 mm 4.57 4.19 0.51 0.25 3.30 0.53 0.33 0.81 0.66 0.180 inches 0.020 0.01 0.165 D (1) E (1) e eD eE HD HE k 29.41 29.41 28.70 28.70 30.35 30.35 1.22 1.27 29.21 29.21 27.69 27.69 30.10 30.10 1.07 k1 max. Lp v w y 0.51 1.44 1.02 0.18 0.18 0.10 Z D(1) Z E (1) max. max. 2.16 2.16 45 o 1.130 1.130 1.195 1.195 0.048 0.057 0.021 0.032 1.158 1.158 0.020 0.05 0.007 0.007 0.004 0.085 0.085 0.13 1.090 1.090 1.185 1.185 0.042 0.040 0.013 0.026 1.150 1.150 Note 1. Plastic or metal protrusions of 0.01 inches maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-03-11 SOT189-2 1996 Jul 23 EUROPEAN PROJECTION 18 Philips Semiconductors Package information Package outlines QFP QFP44: plastic quad flat package; 44 leads (lead length 2.35 mm); body 14 x 14 x 2.2 mm SOT205-1 c y X 33 A 23 34 22 ZE e E HE A A2 (A 3) A1 wM bp Lp pin 1 index 44 L 12 detail X 1 11 ZD e v M A wM bp D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 2.60 0.25 0.05 2.3 2.1 0.25 0.50 0.35 0.25 0.14 14.1 13.9 14.1 13.9 1 19.2 18.2 19.2 18.2 2.35 2.0 1.2 0.3 0.15 0.1 Z D (1) Z E (1) 2.4 1.8 2.4 1.8 o 7 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC SOT205-1 133E01A 1996 Jul 23 JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 97-08-01 19 Philips Semiconductors Package information Package outlines QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm SOT307-2 c y X A 33 23 34 22 ZE e E HE A A2 wM (A 3) A1 bp Lp pin 1 index L 12 44 1 detail X 11 wM bp e ZD v M A D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 2.10 0.25 0.05 1.85 1.65 0.25 0.40 0.20 0.25 0.14 10.1 9.9 10.1 9.9 0.8 12.9 12.3 12.9 12.3 1.3 0.95 0.55 0.15 0.15 0.1 Z D (1) Z E (1) 1.2 0.8 1.2 0.8 o 10 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-02-04 97-08-01 SOT307-2 1996 Jul 23 EUROPEAN PROJECTION 20 Philips Semiconductors Package information Package outlines QFP64: plastic quad flat package; 64 leads (lead length 1.95 mm); body 14 x 20 x 2.7 mm; high stand-off height SOT319-1 c y X 51 A 33 52 32 ZE e E HE A A2 (A 3) A1 wM Lp pin 1 index bp L 20 64 detail X 19 1 w M bp e ZD v M A D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 3.3 0.36 0.10 2.87 2.57 0.25 0.50 0.35 0.25 0.13 20.1 19.9 14.1 13.9 1 24.2 23.6 18.2 17.6 1.95 1.0 0.6 0.2 0.2 0.1 Z D (1) Z E (1) 1.2 0.8 1.2 0.8 o 7 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-02-04 97-08-01 SOT319-1 1996 Jul 23 EUROPEAN PROJECTION 21 Philips Semiconductors Package information Package outlines QFP64: plastic quad flat package; 64 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm SOT319-2 c y X 51 A 33 52 32 ZE e E HE A A2 (A 3) A1 wM pin 1 index Lp bp L 20 64 detail X 19 1 ZD w M bp e v M A D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 3.20 0.25 0.05 2.90 2.65 0.25 0.50 0.35 0.25 0.14 20.1 19.9 14.1 13.9 1 24.2 23.6 18.2 17.6 1.95 1.0 0.6 0.2 0.2 0.1 Z D (1) Z E (1) 1.2 0.8 1.2 0.8 o 7 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-02-04 97-08-01 SOT319-2 1996 Jul 23 EUROPEAN PROJECTION 22 Philips Semiconductors Package information Package outlines QFP64: plastic quad flat package; 64 leads (lead length 1.6 mm); body 14 x 14 x 2.7 mm SOT393-1 c y X A 48 33 49 32 ZE e E HE A A2 (A 3) A1 wM Lp bp pin 1 index L 17 64 detail X 16 1 w M bp e v M A ZD D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 3.00 0.25 0.10 2.75 2.55 0.25 0.45 0.30 0.23 0.13 14.1 13.9 14.1 13.9 0.8 HD HE L 17.45 17.45 1.60 16.95 16.95 Lp v w y 1.03 0.73 0.16 0.16 0.10 Z D (1) Z E (1) 1.2 0.8 1.2 0.8 o 7 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT393-1 1996 Jul 23 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 96-05-21 97-08-04 MS-022 23 Philips Semiconductors Package information Package outlines QFP80: plastic quad flat package; 80 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm SOT318-2 c y X 64 A 41 40 65 ZE e E HE A A2 (A 3) A1 wM pin 1 index Lp bp 80 L 25 detail X 24 1 wM bp e ZD v M A D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 3.2 0.25 0.05 2.90 2.65 0.25 0.45 0.30 0.25 0.14 20.1 19.9 14.1 13.9 0.8 24.2 23.6 18.2 17.6 1.95 1.0 0.6 0.2 0.2 0.1 Z D (1) Z E (1) 1.0 0.6 1.2 0.8 o 7 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-02-04 97-08-01 SOT318-2 1996 Jul 23 EUROPEAN PROJECTION 24 Philips Semiconductors Package information Package outlines QFP128: plastic quad flat package; 128 leads (lead length 1.95 mm); body 28 x 28 x 3.4 mm; high stand-off height SOT320-1 c y X A 96 65 97 64 ZE e E HE A A2 A1 (A 3) wM Lp bp L pin 1 index detail X 33 128 1 32 ZD wM bp e v M A D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 3.95 0.40 0.25 3.70 3.15 0.25 0.45 0.30 0.23 0.13 28.1 27.9 28.1 27.9 0.8 32.2 31.6 32.2 31.6 1.95 1.1 0.7 0.3 0.2 0.1 Z D (1) Z E(1) 1.8 1.4 1.8 1.4 o 8 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-02-04 97-08-01 SOT320-1 1996 Jul 23 EUROPEAN PROJECTION 25 Philips Semiconductors Package information Package outlines SDIP SDIP32: plastic shrink dual in-line package; 32 leads (400 mil) SOT232-1 ME seating plane D A2 A A1 L c e Z (e 1) w M b1 MH b 17 32 pin 1 index E 1 16 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.8 1.3 0.8 0.53 0.40 0.32 0.23 29.4 28.5 9.1 8.7 1.778 10.16 3.2 2.8 10.7 10.2 12.2 10.5 0.18 1.6 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-02-04 SOT232-1 1996 Jul 23 EUROPEAN PROJECTION 26 Philips Semiconductors Package information Package outlines seating plane SDIP42: plastic shrink dual in-line package; 42 leads (600 mil) SOT270-1 ME D A2 L A A1 c e Z b1 (e 1) w M MH b 22 42 pin 1 index E 1 21 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 5.08 0.51 4.0 1.3 0.8 0.53 0.40 0.32 0.23 38.9 38.4 14.0 13.7 1.778 15.24 3.2 2.9 15.80 15.24 17.15 15.90 0.18 1.73 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 90-02-13 95-02-04 SOT270-1 1996 Jul 23 EUROPEAN PROJECTION 27 Philips Semiconductors Package information Package outlines SIL SIL9MP: plastic single in-line medium power package; 9 leads SOT142-1 D D1 A2 D2 A3 seating plane E A pin 1 index c L 1 9 b e Z b2 Q w M b1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 max. A3 b b1 b2 c D (1) D1 D2 E (1) e L Q w Z (1) max. mm 12 11 3.7 1.8 1.4 1.40 1.14 0.67 0.50 1.40 1.14 0.48 0.38 21.8 21.4 21.4 20.7 18.6 18.2 6.48 6.20 2.54 3.9 3.4 1.75 1.55 0.25 1.0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-02-09 97-12-16 SOT142-1 1996 Jul 23 EUROPEAN PROJECTION 28 Philips Semiconductors Package information Package outlines SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1 D D1 q P A2 P1 A3 q1 q2 A A4 seating plane E pin 1 index c L 1 9 b e Z Q b2 w M b1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 max. A3 A4 b b1 b2 c D (1) D1 E (1) e L P P1 Q q q1 q2 w Z (1) max. mm 18.5 17.8 3.7 8.7 8.0 15.8 15.4 1.40 1.14 0.67 0.50 1.40 1.14 0.48 0.38 21.8 21.4 21.4 20.7 6.48 6.20 2.54 3.9 3.4 2.75 2.50 3.4 3.2 1.75 1.55 15.1 14.9 4.4 4.2 5.9 5.7 0.25 1.0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-02-25 SOT110-1 1996 Jul 23 EUROPEAN PROJECTION 29 Philips Semiconductors Package information Package outlines SO SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024 inches 0.010 0.057 0.069 0.004 0.049 0.01 0.01 0.028 0.004 0.012 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03S MS-012AA 1996 Jul 23 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 97-05-22 30 o 8 0o Philips Semiconductors Package information Package outlines SO8: plastic small outline package; 8 leads (straight); body width 3.9 mm D SOT96-2 E A X c HE v M A Z 8 5 Q A2 pin 1 index L 1 4 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A2 bp c D (1) E (2) e HE L Q v w Z (1) mm 1.45 1.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.4 6.2 1.2 0.7 0.6 0.25 0.25 0.7 0.3 inches 0.057 0.049 0.019 0.0100 0.20 0.014 0.0075 0.19 0.16 0.15 0.050 0.028 0.024 0.01 0.01 0.028 0.012 0.252 0.047 0.244 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-02-04 97-05-22 SOT96-2 1996 Jul 23 EUROPEAN PROJECTION 31 Philips Semiconductors Package information Package outlines SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.069 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.39 0.014 0.0075 0.38 0.16 0.15 0.050 0.039 0.016 0.028 0.020 0.01 0.01 0.004 0.028 0.012 inches 0.244 0.041 0.228 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07S MS-012AC 1996 Jul 23 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-23 97-05-22 32 o 8 0o Philips Semiconductors Package information Package outlines SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c HE y v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index Lp L 1 8 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.41 0.40 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 inches 0.10 Z (1) Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT162-1 075E03 MS-013AA 1996 Jul 23 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 33 o 8 0o Philips Semiconductors Package information Package outlines SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index Lp L 1 10 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 inches 0.10 Z (1) Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013AC 1996 Jul 23 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 34 o 8 0o Philips Semiconductors Package information Package outlines SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 D E A X c HE y v M A Z 13 24 Q A2 A (A 3) A1 pin 1 index Lp L 1 12 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 15.6 15.2 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.61 0.60 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 inches 0.10 Z (1) Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT137-1 075E05 MS-013AD 1996 Jul 23 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 35 o 8 0o Philips Semiconductors Package information Package outlines SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 D E A X c y HE v M A Z 15 28 Q A2 A (A 3) A1 pin 1 index Lp L 1 14 e w M bp 0 detail X 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 18.1 17.7 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.71 0.69 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT136-1 075E06 MS-013AE 1996 Jul 23 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 36 Philips Semiconductors Package information Package outlines SO32: plastic small outline package; 32 leads; body width 7.5 mm SOT287-1 D E A X c y HE v M A Z 17 32 Q A2 A (A 3) A1 pin 1 index Lp L 16 1 0 detail X w M bp e 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.27 0.18 20.7 20.3 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.2 1.0 0.25 0.25 0.1 0.95 0.55 inches 0.10 0.012 0.096 0.004 0.086 0.01 0.02 0.01 0.011 0.007 0.81 0.80 0.30 0.29 0.050 0.419 0.394 0.055 0.043 0.016 0.047 0.039 0.01 0.01 0.004 0.037 0.022 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-01-25 97-05-22 SOT287-1 1996 Jul 23 EUROPEAN PROJECTION 37 Philips Semiconductors Package information Package outlines SSOP SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm D SOT341-1 E A X c HE y v M A Z 28 15 Q A2 A (A 3) A1 pin 1 index Lp L 1 14 w M bp e detail X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 2.0 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 10.4 10.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 1.1 0.7 8 0o Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT341-1 1996 Jul 23 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 93-09-08 95-02-04 MO-150AH 38 o Philips Semiconductors Package information Package outlines SQFP SQFP128: plastic shrink quad flat package; 128 leads (lead length 1.6 mm); body 14 x 20 x 2.8 mm SOT387-2 c y X A 102 103 65 64 e E HE A A2 A1 (A 3) wM Lp bp pin 1 index 128 L 39 38 1 v M A wM bp e detail X D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 min. A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 3.40 0.25 3.05 2.55 0.25 0.27 0.17 0.20 0.09 20.0 14.0 0.50 23.2 17.2 1.60 0.95 0.65 0.20 0.08 0.10 7 0o o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 96-03-14 SOT387-2 1996 Jul 23 EUROPEAN PROJECTION 39 Philips Semiconductors Package information Package outlines VSO VSO40: plastic very small outline package; 40 leads SOT158-1 D E A X c y HE v M A Z 40 21 Q A2 A (A 3) A1 pin 1 index Lp L 1 detail X 20 w M bp e 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 2.70 0.3 0.1 2.45 2.25 0.25 0.42 0.30 0.22 0.14 15.6 15.2 7.6 7.5 0.762 12.3 11.8 2.25 1.7 1.5 1.15 1.05 0.2 0.1 0.1 0.6 0.3 0.012 0.096 0.017 0.0087 0.61 0.010 0.004 0.089 0.012 0.0055 0.60 0.30 0.29 0.03 0.48 0.46 0.067 0.089 0.059 inches 0.11 0.045 0.024 0.008 0.004 0.004 0.041 0.012 7o 0o Notes 1. Plastic or metal protrusions of 0.4 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-01-24 SOT158-1 1996 Jul 23 EUROPEAN PROJECTION 40 Philips Semiconductors Package information Package outlines VSO40: plastic very small outline package; 40 leads; face down SOT158-2 D E A y X c HE v M A Z 40 21 L Lp A1 Q (A 3) A2 A pin 1 index detail X 1 20 w M bp e 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 2.70 0.3 0.1 2.45 2.25 0.25 0.42 0.30 0.22 0.14 15.6 15.2 7.6 7.5 0.762 12.3 11.8 2.25 1.7 1.5 1.15 1.05 0.2 0.1 0.1 0.6 0.3 0.012 0.096 0.017 0.0087 0.61 0.010 0.004 0.089 0.012 0.0055 0.60 0.30 0.29 0.03 0.48 0.46 0.067 0.089 0.059 inches 0.11 0.045 0.024 0.008 0.004 0.004 0.041 0.012 Note 1. Plastic or metal protrusions of 0.4 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-01-24 SOT158-2 1996 Jul 23 EUROPEAN PROJECTION 41 o 7 0o Philips Semiconductors Package information Package outlines VSO56: plastic very small outline package; 56 leads SOT190-1 D E A X c y HE v M A Z 56 29 Q A2 A (A 3) A1 pin 1 index Lp L 1 detail X 28 w M bp e 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 3.3 0.3 0.1 3.0 2.8 0.25 0.42 0.30 0.22 0.14 21.65 21.35 11.1 11.0 0.75 15.8 15.2 2.25 1.6 1.4 1.45 1.30 0.2 0.1 0.1 0.90 0.55 0.13 0.012 0.004 0.12 0.11 0.01 0.017 0.0087 0.85 0.012 0.0055 0.84 inches 0.44 0.62 0.0295 0.43 0.60 0.063 0.089 0.055 0.057 0.035 0.008 0.004 0.004 0.051 0.022 Note 1. Plastic or metal protrusions of 0.3 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 96-04-02 97-08-11 SOT190-1 1996 Jul 23 EUROPEAN PROJECTION 42 o 7 0o