PACKAGE INFORMATION
Page
Index nnnn
DBS nnnn
DIP nnnn
HDIP nnnn
LQFP nnnn
PLCC nnnn
QFP nnnn
SDIP nnnn
SIL nnnn
SO nnnn
SSOP nnnn
SQFP nnnn
VSO nnnn
Soldering nnnn
1996 Jul 23 2
Philips Semiconductors
Package information Package outlines
INDEX
NAME DESCRIPTION VERSION PAGE
DBS (DIL-bent-SIL)
DBS13P plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6
DBS17P plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1
DIP (dual in-line package)
DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1;
SOT97DE
DIP14 plastic dual in-line package; 14 leads (300 mil) SOT27-1
DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1;
SOT38GG6
DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4
DIP18 plastic dual in-line package; 18 leads (300 mil) SOT102-1;
SOT102
DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1
HDIP (heat-dissipating dual in-line package)
HDIP18 plastic heat-dissipating dual in-line package; 18 leads SOT398-1
LQFP
LQFP48 plastic low profile quad flat package; 48 leads; body 7 ×7×1.4 mm SOT313-1
LQFP48 plastic low profile quad flat package; 48 leads; body 7 ×7×1.4 mm SOT313-2
LQFP64 plastic low profile quad flat package; 64 leads; body 10 ×10 ×1.4 mm SOT314-2
LQFP80 plastic low profile quad flat package; 80 leads; body 12 ×12 ×1.4 mm SOT315-1
PLCC (plastic leaded chip carrier)
PLCC68 plastic leaded chip carrier; 68 leads SOT188-2
PLCC84 plastic leaded chip carrier; 84 leads SOT189-2
QFP (quad flat package)
QFP44 plastic quad flat package; 44 leads (lead length 2.35 mm);
body 14 ×14 ×2.2 mm SOT205-1
QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm);
body 10 ×10 ×1.75 mm SOT307-2;
SOT307
QFP64 plastic quad flat package; 64 leads (lead length 1.95 mm);
body 14 ×20 ×2.7 mm; high stand-off height SOT319-1
QFP64 plastic quad flat package; 64 leads (lead length 1.95 mm);
body 14 ×20 ×2.8 mm SOT319-2
QFP64 plastic quad flat package; 64 leads (lead length 1.6 mm);
body 14 ×14 ×2.7 mm SOT393-1
QFP80 plastic quad flat package; 80 leads (lead length 1.95 mm);
body 14 ×20 ×2.8 mm SOT318-2
QFP128 plastic quad flat package; 128 leads (lead length 1.95 mm);
body 28 ×28 ×3.4 mm; high stand-off height SOT320-1
1996 Jul 23 3
Philips Semiconductors
Package information Package outlines
SDIP (shrink dual in-line package)
SDIP32 plastic shrink dual in-line package; 32 leads (400 mil) SOT232-1
SDIP42 plastic shrink dual in-line package; 42 leads (600 mil) SOT270-1;
SOT270AG
SIL (single in-line)
SIL9MP plastic single in-line medium power package; 9 leads SOT142-1
SIL9MPF plastic single in-line medium power package with fin; 9 leads SOT110-1
SO (small outline)
SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1;
SOT96AG
SO8 plastic small outline package; 8 leads (straight); body width 3.9 mm SOT96-2
SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1;
SOT162A
SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1;
SOT163A
SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1;
SOT137A
SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1;
SOT136A
SO32 plastic small outline package; 32 leads; body width 7.5 mm SOT287-1
SSOP (shrink small outline package)
SSOP28 plastic shrink small outline package; 28 leads; body width 5.3 mm SOT341-1
SQFP (shrink quad flat package)
SQFP128 plastic shrink quad flat package; 128 leads (lead length 1.6 mm);
body 14 ×20 ×2.8 mm SOT387-2
VSO (very small outline)
VSO40 plastic very small outline package; 40 leads SOT158-1
VSO40 plastic very small outline package; 40 leads; face down SOT158-2
VSO56 plastic very small outline package; 56 leads SOT190-1;
SOT190
NAME DESCRIPTION VERSION PAGE
1996 Jul 23 4
Philips Semiconductors
Package information Package outlines
DBS
UNIT A e1
A2bpcD
(1) E(1) Z(1)
deD
hLL
3m
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 17.0
15.5 4.6
4.2 0.75
0.60 0.48
0.38 24.0
23.6 20.0
19.6 10 3.4
v
0.8
12.2
11.8 1.7
e2
5.08 2.4
1.6
Eh
62.00
1.45
2.1
1.8
3.4
3.1 4.3
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
12.4
11.0
SOT141-6
0 5 10 mm
scale
Qj
0.25
w
0.03
x
D
L
E
A
c
A2
m
L3
Q
wM
bp
1
d
D
Ze2
e
e
xh
113
j
E
h
non-concave
view B: mounting base side
95-03-11
97-12-16
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6
vM
B
1996 Jul 23 5
Philips Semiconductors
Package information Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT243-1
0 5 10 mm
scale
D
L
E
A
c
A2
L3
Q
wM
bp
1
d
D
Ze
e
xh
117
j
E
h
non-concave
95-03-11
97-12-16
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1
view B: mounting base side
m2
e
vM
B
UNIT A e1
A2bpcD
(1) E(1) Z(1)
deD
hLL
3m
mm 17.0
15.5 4.6
4.2 0.75
0.60 0.48
0.38 24.0
23.6 20.0
19.6 10 2.54
v
0.8
12.2
11.8 1.27
e2
5.08 2.4
1.6
Eh
62.00
1.45
2.1
1.8
3.4
3.1 4.3
12.4
11.0
Qj
0.4
w
0.03
x
1996 Jul 23 6
Philips Semiconductors
Package information Package outlines
DIP
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT97-1 92-11-17
95-02-04
UNIT A
max. 12 b
1(1) (1) (1)
b2cD E e M Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min. A
max. bmax.
w
ME
e1
1.73
1.14 0.53
0.38 0.36
0.23 9.8
9.2 6.48
6.20 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 1.154.2 0.51 3.2
inches 0.068
0.045 0.021
0.015 0.014
0.009
1.07
0.89
0.042
0.035 0.39
0.36 0.26
0.24 0.14
0.12 0.010.10 0.30 0.32
0.31 0.39
0.33 0.0450.17 0.020 0.13
b2
050G01 MO-001AN
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
8
1
5
4
b
E
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
pin 1 index
DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1
1996 Jul 23 7
Philips Semiconductors
Package information Package outlines
UNIT A
max. 1 2 (1) (1)
b1cD (1)
Z
Ee M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT27-1 92-11-17
95-03-11
A
min. A
max. bmax.
w
ME
e1
1.73
1.13 0.53
0.38 0.36
0.23 19.50
18.55 6.48
6.20 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 2.24.2 0.51 3.2
0.068
0.044 0.021
0.015 0.77
0.73
0.014
0.009 0.26
0.24 0.14
0.12 0.010.10 0.30 0.32
0.31 0.39
0.33 0.0870.17 0.020 0.13
050G04 MO-001AA
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
14
1
8
7
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1
1996 Jul 23 8
Philips Semiconductors
Package information Package outlines
UNIT A
max. 1 2 b1cEe M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT38-1 92-10-02
95-01-19
A
min. A
max. bmax.
w
ME
e1
1.40
1.14
0.055
0.045
0.53
0.38 0.32
0.23 21.8
21.4
0.86
0.84
6.48
6.20
0.26
0.24
3.9
3.4
0.15
0.13
0.2542.54 7.62
0.30
8.25
7.80
0.32
0.31
9.5
8.3
0.37
0.33
2.2
0.087
4.7 0.51 3.7
0.15 0.021
0.015 0.013
0.009 0.010.100.0200.19
050G09 MO-001AE
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
16
1
9
8
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1) (1)
D(1)
Z
DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1
1996 Jul 23 9
Philips Semiconductors
Package information Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT38-4 92-11-17
95-01-14
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
b2
e
D
A2
Z
16
1
9
8
E
pin 1 index
b
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT A
max. 12 b
1(1) (1) (1)
b2cD E e M Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min. A
max. bmax.
w
ME
e1
1.73
1.30 0.53
0.38 0.36
0.23 19.50
18.55 6.48
6.20 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 0.764.2 0.51 3.2
inches 0.068
0.051 0.021
0.015 0.014
0.009
1.25
0.85
0.049
0.033 0.77
0.73 0.26
0.24 0.14
0.12 0.010.10 0.30 0.32
0.31 0.39
0.33 0.0300.17 0.020 0.13
DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4
1996 Jul 23 10
Philips Semiconductors
Package information Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT102-1 93-10-14
95-01-23
UNIT A
max. 12 b
1(1) (1) (1)
b2cD E e M Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min. A
max. bmax.
w
ME
e1
1.40
1.14 0.53
0.38 0.32
0.23 21.8
21.4 6.48
6.20 3.9
3.4 0.2542.54 7.62 8.25
7.80 9.5
8.3 0.854.7 0.51 3.7
inches 0.055
0.044 0.021
0.015 0.013
0.009
1.40
1.14
0.055
0.044 0.86
0.84 0.26
0.24 0.15
0.13 0.010.10 0.30 0.32
0.31 0.37
0.33 0.0330.19 0.020 0.15
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
b2
e
D
A2
Z
18
1
10
9
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
DIP18: plastic dual in-line package; 18 leads (300 mil) SOT102-1
1996 Jul 23 11
Philips Semiconductors
Package information Package outlines
UNIT A
max. 1 2 b1cD E e M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT146-1 92-11-17
95-05-24
A
min. A
max. bZ
max.
w
ME
e1
1.73
1.30 0.53
0.38 0.36
0.23 26.92
26.54 6.40
6.22 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 2.04.2 0.51 3.2
0.068
0.051 0.021
0.015 0.014
0.009 1.060
1.045 0.25
0.24 0.14
0.12 0.010.10 0.30 0.32
0.31 0.39
0.33 0.0780.17 0.020 0.13
SC603
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
20
1
11
10
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1)
(1) (1)
DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1
1996 Jul 23 12
Philips Semiconductors
Package information Package outlines
HDIP
UNIT A
max. 12 b
1(1) (1) (1)
b2cD E e M Z
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT398-1 94-04-13
95-01-25
A
min. A
max. bmax.
w
ME
e1
1.40
1.14 0.67
0.50 0.47
0.38 21.85
21.35 6.5
6.2 3.9
3.1 0.252.54 7.62 8.32
8.02 8.7
7.7 1.04.7 0.51 3.7
inches 0.06
0.04 0.03
0.02 0.02
0.01
1.05
0.75
0.04
0.03 0.87
0.84 0.26
0.24 0.15
0.12 0.010.10 0.30 0.33
0.32 0.34
0.30 0.040.19 0.02 0.15
MH
c
(e )
1
ME
wM
b1
b2
e
A
A1
A2
L
seating plane
Z
D
E
18
1
10
9
b
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
HDIP18: plastic heat-dissipating dual in-line package; 18 leads SOT398-1
1996 Jul 23 13
Philips Semiconductors
Package information Package outlines
LQFP
0.2
UNIT A
max. A1A2A3bpcE
(1) eH
E
LL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 1.70 0.20
0.04 1.50
1.30 0.25 0.26
0.14 0.18
0.12 7.1
6.9 0.5 9.3
8.7 1.0 0.66
0.56 0.95
0.55 7
0
o
o
0.15 0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.7
0.3
SOT313-1 93-03-23
94-02-04
D(1) (1)(1)
7.1
6.9
HD
9.3
8.7
E
Z
0.95
0.55
D
bp
e
E
B
12
c
D
H
bp
E
H
vMB
D
ZD
A
ZE
e
vMA
X
1
48
37
36 25
24
13
θ
A1
A
Lp
Q
detail X
L
(A )
3
A2
y
pin 1 index
wM
wM
0 2.5 5 mm
scale
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-1
1996 Jul 23 14
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 1.60 0.20
0.05 1.45
1.35 0.25 0.27
0.17 0.18
0.12 7.1
6.9 0.5 9.15
8.85 0.95
0.55 7
0
o
o
0.12 0.10.21.0
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT313-2 94-12-19
97-08-01
D(1) (1)(1)
7.1
6.9
HD
9.15
8.85
E
Z
0.95
0.55
D
bp
e
E
B
12
D
H
bp
E
H
vMB
D
ZD
A
ZE
e
vMA
1
48
37
36 25
24
13
θ
A1
A
Lp
detail X
L
(A )
3
A2
X
y
c
wM
wM
0 2.5 5 mm
scale
pin 1 index
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-2
1996 Jul 23 15
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 1.60 0.20
0.05 1.45
1.35 0.25 0.27
0.17 0.18
0.12 10.1
9.9 0.5 12.15
11.85 1.45
1.05 7
0
o
o
0.12 0.11.0 0.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT314-2 95-12-19
97-08-01
D(1) (1)(1)
10.1
9.9
HD
12.15
11.85
E
Z
1.45
1.05
D
bp
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
16
c
D
H
bp
E
HA2
vMB
D
ZD
A
ZE
e
vMA
X
1
64
49
48 33
32
17
y
pin 1 index
wM
wM
0 2.5 5 mm
scale
LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm SOT314-2
1996 Jul 23 16
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 1.6 0.16
0.04 1.5
1.3 0.25 0.27
0.13 0.18
0.12 12.1
11.9 0.5 14.15
13.85 1.45
1.05 7
0
o
o
0.15 0.10.21.0
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.30
SOT315-1 97-07-15
95-12-19
D(1) (1)(1)
12.1
11.9
HD
14.15
13.85
E
Z
1.45
1.05
D
bp
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
20
c
D
H
bp
E
HA2
vMB
D
ZD
A
ZE
e
vMA
X
1
80
61
60 41
40
21
y
pin 1 index
wM
wM
0 5 10 mm
scale
LQFP80: plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm SOT315-1
1996 Jul 23 17
Philips Semiconductors
Package information Package outlines
PLCC
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
Note
1. Plastic or metal protrusions of 0.01 inches maximum per side are not included.
SOT188-2
4460
68
1
9
10 26
43
27
61
detail X
(A )
3
bp
wM
A1
AA4
Lp
b1
βk1
k
X
y
e
E
B
D
H
E
H
vMB
D
ZD
A
ZE
e
vMA
pin 1 index
112E10 MO-047AC
0 5 10 mm
scale
92-11-17
95-03-11
PLCC68: plastic leaded chip carrier; 68 leads SOT188-2
UNIT A A
min. max. max. max. max.
1A4bpE(1) (1) (1)
eH
EZ
ywv β
mm 4.57
4.19 0.51 3.30 0.53
0.33
0.021
0.013
1.27 0.51 2.16 45o
0.18 0.100.18
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
D(1)
24.33
24.13
HD
25.27
25.02
E
Z
2.16
D
b1
0.81
0.66
k
1.22
1.07
k1
0.180
0.165 0.020 0.13
A3
0.25
0.01 0.05 0.020 0.085
0.007 0.0040.007
Lp
1.44
1.02
0.057
0.040
0.958
0.950
24.33
24.13
0.958
0.950 0.995
0.985
25.27
25.02
0.995
0.985
eE
eD
23.62
22.61
0.930
0.890
23.62
22.61
0.930
0.890 0.085
0.032
0.026 0.048
0.042
E
e
inches
D
e
1996 Jul 23 18
Philips Semiconductors
Package information Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
Note
1. Plastic or metal protrusions of 0.01 inches maximum per side are not included.
SOT189-2
5474
84
1
11
12 32
53
33
75
detail X
(A )
3
bp
wM
A1
AA4
Lp
b1
βk1
k
X
y
e
E
B
D
H
E
H
vMB
D
ZD
A
ZE
e
vMA
pin 1 index
0 5 10 mm
scale
92-11-17
95-03-11
PLCC84: plastic leaded chip carrier; 84 leads SOT189-2
UNIT A A
min. max. max. max. max.
1A4bpE(1) (1) (1)
eH
EZ
ywv β
mm 4.57
4.19 0.51 3.30 0.53
0.33
0.021
0.013
1.27 0.51 2.16 45o
0.18 0.100.18
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
D(1)
29.41
29.21
HD
30.35
30.10
E
Z
2.16
D
b1
0.81
0.66
k
1.22
1.07
k1
0.180
0.165 0.020 0.13
A3
0.25
0.01 0.05 0.020 0.085
0.007 0.0040.007
Lp
1.44
1.02
0.057
0.040
1.158
1.150
29.41
29.21
1.158
1.150 1.195
1.185
30.35
30.10
1.195
1.185
eE
eD
28.70
27.69
1.130
1.090
28.70
27.69
1.130
1.090 0.085
0.032
0.026 0.048
0.042
E
e
inches
D
e
1996 Jul 23 19
Philips Semiconductors
Package information Package outlines
QFP
UNIT A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.25
0.05 2.3
2.1 0.25 0.50
0.35 0.25
0.14 14.1
13.9 119.2
18.2 2.4
1.8 7
0
o
o
0.152.35 0.10.3
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2.0
1.2
SOT205-1 95-02-04
97-08-01
D(1) (1)(1)
14.1
13.9
HD
19.2
18.2
E
Z
2.4
1.8
D
bp
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
11
y
c
D
H
bp
E
HA2
vMB
D
ZD
A
ZE
e
vMA
X
1
44
34
33 23
22
12
133E01A
pin 1 index
wM
wM
0 5 10 mm
scale
QFP44: plastic quad flat package; 44 leads (lead length 2.35 mm); body 14 x 14 x 2.2 mm SOT205-1
A
max.
2.60
1996 Jul 23 20
Philips Semiconductors
Package information Package outlines
UNIT A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.25
0.05 1.85
1.65 0.25 0.40
0.20 0.25
0.14 10.1
9.9 0.8 1.3
12.9
12.3 1.2
0.8 10
0
o
o
0.15 0.10.15
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.95
0.55
SOT307-2 95-02-04
97-08-01
D(1) (1)(1)
10.1
9.9
HD
12.9
12.3
E
Z
1.2
0.8
D
e
E
B
11
c
E
H
D
ZD
A
ZE
e
vMA
X
1
44
34 33 23 22
12
y
θ
A1
A
Lp
detail X
L
(A )
3
A2
pin 1 index
D
HvMB
bp
bp
wM
wM
0 2.5 5 mm
scale
QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm SOT307-2
A
max.
2.10
1996 Jul 23 21
Philips Semiconductors
Package information Package outlines
UNIT A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.36
0.10 2.87
2.57 0.25 0.50
0.35 0.25
0.13 14.1
13.9 118.2
17.6 1.2
0.8 7
0
o
o
0.2 0.10.21.95
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.6
SOT319-1 95-02-04
97-08-01
D(1) (1)(1)
20.1
19.9
HD
24.2
23.6
E
Z
1.2
0.8
D
bp
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
19
y
c
D
H
bp
E
HA2
vMB
D
ZD
A
ZE
e
vMA
wM
1
64
52 51 33 32
20
X
wM
0 5 10 mm
scale
pin 1 index
64 leads (lead length 1.95 mm); body 14 x 20 x 2.7 mm; high stand-off height
QFP64: plastic quad flat package; SOT319-1
A
max.
3.3
1996 Jul 23 22
Philips Semiconductors
Package information Package outlines
UNIT A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.25
0.05 2.90
2.65 0.25 0.50
0.35 0.25
0.14 14.1
13.9 118.2
17.6 1.2
0.8 7
0
o
o
0.2 0.10.21.95
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.6
SOT319-2 95-02-04
97-08-01
D(1) (1)(1)
20.1
19.9
HD
24.2
23.6
E
Z
1.2
0.8
D
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
19
y
c
E
HA2
D
ZD
A
ZE
e
vMA
1
64
52 51 33 32
20
X
pin 1 index
bp
D
H
bp
vMB
wM
wM
0 5 10 mm
scale
QFP64: plastic quad flat package; 64 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm SOT319-2
A
max.
3.20
1996 Jul 23 23
Philips Semiconductors
Package information Package outlines
UNIT A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.25
0.10 2.75
2.55 0.25 0.45
0.30 0.23
0.13 14.1
13.9 0.8 17.45
16.95 1.2
0.8 7
0
o
o
0.16 0.100.161.60
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.03
0.73
SOT393-1 MS-022 96-05-21
97-08-04
D(1) (1)(1)
14.1
13.9
HD
17.45
16.95
E
Z
1.2
0.8
D
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
16
y
c
E
HA2
D
ZD
A
ZE
e
vMA
1
64
49 48 3332
17
X
bp
D
H
bp
vMB
wM
wM
0 5 10 mm
scale
pin 1 index
QFP64: plastic quad flat package; 64 leads (lead length 1.6 mm); body 14 x 14 x 2.7 mm SOT393-1
A
max.
3.00
1996 Jul 23 24
Philips Semiconductors
Package information Package outlines
UNIT A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.25
0.05 2.90
2.65 0.25 0.45
0.30 0.25
0.14 14.1
13.9 0.8 1.95
18.2
17.6 1.2
0.8 7
0
o
o
0.20.2 0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.6
SOT318-2
D(1) (1)(1)
20.1
19.9
HD
24.2
23.6
E
Z
1.0
0.6
D
bp
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
24
c
bp
E
HA2
D
ZD
A
ZE
e
vMA
1
80
6564 41 40
25
pin 1 index
X
y
D
HvMB
wM
wM
95-02-04
97-08-01
0 5 10 mm
scale
QFP80: plastic quad flat package; 80 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm SOT318-2
A
max.
3.2
1996 Jul 23 25
Philips Semiconductors
Package information Package outlines
UNIT A1A2A3bpcE
(1) (1)(1)
eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.40
0.25 3.70
3.15 0.25 0.45
0.30 0.23
0.13 28.1
27.9 0.8 32.2
31.6 1.8
1.4 8
0
o
o
0.20.3 0.11.95
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.1
0.7
SOT320-1 95-02-04
97-08-01
D(1)
28.1
27.9
HD
32.2
31.6
E
Z
1.8
1.4
D
0 5 10 mm
scale
pin 1 index
bp
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
32
c
bp
E
HA2
D
HvMB
D
ZD
A
ZE
e
vMA
X
1
128
9796 6564
33
y
wM
wM
128 leads (lead length 1.95 mm); body 28 x 28 x 3.4 mm; high stand-off height
QFP128: plastic quad flat package; SOT320-1
A
max.
3.95
1996 Jul 23 26
Philips Semiconductors
Package information Package outlines
SDIP
UNIT b1cEe M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
DIMENSIONS (mm are the original dimensions)
SOT232-1 92-11-17
95-02-04
bmax.
w
ME
e1
1.3
0.8 0.53
0.40 0.32
0.23 29.4
28.5 9.1
8.7 3.2
2.8 0.181.778 10.16 10.7
10.2 12.2
10.5 1.6
4.7 0.51 3.8
MH
c(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
32
1
17
16
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1) (1)
D(1)
Z
A
max. 12
A
min. A
max.
SDIP32: plastic shrink dual in-line package; 32 leads (400 mil) SOT232-1
1996 Jul 23 27
Philips Semiconductors
Package information Package outlines
UNIT b1cEe M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
DIMENSIONS (mm are the original dimensions)
SOT270-1 90-02-13
95-02-04
bmax.
w
ME
e1
1.3
0.8 0.53
0.40 0.32
0.23 38.9
38.4 14.0
13.7 3.2
2.9 0.181.778 15.24 15.80
15.24 17.15
15.90 1.73
5.08 0.51 4.0
MH
c(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
42
1
22
21
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1) (1)
D(1)
Z
A
max. 12
A
min. A
max.
SDIP42: plastic shrink dual in-line package; 42 leads (600 mil) SOT270-1
1996 Jul 23 28
Philips Semiconductors
Package information Package outlines
SIL
UNIT A A3b1D1
b2
bcD
(1) E(1) eL
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 12
11 1.8
1.4 1.40
1.14 0.67
0.50 1.40
1.14 0.48
0.38 21.8
21.4 21.4
20.7
D2
18.6
18.2 6.48
6.20 2.54 3.9
3.4
Q
1.75
1.55
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT142-1 95-02-09
97-12-16
0 5 10 mm
scale
Z(1)
1.0
0.25
wmax.
D
E
A
A
c
A2
3
L
Q
wM
b
b1
b2
D1
D2
Ze
19
seating plane
pin 1 index
SIL9MP: plastic single in-line medium power package; 9 leads SOT142-1
A
max.
2
3.7
1996 Jul 23 29
Philips Semiconductors
Package information Package outlines
UNIT AA
max.
2A3b1D1
b2
bcD
(1) E(1) Z
max.
(1)
eLPP
1q
1
q
2
q
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 18.5
17.8 3.7 8.7
8.0
A4
15.8
15.4 1.40
1.14 0.67
0.50 1.40
1.14 0.48
0.38 21.8
21.4 21.4
20.7 6.48
6.20 3.4
3.2
2.54 1.0
5.9
5.7
4.4
4.2
3.9
3.4 15.1
14.9
Q
1.75
1.55
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2.75
2.50
SOT110-1 92-11-17
95-02-25
0 5 10 mm
scale
0.25
w
D
E
A
A
c
A2
3
A4
q1q2
L
Q
wM
b
b1
b2
D1
P
q
1
Ze
19
P
seating plane
pin 1 index
SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1
1996 Jul 23 30
Philips Semiconductors
Package information Package outlines
SO
UNIT A
max. A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 5.0
4.8 4.0
3.8 1.27 6.2
5.8 1.05 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.10.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.4
SOT96-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
4
5
pin 1 index
1
8
y
076E03S MS-012AA
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.20
0.19 0.16
0.15 0.050 0.244
0.228 0.028
0.024 0.028
0.012
0.010.010.041 0.004
0.039
0.016
0 2.5 5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
95-02-04
97-05-22
1996 Jul 23 31
Philips Semiconductors
Package information Package outlines
UNIT A bpcD
(1)
2E(2) (1)
eH
ELQ Zwv
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
1.45
1.25 0.49
0.36 0.25
0.19 5.0
4.8 4.0
3.8 1.27 6.4
6.2 1.2 0.7
0.6 0.7
0.3
0.250.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT96-2
X
wM
bp
D
HE
Q
detail X
E
Z
e
c
L
vMA
A
4
5
1
8
pin 1 index
0.057
0.049 0.019
0.014 0.0100
0.0075 0.20
0.19 0.16
0.15 0.050 0.252
0.244 0.028
0.024 0.028
0.012
0.010.010.047
0 2.5 5 mm
scale
SO8: plastic small outline package; 8 leads (straight); body width 3.9 mm SOT96-2
A2
95-02-04
97-05-22
1996 Jul 23 32
Philips Semiconductors
Package information Package outlines
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
8
9
1
16
y
pin 1 index
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 10.0
9.8 4.0
3.8 1.27 6.2
5.8 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.0
0.4
SOT109-1 95-01-23
97-05-22
076E07S MS-012AC
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.39
0.38 0.16
0.15 0.050
1.05
0.041
0.244
0.228 0.028
0.020 0.028
0.012
0.01
0.25
0.01 0.004
0.039
0.016
0 2.5 5 mm
scale
SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
1996 Jul 23 33
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.30
0.10 2.45
2.25 0.49
0.36 0.32
0.23 10.5
10.1 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT162-1
8
16
wM
bp
D
detail X
Z
e
9
1
y
0.25
075E03 MS-013AA
pin 1 index
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.41
0.40 0.30
0.29 0.050
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
X
θ
A
A1
A2
HE
Lp
Q
E
c
L
vMA
(A )
3
A
0 5 10 mm
scale
SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1
95-01-24
97-05-22
1996 Jul 23 34
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.30
0.10 2.45
2.25 0.49
0.36 0.32
0.23 13.0
12.6 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT163-1
10
20
wM
bp
detail X
Z
e
11
1
D
y
0.25
075E04 MS-013AC
pin 1 index
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.51
0.49 0.30
0.29 0.050
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
0 5 10 mm
scale
X
θ
A
A1
A2
HE
Lp
Q
E
c
L
vMA
(A )
3
A
SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
95-01-24
97-05-22
1996 Jul 23 35
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.30
0.10 2.45
2.25 0.49
0.36 0.32
0.23 15.6
15.2 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT137-1
X
12
24
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
c
L
vMA
13
(A )
3
A
y
0.25
075E05 MS-013AD
pin 1 index
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.61
0.60 0.30
0.29 0.050
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
e
1
0 5 10 mm
scale
SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1
95-01-24
97-05-22
1996 Jul 23 36
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.30
0.10 2.45
2.25 0.49
0.36 0.32
0.23 18.1
17.7 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT136-1
X
14
28
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
c
L
vMA
e
15
1
(A )
3
A
y
0.25
075E06 MS-013AE
pin 1 index
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.71
0.69 0.30
0.29 0.050
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
0 5 10 mm
scale
SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1
95-01-24
97-05-22
1996 Jul 23 37
Philips Semiconductors
Package information Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(1) eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65
0.10
0.25
0.01
1.4
0.055
0.3
0.1 2.45
2.25 0.49
0.36 0.27
0.18 20.7
20.3 7.6
7.4 1.27 10.65
10.00 1.2
1.0 0.95
0.55 8
0
o
o
0.25 0.1
0.004
0.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT287-1
(1)
0.012
0.004 0.096
0.086 0.02
0.01 0.050 0.047
0.039
0.419
0.394
0.30
0.29
0.81
0.80
0.011
0.007 0.037
0.022
0.010.01
0.043
0.016
wM
bp
D
HE
Z
e
c
vMA
X
A
y
32 17
16
1
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
E
pin 1 index
0 5 10 mm
scale
SO32: plastic small outline package; 32 leads; body width 7.5 mm SOT287-1
95-01-25
97-05-22
1996 Jul 23 38
Philips Semiconductors
Package information Package outlines
SSOP
UNIT A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.21
0.05 1.80
1.65 0.38
0.25 0.20
0.09 10.4
10.0 5.4
5.2 0.65 1.25
7.9
7.6 0.9
0.7 1.1
0.7 8
0
o
o
0.13 0.10.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
1.03
0.63
SOT341-1 MO-150AH 93-09-08
95-02-04
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
114
28 15
0.25
y
pin 1 index
0 2.5 5 mm
scale
SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm SOT341-1
A
max.
2.0
1996 Jul 23 39
Philips Semiconductors
Package information Package outlines
SQFP
UNIT A1A2A3bpcE
(1) eH
E
LL
pywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.250.25 3.05
2.55 0.27
0.17 0.20
0.09 14.020.0 0.50 17.2 7
0
o
o
0.08 0.100.201.60
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.95
0.65
SOT387-2 96-03-14
D(1) HD
23.2
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
38
bp
E
HA2
D
A
e
vMA
1
128
103
102 6564
39
pin 1 index
y
bp
D
HvMB
wM
wM
0 5 10 mm
scale
c
SQFP128: plastic shrink quad flat package; 128 leads (lead length 1.6 mm); body 14 x 20 x 2.8 mm SOT387-2
A
max. min.
3.40
X
1996 Jul 23 40
Philips Semiconductors
Package information Package outlines
VSO
UNIT A1A2A3bpcD
(1) E(2) Z(1)
eH
ELL
pQywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
0.3
0.1 2.45
2.25 0.25 0.42
0.30 0.22
0.14 15.6
15.2 7.6
7.5 0.762 2.25
12.3
11.8 1.15
1.05 0.6
0.3 7
0
o
o
0.1 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.4 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
1.7
1.5
SOT158-1 92-11-17
95-01-24
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
y
40
20
21
1
pin 1 index
0.012
0.004 0.096
0.089 0.017
0.012 0.0087
0.0055 0.61
0.60 0.30
0.29 0.03 0.089
0.48
0.46 0.045
0.041 0.024
0.012
0.004
0.2
0.008 0.004
0.067
0.059
0.010
0 5 10 mm
scale
VSO40: plastic very small outline package; 40 leads SOT158-1
A
max.
2.70
0.11
1996 Jul 23 41
Philips Semiconductors
Package information Package outlines
UNIT A1A2A3bpcD
(1) E(2) eH
ELL
pQywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
0.3
0.1 2.45
2.25 0.25 0.42
0.30 0.22
0.14 15.6
15.2 7.6
7.5 0.762 12.3
11.8 1.15
1.05 0.6
0.3 7
0
o
o
0.1 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.4 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
1.7
1.5
SOT158-2
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
y
40 21
201
pin 1 index
0.012
0.004 0.096
0.089 0.017
0.012 0.0087
0.0055 0.61
0.60 0.30
0.29 0.03
2.25
0.089
0.48
0.46 0.045
0.041 0.024
0.012
0.004
0.2
0.008 0.004
0.067
0.059
0.010
Z(1)
0 5 10 mm
scale
92-11-17
95-01-24
VSO40: plastic very small outline package; 40 leads; face down SOT158-2
A
max.
2.70
0.11
1996 Jul 23 42
Philips Semiconductors
Package information Package outlines
UNIT A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
0.3
0.1 3.0
2.8 0.25 0.42
0.30 0.22
0.14 21.65
21.35 11.1
11.0 0.75 15.8
15.2 1.45
1.30 0.90
0.55 7
0
o
o
0.1 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
1.6
1.4
SOT190-1 96-04-02
97-08-11
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
X
(A )
3
A
y
56 29
281
pin 1 index
0.012
0.004 0.12
0.11 0.017
0.012 0.0087
0.0055 0.85
0.84 0.44
0.43 0.0295
2.25
0.089
0.62
0.60 0.057
0.051 0.035
0.022
0.004
0.2
0.008 0.004
0.063
0.055
0.01
0 5 10 mm
scale
VSO56: plastic very small outline package; 56 leads SOT190-1
A
max.
3.3
0.13
Note
1. Plastic or metal protrusions of 0.3 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.