TD62008APG(5,J) - TOSHIBA - Datasheet.Live

TD62008APG/AFG

2007-10-16

TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC

TD62008APG,TD62008AFG

7CH DARLINGTON SINK DRIVER

The TD62008APG and TD62008AFG are high−voltage,

high−current darlington drivers comprised of seven NPN

darlington pairs.

All units feature integral clamp diodes for switching inductive

loads and protective diodes against a negative input voltage.

The TD62008APG and TD62008AFG are suitable for interfaces

from plus and minus dual supply voltage systems to plus single

supply voltage systems.

Applications include relay, hammer, lamp and display (LED)

drivers.

Please observe the thermal conditions for use.

The suffix (G) appended to the part number represents a RoHS

product.

Features

z Output current (single output) 400 mA (Max)

z High sustaining voltage output 50 V (Min)

z Output clamp diodes

z Protective diodes against a negative input voltage

z Inputs base resistor RIN = 20 kΩ

z Inputs compatible with 9~15 V PMOS, CMOS.

z Package type−APG : DIP−16 pin

z Package type−AFG : SOP−16 pin

Pin Connection (top view) Schematics (each driver)

Note: The input and output parasitic diodes cannot

be used as clamp diodes.

Weight

DIP16−P−300−2.54A : 1.11 g (typ.)

SOP16−P−225−1.27 : 0.16 g (typ.)

TD62008APG

TD62008AFG

TD62008APG/AFG

2007-10-16

Absolute Maximum Ratings (Ta = 25°C)

CHARACTERISTIC SYMBOL RATING UNIT

Output Sustaining

Voltage VCE (SUS) −0.5 ~ 50 V

Output Current IOUT 400 mA / ch

Input Voltage VIN −40 ~ 40 V

Clamp Diode Reverse

Voltage VR 50 V

Clamp Diode Forward Current IF 400 mA

APG 1.47

Power Dissipation

AFG

PD 0.625 (Note)

Operating Temperature Topr −40 ~ 85 °C

Storage Temperature Tstg −55 ~ 150 °C

Note: On Glass Epoxy PCB (30 × 30 × 1.6 mm Cu 50%)

Operating Conditions (Ta = −40 ~ 85°C)

CHARACTERISTIC SYMBOL CONDITION MIN TYP. MAX UNIT

Output Sustaining

Voltage VCE (SUS) 0 ― 50 V

DC 1 Circuit, Tpw = 25%, Duty = 40% 0 ― 400

Output Current IOUT Tpw = 25 ms, Duty = 10%, 7 Circuits 0 ― 200

Input Voltage VIN −35 ― 35 V

Clamp Diode Reverse

Voltage VR ― ― 50 V

Clamp Diode Forward Current IF ― ― 400 mA

APG ― ― 0.52

Power Dissipation

AFG

PD Ta = 85°C (Note) ― ― 0.325

Note: On Glass Epoxy PCB (30 × 30 × 1.6 mm Cu 50%)

TD62008APG/AFG

2007-10-16

Electrical Characteristics (Ta = 25°C)

CHARACTERISTIC SYMBOL

TEST

CIR−

CUIT

TEST CONDITION MIN TYP. MAX UNIT

Output Leakage

Current ICEX 1 VOUT = 50 V ― ― 100 μA

IOUT = 400 mA ― 1.3 2.4

Collector−Emitter Saturation Voltage VCE (sat) 2

IOUT = 200 mA ― 1.0 1.6

VIN = 18 V ― 0.85 1.8

“H” Level IIN (ON) 4

VIN = 35 V ― ― 3.8

Input Current

“L” Level IIN (OFF) 4 VIN = −35 V ― ― −20 μA

DC Current Transfer Ratio hFE 3 VCE = 4 V, IOUT = 350 mA 1000 3000 ―

Clamp Diode Reverse Current IR 5 VR = 50 V, VR = 35 V (Type−F) ― ― 100 μA

Clamp Diode Forward Voltage VF 6 IF = 400 mA ― 1.5 2.4 V

Turn−On Delay tON VOUT = 50 V, RL = 156 Ω ― 0.1 ― μs

Turn−Off Delay tOFF

7 CL =

15 pF

VOUT = 50 V, RL = 156 Ω ― 0.2 ― μs

TD62008APG/AFG

2007-10-16

Test Circuit

1. ICEX 2. VCE (sat) 3. hFE

4. IIN (ON), IIN (OFF) 5. IR 6. VF

7. tON, tOFF

Precautions for Use

This IC does not include built-in protection circuits for excess current or overvoltage.

If this IC is subjected to excess current or overvoltage, it may be destroyed.

Hence, the utmost care must be taken when systems which incorporate this IC are designed.

Utmost care is necessary in the design of the output line, COMMON and GND line since the IC may be

destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding.

Note 1: Pulse Width 50 μs

Duty Cycle 10%

Output Impedance 50 Ω

tr ≤ 5 ns, tf ≤ 10 ns

Note 2: CL includes probe and jig capacitance

TD62008APG/AFG

2007-10-16

① Type-APG Free Air

② Type-AFG Free Air

③ Type-APG On Glass Epoxy

PCB 30x30x16mm Cu 50%

TD62008APG/AFG

2007-10-16

Package Dimensions

DIP16−P−300−2.54A Unit : mm

Weight: 1.11 g (Typ.)

TD62008APG/AFG

2007-10-16

Package Dimensions

SOP16−P−225−1.27 Unit : mm

Weight: 0.16 gTyp.)

TD62008APG/AFG

2007-10-16

Notes on Contents

1. Equivalent Circuits

The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory

purposes.

2. Test Circuits

Components in the test circuits are used only to obtain and confirm the device characteristics. These

components and circuits are not guaranteed to prevent malfunction or failure from occurring in the

application equipment.

IC Usage Considerations

Notes on Handling of ICs

(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be

exceeded, even for a moment. Do not exceed any of these ratings.

Exceeding the rating(s) may cause breakdown, damage or deterioration of the device, and may result

in injury by explosion or combustion.

(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in

case of overcurrent and/or IC failure. The IC will fully break down when used under conditions that

exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal

pulse noise occurs from the wiring or load. A breakdown could cause a large current to continuously

flow and lead to smoke or ignition. To minimize the effects of the flow of a large current in case of

breakdown, appropriate settings are required, such as fuse capacity, fusing time and insertion circuit

location.

(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the

design to prevent device malfunction or breakdown caused by the current resulting from the inrush

current at power ON or the negative current resulting from the back electromotive force at power OFF.

IC breakdown may cause injury, smoke or ignition.

Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,

the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,

smoke or ignition.

(4) Do not insert devices in the wrong orientation or incorrectly.

Make sure that the positive and negative terminals of power supplies are connected properly.

Otherwise, the current or power consumption may exceed the absolute maximum rating, and

exceeding the rating(s) may cause breakdown, damage or deterioration of the device, and may result

injury by explosion or combustion.

In addition, do not use any device that has had current applied even once while inserted in the wrong

orientation or incorrectly .

(5) Carefully select external components such as power amps and regulators (including input and

negative feedback capacitors), and load components such as speakers.

If there is a large amount of leakage current, such as from input or negative feedback condensers, the

IC output DC voltage will increase. If this output voltage is connected to a speaker with a low input

voltage threshold, overcurrent or IC failure could cause smoke or ignition. (The overcurrent can cause

smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied

Load (BTL) connection type IC that inputs output DC voltage directly to a speaker.

TD62008APG/AFG

2007-10-16

Points to Remember on Handling of ICs

(1) Heat Radiation Design

When using an IC with a large current flow, such as in a power amp, regulator or driver, please

design the device so that heat is appropriately radiated, so as not to exceed the specified junction

temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An

inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics

or IC breakdown. In addition, please design the device taking into consideration the effect of IC heat

radiation on peripheral components.

(2) Back-EMF

When a motor rotates in the reverse direction, stops or slows down abruptly, current flows back to the

motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply

is small, the device’s motor power supply and output pins might be exposed to conditions beyond

absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in

system design.

About solderability, following conditions were confirmed

• Solderability

(1) Use of Sn-37Pb solder Bath

· solder bath temperature = 230°C

· dipping time = 5 seconds

· the number of times = once

· use of R-type flux

(2) Use of Sn-3.0Ag-0.5Cu solder Bath

· solder bath temperature = 245°C

· dipping time = 5 seconds

· the number of times = once

· use of R-type flux

TD62008APG/AFG

2007-10-16

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