PT85QWx45 PT85QWx45 Pulse Power Thyristor Switch Preliminary Information DS5334-1.2 April 2000 APPLICATIONS Pulse Power Crowbars Ignitron Replacement KEY PARAMETERS 4500V VDRM IT(AV) 1670A ITSM 37000A dI/dt 22000A/s FEATURES Double Side Cooling Fast Turn-on Low Turn-on Losses VOLTAGE RATINGS Type Number Repetitive Peak Voltages VDRM /VRRM V Conditions 4500/16 Tvj = 0 to 125C, IDRM = IRRM = 50mA, VDRM, VRRM tp = 10ms PT85QWx45 Outline type code: W. See Package Details for further information. Lower voltage grades available. Fig.1 Package outline CURRENT RATINGS Symbol Parameter Conditions Max. Units Double Side Cooled IT(AV) Mean on-state current Half wave resistive load, Tcase = 80oC 1670 A IT(RMS) RMS value Tcase = 80oC 2625 A 1/6 PT85QWx45 SURGE RATINGS Parameter Symbol ITSM I2t ITSM I2t Surge (non-repetitive) on-state current I2t for fusing Surge (non-repetitive) on-state current Conditions Max. Units 10ms half sine; Tcase = 125oC 29.6 kA VR = 50% VRRM - 1/4 sine 4.38 x 106 A2s 10ms half sine; Tcase = 125oC 37.0 kA VR = 0 6.85 x 106 A2s I2t for fusing THERMAL AND MECHANICAL DATA Conditions Parameter Symbol Min. Max. Units Rth(j-c) Thermal resistance - junction to case Double side cooled dc - 0.01 o Rth(c-h) Thermal resistance - case to heatsink Clamping force 40kN with mounting compound Double side - 0.001 o On-state (conducting) - 135 o Reverse (blocking) - 125 o Storage temperature range -55 125 o Clamping force 36.0 44.0 kN Typ. Max. Units Tvj Tstg - C/W C/W C Virtual junction temperature C C DYNAMIC CHARACTERISTICS Symbol Parameter Conditions Peak reverse and off-state current At VRRM/VDRM, Tcase = 125oC - 250 mA dV/dt Maximum linear rate of rise of off-state voltage To 67% VDRM Tj = 125oC. Rgk 1.5 - 200 V/s dI/dt Rate of rise of on-state current From 67% VDRM to 90kA Gate source 130A tr = 1.5s, Tj = 25oC - 22000 A/s VT(TO) Threshold voltage At Tvj = 125oC - 1.45 V On-state slope resistance At Tvj = 125oC - 0.3 m Typ. Max. Units IRRM/IDRM rT Non-repetitive GATE TRIGGER CHARACTERISTICS AND RATINGS Symbol 2/6 Parameter Conditions VGT Gate trigger voltage VDRM = 5V, Tcase = 25oC 1.0 4.0 V IGT Gate trigger current VDRM = 5V, Tcase = 25oC - 1.5 A PT85QWx45 ORDERING INFORMATION PT 85Q W x 45 Lead length (x) Pulse Power Thyristor Device type Package outline type code lead length (see table, right) Voltage x100 O No lead C 8" 200mm D 10" 250mm E 12" 300mm F 16" 400mm G 18" 450mm H 20" 500mm J 24" 600mm K 30" 750mm L 40" 1000mm CURVES 5000 1 2 Instantaneous on-state current, IT - (A) 4000 1: Tj = 25C Max 2: Tj = 125C Max 3000 2000 1000 Measured under pulse conditions 0 1.0 2.0 3.0 4.0 Instantaneous on-state voltage, VT - (V) 5.0 Fig.2 Maximum (limit) on-state characteristics 3/6 PT85QWx45 Thermal impedance - C/W 0.015 dc 0.010 0.005 0 0.001 0.01 0.1 Time - (s) 1.0 10 Fig.3 Maximum (limit) transient thermal impedance - junction to case 4/6 100 PT85QWx45 PACKAGE DETAILS For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. 2 holes O3.6x2.0 deep (in both electrodes) Cathode tab Cathode 27.7 26.0 O120 max O84.6 nom Gate O84.6 nom Anode O120 max Nominal weight: 2600g Clamping force: 40kN 10% Package outine type code: W 5/6 POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs). HEATSINKS The Power Assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or Customer Services. http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: +44-(0)1522-500500 Fax: +44-(0)1522-500550 CUSTOMER SERVICE Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020 SALES OFFICES Benelux, Italy & Switzerland: Tel: +33 (0)1 64 66 42 17. Fax: +33 (0)1 64 66 42 19. France: Tel: +33 (0)2 47 55 75 52. Fax: +33 (0)2 47 55 75 59. Germany, Northern Europe, Spain & Rest Of World: Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020 North America: Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (949) 733-3005. Fax: (949) 733-2986. These offices are supported by Representatives and Distributors in many countries world-wide. (c) Dynex Semiconductor 2002 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRODUCED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. www.dynexsemi.com