2017 Microchip Technology Inc. DS20005599A-page 1
CL320/CL325/CL330
Features
• ±6% Current Accuracy when VOUT is between 4V
and 15V
• 90V Standoff Voltage
• Separate Enable Pins for each Channel for PWM
Dimming
• Overtemperature Protection
• 8-Lead SOIC (with Heat Slug) Package
Applications
• LCD Backlighting
• Indicator Lamps
General Description
The CL320/CL325/CL330 are designed to drive three
strings of LEDs at a constant current of 20 mA, 25 mA
and 30 mA, respectively.
The drive current is fixed, with a ±6% tolerance over a
VOUT range of 4V to 15V. Separate enable pins for
each channel allow for PWM dimming, three-step linear
dimming or individual disconnection of faulty LED
strings.
Overtemperature protection circuitry shuts down all
three channels when the nominal die temperature
reaches 135°C. Normal operation resumes when the
die temperature drops by 30°C.
The CL320/CL325/CL330 are available in the 8-lead
SOIC (with heat slug) package and require a single
ceramic bypass capacitor which may be shared among
several drivers.
Package Type
8-lead SOIC
with heat slug
(Top view)
EN1
GND
EN2
EN3
VIN
OUT3
OUT1
OUT2
Underside plate
is ground
See Table 2-1 for pin information.
3-Channel Linear LED Drivers
CL320/CL325/CL330
DS20005599A-page 2 2017 Microchip Technology Inc.
Functional Block Diagram
V
DD
6.5 - 90V
CL320/CL325/CL330
REG
1
2
3
8765
4
C
IN
100 nF
EN1
EN2
EN3
OUT1 OUT2 OUT3
GND
VIN
Host
Controller
and Typical Application Circuit
2017 Microchip Technology Inc. DS20005599A-page 3
CL320/CL325/CL330
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings†
Supply Voltage, VIN ................................................................................................................................–0.5V to +100V
Output Voltage, VOUT .............................................................................................................................–0.5V to +100V
Enable Voltage, VEN.................................................................................................................................–0.5V to +6.5V
Minimum Operating Junction Temperature, TJ (Note 1) .......................................................................................–40°C
Storage Temperature, TS .....................................................................................................................–65°C to +150°C
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only, and functional operation of the device at those or any other conditions above those
indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note 1: Maximum junction temperature internally limited
RECOMMENDED OPERATING CONDITIONS
Electrical Specifications: All voltages with respect to GND pin
Parameter Sym. Min. Typ. Max. Unit Conditions
Supply Voltage VIN 6.5 —90 V
Output Voltage VOUT 4 — 15 VEN = 0
90 EN = 1
Enable Toggling Frequency fEN 0 — 100 kHz
Operating Junction
Temperature TJ–40 — — °C
VIN Capacitor CIN —100 —nF
ELECTRICAL CHARACTERISTICS
Electrical Specifications: Over recommended operating conditions. TA = 25°C unless otherwise noted.
Parameter Sym. Min. Typ. Max. Unit Conditions
VIN Supply Current IIN
—220 250 µA EN1-3 = 1
—2.2 2.3 mA EN1-3 = 0
Output Current, Off IOUT(OFF) — 4 10 µA ENX = 1
Output Current, On
CL320
IOUT(ON)
— — 21.2
mA
ENX = 0, VOUT = 0V–4V
18.8 20 21.2 ENX = 0, VOUT = 4V–15V
18 20 22 ENX = 0, VOUT = 15V–90V
CL325
— — 26.5 ENX = 0, VOUT = 0V–4V
23.5 25 26.5 ENX = 0, VOUT = 4V–15V
22.5 25 27.5 ENX = 0, VOUT = 15V–90V
CL330
— — 31.8 ENX = 0, VOUT = 0V–4V
28.2 30 31.8 ENX = 0, VOUT = 4V–15V
27 30 33 ENX = 0, VOUT = 15V–90V
Enable Voltage, On VEN(ON) — — 0.8 V
Enable Voltage, Off VEN(OFF) 2.4 — — V
Enable Input Capacitance CEN — 5 10 pF
CL320/CL325/CL330
DS20005599A-page 4 2017 Microchip Technology Inc.
Enable Low Input Current IENL — — 1 µA VEN = 0V
Enable High Input Current IENH — — 1 µA VEN = 5V
Enable on Delay tON — 2 2.4 µs
Output Current Rise Time tRISE — 1 1.2 µs
Enable Off Delay tOFF —440 800 ns
Output Current Fall Time tFALL —170 250 ns
TEMPERATURE SPECIFICATIONS
Parameter Sym. Min. Typ. Max. Unit Conditions
TEMPERATURE RANGE
Operating Junction Temperature TJ–40 — — °C
Storage Temperature TS–65 —+150 °C
Overtemperature Limit TLIM +120 +135 +150 °C
Overtemperature Hysteresis THYST —30 —°C
PACKAGE THERMAL RESISTANCE
8-lead SOIC (with heat slug) JA —84 —°C/W Note 1
Note 1: Mounted on JEDEC test PCB (2s 2p)
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Over recommended operating conditions. TA = 25°C unless otherwise noted.
Parameter Sym. Min. Typ. Max. Unit Conditions
2017 Microchip Technology Inc. DS20005599A-page 5
CL320/CL325/CL330
Timing Waveforms
t
RISE
t
FALL
90% I
OUT(ON)
EN
IOUT
V
EN(ON)
t
ON
t
OFF
10% I
OUT(ON)
90%
10%
V
EN(OFF)
Temperature Effects
1.00
1.05
0.95
-50 0 50 100 150
Junction Temperature (OC)
0.90
0.85
0.80
Current (normalized to 25
O
C)
12025-40
0 5 10 15 20 40 60 80 100
scale change
I
OUT
(normalized to nominal)
1.20
1.00
0.80
0.60
0.40
0.20
0
V
OUT
(V)
CL320/CL325/CL330
DS20005599A-page 6 2017 Microchip Technology Inc.
Load Regulation
Recommended PCB Layout
Underside plate soldered
to copper area.
Exposed copper area
may be plated.
1cm2 exposed copper
1cm2 exposed copper
2017 Microchip Technology Inc. DS20005599A-page 7
CL320/CL325/CL330
2.0 PIN DESCRIPTION
The pin details of CL320/CL325/CL330 are listed on
Table 2-1. Refer to Package Type for the location of
the pins.
TABLE 2-1: PIN FUNCTION TABLE
Pin Number Pin Name Description
1EN1
Output enable, active low
2EN2
3EN3
4 GND Circuit common
5OUT3
Constant current output (sinking). Connect the cathodes of the LEDs to these pins.6OUT2
7OUT1
8VIN Supply voltage 6.5V to 90V. Bypass locally with a 100 nF capacitor to ground.
Underside
Plate GND
The exposed underside plate is internally connected to the GND pin. The plate may
either be left floating or connected to ground. Solder the plate to an exposed copper
area on the PCB for heatsinking purposes. (See Recommended PCB Layout.)
CL320/CL325/CL330
DS20005599A-page 8 2017 Microchip Technology Inc.
3.0 DETAILED DESCRIPTION
3.1 Higher LED Current
By paralleling outputs, higher LED currents can be
achieved. In addition, linear dimming in three discrete
steps may be obtained by enabling 1, 2 or 3 outputs.
V
DD
V
LL
CL320/CL325/CL330
1
2
3
8765
4
C
IN
100 nF
EN1
EN2
EN3
OUT1 OUT2 OUT3
GND
VIN
Host
Controller
REG
FIGURE 3-1: Paralleling Outputs of the CL320/CL325/CL330 LED Drivers.
3.2 Lower Power Dissipation in the
CL320/CL325/CL330
Power dissipation in the CL320/Cl325/Cl330 can be
lowered in multiple ways. The following figures indicate
some of the possible means to reduce power
dissipation in the IC. Refer to Figure 3-2, Figure 3-3
and Figure 3-4.
V
DD
1
2
3
8765
4
C
IN
100nF
V
IN
V
LL
REG
EN1
EN2
EN3
OUT1 OUT2 OUT3
GND
VIN
Host
Controller
CL320/CL325/CL330
FIGURE 3-2: Using a Separate Voltage Source for VIN that is lower than VLL.
VDD
1
2
3
8765
4
V
LL
R
DROP
RDROP <
VLL(MIN) - 6.5V
2.3mA
where: RDROP = Dropping resistance
VLL(MIN) = minimum supply voltage
C
IN
100nF
EN1
EN2
EN3
OUT1 OUT2 OUT3
GND
VIN
Host
Controller
REG
CL320/CL325/CL330
2017 Microchip Technology Inc. DS20005599A-page 9
CL320/CL325/CL330
FIGURE 3-3: Using an External Resistor in Series with the VIN pin.
VDD
1
2
3
8765
4
VLL
Z
DROP
VZ < (VLL(MIN) - 6.5V)
where: VZ = Zener voltage
VLL(MIN) = minimum supply voltage
CIN
100nF
EN1
EN2
EN3
OUT1 OUT2 OUT3
GND
VIN
Host
Controller
REG
CL320/CL325/CL330
FIGURE 3-4: Using an External Zener Diode in Series with the VIN pin.
CL320/CL325/CL330
DS20005599A-page 10 2017 Microchip Technology Inc.
4.0 PACKAGING INFORMATION
4.1 Package Marking Information
Legend: XX...X Product Code or Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for product code or customer-specific information. Package may or
not include the corporate logo.
3
e
3
e
8-lead SOIC
NNN
XXXXXXX
YYWW
e3
Example
715
CL320SG
1726
e3
Example
657
CL330SG
1795
e3
Example
815
CL325SG
1722
e3
8-Lead SOIC (Narrow Body w/Heat Slug) Package Outline (SG)
4.90x3.90mm body, 1.70mm height (max), 1.27mm pitch
Symbol A A1 A2 b D D1 E E1 E2 e h L L1 L2 șș
Dimension
(mm)
MIN 1.25* 0.00 1.25 0.31 4.80* 3.30†5.80* 3.80* 2.29†
1.27
BSC
0.25 0.40
1.04
REF
0.25
BSC
0O5O
NOM----4.90 - 6.00 3.90 - - - - -
MAX 1.70 0.15 1.55* 0.51 5.00* 3.81†6.20* 4.00* 2.79†0.50 1.27 8O15O
JEDEC Registration MS-012, Variation BA, Issue E, Sept. 2005.
7KLVGLPHQVLRQLVQRWVSHFL¿HGLQWKH-('(&GUDZLQJ
7KLVGLPHQVLRQGLIIHUVIURPWKH-('(&GUDZLQJ
Drawings not to scale.
D
Seating
Plane
Gauge
Plane
L
L1
L2
Top View
Side View View A - A View B
View B
θ1
θ
E1 E
AA2
A1
A
A
Seating
Plane
eb
h
h
8
1
D1
E2
Bottom View
Exposed
Thermal
Pad Zone
Note 1
Note 1
(Index Area
D/2 x E1/2)
8
1
Note:
1. ,IRSWLRQDOFKDPIHUIHDWXUHLVQRWSUHVHQWD3LQLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWL¿HUFDQEHDPROGHGPDUN
LGHQWL¿HUDQHPEHGGHGPHWDOPDUNHURUDSULQWHGLQGLFDWRU
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
2017 Microchip Technology Inc. DS20005599A-page 11
CL320/CL325/CL330
CL320/CL325/CL330
DS20005599A-page 12 2017 Microchip Technology Inc.
NOTES:
2017 Microchip Technology Inc. DS20005599A-page 13
CL320/CL325/CL330
APPENDIX A: REVISION HISTORY
Revision A (May 2017)
• Consolidated and converted Supertex
Doc# DSFP-CL320, Doc# DSFP-CL325 and
Doc# DSFP-CL330 to Microchip DS20005599A
• Changed package marking format
• Changed the quantity of the SG package from
2500/Reel to 3300/Reel
• Made minor text changes throughout the docu-
ment
CL320/CL325/CL330
DS20005599A-page 14 2017 Microchip Technology Inc.
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
a) CL320SG-G: 3-Channel, 20 mA Linear LED Driver,
8-lead SOIC Package, 3300/Reel
b) CL325SG-G: 3-Channel, 25 mA Linear LED Driver,
8-lead SOIC Package, 3300/Reel
c) CL330SG-G: 3-Channel, 30 mA Linear LED Driver,
8-lead SOIC Package, 3300/Reel
PART NO.
Device
Devices: CL320 = 3-Channel, 20 mA Linear LED Driver
CL325 = 3-Channel, 25 mA Linear LED Driver
CL330 = 3-Channel, 30 mA Linear LED Driver
Package: SG = 8-lead SOIC (with Heat Slug)
Environmental: G = Lead (Pb)-free/RoHS-compliant Package
Media Type: (blank) = 3300/Reel for an SG Package
XX
Package
-
X - X
Environmental
Media Type
Options
2017 Microchip Technology Inc. DS20005599A-page 15
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2017, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-1719-4
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITYMANAGEMENTS
YSTEM
CERTIFIEDBYDNV
== ISO/TS16949==
DS20005599A-page 16 2017 Microchip Technology Inc.
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Raleigh, NC
Tel: 919-844-7510
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
ASIA/PACIFIC
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Dongguan
Tel: 86-769-8702-9880
China - Guangzhou
Tel: 86-20-8755-8029
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-3326-8000
Fax: 86-21-3326-8021
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
ASIA/PACIFIC
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
Finland - Espoo
Tel: 358-9-4520-820
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
France - Saint Cloud
Tel: 33-1-30-60-70-00
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Tel: 49-2129-3766400
Germany - Heilbronn
Tel: 49-7131-67-3636
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Rosenheim
Tel: 49-8031-354-560
Israel - Ra’anana
Tel: 972-9-744-7705
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Padova
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-7289-7561
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Worldwide Sales and Service
11/07/16
