CSPEMI205 3 Channel Headset EMI Filter with ESD Protection Features Product Description * The CSPEMI205 is a low-pass filter array integrating three pi-style filters (C-R-C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This device is custom-designed to interface with the headset port on a cellular telephone, and contains two different filter values. Each high quality filter provides more than 30dB attenuation in the 800-2700 MHz range. These pi-style filters support bidirectional filtering, controlling EMI both to and from the microphone and speaker elements. They also support bipolar signals, enabling audio signals to pass through without distortion. * * * * * * * Three channels of EMI filtering, two for earpiece speakers and one for a microphone Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network Chip Scale Package features extremely low parasitic inductance for optimum filter performance Greater than 30dB relative attenuation in the 8002700MHz range +8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +15kV ESD protection on each channel (HBM) 8-bump, 1.41mm X 1.45mm footprint Chip Scale Package (CSP) Lead-free version available Applications * * * * * * EMI filtering and ESD protection for headset microphone and speaker Cellular / Mobile Phones Notebooks and Personal Computers Handheld PCs / PDAs / Tablets Wireless Handsets Digital Camcorders In addition, the CSPEMI205 provides a very high level of protection for sensitive electronic components that may be subject to electrostatic discharge (ESD). The input pins are designed and characterized to safely dissipate ESD strikes of +8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than +15kV. The CSPEMI205 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight. The CSPEMI205 is available in a spacesaving, low-profile Chip Scale Package with optional lead-free finishing. Electrical Schematic 10 68 C5 Microphone Output 47pF 100pF 100pF Microphone A5 Input 47pF C1 Earpiece 1 Output Earpiece 1 A1 Input 10 Earpiece 2 A3 Input Earpiece 2 Output 100pF 100pF C3 GND GND B2 B4 (c) 2003 California Micro Devices Corp. All rights reserved. 10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 1 CSPEMI205 PACKAGE / PINOUT DIAGRAMS TOP VIEW (Bumps Down View) 1 2 3 4 5 A B AF MIC_IN EAR2_IN EAR1_IN A5 A3 A1 GND GND B4 B2 Orientation Marking A1 Orientation Marking (se note 2) BOTTOM VIEW (Bumps Up View) MIC_OUT EAR2_OUT EAR1_OUT C C5 C3 C1 CSPEMI205 CSP Package Note: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS PIN NAME A1 EAR1_IN DESCRIPTION Earpiece Input 1 (from audio circuitry) A3 EAR2_IN Earpiece Input 2 (from audio circuitry) A5 MIC_IN Microphone Input (from microphone) B2 GND Device Ground B4 GND Device Ground C1 EAR1_OUT Earpiece Output 1 (to earpiece) C3 EAR2_OUT Earpiece Output 2 (to earpiece) C5 MIC_OUT Microphone Output (to audio circuitry) Ordering Information PART NUMBERING INFORMATION Lead-free Finish 2 Standard Finish Ordering Part Ordering Part Bumps Package Number1 Part Marking Number1 Part Marking 8 CSP CSPEMI205 AF CSPEMI205G AF Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. (c) 2003 California Micro Devices Corp. All rights reserved. 2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 10/09/03 CSPEMI205 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 C DC Power per Resistor 100 mW DC Package Power Rating 300 mW RATING UNITS -40 to +85 C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL MIN TYP MAX UNITS R1 PARAMETER Resistance CONDITIONS 9 10 11 R2 Resistance 54 68 75 C1 Capacitance 80 100 120 pF C2 Capacitance 38 47 57 pF 1.0 A 15 -15 V V ILEAK Diode Leakage Current VIN=5.0V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Notes 2,4 and 5 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2,3,4 and 5 fC1 Cut-off frequency 1; Note 6 fC2 Cut-off frequency 2; Note 6 VESD VCL 5 -5 7 -10 15 kV 8 kV +15 -19 V V R = 10, C = 100pF 34 MHz R = 68, C = 47pF 63 MHz Note 1: TA=25C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: The parameters are guaranteed by design. Note 6: ZSOURCE=50, ZLOAD =50 (c) 2003 California Micro Devices Corp. All rights reserved. 10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 3 CSPEMI205 Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. Earpiece Circuit (A1-C1) EMI Filter Performance Figure 2. Earpiece Circuit (A3-C3) EMI Filter Performance (c) 2003 California Micro Devices Corp. All rights reserved. 4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 10/09/03 CSPEMI205 Performance Information (cont'd) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 3. Microphone Circuit (A5-C5) EMI Filter Performance (c) 2003 California Micro Devices Corp. All rights reserved. 10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 5 CSPEMI205 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.125 - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance -- Edge To Corner Ball +50m Solder Ball Side Coplanarity +20m Maximum Dwell Time Above Liquidous 60 seconds Soldering Maximum Temperature 260C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 4. Recommended Non-Solder Mask Defined Pad Illustration Temperature (C) 250 200 150 100 50 0 Figure 5. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile (c) 2003 California Micro Devices Corp. All rights reserved. 6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 10/09/03 CSPEMI205 Mechanical Details CSP Mechanical Specifications Mechanical Package Diagrams CSPEMI205 devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. BOTTOM VIEW A1 SIDE VIEW C1 B4 B3 B1 C Package Custom CSP Bumps 8 Millimeters B A 1 2 3 4 5 Inches Min Nom Max A1 1.405 1.450 1.495 0.0553 0.0571 0.0589 A2 1.365 1.410 1.455 0.0537 0.0555 0.0573 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.175 0.225 0.275 0.0069 0.0089 0.0108 C2 0.220 0.270 0.320 0.0087 0.0106 0.0126 D1 0.561 0.605 0.649 0.0221 0.0238 0.0255 D2 0.355 0.380 0.405 0.0140 0.0150 0.0159 # per tape and reel Min Nom C2 Dim A2 PACKAGE DIMENSIONS Max 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS D1 D2 DIMENSIONS IN MILLIMETERS Package Dimensions for CSPEMI205 Chip Scale Package 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CSPEMI205 1.45 X 1.41 X 0.6 1.55 X 1.52 X 0.71 8mm 178mm (7") 3500 4mm 4mm 10 Pitches cumulative tolerance on tape 0.2 mm Po Top Cover Tape Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment Center lines of cavity P1 User direction of feed Figure 7. Tape and Reel Mechanical Data (c) 2003 California Micro Devices Corp. All rights reserved. 10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 7