© 2003 California Micro Devices Corp. All rights reserved.
10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 1
CSPEMI205
3 Channel Headset EMI Filter with ESD Protection
Features
• Three channels of EMI filtering, two for earpiece
speakers and one for a microphone
• Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network
• Chip Scale Package features extremely low para-
sitic inductance for optimum filter performance
• Greater than 30dB relative attenuation in the 800-
2700MHz range
•+8kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
•+15kV ESD protection on each channel (HBM)
• 8-bump, 1.41mm X 1.45mm footprint
Chip Scale Package (CSP)
• Lead-free version available
Applications
• EMI filtering and ESD protection for headset micro-
phone and speaker
• Cellular / Mobile Phones
• Notebooks and Personal Computers
• Handheld PCs / PDAs / Tablets
• Wireless Handsets
• Digital Camcorders
Product Description
The CSPEMI205 is a low-pass filter array integrating
three pi-style filters (C-R-C) that reduce EMI/RFI emis-
sions while at the same time providing ESD protection.
This device is custom-designed to interface with the
headset port on a cellular telephone, and contains two
different filter values. Each high quality filter provides
more than 30dB attenuation in the 800-2700 MHz
range. These pi-style filters support bidirectional filter-
ing, controlling EMI both to and from the microphone
and speaker elements. They also support bipolar sig-
nals, enabling audio signals to pass through without
distortion.
In addition, the CSPEMI205 provides a very high level
of protection for sensitive electronic components that
may be subject to electrostatic discharge (ESD). The
input pins are designed and characterized to safely dis-
sipate ESD strikes of +8kV, the maximum requirement
of the IEC 61000-4-2 international standard. Using the
MIL-STD-883 (Method 3015) specification for Human
Body Model (HBM) ESD, the device provides protec-
tion for contact discharges to greater than +15kV.
The CSPEMI205 is particularly well suited for portable
electronics (e.g., cellular telephones, PDAs, notebook
computers) because of its small package format and
low weight. The CSPEMI205 is available in a space-
saving, low-profile Chip Scale Package with optional
lead-free finishing.
Electrical Schematic
10
Ω
100pF
100pF
Earpiece 1
A3
B4
C1
C3 B2
GND
GND
A1
10
Ω
Input
Earpiece 2
Input
Earpiece 1
Output
Earpiece 2
Output
100pF
100pF
68
Ω
47pF
47pF
Microphone C5A5
Input
Microphone
Output
© 2003 California Micro Devices Corp. All rights reserved.
2430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 10/09/03
CSPEMI205
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN NAME DESCRIPTION
A1 EAR1_IN Earpiece Input 1 (from audio circuitry)
A3 EAR2_IN Earpiece Input 2 (from audio circuitry)
A5 MIC_IN Microphone Input (from microphone)
B2 GND Device Ground
B4 GND Device Ground
C1 EAR1_OUT Earpiece Output 1 (to earpiece)
C3 EAR2_OUT Earpiece Output 2 (to earpiece)
C5 MIC_OUT Microphone Output (to audio circuitry)
MIC_OUT EAR2_OUT EAR1_OUT
GND GND
MIC_IN EAR2_IN EAR1_IN
C3C5
Orientation
Marking
C1
B2B4
A1A3A5
A1
AF
53142
C
B
A
Orientation
Marking
(se note 2)
PACKAGE / PINOUT DIAGRAMS
Note:
TOP VIEW
CSPEMI205
CSP Package
BOTTOM VIEW
(Bumps Down View) (Bumps Up View)
1) These drawings are not to scale.
2)
Lead-free devices are specified by using a "+" character for the top side orientation mark.
PART NUMBERING INFORMATION
Bumps Package
Standard Finish Lead-free Finish2
Ordering Part
Number1Part Marking
Ordering Part
Number1Part Marking
8 CSP CSPEMI205 AF CSPEMI205G AF
© 2003 California Micro Devices Corp. All rights reserved.
10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 3
CSPEMI205
Specifications
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,
then clamping voltage is measured at Pin C1.
Note 4: Unused pins are left open
Note 5: The parameters are guaranteed by design.
Note 6: ZSOURCE=50Ω, ZLOAD=50Ω
ABSOLUTE MAXIMUM RATINGS
PARAMETER RATING UNITS
Storage Temperature Range -65 to +150 °C
DC Power per Resistor 100 mW
DC Package Power Rating 300 mW
STANDARD OPERATING CONDITIONS
PARAMETER RATING UNITS
Operating Temperature Range -40 to +85 °C
ELECTRICAL OPERATING CHARACTERISTICS1
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
R1Resistance 9 10 11 Ω
R2Resistance 54 68 75 Ω
C1 Capacitance 80 100 120 pF
C2 Capacitance 38 47 57 pF
ILEAK Diode Leakage Current VIN=5.0V 1.0 µA
VSIG Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
5
-5
7
-10
15
-15
V
V
VESD In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Notes 2,4 and 5
±15
±8
kV
kV
VCL Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Notes 2,3,4 and 5
+15
-19
V
V
fC1 Cut-off frequency 1; Note 6 R = 10Ω, C = 100pF 34 MHz
fC2 Cut-off frequency 2; Note 6 R = 68Ω, C = 47pF 63 MHz
© 2003 California Micro Devices Corp. All rights reserved.
4430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 10/09/03
CSPEMI205
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. Earpiece Circuit (A1-C1) EMI Filter Performance
Figure 2. Earpiece Circuit (A3-C3) EMI Filter Performance
© 2003 California Micro Devices Corp. All rights reserved.
10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 5
CSPEMI205
Performance Information (cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 3. Microphone Circuit (A5-C5) EMI Filter Performance
© 2003 California Micro Devices Corp. All rights reserved.
6430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 10/09/03
CSPEMI205
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
Figure 4. Recommended Non-Solder Mask Defined Pad Illustration
Figure 5. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 6. Lead-free (SnAgCu) Solder
Ball Reflow Profile
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER VALUE
Pad Size on PCB 0.275mm Round
Pad Definition Non-Solder Mask defined pads
Solder Mask Opening 0.325mm Round
Solder Stencil Thickness 0.125 - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round
Solder Flux Ratio 50/50 by volume
Solder Paste Type No Clean
Pad Protective Finish OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball +50µm
Solder Ball Side Coplanarity +20µm
Maximum Dwell Time Above Liquidous 60 seconds
Soldering Maximum Temperature 260°C
Solder Mask Opening
0.325mm DIA.
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
200
250
150
100
50
0 1:00.0 2:00.0 3:00.0 4:00.0
Time (minutes)
Temperature (°C)
© 2003 California Micro Devices Corp. All rights reserved.
10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 7
CSPEMI205
Mechanical Details
CSP Mechanical Specifications
CSPEMI205 devices are packaged in a custom Chip
Scale Package (CSP). Dimensions are presented
below. For complete information on CSP packaging,
see the California Micro Devices CSP Package Infor-
mation document.
Package Dimensions for CSPEMI205
Chip Scale Package
CSP Tape and Reel Specifications
Figure 7. Tape and Reel Mechanical Data
PACKAGE DIMENSIONS
Package Custom CSP
Bumps 8
Dim Millimeters Inches
Min Nom Max Min Nom Max
A1 1.405 1.450 1.495 0.0553 0.0571 0.0589
A2 1.365 1.410 1.455 0.0537 0.0555 0.0573
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.245 0.250 0.255 0.0096 0.0098 0.0100
B3 0.430 0.435 0.440 0.0169 0.0171 0.0173
B4 0.430 0.435 0.440 0.0169 0.0171 0.0173
C1 0.175 0.225 0.275 0.0069 0.0089 0.0108
C2 0.220 0.270 0.320 0.0087 0.0106 0.0126
D1 0.561 0.605 0.649 0.0221 0.0238 0.0255
D2 0.355 0.380 0.405 0.0140 0.0150 0.0159
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
A
B
C
135
DIMENSIONS IN MILLIMETERS
D1
D2
A2
BOTTOM VIEW
SIDE
VIEW
24
C1
B1
A1
B3
C2
B4
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
SOLDER BUMPS
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
PART NUMBER CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL P0P1
CSPEMI205 1.45 X 1.41 X 0.6 1.55 X 1.52 X 0.71 8mm 178mm (7") 3500 4mm 4mm
To p
For tape feeder reference
Cover
Ta pe
P
1
only including draft.
Concentric around B.
K
o
Embossment
User direction of feed
±
0.2 mm
P
o
Center lines
of cavity
W
10 Pitches cumulative
tolerance on tape
A
o
B
o
