DATA SHEET
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
PHOTOCOUPLER
PS8501,PS8501L1,PS8501L2,PS8501L3
HIGH SPEED ANALOG OUTPUT TYPE
8 mm CREEPAGE 8-PIN PHOTOCOUPLER −NEPOC Series−
Document No. PN10656EJ04V0DS (4th edition)
Date Published September 2009 NS
Printed in Japan
2007, 2009
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
DESCRIPTION
The PS8501, PS8501L1, PS8501L2 and PS8501L3 are 8-pin high speed photocouplers containing a GaAIAs LED
on input side and a PN photodiode and a high speed amplifier transistor on output side on one chip. The PS8501 is in
a plastic DIP (Dual In-line Package) with 8 mm creepage distance product.
The PS8501L1 is lead bending type for long creepage distance.
The PS8501L2 is lead bending type for long creepage distance (Gull-wing) for surface mount.
The PS8501L3 is lead bending type (Gull-wing) for surface mounting.
FEATURES
• Long creepage distance (8 mm MIN.: PS8501L1, PS8501L2)
• High supply voltage (VCC = 35 V MAX.)
• High speed response (tPHL, tPLH = 0.8
μ
s MAX.)
• High isolation voltage (BV = 5 000 Vr.m.s.)
• TTL, CMOS compatible with a resistor
• Ordering number of tape product: PS8501L2-E3: 1 000 pcs/reel
: PS8501L3-E3: 1 000 pcs/reel
• Pb-Free product
• Safety standards
• UL approved: No. E72422
• CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950)
• BSI approved: No. 8937, 8938
• SEMKO approved: No. 615433
• NEMKO approved: No. P06207243
• DEMKO approved: No. 314091
• FIMKO approved: No. FI 22827
• DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40019182 (Option)
APPLICATIONS
• Interface for measurement or control equipment
• Substitutions for relays and pulse transformers
• Modem, communications device
• General purpose inverter
PIN CONNECTION
(Top View)
1. NC
2. Anode
3. Cathode
4. NC
5. Emitter
6. V
O
7. Base
8. V
CC
12 43
6587
<R>
<R>
Data Sheet PN10656EJ04V0DS
2
PS8501,PS8501L1,PS8501L2,PS8501L3
PACKAGE DIMENSIONS (UNIT: mm)
DIP Type
PS8501
9.25+0.5
–0.25
6.5+0.5
–0.1
0 to 15°
7.62
2.54
1.01+0.4
–0.2
0.5±0.15
0.84±0.15
0.25
M
3.5±0.2
4.15±0.32.8 MIN.
Lead Bending Type (Gull-wing) For Surface Mount
PS8501L3
6.5+0.5
–0.1
9.65±0.4
0.74±0.25
0.635±0.15
2.54
3.5±0.2
1.01+0.4
–0.2
9.25+0.5
–0.25
0.5±0.15
0.25
M
<R>
Data Sheet PN10656EJ04V0DS 3
PS8501,PS8501L1,PS8501L2,PS8501L3
Lead Bending Type For Long Creepage Distance
PS8501L1
9.25
+0.5
–0.25
6.5
+0.5
–0.1
0 to 15°
10.16
2.54
3.5±0.2
3.87±0.42.8 MIN.
1.01
+0.4
–0.2
0.5±0.15
0.25
M
0.84±0.15
Lead Bending Type For Long Creepage Distance (Gull-wing) For Surface Mount
PS8501L2
9.25
+0.5
–0.25
6.5+0.5
–0.1
11.8±0.4
2.54
3.5±0.2
1.01+0.4
–0.2
0.9±0.25
0.25±0.2
0.5±0.15
0.25
M
Data Sheet PN10656EJ04V0DS
4
PS8501,PS8501L1,PS8501L2,PS8501L3
PHOTOCOUPLER CONSTRUCTION
Parameter PS8501, PS8501L3 PS8501L1, PS8501L2
Air Distance (MIN.) 7 mm 8 mm
Outer Creepage Distance (MIN.) 7 mm 8 mm
Isolation Distance (MIN.) 0.4 mm 0.4 mm
MARKING EXAMPLE
8501
N 931
No. 1 pin
Mark Type Number
Assembly Lot
Year Assembled
(Last 1 Digit)
931
N
Rank Code
In-house Code
(L or T)
Week Assembled
<R>
Data Sheet PN10656EJ04V0DS 5
PS8501,PS8501L1,PS8501L2,PS8501L3
ORDERING INFORMATION
Part Number Order Number Solder Plating
Specification
Packing Style Safety Standard
Approval
Application Part
Number*1
PS8501 PS8501-AX Pb-Free Magazine case 50 pcs Standard products PS8501
PS8501L1 PS8501L1-AX (Ni/Pd/Au) (UL, CSA, BSI, PS8501L1
PS8501L2 PS8501L2-AX SEMKO, NEMKO, PS8501L2
PS8501L3 PS8501L3-AX DEMKO, FIMKO PS8501L3
PS8501L2-E3 PS8501L2-E3-AX Embossed Tape 1 000 pcs/reel approved) PS8501L2
PS8501L3-E3 PS8501L3-E3-AX PS8501L3
PS8501-V PS8501-V-AX Magazine case 50 pcs DIN EN60747-5-2 PS8501
PS8501L1-V PS8501L1-V-AX (VDE0884 Part2) PS8501L1
PS8501L2-V PS8501L2-V-AX Approved (Option) PS8501L2
PS8501L3-V PS8501L3-V-AX PS8501L3
PS8501L2-V-E3 PS8501L2-V-E3-AX
Embossed Tape 1 000 pcs/reel PS8501L2
PS8501L3-V-E3 PS8501L3-V-E3-AX PS8501L3
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter Symbol Ratings Unit
Diode Forward Current *1 IF 25 mA
Reverse Voltage VR 5 V
Detector Supply Voltage VCC 35 V
Output Voltage VO 35 V
Output Current IO 8 mA
Power Dissipation *2 PC 100 mW
Isolation Voltage*3 BV 5 000 Vr.m.s.
Operating Ambient Temperature TA −55 to +100 °C
Storage Temperature Tstg −55 to +125 °C
*1 Reduced to 0.33 mA/°C at TA = 70°C or more.
*2 Reduced to 2.0 mW/°C at TA = 75°C or more.
*3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Pins 1-4 shorted together, 5-8 shorted together.
Data Sheet PN10656EJ04V0DS
6
PS8501,PS8501L1,PS8501L2,PS8501L3
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Parameter Symbol Conditions MIN. TYP.*1 MAX. Unit
Diode Forward Voltage VF IF = 16 mA 1.7 2.2 V
Reverse Current IR VR = 3 V 10
μ
A
Forward Voltage
Temperature Coefficent
Δ
VF/
Δ
TA IF = 16 mA −2.1 mV/°C
Terminal Capacitance Ct V = 0 V, f = 1 MHz 30 pF
Detector High Level Output Current IOH (1) IF = 0 mA, VCC = VO = 5.5 V 3 500 nA
High Level Output Current IOH (2) IF = 0 mA, VCC = VO = 35 V 100
μ
A
Low Level Output Voltage VOL IF = 16 mA, VCC = 4.5 V, IO = 2.4 mA 0.15 0.4 V
Low Level Supply Current ICCL IF = 16 mA, VO = Open, VCC = 35 V 150
μ
A
High Level Supply Current ICCH IF = 0 mA, VO = Open, VCC = 35 V 0.01 1
μ
A
DC Current Gain hFE VO = 5 V, IO = 3 mA 65
Coupled Current Transfer Ratio CTR IF = 16 mA, VCC = 4.5 V, VO = 0.4 V 15 %
Isolation Resistance RI-O VI-O = 1 kVDC 1011 Ω
Isolation Capacitance CI-O V = 0 V, f = 1 MHz 0.7 pF
Propagation Delay Time tPHL IF = 16 mA, VCC = 5 V, RL = 1.9 kΩ 0.22 0.8
μ
s
(H → L)*2
Propagation Delay Time tPLH IF = 16 mA, VCC = 5 V, RL = 1.9 kΩ 0.35 0.8
μ
s
(L → H)*2
*1 Typical values at TA = 25°C
*2 Test circuit for propagation delay time
18
27
36
45
I
F
51 Ω
V
CC
= 5 V
(Monitor)
V
O
R
L
C
L
= 15 pF
0.1
F
μ
Input
Output
Pulse Input
I
F
Monitor
PW = 100 s
Duty Cycle = 1/10
μ
()
50%
1.5 V
5 V
V
OL
t
PHL
t
PLH
Remark C
L includes probe and stray wiring capacitance.
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static
electricity when handling.
2. By-pass capacitor of more than 0.1
μ
F is used between VCC and GND near device. Also, ensure that the
distance between the leads of the photocoupler and capacitor is no more than 10 mm.
3. Pins 1, 4 (which is an NC*1 pin) can either be connected directly to the GND pin on the LED side or left open.
Unconnected pins should not be used as a bypass for signals or for any other similar purpose because this may
degrade the internal noise environment of the device.
*1 NC: Non-Connection (No Connection)
4. Avoid storage at a high temperature and high humidity.
<R>
<R>
Data Sheet PN10656EJ04V0DS 7
PS8501,PS8501L1,PS8501L2,PS8501L3
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
Ambient Temperature T
A
(°C)
Maximum Forward Current I
F
(mA)
MAXIMUM FORWARD CURRENT
vs. AMBIENT TEMPERATURE
30
20
25
10
15
5
0 25 50 75 100 125
Ambient Temperature T
A
(°C)
Detector Power Dissipation P
C
(mW)
DETECTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
120
80
40
0 25 50 75 100 125
100
60
20
Output Voltage V
O
(V)
Output Current I
O
(mA)
OUTPUT CURRENT vs.
OUTPUT VOLTAGE
Forward Current I
F
(mA)
Current Transfer Ratio CTR (%)
CURRENT TRANSFER RATIO
vs. FORWARD CURRENT
V
CC
= 4.5 V,
V
O
= 0.4 V
50
40
30
20
10
0
0.1 0.5 1 5 10 50 100
Forward Voltage V
F
(V)
Forward Current I
F
(mA)
FORWARD CURRENT vs.
FORWARD VOLTAGE
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
0.01
0.1
1.0
10
100
T
A
= +100°C
+85°C
+50°C
+25°C
0°C
–20°C
–40°C
Ambient Temperature T
A
(°C)
Normalized Current Transfer Ratio CTR
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
–75 –50 –25 0 25 50 75 100 125
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Normalized to 1.0
at T
A
= 25°C,
I
F
= 16 mA, V
CC
= 4.5 V,
V
O
= 0.4 V
12
10
4
8
6
2
048 1820162 6 10 12 14
I
F
= 25 mA
20 mA
15 mA
10 mA
5 mA
Remark The graphs indicate nominal characteristics.
<R>
Data Sheet PN10656EJ04V0DS
8
PS8501,PS8501L1,PS8501L2,PS8501L3
Ambient Temperature T
A
(°C)
High Level Output Current I
OH
(nA)
HIGH LEVEL OUTPUT CURRENT
vs. AMBIENT TEMPERATURE
Load Resistance R
L
(kΩ)
Propagation Delay Time t
PHL
, t
PLH
( s)
PROPAGATION DELAY TIME,
vs. LORD RESISTANCE
10
1
0.1 10 100
1
1 000
1
0.1
100
10
50 100–25 0 25 75
Ambient Temperature T
A
(°C)
PROPAGATION DELAY TIME,
vs. AMBIENT TEMPERATURE
Propagation Delay Time t
PHL
, t
PLH
( s)
t
PHL
t
PLH
V
CC
= 5 V,
I
F
= 16 mA,
R
L
= 1.9 kΩ
–50 –25 0 25 50 75 100 125
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Forward Current I
F
(mA)
Output Voltage V
O
(V)
OUTPUT VOLTAGE vs.
FORWARD CURRENT
6
7
5
4
2
0
3
1
12 16 20
4826
10 14 18
V
CC
= 5 V
R
L
V
CC
I
F
5.5 kΩ
R
L
= 1.9 kΩ
12 kΩ
I
F
= 0 mA
V
CC
= V
O
= 35 V
V
CC
= V
O
= 5.5 V
V
CC
= 5 V,
I
F
= 16 mA
t
PLH
t
PHL
Remark The graphs indicate nominal characteristics.
Data Sheet PN10656EJ04V0DS 9
PS8501,PS8501L1,PS8501L2,PS8501L3
TAPING SPECIFICATIONS (UNIT: mm)
2.05±0.05
2.0±0.1
4.0±0.1
1.75±0.1
24.0±0.3
10.7±0.1
12.0±0.1
1.5
+0.1
–0
4.5 MAX.
12.8±0.1
4.1±0.1
0.3±0.05
11.5±0.1
Tape Direction
PS8501L2-E3
Outline and Dimensions (Tape)
Outline and Dimensions (Reel)
Packing: 1 000 pcs/reel
330±2.0
100±1.0
2.0±0.5
13.0±0.2
R 1.0 21.0±0.8
2.0±0.5
23.9 to 27.4
Outer edge of
flange
25.5±1.0
29.5±1.0
Data Sheet PN10656EJ04V0DS
10
PS8501,PS8501L1,PS8501L2,PS8501L3
Outline and Dimensions (Tape)
1.55±0.1
2.0±0.1
4.0±0.1
1.75±0.1
5.3 MAX.
10.3±0.1
12.0±0.1
1.5
+0.1
–0
7.5±0.1
10.4±0.1
16.0±0.3
4.75±0.1
0.35±0.05
Outline and Dimensions (Reel)
Packing: 1 000 pcs/reel
330±2.0
100±1.0
2.0±0.5
13.0±0.2
R 1.0 21.0±0.8
2.0±0.5
15.9 to 19.4
Outer edge of
flange
21.5±1.0
17.5±1.0
Tape Direction
PS8501L3-E3
Data Sheet PN10656EJ04V0DS 11
PS8501,PS8501L1,PS8501L2,PS8501L3
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
D
CB
A
Part Number
PS8501L2
PS8501L3
Lead Bending A
lead bending type (Gull-wing)
for long creepage distance (surface mount)
lead bending type (Gull-wing)
for surface mount
10.2
8.2
B
2.54
2.54
C
1.7
1.7
D
2.2
2.2
Data Sheet PN10656EJ04V0DS
12
PS8501,PS8501L1,PS8501L2,PS8501L3
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature 260°C or below (package surface temperature)
• Time of peak reflow temperature 10 seconds or less
• Time of temperature higher than 220°C 60 seconds or less
• Time to preheat temperature from 120 to 180°C 120±30 s
• Number of reflows Three
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
120±30 s
(preheating)
220°C
180°C
Package Surface Temperature T (°C)
Time (s)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
to 60 s
260°C MAX.
120°C
(2) Wave soldering
• Temperature 260°C or below (molten solder temperature)
• Time 10 seconds or less
• Preheating conditions 120°C or below (package surface temperature)
• Number of times One (Allowed to be dipped in solder including plastic mold portion.)
• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
• Peak temperature (lead part temperature) 350°C or below
• Time (each pins) 3 seconds or less
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
Data Sheet PN10656EJ04V0DS 13
PS8501,PS8501L1,PS8501L2,PS8501L3
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between VCC-
emitters at startup, the output side may enter the on state, even if the voltage is within the absolute maximum
ratings.
Data Sheet PN10656EJ04V0DS
14
PS8501,PS8501L1,PS8501L2,PS8501L3
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
Parameter Symbol Speck Unit
Climatic test class (IEC 60068-1/DIN EN 60068-1) 55/100/21
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
Upr = 1.5 × UIORM, Pd < 5 pC
UIORM
Upr
1 130
1 695
Vpeak
Vpeak
Test voltage (partial discharge test, procedure b for all devices)
Upr = 1.875 × UIORM, Pd < 5 pC
Upr 2 119 Vpeak
Highest permissible overvoltage UTR 8 000 Vpeak
Degree of pollution (DIN EN 60664-1 VDE0110 Part 1) 2
Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11)) CTI 175
Material group (DIN EN 60664-1 VDE0110 Part 1) III a
Storage temperature range Tstg –55 to +125 °C
Operating temperature range TA –55 to +100 °C
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25°C
VIO = 500 V dc at TA MAX. at least 100°C
Ris MIN.
Ris MIN.
1012
1011
Ω
Ω
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Package temperature
Current (input current IF, Psi = 0)
Power (output or total power dissipation)
Isolation resistance
VIO = 500 V dc at TA = Tsi
Tsi
Isi
Psi
Ris MIN.
175
400
700
109
°C
mA
mW
Ω
<R>
Data Sheet PN10656EJ04V0DS 15
PS8501,PS8501L1,PS8501L2,PS8501L3
The information in this document is current as of September, 2009. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets, etc., for the most up-to-date specifications of NEC Electronics products. Not all products
and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
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written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
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or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
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The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-
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(Note)
•
•
•
•
•
•
M8E0904E
(1)
(2)
"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
"Standard":
"Special":
"Specific":
PS8501,PS8501L1,PS8501L2,PS8501L3
Caution GaAs Products This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
To our customers,
Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas Electronics Corporation took over all the business of both
companies. Therefore, although the old company name remains in this document, it is a valid
Renesas Electronics document. We appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April 1st, 2010
Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com)
Send any inquiries to http://www.renesas.com/inquiry.
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technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited
under any applicable domestic or foreign laws or regulations.
6. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics
does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages
incurred by you resulting from errors in or omissions from the information included herein.
7. Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and
“Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as
indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular
application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior
written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for
which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way
liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an
application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written
consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise
expressly specified in a Renesas Electronics data sheets or data books, etc.
“Standard”: Computers; office equipment; communications equipment; test and measurement equipment; audio and visual
equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots.
“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-
crime systems; safety equipment; and medical equipment not specifically designed for life support.
“Specific”: Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or
systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare
intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.
8. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,
especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or
damages arising out of the use of Renesas Electronics products beyond such specified ranges.
9. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have
specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further,
Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to
guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a
Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire
control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because
the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system
manufactured by you.
10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental
compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable
laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS
Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with
applicable laws and regulations.
11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas
Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this
document or Renesas Electronics products, or if you have any other inquiries.
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority-
owned subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
