The increase in power delivered by the BTL configuration
directly results in an increase in internal power dissipation
over the single-ended configuration. The maximum power
dissipation for a given VCC and load is given by the fol-
lowing equation:
CC
DISSP(MAX) 2L
2V
P
R
=π
If the power dissipation for a given application exceeds
the maximum allowed for a given package, reduce VCC,
increase load impedance, decrease the ambient tempera-
ture or add heat sinking to the device. Large output, sup-
ply, and ground PC board traces improve the maximum
power dissipation in the package.
Thermal-overload protection limits total power dissipa-
tion in the MAX4364/MAX4365. When the junction tem-
perature exceeds +160°C, the thermal protection circuitry
disables the amplifier output stage. The amplifiers are
enabled once the junction temperature cools by 15°C.
This results in a pulsing output under continuous thermal
overload conditions as the device heats and cools.
The MAX4365 TDFN package features an exposed ther-
mal pad on its underside. This pad lowers the thermal
resistance of the package by providing a direct heat con-
duction path from the die to the PC board. Connect the
exposed thermal pad to circuit ground by using a large
pad, ground plane, or multiple vias to the ground plane.
Eciency
The efficiency of the MAX4364/MAX4365 is calculated by
taking the ratio of the power delivered to the load to the
power consumed from the power supply. Output power is
calculated by the following equations:
PEAK
OUT
V
P2R
=
where VPEAK is half the peak-to-peak output voltage. In
BTL amplifiers, the supply current waveform is a fullwave
rectified sinusoid with the magnitude proportional to the
peak output voltage and load. Calculate the supply cur-
rent and power drawn from the power supply by the fol-
lowing:
PEAK
CC L
2V
IR
=π
PEAK
IN CC
2V
PV R
=
π
The efficiency of the MAX4364/MAX4365 is:
OUT L
OUT
IN CC
PR
P2
P 2V
π
η= =
The device efficiency values in Table 1 are calculated
based on the previous equation and do include the effects
of quiescent current. Note that efficiency is low at low
output-power levels, but remains relatively constant at
normal operating, output-power levels.
Component Selection
Gain-Setting Resistors
External feedback components set the gain of both
devices. Resistors RF and RIN (see Typical Application
Circuit/Functional Diagram) set the gain of the amplifier
as follows:
F
VD IN
R
A2
R
= ×
Optimum output offset is achieved when RF = 20kΩ.
Vary the gain by changing the value of RIN. When using
the MAX4364/MAX4365 in a high-gain configuration
(greater than 8V/V), a feedback capacitor may be required
to maintain stability (see Figure 2). CF and RF limit the
bandwidth of the device, preventing high-frequency oscil-
lations. Ensure that the pole created by CF and RF is not
within the frequency band of interest.
Input Filter
The input capacitor (CIN), in conjunction with RIN forms a
highpass filter that removes the DC bias from an incom-
ing signal. The AC-coupling capacitor allows the amplifier
to bias the signal to an optimum DC level. Assuming zero
source impedance, the -3dB point of the highpass filter is
given by:
3DB IN IN
1
f2R C
−=π
Choose RIN according to the Gain-Setting Resistors
section. Choose CIN such that f-3dB is well below the
lowest frequency of interest. Setting f-3dB too high
affects the low-frequency response of the amplifier. Use
capacitors whose dielectrics have low-voltage coeffi-
MAX4364/MAX4365 1.4W and 1W, Ultra-Small, Audio Power
Ampliers with Shutdown
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