DB, DW, OR PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
EN
C1+
V+
C1−
C2+
C2−
V−
DOUT2
RIN2
ROUT2
FORCEOFF
VCC
GND
DOUT1
RIN1
ROUT1
FORCEON
DIN1
DIN2
INVALID
MAX3223E
www.ti.com
.......................................................................................................................................... SLLS707A –JANUARY 2006–REVISED SEPTEMBER 2009
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
Check for Samples: MAX3223E
1FEATURES
• ESD Protection for RS-232 Bus Pins
– ±15-kV Human-Body Model (HBM)
– ±8-kV IEC61000-4-2, Contact Discharge
– ±15-kV IEC61000-4-2, Air-Gap Discharge
• Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
• Operates With 3-V to 5.5-V VCC Supply
• Operates up to 500 kbit/s
• Two Drivers and Two Receivers
• Low Standby Current . . . 1 μA Typ
• External Capacitors . . . 4 × 0.1 μF
• Accepts 5-V Logic Input With 3.3-V Supply
• Alternative High-Speed Pin-Compatible Device
(1 Mbit/s) for SNx5C3223E
APPLICATIONS
• Battery-Powered Systems
• PDAs
• Notebooks
• Laptops
• Palmtop PCs
• Hand-Held Equipment
DESCRIPTION/ORDERING INFORMATION
The MAX3223E consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD
protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of
TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the
serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to
5.5-V supply. The device operates at typical data signaling rates up to 500 kbit/s and a maximum of 30-V/μs
driver output slew rate.
Flexible control options for power management are available when the serial port is inactive. The
auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of
operation, if the device does not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF is
set low and EN is high, both drivers and receivers are shut off, and the supply current is reduced to 1 mA.
Disconnecting the serial port or turning off the peripheral drivers causes auto-powerdown to occur.
Auto-powerdown can be disabled when FORCEON and FORCEOFF are high. With auto-powerdown enabled,
the device is activated automatically when a valid signal is applied to any receiver input. The INVALID output is
used to notify the user if an RS-232 signal is present at any receiver input. INVALID is high (valid data) if any
receiver input voltage is greater than 2.7 V or less than –2.7 V, or has been between –0.3 V and 0.3 V for less
than 30 μs. INVALID is low (invalid data) if the receiver input voltage is between –0.3 V and 0.3 V for more than
30 μs. Refer to Figure 4 for receiver input levels.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 2006–2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
MAX3223E
SLLS707A –JANUARY 2006–REVISED SEPTEMBER 2009..........................................................................................................................................
www.ti.com
Table 1. ORDERING INFORMATION
TAPACKAGE (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING
Tube of 25 MAX3223ECDW
SOIC – DW MAX3223EC
Reel of 2000 MAX3223ECDWR
Tube of 70 MAX3223ECDB
–0°C to 70°C SSOP – DB MP223EC
Reel of 2000 MAX3223ECDBR
Tube of 70 MAX3223ECPW
TSSOP – PW MP223EC
Reel of 2000 MAX3223ECPWR
Tube of 25 MAX3223EIDW
SOIC – DW MAX3223EI
Reel of 2000 MAX3223EIDWR
Tube of 70 MAX3223EIDB
–40°C to 85°C SSOP – DB MP223EI
Reel of 2000 MAX3223EIDBR
Tube of 70 MAX3223EIPW
TSSOP – PW MP223EI
Reel of 2000 MAX3223EIPWR
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
2Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3223E
MAX3223E
www.ti.com
.......................................................................................................................................... SLLS707A –JANUARY 2006–REVISED SEPTEMBER 2009
FUNCTION TABLES
ABC
EACH DRIVER(1)
INPUTS OUTPUT DRIVER STATUS
VALID RIN DOUT
DIN FORCEON FORCEOFF RS-232 LEVEL
X X L X Z Powered off
L H H X H Normal operation with
auto-powerdown disabled
H H H X L
L L H Yes H Normal operation with
auto-powerdown enabled
H L H Yes L
L L H No Z Powered off by
auto-powerdown feature
H L H No Z
(1) H = high level, L = low level, X = irrelevant, Z = high impedance
EACH RECEIVER(1)
INPUTS OUTPUT
VALID RIN DOUT
RIN EN RS-232 LEVEL
L L X H
H L X L
X H X Z
Open L No H
(1) H = high level, L = low level, X = irrelevant,
Z = high impedance (off),
Open = input disconnected or connected driver off
Copyright © 2006–2009, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): MAX3223E
DIN2 DOUT2
12 8
Powerdown
RIN1
16
20
15
FORCEOFF
ROUT1
DIN1 DOUT1
13 17
RIN2
910
ROUT2
1
EN
14
FORCEON
11 INVALID
MAX3223E
SLLS707A –JANUARY 2006–REVISED SEPTEMBER 2009..........................................................................................................................................
www.ti.com
LOGIC DIAGRAM (POSITIVE LOGIC)
Pin numbers are for the DB, DW, and PW packages.
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
VCC Supply voltage range –0.3 6 V
V+ Positive-output supply voltage range(2) –0.3 7 V
V– Negative-output supply voltage range(2) 0.3 –7 V
V+ – V– Supply voltage difference(2) 13 V
Driver (FORCEOFF, FORCEON, EN) –0.3 6
VIInput voltage range V
Receiver –25 25
Driver –13.2 13.2
VOOutput voltage range V
Receiver (INVALID) –0.3 VCC + 0.3
DB package 70
θJA Package thermal impedance(3) (4) DW package 58 °C/W
PW package 83
TJOperating virtual junction temperature 150 °C
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD= (TJ(max) – TA)/θJA. Operating at the absolute maximum TJof 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
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Product Folder Link(s): MAX3223E
MAX3223E
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.......................................................................................................................................... SLLS707A –JANUARY 2006–REVISED SEPTEMBER 2009
RECOMMENDED OPERATING CONDITIONS(1)
See Figure 6 MIN NOM MAX UNIT
VCC = 3.3 V 3 3.3 3.6
Supply voltage V
VCC = 5 V 4.5 5 5.5
VCC = 3.3 V 2
Driver and control
VIH DIN, EN, FORCEOFF, FORCEON V
high-level input voltage VCC = 5 V 2.4
Driver and control
VIL DIN, EN, FORCEOFF, FORCEON 0.8 V
low-level input voltage
Driver and control input voltage DIN, EN, FORCEOFF, FORCEON 0 5.5 V
VIReceiver input voltage –25 25 V
MAX3223EC 0 70
TAOperating free-air temperature °C
MAX3223EI –40 85
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
ELECTRICAL CHARACTERISTICS(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT
Input leakage EN, FORCEOFF,
II±0.01 ±1 μA
current FORCEON VCC = 3.3 V or 5 V, TA= 25°C,
Auto-powerdown disabled 0.3 1 mA
No load, FORCEOFF and FORCEON at VCC
Powered off No load, FORCEOFF at GND 1 10
ICC Supply current No load, FORCEOFF at VCC, FORCEON at μA
Auto-powerdown enabled GND, 1 10
All RIN are open or grounded
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA= 25°C.
Copyright © 2006–2009, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): MAX3223E
MAX3223E
SLLS707A –JANUARY 2006–REVISED SEPTEMBER 2009..........................................................................................................................................
www.ti.com
DRIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT
VOH High-level output voltage DOUT at RL= 3 kΩto GND 5 5.4 V
VOL Low-level output voltage DOUT at RL= 3 kΩto GND –5 –5.4 V
IIH High-level input current VI= VCC ±0.01 ±1 μA
IIL Low-level input current VIat GND ±0.01 ±1 μA
VCC = 3.6 V, VO= 0 V
IOS Short-circuit output current(3) ±35 ±60 mA
VCC = 5.5 V, VO= 0 V
roOutput resistance VCC, V+, and V– = 0 V, VO= ±2 V 300 10M Ω
FORCEOFF = GND, VCC = 3 V to 3.6 V, VO= ±12 V ±25
IOZ Output leakage current μA
FORCEOFF = GND, VCC = 4.5 V to 5.5 V, VO= ±12 V ±25
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA= 25°C.
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT
CL= 1000 pF, RL= 3 kΩ,
Maximum data rate 250 500 kbit/s
One DOUT switching, See Figure 1
CL= 150 pF to 2500 pF, RL= 3 kΩto 7 kΩ,
tsk(p) Pulse skew(3) 100 ns
See Figure 2 CL= 150 pF to 1000 pF 6 30
Slew rate, transition region RL= 3 kΩto 7 kΩ,
SR(tr) V/μs
(See Figure 1) VCC = 3.3 V CL= 150 pF to 2500 pF 4 30
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA= 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
ESD Protection TYP UNIT
Human-Body Model (HBM) ±15
Driver outputs (DOUTx) IEC61000-4-2, Air-Gap Discharge ±15 kV
IEC61000-4-2, Contact Discharge ±8
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Product Folder Link(s): MAX3223E
MAX3223E
www.ti.com
.......................................................................................................................................... SLLS707A –JANUARY 2006–REVISED SEPTEMBER 2009
RECEIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT
VOH High-level output voltage IOH = –1 mA VCC – 0.6 VCC – 0.1 V
VOL Low-level output voltage IOL = 1.6 mA 0.4 V
VCC = 3.3 V 1.6 2.4
VIT+ Positive-going input threshold voltage V
VCC = 5 V 1.9 2.4
VCC = 3.3 V 0.6 1.1
VIT– Negative-going input threshold voltage V
VCC = 5 V 0.6 1.4
Vhys Input hysteresis (VIT+ – VIT–) 0.5 V
IOZ Output leakage current EN = VCC ±0.05 μA
riInput resistance VI= ±3 V to ±25 V 3 5 kΩ
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA= 25°C.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS TYP (2) UNIT
tPLH Propagation delay time, low- to high-level output CL= 150 pF, See Figure 3 150 ns
tPHL Propagation delay time, high- to low-level output CL= 150 pF, See Figure 3 150 ns
ten Output enable time CL= 150 pF, RL= 3 kΩ, See Figure 4 200 ns
tdis Output disable time CL= 150 pF, RL= 3 kΩ, See Figure 4 200 ns
tsk(p) Pulse skew(3) See Figure 3 50 ns
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA= 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
ESD Protection TYP UNIT
Human-Body Model (HBM) ±15
Receiver inputs (RINx) IEC61000-4-2, Air-Gap Discharge ±15 kV
IEC61000-4-2, Contact Discharge ±8
Copyright © 2006–2009, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): MAX3223E
MAX3223E
SLLS707A –JANUARY 2006–REVISED SEPTEMBER 2009..........................................................................................................................................
www.ti.com
AUTO-POWERDOWN SECTION
Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER TEST CONDITIONS MIN MAX UNIT
Receiver input threshold for
VT+(valid) FORCEON = GND, FORCEOFF = VCC 2.7 V
INVALID high-level output voltage
Receiver input threshold for
VT(valid) FORCEON = GND, FORCEOFF = VCC –2.7 V
INVALID high-level output voltage
Receiver input threshold for
VT(invalid) FORCEON = GND, FORCEOFF = VCC –0.3 0.3 V
INVALID low-level output voltage IOH = 1 mA, FORCEON = GND,
VOH INVALID high-level output voltage VCC – 0.6 V
FORCEOFF = VCC
IOL = 1.6 mA, FORCEON = GND,
VOL INVALID low-level output voltage 0.4 V
FORCEOFF = VCC
Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (seeFigure 5)
PARAMETER TYP (1) UNIT
tvalid Propagation delay time, low- to high-level output 1 μs
tinvalid Propagation delay time, high- to low-level output 30 μs
ten Supply enable time 100 μs
(1) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA= 25°C.
8Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3223E
50 Ω
TEST CIRCUIT VOLTAGE WAVEFORMS
−3 V
−3 V
3 V
3 V
0 V
3 V
1.5 V1.5 V
Output
Input
VOL
VOH
tTLH
Generator
(see Note B) RL
RS-232
Output
tTHL
CL
(see Note A)
SR(tr) +6 V
tTHL or tTLH
3 V
FORCEOFF
50 Ω
TEST CIRCUIT VOLTAGE WAVEFORMS
0 V
3 V
Output
Input
VOL
VOH
tPLH
Generator
(see Note B) RL
3 V
FORCEOFF
RS-232
Output
tPHL
CL
(see Note A)
50% 50%
1.5 V 1.5 V
TEST CIRCUIT VOLTAGE WAVEFORMS
50 Ω
50%
50%
−3 V
3 V
1.5 V1.5 V
Output
Input
VOL
VOH
tPHL
Generator
(see Note B) tPLH
Output
EN
0 V
CL
(see Note A)
MAX3223E
www.ti.com
.......................................................................................................................................... SLLS707A –JANUARY 2006–REVISED SEPTEMBER 2009
PARAMETER MEASUREMENT INFORMATION
A. CLincludes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO= 50 Ω, 50% duty cycle, tr≤10 ns,
tf≤10 ns.
C. CLincludes probe and jig capacitance.
D. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO= 50 Ω, 50% duty cycle, tr≤10 ns,
tf≤10 ns.
E. CLincludes probe and jig capacitance.
F. The pulse generator has the following characteristics: ZO= 50 Ω, 50% duty cycle, tr≤10 ns, tf≤10 ns.
G. CLincludes probe and jig capacitance.
H. The pulse generator has the following characteristics: ZO= 50 Ω, 50% duty cycle, tr≤10 ns, tf≤10 ns.
Copyright © 2006–2009, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): MAX3223E
TEST CIRCUIT VOLTAGE WAVEFORMS
50 Ω
Generator
(see Note B)
3 V or 0 V
Output
VOL
VOH
tPZH
(S1 at GND)
tPLZ
(S1 at VCC)
tPHZ
(S1 at GND)
tPZL
(S1 at VCC)
1.5 V1.5 V 3 V
0 V
50%
0.3 V
Output
Input
50%
0.3 V
EN
RL
S1
VCC GND
CL
(see Note A)
Output
MAX3223E
SLLS707A –JANUARY 2006–REVISED SEPTEMBER 2009..........................................................................................................................................
www.ti.com
PARAMETER MEASUREMENT INFORMATION (continued)
I. CLincludes probe and jig capacitance.
J. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO= 50 Ω, 50% duty cycle, tr≤10 ns,
tf≤10 ns.
10 Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3223E
TEST CIRCUIT VOLTAGE WAVEFORMS
50 Ω
3 V
2.7 V
2.7 V
INVALID
Output
Receiver
Input
tinvalid
Generator
(see Note B)
FORCEOFF
tvalid
ROUT
FORCEON
Auto-
powerdown INVALID
DOUT
0 V
0 V
−3 V
DIN
CL = 30 pF
(see Note A)
VCC
0 V
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
2.7 V
2.7 V
0.3 V
0.3 V
0 V
Indeterminate
Indeterminate
If Signal Remains Within This Region
for More Than 30 ms, INVALID Is Low†
≈V+
0 V
≈V−
V+
VCC
ten
V−
50% VCC 50% VCC
2.7 V
−2.7 V
0.3 V
0.3 V
Supply
Voltages
†Auto-powerdown disables drivers and
reduces supply current to 1 µA
Valid RS-232 Level, INVALID High
Valid RS-232 Level, INVALID High
EN
MAX3223E
www.ti.com
.......................................................................................................................................... SLLS707A –JANUARY 2006–REVISED SEPTEMBER 2009
PARAMETER MEASUREMENT INFORMATION (continued)
Copyright © 2006–2009, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Link(s): MAX3223E
15
14
8
1
2
3
4
7
DIN1
FORCEOFF
FORCEON
13
DOUT1
20
17
16
19
18
ROUT1
5
6
C3
VCC
C2+
C1
C2
C1+
GND
V
C1
RIN1
C2
+
CBYPASS
V+
+
DOUT2
EN
C4+
9
10
12
11
DIN2
INVALID
RIN2
ROUT2
†
= 0.1mF
5 kΩ
5 kΩ
VCC C1 C2, C3, and C4
3.3 V " 0.3 V
5 V " 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF0.47 µF
0.33 µF
0.1 µF
VCC vs CAPACITOR VALUES
†C3 can be connected to VCC or GND.
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown.
Auto-
powerdown
MAX3223E
SLLS707A –JANUARY 2006–REVISED SEPTEMBER 2009..........................................................................................................................................
www.ti.com
APPLICATION INFORMATION
12 Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3223E
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
MAX3223ECDB ACTIVE SSOP DB 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223ECDBG4 ACTIVE SSOP DB 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223ECDBR ACTIVE SSOP DB 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223ECDBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223ECDW ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223ECDWG4 ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223ECDWR ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223ECDWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223ECPW ACTIVE TSSOP PW 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223ECPWG4 ACTIVE TSSOP PW 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223ECPWR ACTIVE TSSOP PW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223ECPWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223EIDB ACTIVE SSOP DB 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223EIDBG4 ACTIVE SSOP DB 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223EIDBR ACTIVE SSOP DB 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223EIDBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223EIDW ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223EIDWG4 ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223EIDWR ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223EIDWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223EIPW ACTIVE TSSOP PW 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223EIPWG4 ACTIVE TSSOP PW 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223EIPWR ACTIVE TSSOP PW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223EIPWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
PACKAGE OPTION ADDENDUM
www.ti.com 16-Jun-2009
Addendum-Page 1
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 16-Jun-2009
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
MAX3223ECDBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1
MAX3223ECDWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1
MAX3223ECPWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
MAX3223EIDBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1
MAX3223EIDWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1
MAX3223EIPWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
MAX3223ECDBR SSOP DB 20 2000 367.0 367.0 38.0
MAX3223ECDWR SOIC DW 20 2000 367.0 367.0 45.0
MAX3223ECPWR TSSOP PW 20 2000 367.0 367.0 38.0
MAX3223EIDBR SSOP DB 20 2000 367.0 367.0 38.0
MAX3223EIDWR SOIC DW 20 2000 367.0 367.0 45.0
MAX3223EIPWR TSSOP PW 20 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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