ALPHA & OMEGA Document No. PO00001 SEMICONDUCTOR Version L SOT23 PACKAGE OUTLINE Be a gE D & 8 " <1 c a il ae Y) | = ul | | I I | el -" MY co 010mm [el Ses | oi RECOMMENDED LAND PATTERN SYMBOLS DIMENSIONS IN MILLIMETERS DIMENSIONS IN INCHES MIN | NOM | MAX MIN | NOM | MAX ! A 0.85 __ 1.25 0.033 __ 0.049 L Al 0.00 _ 0.13 0.000 0.005 | A2 0.70 1.00 1.15 0.028 | 0.039 | 0.045 ! oO b 0.30 0.40 0.50 0.012 | 0.016 | 0.020 + C 0.08 0.13 0.20 0.003 | 0.005 | 0.008 | cu D 2.80 2.90 3.10 0.110 | 0.114 | 0.122 oo ! | ! E 2.60 2.80 3.00 0.102 | 0.110 | 0.118 oj +-t+ !1+ El 1.40 1.60 1.80 0.055 | 0.063 | 0.071 Q { l | e 0.95 BSC 0.037 BSC | | | 0.80 el 1.90 BSC 0.075 BSC L 0.30 0.60 0.012 0.024 |_| ois 61 0 5 8 0 5 8 UNIT: mm NOTE 1. PACKAGE BODY SIZES EXCLUDE MOLD FLASH OR GATE BURRS. MOLD FLASH AT THE NON-LEAD SIDES SHOULD BE LESS THAN 5 MILS EACH. 2. TOLERANCE +0.100 mm (4 mil) UNLESS OTHERWISE SPECIFIED. 3. DIMENSION L IS MEASURED IN GAUGE PLANE. 4. CONTROLLING DIMENSION IS MILLIMETER. CONVERTED INCH DIMENSIONS ARE NOT NECESSARILY EXACT. 5. ALL DIMENSIONS ARE IN MILLIMETERS.