DATA AND DEVICES /// zSFP+ 28/56 GBPS I/O INTERCONNECT
zSFP+ (SFP28/56) 28/56 GBPS PLUGGABLE
I/O INTERCONNECT
The zSFP+ interconnect is currently one of the fastest single-channel I/O connectors on the market today, transferring data at 28
Gbps with possible expansion to 56 Gbps. Through a design that is backward-compatible to SFP/SFP+ products, the interconnect is
hot-swappable with existing SFP+ connectors for fast system upgrades of 28-56 Gbps. Alternatively, users can design-in the zSFP+
connector for 10-16 Gbps data rates, establishing a progressive path to higher speeds–an upgradeability that can result in longterm
cost savings as this would eliminate the need to fully redesign for higher performance.
The zSFP+ interconnect is compliant to SFF-8402 and has been adopted for Fibre Channel 32G (28.05 Gbps line rate). The entire
product family is oered as a dual source option with Molex. LLC.
PAGE 2DATA AND DEVICES /// zSFP+ 28/56 GBPS I/O INTERCONNECT
zSFP+ 28/56 Gbps Pluggable I/O Interconnect
20-Pin Surface-Mount Connector
Electrical
• Voltage (max.): 120V AC
• Current (max.): 0.5A
• Dielectric Withstanding Voltage:
300V AC between contacts
Mechanical
• Mating Force: 25N
• Unmating Force: 11.5N
• Durability (min.): 250 cycles
Physical
• High-temperature thermoplastic housing (glass-filled, UL
94V-0 black)
• High-performance copper alloy contacts
• Plating:
- Nickel underplating; Tin plating on solder tail area;
Gold plating on mating area
- Plating options: 15 and 30μ” Gold or Palladium Nickel
• Operating Temperature: -40 to +85oC
FEATURES
• Data rates: Up to 56 Gbps, 10 Gbps Ethernet and 16 Gbps
Fibre Channel
• Surface-mount connector design for single high 1xN cages
• Press-fit 1xN cages and stacked assemblies (connector and
cage) for one-step, easy PCB placement
• Coupled, narrow-edged, blanked- and formed-contact beam
geometry and insert molding for superior signal integrity,
mechanical and electrical performance
• Backwards-compatibility: Shares same mating interface and
cage dimensions with the SFP+ connector (connector/single
high cages are also PCB footprint-compatible)
• Elastomeric gasket or spring finger options for EMI
containment
• Single high cages (1xN) for design flexibility; accommodates
belly-to-belly applications for increased density and
PCB space savings; available in 1x1, 1x2, 1x4 or 1x6 port
configurations
• Stacked assemblies oered in 2x1, 2x2, 2x4, 2x6, 2x8 or 2x12
port
• Heat sinks, LEDs and plating choices oered
• Additional light pipe configurations available
APPLICATIONS
• Telecommunications: Cellular infrastructure, central oce
uplink equipment, optical transport equipment, switches/
routers, access equipment (CMTS, PON, DSL, etc)
• Data Center: Data center switches and routers, servers,
storage
• Medical: Medical diagnostic equipment
• Networking: Network interface, switches, routers
• Test and Measurement Equipment
No light pipes
All 4 light pipes (shown left)
Inner light pipes
Outer light pipes [standard]
Three light pipes
Outer light pipes [reversed]
Light pipe options include:
PAGE 3DATA AND DEVICES /// zSFP+ 28/56 GBPS I/O INTERCONNECT
zSFP+ 28/56 Gbps Pluggable I/O Interconnect
Ganged 1xN Cages
Mechanical
• Transceiver insertion force (max.): 34 N without heat sink and clip;
45.37 N with heat sink and clip
• Transceiver extraction force (max.): 12.5 N without heat sink and
clip; 14.36 N with heat sink and clip
• SFP+ module to surface-mount connector and zSFP+ cage.
• Cage press fit insertion force (max.): 44.5 N for single port cage,
54.3 N for ganged cage
• Cage press fit extraction force (min.): 8.9 N for single port and
ganged cages
• Durability (min.): 100 cycles
EMI
Suppression
Light Pipe
Option
Heat Sink
Option 1X1 1X2 1X4 1X6 1X8
EMI Spring
Fingers
No No 2274001-1
2291579-1 (PCI) 2227728-1 2227730-1 2227732-1 2304921-1
2295325-6
Yes No 2274000-1 2227727-1 2227729-1 2227731-1 TBD**
Yes Yes TBD* TBD** 2304342-X 2293156-X 2294408-X
Physical
• Cage material: Nickel Silver
• PCB thickness (min.): 1.50mm in single sided
applications; 2.25mm (EMI springs) or 3.0mm
(elastomeric gasket) in belly-to-belly applica-
tions
• Operating Temperature: -40 to +85oC
GHz
Radiated source RF leakage (dB)
0
-10
-20
-30
-40
-50
-60
-70
-80
0 5 10 15 20 25 30
Ganged SFP+ 1x4 —
Ganged zSFP+ 1x4 —
Ganged SFP+ 1x4 vs. zSFP+ 1x4
Connector P/N Description
2170088-1 30μ” in Au or Au Flash Over PdNi
2170088-2 15μ” in Au or Au Flash Over PdNi
Cages with Elastomeric Gaskets
EMI
Suppression
Light Pipe
Option 1X1 1X2 1X4 1X6 1X8
EMI gasket No 2198709-1* 2198720-1 2198722-1 2198724-1 TBD**
Yes 2198708-1* 2198719-1 2198721-1 2198723-1 TBD**
Cages with EMI Springs
*Tooling in process **Not yet tooled, but planned
Electrical
• Voltage (max.): 120V AC
• Current (max.): 0.5A
• Dielectric Withstanding Voltage: 300V AC
between contacts
Mechanical
• Durability (min.): 100 cycles
Physical
• Cage material: Nickel Silver
- High-temperature thermoplastic housing
(glass-filled, UL 94V-0 black)
- High-performance copper alloy contacts
- Plating: Nickel underplating; Tin plating
on solder tail area; 30μ” Gold plating on
mating area
• PCB thickness (min.): 1.57mm
• Operating Temperature: -40 to +85oC
Stacked 2xN Assemblies
Stacked SFP+ vs. zSFP+
Radiated source RF leakage (dB)
0
-10
-20
-30
-40
-50
-60
-70
-80
Stacked SFP+ —
Stacked zSFP+ —
0 5 10 15 20 25 30
GHz
Upper contact row —
Lower contact row —
EMI
Suppression Performance Light Pipe
Configuration
2x1 2x2 2x4 2x6 2x8 2x12
2198318-(x) 2198325-(x) 2180324-(x) 2198339-(x) 2198346-(x) 2288172-(x)
EMI gasket
Standard
None 2198318-1 2198325-1 2180324-1 2198339-1 2198346-1 2288172-1
All 4 2198318-2 2198325-2 2180324-2 2198339-2 2198346-2 2288172-2
Inner 2198318-3 2198325-3 2180324-3 2198339-3 2198346-3 2288172-3
Outer 2198318-4 2198325-4 2180324-4 2198339-4 2198346-4 2288172-4
3 1-2198318-7 1-2198325-7 1-2180324-7 1-2198339-7 1-2198346-7 1-2288172-7
Outer (reversed) 1-2198318-8 1-2198325-8 1-2180324-8 1-2198339-8 1-2198346-8 1-2288172-8
Thermally
Enhanced Multiple -- -- 3-2180324-0 -- -- 2227838-8
EMI spring fingers
Standard
None 2198318-5 2198325-5 2180324-5 2198339-5 2198346-5 2288172-5
All 4 2198318-6 2198325-6 2180324-6 2198339-6 2198346-6 2288172-6
Inner 2198318-7 2198325-7 2180324-7 2198339-7 2198346-7 2288172-7
Outer 2198318-8 2198325-8 2180324-8 2198339-8 2198346-8 2288172-8
3 1-2198318-9 1-2198325-9 1-2180324-9 1-2198339-9 1-2198346-9 1-2288172-9
Outer (reversed) 2-2198318-0 2-2198325-0 2-2180324-0 2-2198339-0 2-2198346-0 2-2288172-0
Thermally
Enhanced Multiple -- -- 3-2180324-1 2291491-1 -- 2227838-7
2301210-2
PAGE 4DATA AND DEVICES /// zSFP+ 28/56 GBPS I/O INTERCONNECT
zSFP+ 28/56 Gbps Pluggable I/O Interconnect
Our SFP28/56 passive copper cable assembly features two dierential copper pairs, providing one data transmission channel
at speeds up to 56 Gbps per channel.
Oered in a broad range of wire gages – from 30AWG through 32AWG – this next generation copper cable assembly features
low insertion loss and low cross talk. Our SFP28/56 assemblies share the same mating interface with SFP+ form factors,
making them backward compatible with existing SFP+ I/O ports. SFP28/56 cable assemblies can be used with legacy 10G
Ethernet and 16G Fibre Channel applications with substantial signal integrity margin.
In addition to SFP28/56 straight cables, we oer break out assemblies with a 100G QSFP28 or 200G QSFP56 module on one
end splitting to four SFP28/56 modules on the opposite end of the assembly. In-line signal integrity (SI) based production
testing ensures that each cable assembly meets the electrical performance requirements of the applicable industry standard
specification.
Features and Benefits
• Compatible with IEEE 802.3by and Fibre Channel industry standards
• Supports single lane data rate up to 56 Gbps
• Optimized construction to minimize insertion loss and cross talk
• Customized cable braid termination limits EMI radiation
• Backward compatible with existing SFP+ form factor connectors and cages
• Pull-to-release latch design
• 30AWG through 32AWG cable
• Straight and breakout cable assembly configurations available
• Customizable EEPROM mapping for cable signature
• RoHS compliant
Industry Standards
• 25G Ethernet (IEEE 802.3by)
• Fibre Channel
• SFF-8402 SFP+ 1X 28Gb/s Pluggable Transceiver Solution (SFP28)
• SFF-8665 QSFP+ 28G 4X Pluggable Transceiver Solution (QSFP28)
SFP28 Part Number Detail
Base
Part
Number
Description AWG
Dash to Length (meters)
0.5 1 1.5 2 2.5 3 3.5 4 5
2334985
SFP28 to SFP28
Straight Assembly
32 -1 -2 -3 -4
2821222 30 -5 -3 -4 -2 -6 -1 -1
2821223 28 -1 -2 -3 -4 -5 -6 -7 -8
2821224 26 -1 -5 -3 -4 -5 -6 -7 -8
SFP56 Part Number Detail
Base
Part
Number
Description AWG
Dash to Length (meters)
0.5 1 1.5 2 2.5 3
2334985
SFP56 to SFP56
Straight Assembly
32 -41 -42 -43
2821222 30 -41 -43 -44 -45
2821223 28 -41 -42 -43 -44 -45
2821224 26 -41 -42 -43 -44 -45
Contact your TE Representative for customized lengths and breakouts.
SFP28/56 Passive Copper Cable Assemblies
QSFP28/56 to 4x SFP28/56 Breakout
Cable Assembly
SFP28/56 to SFP28/56 Straight Cable
Assembly
PAGE 5DATA AND DEVICES /// zSFP+ 28/56 GBPS I/O INTERCONNECT
zSFP+ 28/56 Gbps Pluggable I/O Interconnect
DATA AND DEVICES /// zSFP+ 28/56 GBPS I/O INTERCONNECT
For More Information
te.com/products/zsfp+
TE Technical Support Center
USA: +1 (800) 522-6752
Canada: +1 (905) 475-6222
Mexico +52 (0) 55-1106-0800
Latin/S. America: +54 (0) 11-4733-2200
Germany: +49 (0) 6251-133-1999
UK: +44 (0) 800-267666
France: +33 (0) 1-3420-8686
Netherlands: +31 (0) 73-6246-999
China: +86 (0) 400-820-6015
Part numbers in this brochure are RoHS Compliant*, unless marked otherwise.
*as defined www.te.com/leadfree
While TE has made every reasonable eort to ensure the accuracy of the information in this brochure, TE does not guarantee that it is
error-free, nor does TE make any other representation, warranty or guarantee that the information is accurate, correct, reliable or current. TE
reserves the right to make any adjustments to the information contained herein at any time without notice. TE expressly disclaims all implied
warranties regarding the information contained herein, including, but not limited to, any implied warranties of merchantability or tness for a
particular purpose. The dimensions in this brochure are for reference purposes only and are subject to change without notice. Specications
are subject to change without notice. Consult TE for the latest dimensions and design specications.
te.com
© 2018 TE Connectivity Ltd. family of companies. All Rights Reserved.
1-1773707-6 DND PDF 11/18
TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity Ltd. family of companies.
zSFP+ is a part of the ZXP® family of connectors and uses the ZXP technology.
ZXP is a registered trademark of Molex LLC.
Other logos, product and company names mentioned herein may be trademarks of their respective owners.
