date 02/11/2020
page 1 of 5
SERIES: HSE-BX-035H-02 │ DESCRIPTION: HEAT SINK
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FEATURES
• TO-220 package
• placement pins for secure PCB attachment
• round hole for component attachment
• multiple available cut lengths
MODEL thermal resistance1power
dissipation1
length
(mm)
@ 75°C ΔT,
nat conv
(°C/W)
@ 1 W,
nat conv
(°C/W)
@ 1 W,
200 LFM
(°C/W)
@ 1 W,
400 LFM
(°C/W)
@ 75°C ΔT,
nat conv
(W)
HSE-B20254-035H-02 25.4 13.64 15.97 4.39 3.27 5.50
HSE-B20381-035H-02 38.1 10.87 13.97 3.32 2.14 6.90
HSE-B20508-035H-01 50.8 9.15 13.03 4.76 3.21 8.20
HSE-B20635-035H-01 63.5 7.98 11.06 4.49 3.31 9.40
Note: 1. See performance curves for full thermal resistance details.
2. Custom cut to length options available. Thermal data not available on custom lengths.
PERFORMANCE CURVES
Mounting Surface Temperature
Rise Above Ambient (°C)
0
10
20
30
40
50
60
70
80
90
100
01 2345
Dissipated Power (W)
6789
10
Without Airflow
200 LFM
400 LFM
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv. 200 LFM 400 LFM
0000
1 15.97 4.39 3.27
2 31.26 8.90 6.45
3 45.86 13.39 9.63
4 58.55 17.73 13.18
5 70.33 21.93 16.39
6 80.76 26.48 19.66
7 90.04 30.88 23.26
8 97.89 35.46 26.64
9 104.05 40.56 30.58
10 112.16 45.35 33.51
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
HSE-B20254-035H-02
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date 02/11/2020│ page 2 of 5
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CUI Devices │ SERIES: HSE-BX-035H-02 │ DESCRIPTION: HEAT SINK
PERFORMANCE CURVES (CONTINUED)
Mounting Surface Temperature
Rise Above Ambient (°C)
0
10
20
30
40
50
60
70
80
90
100
01234 5
Dissipated Power (W)
Without Airflow
200 LFM
400 LFM
6789
10
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv. 200 LFM 400 LFM
0000
1 13.97 3.32 2.14
2 26.02 7.06 5.29
3 36.45 10.74 8.06
4 47.83 14.35 11.12
5 56.91 18.07 13.94
6 66.68 21.87 16.57
7 76.12 25.59 19.23
8 83.63 29.34 21.97
9 90.62 33.16 24.05
10 99.30 36.38 26.25
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
HSE-B20381-035H-02
Mounting Surface Temperature
Rise Above Ambient (°C)
0
10
20
30
40
50
60
70
80
90
100
012345
Heat Dissipated (W)
Without Airflow
200 LFM
400 LFM
67
58910
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv. 200 LFM 400 LFM
0000
1 13.03 4.76 3.21
2 23.71 9.71 6.44
3 33.48 14.54 9.72
4 42.45 19.34 12.99
5 51.22 24.34 16.17
6 59.26 29.08 19.43
7 66.97 33.72 22.66
8 73.76 38.43 25.87
9 80.91 43.29 29.05
10 86.41 48.07 32.37
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
HSE-B20508-035H-01
Additional Resources: Product Page | 3D Model
date 02/11/2020│ page 3 of 5
cuidevices.com
CUI Devices │ SERIES: HSE-BX-035H-02 │ DESCRIPTION: HEAT SINK
PERFORMANCE CURVES (CONTINUED)
Mounting Surface Temperature
Rise Above Ambient (°C)
0
10
20
30
40
50
60
70
80
90
100
01 234
Heat Dissipated (W)
67
58910
Without Airflow
200 LFM
400 LFM
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv. 200 LFM 400 LFM
0000
1 11.06 4.49 3.31
2 20.90 9.06 6.55
3 29.15 14.11 9.89
4 38.05 18.83 13.25
5 45.79 23.74 16.62
6 52.98 28.44 19.99
7 60.48 33.15 23.42
8 67.65 38.24 26.83
9 73.09 42.81 30.28
10 80.13 47.53 33.57
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
HSE-B20635-035H-01
Additional Resources: Product Page | 3D Model
date 02/11/2020│ page 4 of 5
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CUI Devices │ SERIES: HSE-BX-035H-02 │ DESCRIPTION: HEAT SINK
MECHANICAL DRAWING
units: mm
tolerance: ±0.5 mm MATERIAL AL 6063-T5
FINISH black anodized
PIN MATERIAL steel
PIN PLATING tin
L
**
MODEL NO. LENGTH, L
(mm)
WEIGHT
(g)
HSE-B20254-035H-02* 25.4 11.33
HSE-B20381-035H-02 38.1 16.67
HSE-B20508-035H-01 50.8 22.22
HSE-B20635-035H-01 63.5 27.5
Note: * Mounting holes not present on 25.4 mm length model.
Additional Resources: Product Page | 3D Model
date 02/11/2020│ page 5 of 5CUI Devices │ SERIES: HSE-BX-035H-02 │ DESCRIPTION: HEAT SINK
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CUI Devices oers a one (1) year limited warranty. Complete warranty information is listed on our website.
CUI Devices reserves the right to make changes to the product at any time without notice. Information provided by CUI Devices is believed to be accurate and reliable. However, no
responsibility is assumed by CUI Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use.
CUI Devices products are not authorized or warranted for use as critical components in equipment that requires an extremely high level of reliability. A critical component is any
component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to aect its safety or
eectiveness.
rev. description date
1.0 initial release 05/04/2017
1.01 updated datasheet 09/11/2017
1.02 brand update 02/11/2020
The revision history provided is for informational purposes only and is believed to be accurate.
REVISION HISTORY
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