NOTES ON HANDLING
(1) Infrared refl ow soldering
• Peak refl ow temperature 260°C or below (package surface temperature)
• Time of peak refl ow temperature 10 seconds or less
• Time of temperature higher than 220°C 60 seconds or less
• Time to preheat temperature from 120 to 180°C 120±30 s
• Number of refl ows Three
• Flux Rosin fl ux containing small amount of chlorine (The fl ux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(2) Wave soldering
• Temperature 260°C or below (molten solder temperature)
• Time 10 seconds or less
• Preheating conditions 120°C or below (package surface temperature)
• Number of times One (Allowed to be dipped in solder including plastic mold portion.)
• Flux Rosin fl ux containing small amount of chlorine (The fl ux with a maximum chlorine content of 0.2
Wt% is recommended.)
(3) Cautions
• Fluxes
Avoid removing the residual fl ux with freon-based and chlorine-based cleaning solvent.
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
PS2561A-1,PS2561AL-1, PS2561AL1-1,PS2561AL2-1
120±30 s
(preheating)
220˚C
180˚C
Package Surface Temperature T (˚C)
Time (s)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
to 60 s
260˚C MAX.
120˚C
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
03/16/2004