SN74LS20NSRE4 - Texas Instruments High-Performance Analog

PACKAGE OPTION ADDENDUM

www.ti.com 23-Apr-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Top-Side Markings

(4)

Samples

JM38510/07006BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

07006BCA

JM38510/07006BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

07006BDA

JM38510/07006BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

07006BDA

JM38510/30007B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/

30007B2A

JM38510/30007B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/

30007B2A

JM38510/30007BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

30007BCA

JM38510/30007BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

30007BCA

JM38510/30007BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

30007BDA

JM38510/30007BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

30007BDA

JM38510/30007SCA ACTIVE CDIP J 14 25 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

30007SCA

JM38510/30007SCA ACTIVE CDIP J 14 25 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

30007SCA

JM38510/30007SDA ACTIVE CFP W 14 25 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

30007SDA

JM38510/30007SDA ACTIVE CFP W 14 25 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

30007SDA

M38510/07006BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

07006BCA

M38510/07006BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

07006BCA

M38510/07006BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

07006BDA

M38510/07006BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

07006BDA

PACKAGE OPTION ADDENDUM

www.ti.com 23-Apr-2013

Addendum-Page 2

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Top-Side Markings

(4)

Samples

M38510/30007B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/

30007B2A

M38510/30007B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/

30007B2A

M38510/30007BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

30007BCA

M38510/30007BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

30007BCA

M38510/30007BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

30007BDA

M38510/30007BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

30007BDA

M38510/30007SCA ACTIVE CDIP J 14 25 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

30007SCA

M38510/30007SCA ACTIVE CDIP J 14 25 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

30007SCA

M38510/30007SDA ACTIVE CFP W 14 25 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

30007SDA

M38510/30007SDA ACTIVE CFP W 14 25 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

30007SDA

SN5420J OBSOLETE CDIP J 14 TBD Call TI Call TI -55 to 125

SN54LS20J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS20J

SN54S20J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54S20J

SN7420N OBSOLETE PDIP N 14 TBD Call TI Call TI 0 to 70

SN74LS20-W ACTIVE WAFERSALE YS 0 TBD Call TI Call TI

SN74LS20D ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS20

PACKAGE OPTION ADDENDUM

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Addendum-Page 3

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Top-Side Markings

(4)

Samples

SN74LS20D ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS20

SN74LS20DE4 ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS20

SN74LS20DE4 ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS20

SN74LS20DG4 ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS20

SN74LS20DG4 ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS20

SN74LS20DR ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS20

SN74LS20DR ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS20

SN74LS20DRE4 ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS20

SN74LS20DRE4 ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS20

SN74LS20DRG4 ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS20

SN74LS20DRG4 ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS20

SN74LS20J OBSOLETE CDIP J 14 TBD Call TI Call TI 0 to 70

SN74LS20N ACTIVE PDIP N 14 25 Pb-Free

(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS20N

SN74LS20N ACTIVE PDIP N 14 25 Pb-Free

(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS20N

SN74LS20N3 OBSOLETE PDIP N 14 TBD Call TI Call TI 0 to 70

SN74LS20NE4 ACTIVE PDIP N 14 25 Pb-Free

(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS20N

SN74LS20NE4 ACTIVE PDIP N 14 25 Pb-Free

(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS20N

SN74LS20NSR ACTIVE SO NS 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS20

PACKAGE OPTION ADDENDUM

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Addendum-Page 4

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Top-Side Markings

(4)

Samples

SN74LS20NSR ACTIVE SO NS 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS20

SN74LS20NSRE4 ACTIVE SO NS 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS20

SN74LS20NSRE4 ACTIVE SO NS 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS20

SN74LS20NSRG4 ACTIVE SO NS 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS20

SN74LS20NSRG4 ACTIVE SO NS 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS20

SN74S20D ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 S20

SN74S20D ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 S20

SN74S20DE4 ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 S20

SN74S20DE4 ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 S20

SN74S20DG4 ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 S20

SN74S20DG4 ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 S20

SN74S20DR OBSOLETE SOIC D 0 TBD Call TI Call TI 0 to 70

SN74S20N ACTIVE PDIP N 14 25 Pb-Free

(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74S20N

SN74S20N ACTIVE PDIP N 14 25 Pb-Free

(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74S20N

SN74S20N3 OBSOLETE PDIP N 14 TBD Call TI Call TI 0 to 70

SN74S20NE4 ACTIVE PDIP N 14 25 Pb-Free

(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74S20N

SN74S20NE4 ACTIVE PDIP N 14 25 Pb-Free

(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74S20N

SNJ5420J OBSOLETE CDIP J 14 TBD Call TI Call TI -55 to 125

PACKAGE OPTION ADDENDUM

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Addendum-Page 5

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Top-Side Markings

(4)

Samples

SNJ5420J OBSOLETE CDIP J 14 TBD Call TI Call TI -55 to 125

SNJ5420W OBSOLETE CFP W 14 TBD Call TI Call TI -55 to 125

SNJ5420WA OBSOLETE CFP WA 14 TBD Call TI Call TI -55 to 125

SNJ54LS20FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54LS

20FK

SNJ54LS20FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54LS

20FK

SNJ54LS20J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS20J

SNJ54LS20W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS20W

SNJ54S20FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54S

20FK

SNJ54S20FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54S

20FK

SNJ54S20J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54S20J

SNJ54S20W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54S20W

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

PACKAGE OPTION ADDENDUM

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Addendum-Page 6

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a

continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF SN5420, SN54LS20, SN54LS20-SP, SN54S20, SN7420, SN74LS20, SN74S20 :

•Catalog: SN7420, SN74LS20, SN54LS20, SN74S20

•Military: SN5420, SN54LS20, SN54S20

•Space: SN54LS20-SP

NOTE: Qualified Version Definitions:

•Catalog - TI's standard catalog product

•Military - QML certified for Military and Defense Applications

•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

SN74LS20DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1

SN74LS20NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

SN74LS20DR SOIC D 14 2500 367.0 367.0 38.0

SN74LS20NSR SO NS 14 2000 367.0 367.0 38.0

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 2